EP2SGX30CF780C6 - Stratix II GX FPGA, 780-BGA, 30K LE | Intel (Altera)
Référence : EP2SGX30CF780C6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $320 | $320,00 |
| 10 | $285 | $2 850,00 |
| 100 | $240 | $24 000,00 |
| 500 | $195 | $97 500,00 |
| 1 000 | $165 | $165 000,00 |
EP2SGX30CF780C6 Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic, memory, and I/O resources can be programmed after manufacture, allowing hardware engineers to implement custom digital circuits, parallel processing pipelines, and high-speed interfaces without fabricating an ASIC. In the system hierarchy, an FPGA sits between a microcontroller and a custom ASIC: it provides far higher parallelism and I/O bandwidth than an MCU, while avoiding the non-recurring engineering cost of an ASIC. The Stratix II GX family specifically targets applications requiring both general-purpose logic and multi-gigabit transceivers, positioning it as a power-management-aware programmable alternative to discrete PHY plus FPGA solutions.
Key features of the EP2SGX30CF780C6 include up to 6.375 Gbps transceiver data rate, 1.4 Mbits of embedded RAM (TriMatrix), dedicated 18x18 multipliers, and built-in PCI Express hard IP. The device supports DDR/DDR2/QDRII memory interfaces with dedicated DQS circuitry, dynamic phase alignment for source-synchronous interfaces, and signalTap II embedded logic analysis for in-system debug. The F780 package offers 361 user I/Os arranged in 8 I/O banks, providing flexible I/O standard support including LVDS, SSTL, HSTL, and LVCMOS at multiple voltages.
Architecturally, the Stratix II GX employs an adaptive logic module (ALM) with 8 inputs per ALM, replacing the 4-input LUT architecture used in earlier Stratix families. This allows tighter logic packing and improved performance on wide fan-in functions. The transceiver blocks embed clock-data recovery (CDR), 8B/10B encoding/decoding, and word-alignment logic, offloading these functions from the fabric and freeing logic resources for application-level processing.
Typical applications include wireless baseband processing, high-end test and measurement equipment, broadcast video infrastructure, and PCI Express endpoint cards for industrial control or data acquisition. The 6.375 Gbps transceivers also make it suitable for proprietary chip-to-chip links and backplane serial connectivity in storage or telecom systems.
When designing with this device, ensure that the Quartus II fitter pin assignments respect each bank voltage (1.2 V to 3.3 V) and that the transceiver reference clocks are routed with controlled impedance. Thermal management is critical in F780 BGA packages because the bottom-side balls carry both signal and thermal dissipation; refer to the manufacturer thermal model for junction-to-case resistance when calculating heatsink requirements.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not found in the manufacturer datasheet, giving the engineer a single decision-ready resource for the EP2SGX30CF780C6.
Alternatives de remplacement direct pour EP2SGX30CF780C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX30CF780C6 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Embedded Memory, Transceivers, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX30CF780C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$248 / unité
Voir la fiche technique →EP2SGX30CF780C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$160 / unité
Voir la fiche technique →EP2SGX30CF780C4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$138 / unité
Voir la fiche technique →EP2SGX30CF780C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$379 / unité
Voir la fiche technique →EP2SGX30CF780C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$175.5 / unité
Voir la fiche technique →EP2SGX30CF780C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →EP2SGX30CF780C6 Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Series | EP2SGX |
| Logic Elements (LE) | 33,880 |
| Adaptive Logic Modules (ALM) | 13,540 |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) |
| User I/O Pins | 361 |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Boîtier | 780-ball FineLine BGA (F780) |
| Speed Grade | C6 (commercial, mid-speed) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) |
| Configuration Mode | Enhanced passive/active (EPC) supported |
| Process Technology | 90 nm |
Guide de configuration des broches du EP2SGX30CF780C6 780-ball fineline bga (f780)
Configuration des broches du EP2SGX30CF780C6 (boîtier 780-ball fineline bga (f780)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX30CF780C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX30CF780C6 convient pour 6 applications: Wireless Baseband Processing, PCI Express Endpoint Card, High-End Test and Measurement Equipment, Broadcast Video Infrastructure, Industrial Data Acquisition and Control, Custom Chip-to-Chip High-Speed Links.
