EP1M350F780I8 - Mercury FPGA 350K Gates | Intel / Altera
Référence : EP1M350F780I8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $235 | $23 500,00 |
| 500 | $210 | $105 000,00 |
| 1 000 | $190 | $190 000,00 |
EP1M350F780I8 Présentation
A Programmable Logic Device (PLD) is an integrated circuit that can be configured by the end user to implement custom digital logic. The Mercury PLD extends the APEX (Advanced Programmable Embedded eXtension) architecture, which combines look-up-table (LUT)-based logic, embedded memory blocks, and high-speed I/O on a single die. PLDs sit within the broader hierarchy of digital semiconductors: PLD -> FPGA -> programmable logic -> semiconductor device, and they enable rapid hardware prototyping and design iteration without the cost of custom ASIC mask sets.
Key features of the EP1M350F780I8 include approximately 350K system gates, embedded SRAM, fast on-chip interconnect (MultiTrack), and LVTTL/LVCMOS-compatible I/O with per-pin direction control. The device supports in-system programmability through the IEEE 1149.1 JTAG interface and is built on a 0.18-micron CMOS process that delivers low static power consumption typical of the Mercury generation. The 'I8' suffix indicates the industrial temperature range (-40C to +85C) and speed-grade 8.
Typical applications include digital signal processing (DSP) data paths, telecommunications backplane interfacing, high-speed image processing front-ends, and embedded control in industrial automation. The Mercury architecture also supports multi-voltage I/O standards, making the EP1M350F780I8 useful for bridging legacy 5V peripherals to 3.3V or 2.5V processor buses.
When designing with the EP1M350F780I8, pay close attention to power-rail sequencing and decoupling. The device supports multiple I/O bank voltages, so a single supply cannot power the entire package. Use of the Altera ByteBlasterMV download cable or a compatible JTAG programmer is recommended for configuration. Always validate signal integrity at the 780-ball BGA using controlled-impedance routing on inner PCB layers.
This page synthesizes distributor pricing, drop-in alternative speed-grade options, and practical design notes not found in the manufacturer datasheet, helping sourcing engineers quickly evaluate EP1M350F780I8 for new designs and legacy board re-spins.
Alternatives de remplacement direct pour EP1M350F780I8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1M350F780I8 (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package, Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1M350F780I7N
✅ Remplacement direct✓ En stock
$152.25 / unité
Voir la fiche technique →EP1M350F780C8
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP1M350F780C7N
✅ Remplacement direct✓ En stock
$168 / unité
Voir la fiche technique →EP1M350F780C7
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP1M350F780I7
✅ Remplacement direct✓ En stock
$165.2 / unité
Voir la fiche technique →EP1M350F780C6
✅ Remplacement direct✓ En stock
$905 / unité
Voir la fiche technique →EP1M350F780I8 Valeurs maximales et caractéristiques électriques
| Family | Altera Mercury (APEX PLD family) |
| System Gates | Approx. 350,000 |
| Boîtier | 780-ball FineLine BGA (F780) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Temperature Grade | Industrial ('I' suffix) |
| Speed Grade | 8 |
| Process Technology | 0.18 micron CMOS |
| Supply Voltage - I/O | Multi-voltage I/O banks supported |
| I/O Standard Support | LVTTL, LVCMOS, PCI (per datasheet) |
| Configuration Interface | IEEE 1149.1 JTAG |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP1M350F780I8 780-ball fineline bga (f780)
Configuration des broches du EP1M350F780I8 (boîtier 780-ball fineline bga (f780)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1M350F780I8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1M350F780I8 convient pour 6 applications: Telecommunications Backplane Interface, Digital Signal Processing (DSP) Front-End, Industrial Automation Controllers, Legacy System Repair and Maintenance, High-Speed Image Processing Pipeline, Avionics and Military Embedded Computing.
Telecommunications Backplane Interface
The EP1M350F780I8 fits telecom backplane bridging applications thanks to its 350K system gates and multi-voltage I/O bank support. With LVTTL/LVCMOS compatibility, the device can interface legacy 5V bus segments to modern 3.3V or 2.5V PHYs without external level shifters, reducing BOM cost and board area. Industrial temperature rating (-40C to +85C) makes it suitable for central-office environments. Pin-to-pin compatibility across the Mercury F780 family allows easy migration to faster speed grades (I7, I6) if timing closure becomes difficult.
Recommandé
Digital Signal Processing (DSP) Front-End
For DSP front-end glue logic, the EP1M350F780I8 provides ample logic capacity to implement FIFO buffers, address generation, and protocol conversion alongside a dedicated DSP processor. The 350K gate count accommodates parallel filter architectures and sample-rate conversion stages. The industrial temperature grade supports outdoor or industrial-cabinet deployments. Designers should use the embedded SRAM blocks efficiently for coefficient storage, freeing logic resources for arithmetic paths.
