EP1S10F672C7N - Stratix FPGA 10,570 LEs 672-BGA | Intel / Altera
Référence : EP1S10F672C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 500 | $199.5 | $99 750,00 |
| 1 000 | $171 | $171 000,00 |
EP1S10F672C7N Présentation
As a Field-Programmable Gate Array (FPGA), the EP1S10F672C7N belongs to a class of semiconductor devices that combine programmable logic fabric, configurable I/O, and hard IP blocks into a single re-programmable IC. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering ASIC-class parallelism and throughput while preserving in-system re-programmability. The Stratix family specifically targets high-density, performance-critical applications such as DSP pipelines, telecom infrastructure, and parallel processing.
Key features of the EP1S10F672C7N include 10,570 logic elements distributed across 1,057 LABs/CLBs, 920,448 bits of embedded RAM configurable as simple dual-port, true dual-port, or shift-register memory, 6 dedicated DSP blocks for high-speed multiplication, and up to 345 user I/O pins supporting multiple I/O standards including LVDS, SSTL, and PCI. The device supports both serial and parallel configuration schemes via JTAG or passive/active configuration devices.
Architecturally, Stratix devices employ a logic-element (LE) granularity of 4-input look-up tables combined with dedicated carry chains and register-rich LABs. The TriMatrix memory architecture provides three distinct block sizes (M512, M4K, M-RAM) optimized for different data-path widths. The 130 nm process node was the leading-edge production geometry when Stratix launched in 2002, balancing leakage and performance for high-utilization designs.
Typical applications include high-performance digital signal processing (DSP) for baseband and image processing, telecom line-card and framer implementations, military and aerospace signal-processing boards, prototyping of ASIC-class designs prior to tape-out, industrial control and instrumentation, and test-and-measurement data acquisition. The wide I/O count and rich memory architecture also suit software-defined radio (SDR) front-ends.
When designing with this device, plan your PCB layout to accommodate the 672-ball 35 x 35 mm FBGA with 1.27 mm pitch. Stratix FPGAs require multiple supply rails (core, I/O, PLL, and auxiliary) with careful decoupling and a power-sequencing strategy. Consult the Stratix Device Handbook (Volume 1, Section I) for DC and switching characteristics, configuration timing, and JTAG boundary-scan details before committing to layout.
This page synthesizes verified distributor pricing from DigiKey and Mouser, drop-in same-package alternatives from across the Stratix family, and practical design notes not found in a single datasheet chapter, providing engineer-grade context beyond the manufacturer PDF.
Alternatives de remplacement direct pour EP1S10F672C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S10F672C7N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, DSP Blocks, Configuration Method, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S10F672C7
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP1S10F672C6
✅ Remplacement direct✓ En stock
$72 / unité
Voir la fiche technique →EP1S10B672C7N
✅ Remplacement direct✓ En stock
$67.9 / unité
Voir la fiche technique →EP1S10B672C7
✅ Remplacement direct✓ En stock
$140 / unité
Voir la fiche technique →EP1S10B672C6
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →LFEC6E-5F672C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S10F672C7N Valeurs maximales et caractéristiques électriques
| Series | Stratix |
| Logic Elements / Cells | 10,570 |
| Number of LABs/CLBs | 1,057 |
| Total RAM Bits | 920,448 |
| Number of User I/Os | 345 |
| DSP Blocks | 6 |
| Package Type | 672-BBGA (FBGA) 35 x 35 mm, 1.27 mm pitch |
| Type de montage | Surface Mount |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Operating Frequency | 420.17 MHz |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Configuration Method | SRAM, JTAG, passive/active serial/parallel |