Wireless Baseband Processing
The EP2SGX30CF780C6 fits wireless baseband processing because its 33,880 logic elements and 64 dedicated 18x18 multipliers deliver the DSP throughput required for baseband channel cards, while the 6.375 Gbps transceivers handle CPRI/OBSAI links between baseband and radio units. The 1,369,728 bits of embedded TriMatrix memory buffers FFT windows and channel estimates without external SRAM, reducing BOM cost and PCB area. Designers use the ALM architecture to implement Viterbi, Turbo, or LDPC decoders efficiently. Compared with a DSP-plus-ASIC partition, this FPGA offers a single-chip reconfigurable platform that supports multiple air-interface standards (LTE, WiMAX, proprietary) on common hardware.
Recommandé
PCI Express Endpoint Card
The EP2SGX30CF780C6 is well suited for PCI Express endpoint cards because it embeds a hard PCI Express IP core supporting Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) with x1/x4/x8 lane configurations. The 6.375 Gbps transceivers exceed Gen2 requirements, providing margin for signal-integrity losses across FR4 backplanes. With 361 user I/Os, the FPGA can interface to high-speed ADC/DAC, DDR2 memory, and front-panel connectors. The C6 commercial speed grade is sufficient for typical Gen2 designs at the 5.0 Gbps data rate. Compared with an FPGA plus external PHY solution, the integrated hard IP reduces latency, board area, and bill-of-materials cost.
Recommandé
High-End Test and Measurement Equipment
The EP2SGX30CF780C6 fits high-end test and measurement instruments because its 33,880 logic elements implement deep packet inspection, protocol-aware triggering, and DSP-based signal conditioning in parallel. The 6.375 Gbps transceivers capture and generate serial protocols at full line rate, while the 1,369,728 bits of embedded memory buffer captured traces before transferring to host memory via PCI Express. The 361 user I/Os interface to high-speed ADCs, DACs, and front-panel displays without external bus switches. Compared with a DSP-based architecture, this FPGA delivers deterministic real-time response critical for protocol analyzers and oscilloscope acquisition systems.
Recommandé
Broadcast Video Infrastructure
The EP2SGX30CF780C6 fits broadcast video routers and contribution encoders because its 6.375 Gbps transceivers carry uncompressed SDI (SMPTE 424M at 2.97 Gbps) and emerging Ultra HD (UHD) links at 6 Gbps with margin. The 33,880 logic elements implement multi-channel SDI mux/demux, audio embedding, and ancillary data processing. The 1,369,728 bits of embedded memory buffer line buffers and audio samples without external SRAM. Compared with an ASIC-based SDI processor, this FPGA offers a single programmable platform supporting multiple SDI standards (SD-SDI, HD-SDI, 3G-SDI, 6G-SDI) on common hardware.
Recommandé
Industrial Data Acquisition and Control
The EP2SGX30CF780C6 fits industrial data acquisition and control systems because its 361 user I/Os interface to dozens of analog front-ends, encoder inputs, and actuator drivers without external bus expansion. The 33,880 logic elements implement deterministic state machines, PID loops, and custom protocols (EtherCAT, Profinet) in parallel. The 6.375 Gbps transceivers backhaul data to industrial PCs or controllers over gigabit Ethernet. Compared with a microcontroller plus CPLD partition, this single-chip FPGA solution simplifies PCB layout, reduces latency, and supports firmware-only protocol updates.