Recommandé
Industrial Automation Controllers
In PLC and motion-control platforms, the EP1M350F780I8 can host custom control algorithms, encoder interfaces, and fieldbus glue logic in a single device. Its 780-ball FineLine BGA package supports high I/O count required for multi-axis servo control. Industrial temperature grade ensures operation in factory-floor enclosures. Designers should isolate motor-drive grounds from the PLD's sensitive I/O banks to prevent noise injection into JTAG and configuration logic.
Recommandé
Legacy System Repair and Maintenance
The EP1M350F780I8 is primarily targeted at repair and maintenance of legacy systems built around the Mercury PLD family. Sourcing is constrained due to obsolete status, so board-level repair often requires either re-spinning the Mercury section with a Stratix/Cyclone equivalent or sourcing original parts from authorized distributors holding residual stock. Engineers should qualify a second source early and consider re-spin to active lifecycle parts for ongoing production.
Recommandé
High-Speed Image Processing Pipeline
Image-acquisition boards using the EP1M350F780I8 can implement line buffers, pixel-format conversion, and timing generators in programmable logic. The 350K gates comfortably accommodate 8-bit and 16-bit wide video paths. Multi-voltage I/O banks allow direct connection to CMOS image sensors operating at 2.5V or 3.3V. The industrial temperature range supports outdoor machine-vision installations such as traffic monitoring and security cameras.
Recommandé
Avionics and Military Embedded Computing
Although not radiation-hardened, the EP1M350F780I8 industrial temperature range and robust 780-ball BGA package suit certain ruggedized military and avionics subsystems where commercial-grade parts are acceptable. Designers in this segment should validate against vibration, shock, and thermal cycling per MIL-STD-810. The Mercury family is mature and well-documented, which simplifies DO-254-style design assurance. For new programs, modern Stratix or Cyclone FPGAs with active lifecycle support are recommended.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1M350F780I8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1M350F780I7N | EP1M350F780C8 | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780I7 | EP1M350F780C6 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| System Gates | 350K | 350K | 350K | 350K | 350K | 350K | 350K |
| Speed Grade | 8 | 7 (faster) | 8 | 7 (faster) | 7 (faster) | 7 (faster) | 6 (fastest) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C |
| Family | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD |
| Configuration Interface | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 |
| Process Technology | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature rating for harsh environments (vs EP1M350F780C8)
- Speed grade 8 for cost-sensitive timing closure (vs EP1M350F780I7N)
- FineLine BGA package for high I/O density (vs EP1M350F672C7)
Notes de conception
The EP1M350F780I8 supports multi-voltage I/O banks; design separate decoupling networks for each bank voltage (typically 2.5V, 3.3V, and 5V). Use 0.1uF X7R ceramic capacitors placed as close as possible to each bank power pin, with bulk tantalum or polymer capacitors on the supply side. Power-rail sequencing should bring up core voltage VCCINT before I/O voltages to avoid latch-up. Refer to the Altera Mercury family datasheet for recommended decoupling topologies and supply-current budgets per bank.
The 780-ball FineLine BGA requires controlled-impedance PCB routing on inner layers. Use a 4-layer or 6-layer stack-up with continuous ground planes beneath the BGA to control return-path inductance. Escape routing should use vias-in-pad (VIP) or dogbone fan-out patterns; microvia technology is recommended for sub-1mm pitch. After reflow, perform X-ray inspection on every joint to verify solder wetting and detect head-in-pillow defects.
Obsolete Mercury parts have dwindling software support in modern Intel Quartus Prime releases. Confirm that your Quartus II version (legacy) supports the EP1M350F780I8 device library before committing to a design. Also verify that the JTAG programmer (ByteBlasterMV or USB-Blaster) is available for configuration download. Migrate to Stratix or Cyclone for new designs where possible to retain software tool support.
At high toggle rates, the EP1M350F780I8 generates simultaneous switching noise (SSN) that can couple into adjacent I/O banks. Stagger clock edges across banks, enable slew-rate control where available, and add series termination resistors near driver outputs for high-speed signals (>100 MHz). Use the IBIS model from Altera to perform pre-layout signal-integrity simulation.
Informations de conformité
Compliance data not available in verified web sources for EP1M350F780I8. Industrial temperature grade implied by 'I' suffix per Altera naming convention. AEC-Q100 not applicable - FPGAs are not automotive-qualified components in this family.