EP1M350F780I8 - Mercury FPGA 350K Gates | Intel / Altera
MPN: EP1M350F780I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $190 | $190,000.00 |
Drop-in alternatives for EP1M350F780I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780I7N
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$152.25 / Unit
View Datasheet →EP1M350F780C8
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View Datasheet →EP1M350F780C7N
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View Datasheet →EP1M350F780C7
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View Datasheet →EP1M350F780I7
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View Datasheet →EP1M350F780C6
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View Datasheet →EP1M350F780I8 Maximum Ratings & Electrical Characteristics
| Family | Altera Mercury (APEX PLD family) |
| System Gates | Approx. 350,000 |
| Package | 780-ball FineLine BGA (F780) |
| Operating Temperature | -40C to +85C (Industrial) |
| Temperature Grade | Industrial ('I' suffix) |
| Speed Grade | 8 |
| Process Technology | 0.18 micron CMOS |
| Supply Voltage - I/O | Multi-voltage I/O banks supported |
| I/O Standard Support | LVTTL, LVCMOS, PCI (per datasheet) |
| Configuration Interface | IEEE 1149.1 JTAG |
| Mounting Type | Surface Mount (BGA) |
EP1M350F780I8 780-ball fineline bga (f780) Pin Configuration Guide
Complete pinout information for EP1M350F780I8 (780-ball fineline bga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780I8.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780I8 is suitable for 6 applications: Telecommunications Backplane Interface, Digital Signal Processing (DSP) Front-End, Industrial Automation Controllers, Legacy System Repair and Maintenance, High-Speed Image Processing Pipeline, Avionics and Military Embedded Computing.
Telecommunications Backplane Interface
The EP1M350F780I8 fits telecom backplane bridging applications thanks to its 350K system gates and multi-voltage I/O bank support. With LVTTL/LVCMOS compatibility, the device can interface legacy 5V bus segments to modern 3.3V or 2.5V PHYs without external level shifters, reducing BOM cost and board area. Industrial temperature rating (-40C to +85C) makes it suitable for central-office environments. Pin-to-pin compatibility across the Mercury F780 family allows easy migration to faster speed grades (I7, I6) if timing closure becomes difficult.
Recommended
Digital Signal Processing (DSP) Front-End
For DSP front-end glue logic, the EP1M350F780I8 provides ample logic capacity to implement FIFO buffers, address generation, and protocol conversion alongside a dedicated DSP processor. The 350K gate count accommodates parallel filter architectures and sample-rate conversion stages. The industrial temperature grade supports outdoor or industrial-cabinet deployments. Designers should use the embedded SRAM blocks efficiently for coefficient storage, freeing logic resources for arithmetic paths.
Recommended
Industrial Automation Controllers
In PLC and motion-control platforms, the EP1M350F780I8 can host custom control algorithms, encoder interfaces, and fieldbus glue logic in a single device. Its 780-ball FineLine BGA package supports high I/O count required for multi-axis servo control. Industrial temperature grade ensures operation in factory-floor enclosures. Designers should isolate motor-drive grounds from the PLD's sensitive I/O banks to prevent noise injection into JTAG and configuration logic.
Recommended
Legacy System Repair and Maintenance
The EP1M350F780I8 is primarily targeted at repair and maintenance of legacy systems built around the Mercury PLD family. Sourcing is constrained due to obsolete status, so board-level repair often requires either re-spinning the Mercury section with a Stratix/Cyclone equivalent or sourcing original parts from authorized distributors holding residual stock. Engineers should qualify a second source early and consider re-spin to active lifecycle parts for ongoing production.
Recommended
High-Speed Image Processing Pipeline
Image-acquisition boards using the EP1M350F780I8 can implement line buffers, pixel-format conversion, and timing generators in programmable logic. The 350K gates comfortably accommodate 8-bit and 16-bit wide video paths. Multi-voltage I/O banks allow direct connection to CMOS image sensors operating at 2.5V or 3.3V. The industrial temperature range supports outdoor machine-vision installations such as traffic monitoring and security cameras.
Recommended
Avionics and Military Embedded Computing
Although not radiation-hardened, the EP1M350F780I8 industrial temperature range and robust 780-ball BGA package suit certain ruggedized military and avionics subsystems where commercial-grade parts are acceptable. Designers in this segment should validate against vibration, shock, and thermal cycling per MIL-STD-810. The Mercury family is mature and well-documented, which simplifies DO-254-style design assurance. For new programs, modern Stratix or Cyclone FPGAs with active lifecycle support are recommended.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780I7N | EP1M350F780C8 | EP1M350F780C7N | EP1M350F780C7 | EP1M350F780I7 | EP1M350F780C6 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| System Gates | 350K | 350K | 350K | 350K | 350K | 350K | 350K |
| Speed Grade | 8 | 7 (faster) | 8 | 7 (faster) | 7 (faster) | 7 (faster) | 6 (fastest) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C |
| Family | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD | Mercury PLD |
| Configuration Interface | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 | JTAG IEEE 1149.1 |
| Process Technology | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS | 0.18 micron CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature rating for harsh environments (vs EP1M350F780C8)
- Speed grade 8 for cost-sensitive timing closure (vs EP1M350F780I7N)
- FineLine BGA package for high I/O density (vs EP1M350F672C7)
Design Notes
The EP1M350F780I8 supports multi-voltage I/O banks; design separate decoupling networks for each bank voltage (typically 2.5V, 3.3V, and 5V). Use 0.1uF X7R ceramic capacitors placed as close as possible to each bank power pin, with bulk tantalum or polymer capacitors on the supply side. Power-rail sequencing should bring up core voltage VCCINT before I/O voltages to avoid latch-up. Refer to the Altera Mercury family datasheet for recommended decoupling topologies and supply-current budgets per bank.
The 780-ball FineLine BGA requires controlled-impedance PCB routing on inner layers. Use a 4-layer or 6-layer stack-up with continuous ground planes beneath the BGA to control return-path inductance. Escape routing should use vias-in-pad (VIP) or dogbone fan-out patterns; microvia technology is recommended for sub-1mm pitch. After reflow, perform X-ray inspection on every joint to verify solder wetting and detect head-in-pillow defects.
Obsolete Mercury parts have dwindling software support in modern Intel Quartus Prime releases. Confirm that your Quartus II version (legacy) supports the EP1M350F780I8 device library before committing to a design. Also verify that the JTAG programmer (ByteBlasterMV or USB-Blaster) is available for configuration download. Migrate to Stratix or Cyclone for new designs where possible to retain software tool support.
At high toggle rates, the EP1M350F780I8 generates simultaneous switching noise (SSN) that can couple into adjacent I/O banks. Stagger clock edges across banks, enable slew-rate control where available, and add series termination resistors near driver outputs for high-speed signals (>100 MHz). Use the IBIS model from Altera to perform pre-layout signal-integrity simulation.
Compliance Information
Compliance data not available in verified web sources for EP1M350F780I8. Industrial temperature grade implied by 'I' suffix per Altera naming convention. AEC-Q100 not applicable - FPGAs are not automotive-qualified components in this family.