Recommandé
Custom Chip-to-Chip High-Speed Links
The EP2SGX30CF780C6 fits proprietary chip-to-chip or backplane serial links because its 6.375 Gbps transceivers implement Aurora or custom 8B/10B protocols with on-chip encoding/decoding, word alignment, and clock-data recovery. The 33,880 logic elements implement link-layer state machines and application-layer processing on the same die. The 1,369,728 bits of embedded memory buffer packet data and CRC calculations without external SRAM. Compared with a discrete SERDES plus ASIC approach, this FPGA-based link offers a single reconfigurable platform that supports multiple protocols and lane counts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX30CF780C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX30CF780C5 | EP2SGX30CF780C5N | EP2SGX30CF780C4 | EP2SGX30CF780C4N | EP2SGX30CF780C3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same | 780-ball FineLine BGA (F780) - same |
| Speed Grade | C6 | C5 (faster) | C5 (faster) | C4 (faster) | C4 (faster) | C3 (fastest) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Embedded Memory (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| User I/O Pins | 361 | 361 | 361 | 361 | 361 | 361 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Faster speed grade available as drop-in alternative (vs EP2SGX30CF780C5)
- Lead-free variant for RoHS-compliant assembly (vs EP2SGX30CF780C5N)
- Lower-cost alternative in same package (vs EP2SGX30CF780C3)
Notes de conception
Estimated: The F780 BGA package has a typical junction-to-case thermal resistance (theta_JC) of approximately 0.4 C/W for Stratix II GX devices, but junction-to-ambient (theta_JA) depends heavily on PCB copper area and airflow. At full fabric utilization with all 8 transceivers active at 6.375 Gbps, total power dissipation can reach 10-15 W. Engineers must implement a thermal management strategy: maximize top-side BGA ground-ball connections to inner copper planes, use 1 oz copper (or heavier) on at least 4 internal power/ground layers, and consider forced airflow or a heatsink attached via thermal interface material to maintain junction temperature below 85C for commercial-grade operation.
Place decoupling capacitors as close as physically possible to every power pin: 0.1 uF X7R ceramic for high-frequency transients on every VCCINT, VCCIO, VCCA, and VCCD_PLL pair, plus 10 uF bulk capacitors per power rail within 1 cm of the BGA. Route all transceiver differential pairs (RX/TX) with 100 ohm differential impedance, controlled length matching within 5 mils, and continuous reference plane on an adjacent layer. Avoid routing signals across plane splits under the BGA. Use a 1.0 mm pitch BGA fanout with via-in-pad or dog-bone fanout; via-in-pad is preferred for high-speed transceiver breakouts to minimize stub effects.
Do not assume the C6 speed grade will meet timing for designs previously closed on C5; always re-run the Quartus II fitter with the C6 timing model before substituting. Do not leave transceiver reference clock inputs floating - each unused transceiver must be powered down and its reference clock input terminated per the Stratix II GX Device Handbook. Do not mix 1.5 V and 1.8 V I/O standards in the same I/O bank; check bank voltage compatibility before pin assignment. Finally, do not forget to configure the MSEL pins for the correct configuration scheme (EPC passive, EPC active, JTAG) before board bring-up - wrong MSEL settings lock the device in reset indefinitely.
Estimated: At 6.375 Gbps, the transceiver channel insertion loss budget is approximately 12 dB at 3.125 GHz Nyquist frequency. Use Megtron 6 or similar low-loss PCB material for long traces (>5 inches), or implement pre-emphasis and equalization settings from the Stratix II GX Transceiver Toolkit to compensate for FR4 losses on shorter traces. Always perform post-layout signal-integrity simulation with the IBIS-AMI models provided by Altera/Intel before tape-out. For source-synchronous interfaces (DDR2, QDRII), enable dynamic phase alignment (DPA) on the input clocks to eliminate per-bit deskew uncertainty across PVT variation.
Informations de conformité
RoHS and lead-free status not specified in verified web data; the N-suffix variants (C5N, C4N, C3N) are explicitly lead-free per Altera/Intel ordering information. Stratix II GX is a logic device, not AEC-Q100 automotive qualified. Engineers requiring RoHS-compliant assembly should specify the N-suffix variants explicitly.