Configuration des broches de EP1S10F672C7N
| Broche A1 | I/O — User I/O - bank 1 |
| Broche A22 | I/O — User I/O - bank 2 |
| Broche AA1 | I/O — User I/O - bank 8 |
| Broche AA22 | I/O — User I/O - bank 8 |
| Broche AB1 | GND — Ground |
| Broche AB22 | VCCIO — I/O bank supply |
| Broche B1 | I/O — User I/O - bank 1 |
| Broche B22 | I/O — User I/O - bank 2 |
| Broche C1 | I/O — User I/O - bank 1 |
| Broche C22 | I/O — User I/O - bank 2 |
| Broche D1 | I/O — User I/O - bank 1 |
| Broche D22 | I/O — User I/O - bank 3 |
| Broche E1 | I/O — User I/O - bank 3 |
| Broche E22 | I/O — User I/O - bank 3 |
| Broche F1 | I/O — User I/O - bank 3 |
| Broche F22 | I/O — User I/O - bank 4 |
| Broche G1 | I/O — User I/O - bank 4 |
| Broche G22 | I/O — User I/O - bank 4 |
| Broche H1 | I/O — User I/O - bank 4 |
| Broche H22 | VCCINT — Core supply 1.5 V |
Applications typiques
EP1S10F672C7N convient pour 6 applications: High-Performance DSP Pipelines, Telecom Line-Card and Framer Designs, ASIC Prototyping and Emulation, Military / Aerospace Embedded Boards, Industrial Control and Instrumentation, Test and Measurement Data Acquisition.
High-Performance DSP Pipelines
The EP1S10F672C7N's 6 dedicated DSP blocks and 420 MHz core clock make it a natural fit for high-throughput DSP pipelines such as FIR filters, FFT engines, and adaptive equalizers. Each DSP block contains multipliers and adders that can be cascaded to implement 18-bit and 36-bit MAC operations at hardware speed, offloading DSP work from any host processor. With 10,570 logic elements and 920 Kbits of TriMatrix memory, designs can fit multi-channel baseband processing, modulation/demodulation, and correlator banks on a single device. This part was a workhorse for early-2000s DSP development boards and remains in service in deployed telecom equipment.
Recommandé
Telecom Line-Card and Framer Designs
The Stratix family was originally launched for telecom line cards and SONET/SDH framers, and the EP1S10F672C7N supports that workload with up to 345 user I/Os that can be configured to multiple standards including LVDS, LVPECL, SSTL, and PCI. The TriMatrix memory architecture delivers dual-port and true-dual-port RAM blocks sized for cell buffering, header parsing, and pointer arithmetic in framer implementations. At 420 MHz internal frequency, the EP1S10F672C7N can sustain OC-48 / STM-16 class line rates. JTAG and passive-serial configuration via EPC16/EPC8 enhanced configuration devices simplify board bring-up and in-field firmware updates on telecom line cards.
Recommandé
ASIC Prototyping and Emulation
ASIC prototyping and logic emulation demand high logic density, generous routing, and predictable timing - all characteristics of the EP1S10F672C7N. With 10,570 logic elements across 1,057 LABs/CLBs and a 672-ball BGA package providing 345 user I/Os, multiple FPGAs can be tiled on a prototyping board to emulate ASIC-class designs before tape-out. The Quartus II toolchain supports partition-based multi-FPGA prototyping with automated pin assignment, and the 1.5 V core minimizes per-device power relative to older 3.3 V families. This remains a standard methodology for validating ASIC RTL prior to committing to mask costs.
Recommandé
Military / Aerospace Embedded Boards
Although the EP1S10F672C7N is commercial-grade (0C to +85C), Stratix devices have been deployed on ruggedized military and aerospace boards where the wide logic capacity, multiple I/O standards, and JTAG-based testing simplify board bring-up. Designers should consult the Altera / Intel Military and Aerospace product line for actual MIL-spec variants; the EP1S10F672C7N is typically used as a logic baseline for non-flight ground-support equipment and laboratory test rigs. The 672-FBGA package supports robust mechanical mounting and the SRAM configuration supports rapid design iteration during qualification campaigns.
