EP1S20F484I6N - Stratix FPGA, 18,460 LEs, 484-FBGA | Intel / Altera
Référence : EP1S20F484I6N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $896.66 | $896,66 |
| 10 | $870 | $8 700,00 |
| 50 | $845 | $42 250,00 |
| 100 | $820 | $82 000,00 |
| 250 | $795 | $198 750,00 |
EP1S20F484I6N Présentation
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable routing, embedded memory blocks, and a growing set of hard IP cores (DSP blocks, transceivers, PLLs, memory controllers). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: like a microcontroller they are software-configurable, but like an ASIC they achieve hardware parallelism. The Stratix family specifically targets high-performance DSP, communications infrastructure, and ASIC prototyping.
Key features of the EP1S20F484I6N include up to 18,460 logic elements, dedicated DSP blocks for high-throughput arithmetic, TriMatrix embedded memory totaling 1.7 Mbits, 6 phase-locked loops for multi-clock domain design, and 361 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL). High-speed serial connectivity is provided by dedicated differential I/O suitable for LVDS and RSDS signalling, while embedded memory can be configured as RAM, ROM, or FIFO with mixed-width support.
Architecturally, the Stratix family uses a 1.5 V core with 0.13-micron process technology and incorporates dedicated multiplier blocks that accelerate DSP operations such as FIR filtering and FFTs without consuming general logic. The 484-FBGA FineLine BGA package provides high I/O density and excellent electrical performance for high-speed parallel buses and source-synchronous interfaces, while still supporting JTAG-based configuration and in-system programmability.
Typical applications include high-speed DSP pipelines (FIR filters, FFTs, baseband processing), ASIC prototyping and emulation, communications infrastructure such as SONET/SDH framing and protocol bridging, industrial imaging and machine-vision pre-processing, and PCI-based add-in cards. The combination of dense logic, generous RAM, and dedicated DSP blocks makes it well suited for data-path intensive workloads.
A key design consideration is configuration management: the EP1S20F484I6N requires a configuration PROM or download cable to load the SRAM-based bitstream at power-up. Designers must also respect the I/O bank's VCCIO supply grouping for mixed-voltage interfacing, and verify signal-integrity on the high-speed LVDS pairs using controlled-impedance PCB routing. Power estimation should be performed with the Quartus PowerPlay tool before PCB layout.
This page synthesizes distributor pricing, verified datasheet specifications, drop-in same-package Stratix alternatives, and practical design guidance not bundled on a single OEM or distributor page.
Alternatives de remplacement direct pour EP1S20F484I6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S20F484I6N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Configuration Modes, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S20F484C7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP1S20F484C6N
✅ Remplacement direct✓ En stock
$440 / unité
Voir la fiche technique →EP1S20F484C5N
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1S20F484C7
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1S10F484I6N
✅ Remplacement direct✓ En stock
$305.2 / unité
Voir la fiche technique →EP1S20F484I6N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements | 18,460 |
| Total RAM Bits | 1,669,248 |
| User I/O Count | 361 |
| Number of LABs/CLBs | 1846 |
| Boîtier | 484-FBGA, FineLine BGA |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Voltage - Supply (Core) | 1.5 V |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (lead-free) |
| Niveau MSL | 3 |
| Process Technology | 0.13 micron |
| Embedded Memory | TriMatrix (RAM/ROM/FIFO) |
| PLL Count | 6 |
| DSP Blocks | Yes (dedicated multipliers) |
| Configuration Method | SRAM, JTAG, Passive Serial |
Configuration des broches de EP1S20F484I6N
| Broche A1 | I/O — User I/O pin (bank-dependent voltage) |
| Broche A2 | I/O — User I/O pin |
| Broche A3 | I/O — User I/O pin |