Recommandé
Industrial Control and Instrumentation
Industrial control systems require deterministic, parallel logic for high-speed control loops, encoder decoding, and motion control. The EP1S10F672C7N's 10,570 logic elements are sufficient for multi-axis servo loops running at sub-microsecond cycle times, and the 920 Kbits of embedded memory provide look-up-table storage for non-linear motion profiles. The 345 user I/Os accept differential encoder inputs (RS-422, LVDS), parallel ADC/DAC buses, and opto-isolated discrete I/O. Combined with Quartus II SOPC Builder integration of Nios II soft-core processors, the device is a strong fit for high-channel-count data acquisition and process control.
Recommandé
Test and Measurement Data Acquisition
Test and measurement instruments - oscilloscopes, logic analyzers, protocol analyzers - benefit from the EP1S10F672C7N's combination of high logic density, abundant embedded memory, and parallel I/O. Designs can buffer multi-channel ADC samples in 920 Kbits of TriMatrix RAM while state machines implement real-time triggering, decimation, and protocol decoding at 420 MHz. Multiple LVDS-capable I/O banks interface to high-speed ADCs and DACs without external transceivers. The SRAM-based architecture lets vendors ship firmware updates as new bitstreams, a major advantage in a fast-evolving test-equipment market.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S10F672C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S10F672C7 | EP1S10F672C6 | EP1S10B672C7N | EP1S10B672C7 | EP1S10B672C6 | LFEC6E-5F672C |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA (F672) 35x35 mm | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA - same footprint, different die |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Lattice Semiconductor |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 6,000 (-43%) |
| Speed Grade | C7 | C7 | C6 (slower) | C7 | C7 | C6 (slower) | -5 |
| Total RAM Bits | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 920,448 | 245,760 (-73%) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-speed grade (C7) within the Stratix EP1S10 family in 672-FBGA (vs EP1S10F672C6)
- Original Stratix die (EP1S10F) versus the B-revision (EP1S10B) (vs EP1S10B672C7N)
- Wider logic capacity than Lattice ECP2 (LFEC6E) alternative (vs LFEC6E-5F672C)
Notes de conception
Estimated: Stratix EP1S10F672C7N requires four independent supply rails - VCCINT (1.5 V core), VCCIO (3.3 V/2.5 V/1.8 V I/O banks), VCC_PLL (1.5 V PLL analog), and VCC_AUX (auxiliary). Power-on sequencing per the Stratix Device Handbook requires VCCINT to ramp before or simultaneous with VCCIO. Decoupling should include 0.1 uF X7R ceramics at every quadrant of the BGA plus 10 uF bulk capacitors near each supply pin. Estimated static current for the EP1S10F672C7N at room temperature is approximately 0.5 A core plus 0.1-0.3 A per I/O bank depending on switching activity.
The 672-ball FineLine BGA uses 1.27 mm ball pitch, which is at the limit of many prototype-assembly houses. Per Altera / Intel package guidelines, PCB pad design should use non-solder-mask-defined (NSMD) pads with a 0.6 mm diameter, with microvia-in-pad for high-density signal escape. Trace width 0.1 mm (4 mil) with 0.15 mm (6 mil) spacing is recommended. Ground and power planes must remain solid under the BGA; avoid antipad congestion that would disrupt return-current paths for the 345 user I/Os.
Configuration mode pin strapping (MSEL[3..0]) must be set correctly or the EP1S10F672C7N will not enter the desired configuration mode at power-up. According to the Stratix Device Handbook Chapter 8, MSEL selects among AS, AP, PS, FPP, and JTAG modes and the wrong setting can result in no configuration or misconfigured I/O behavior. Additionally, the nCONFIG, nSTATUS, and CONF_DONE pins must be properly pulled high with 10 kohm resistors; leaving them floating causes intermittent bring-up failures that look like silicon defects but are actually configuration-pitfall issues.
Informations de conformité
Compliance status not stated in the verified web data. EP1S10F672C7N is commercial-grade (0-85C), so AEC-Q100 qualification is not applicable. Designers should request a C-of-C from the distributor when sourcing obsolete stock.