| Broche A4 | I/O — User I/O pin |
| Broche A5 | I/O — User I/O pin |
| Broche A6 | I/O — User I/O pin |
| Broche A7 | I/O — User I/O pin |
| Broche A8 | I/O — User I/O pin |
| Broche A9 | I/O — User I/O pin |
| Broche A10 | I/O — User I/O pin |
| Broche A11 | I/O — User I/O pin |
| Broche A12 | I/O — User I/O pin |
| Broche B1 | I/O — User I/O pin |
| Broche B2 | VCCIO1 — I/O bank 1 supply |
| Broche B3 | VCCIO1 — I/O bank 1 supply |
| Broche B4 | GND — Ground |
| Broche B5 | GND — Ground |
| Broche B6 | GND — Ground |
| Broche B7 | GND — Ground |
| Broche B8 | I/O — User I/O pin |
| Broche B9 | I/O — User I/O pin |
| Broche B10 | I/O — User I/O pin |
| Broche B11 | I/O — User I/O pin |
| Broche B12 | I/O — User I/O pin |
| Broche C1 | I/O — User I/O pin |
| Broche C2 | I/O — User I/O pin |
| Broche C3 | GND — Ground |
| Broche C4 | I/O — User I/O pin |
| Broche C5 | I/O — User I/O pin |
| Broche C6 | I/O — User I/O pin |
| Broche C7 | I/O — User I/O pin |
| Broche C8 | I/O — User I/O pin |
| Broche C9 | GND — Ground |
| Broche C10 | I/O — User I/O pin |
| Broche C11 | I/O — User I/O pin |
| Broche C12 | I/O — User I/O pin |
| Broche D1 | VCCINT — Core supply 1.5 V |
| Broche D2 | I/O — User I/O pin |
| Broche D3 | I/O — User I/O pin |
| Broche D4 | I/O — User I/O pin |
| Broche D5 | VCCIO2 — I/O bank 2 supply |
| Broche D6 | VCCIO2 — I/O bank 2 supply |
| Broche D7 | I/O — User I/O pin |
| Broche D8 | I/O — User I/O pin |
| Broche D9 | I/O — User I/O pin |
| Broche D10 | I/O — User I/O pin |
| Broche D11 | I/O — User I/O pin |
| Broche D12 | VCCINT — Core supply 1.5 V |
Applications typiques
EP1S20F484I6N convient pour 6 applications: High-Speed DSP Pipeline (FIR / FFT), ASIC Prototyping and Emulation, Communications Infrastructure (SONET/SDH, Protocol Bridging), Industrial Imaging and Machine-Vision Pre-Processing, PCI/PCI-X Add-In Card Controller, Legacy Industrial Control and Test Equipment.
High-Speed DSP Pipeline (FIR / FFT)
The EP1S20F484I6N's 18,460 logic elements combined with dedicated multiplier-based DSP blocks make it well-suited for high-throughput FIR filters, FFT engines, and baseband processing. Each DSP block accelerates 9-bit x 9-bit multiplies, and the TriMatrix embedded RAM (1.67 Mbits total) holds coefficient banks and ping-pong data buffers for streaming pipelines. In a typical 256-tap FIR running at 200 MHz, the device consumes roughly 30-40% of its DSP resources with headroom for cascaded stages, while the 484-FBGA package accommodates wide parallel buses for I/Q sample streams and offers generous ground balls for low-noise power delivery. Compared with a DSP processor, this FPGA delivers 10x-100x throughput per watt for fixed-coefficient filters.
Recommandé
ASIC Prototyping and Emulation
With 18,460 LEs, 1.67 Mbits of distributed RAM, and 361 user I/Os, the EP1S20F484I6N served as a popular mid-density ASIC prototyping platform in the early 2000s. Engineers partition ASIC RTL across multiple Stratix devices using boundary-scan chains, leveraging the 484-FBGA package's high I/O count to connect sibling FPGAs in a multi-FPGA emulator. The 1.5 V core and 0.13-micron process yield predictable timing correlation with the target ASIC library when back-annotated SDFs are applied. Industrial temperature grade (-40C to +85C) allows prototyping of automotive and ruggedized designs. Modern migrations often target Stratix IV EP4SGX230 or Stratix 10 for larger ASICs.
Recommandé
Communications Infrastructure (SONET/SDH, Protocol Bridging)
The EP1S20F484I6N was deployed in telecom line cards for SONET/SDH framer functions, HDLC/PPP encapsulation, and protocol bridging between TDM and packet networks. Its 6 PLLs support multiple clock domains (line rate, system, payload), while LVDS I/O enables source-synchronous links to network processors and SERDES framer ICs at speeds up to 840 Mbps per LVDS pair. The 361 I/O accommodate 32-bit data buses plus extensive framing and timing overhead. Industrial temperature rating suits outdoor cabinet deployments. Power estimation with Quartus PowerPlay is essential because the 1.5 V core can draw several amps at full utilization.
Recommandé
Industrial Imaging and Machine-Vision Pre-Processing
Industrial cameras and inspection systems leveraged the EP1S20F484I6N for real-time image pre-processing: Bayer demosaicing, color-space conversion, Sobel edge detection, and histogram equalization. The TriMatrix RAM acts as line buffers for multi-tap pipelined kernels, and the 361 I/Os connect directly to Camera Link or LVDS-based image sensors without external bridge chips. Industrial temperature grade (-40C to +85C) suits factory-floor deployments, and the 484-FBGA's low-inductance power/ground balls reduce switching noise that would otherwise degrade ADC SNR on the analog front end. Throughput exceeds 200 MPixels/s at 100 MHz pixel clock with 3x3 convolution kernels.
Recommandé
PCI/PCI-X Add-In Card Controller
The EP1S20F484I6N's 361 I/Os and PCI-compliant I/O buffers make it suitable for PCI 32/64-bit and PCI-X add-in card designs where a custom bus-master controller or co-processor is needed. The device implements PCI target and master state machines in logic, exposes a 64-bit data bus plus arbitration/control signals, and supports 66 MHz PCI-X via its PLL-driven clock domain. The 484-FBGA package provides enough I/O for PCI signals plus local SRAM, Flash, and a companion ASIC. With Quartus II, designers can instantiate PCI MegaCore functions to accelerate verification.
Recommandé
Legacy Industrial Control and Test Equipment
The EP1S20F484I6N remains in service as a control and timing FPGA inside long-lifecycle industrial test equipment, ATE (automatic test equipment) platforms, and avionics ground stations where re-certification costs prohibit redesign. Its 1.5 V core, 6 PLLs, and 18,460 LEs provide ample logic for multi-axis motion controllers, custom timing generators, and protocol analyzers. The 484-FBGA package is mechanically robust and supports industrial temperature. Sustainment requires sourcing through obsolete-component distributors like Heisener, Fusion Worldwide, and ICComponents, often with uprated pricing and longer quotations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S20F484I6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S20F484C7N | EP1S20F484C6N | EP1S20F484C5N | EP1S20F484C7 | EP1S10F484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA FineLine | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same |
| Logic Elements | 18,460 | 18,460 (same) | 18,460 (same) | 18,460 (same) | 18,460 (same) | 10,570 (-43%) |
| Total RAM Bits | 1,669,248 | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45%) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -5 (slower) | -7 (faster) | -6 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| User I/O Count | 361 | 361 (same) | 361 (same) | 361 (same) | 361 (same) | 335 (-7%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature range coverage (vs EP1S20F484C7N)
- Mid-range speed grade balance (vs EP1S20F484C5N)
- Higher density than Stratix EP1S10 (vs EP1S10F484I6N)
Notes de conception
The EP1S20F484I6N requires a 1.5 V core supply (VCCINT) capable of delivering up to 3-5 A at full utilization, plus multiple VCCIO rails (1.5 V, 1.8 V, 2.5 V, 3.3 V typical) for each I/O bank. Use a low-impedance power distribution network with decoupling capacitors placed within 100 mils of every power pin, and isolate analog and digital grounds with a single-point connection. The Quartus II PowerPlay tool provides pre-layout power estimates that should drive your regulator selection and thermal budgeting.
The 484-FBGA FineLine BGA has a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvias or via-in-pad construction for inner-row escape. Fanout follows a dog-bone or staggered-via pattern; signal layers must maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS. Reference the Altera AN 114: Stratix Device Package Information and AN 315: BGA PCB Design Guidelines for detailed stack-up and routing recommendations. Keep all BGA balls connected to planes or traces - no floating or unused balls.
A frequent mistake is configuring the Stratix with an unsupported configuration mode or missing the nCONFIG pull-up resistor. The nCONFIG, nSTATUS, and CONF_DONE signals must be pulled high to VCCIO of the configuration bank through 10 kohm resistors, and a configuration device (EPCS4, EPCS16, or EPC16) or download cable must be present at power-up. Verify JTAG chain integrity with the Quartus programmer before attempting SRAM configuration. Designers also frequently overlook MSL 3 moisture sensitivity - the FBGA package must be baked before reflow if exposure exceeds the floor-life limit.
Differential pair routing for LVDS must maintain length matching within 20 mils and keep 100 ohm differential impedance with no more than two vias per pair. Use ground-copex stripline or microstrip with reference planes unbroken beneath the entire pair. For source-synchronous buses (e.g., DDR, Camera Link), match clock-to-data skew at the FPGA pins and apply Quartus II's delay-chain tuning to align strobe capture windows. Keep high-speed traces away from I/O bank power inductors and switching regulators by at least 200 mils.
Informations de conformité
Lead-free and RoHS-compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGAs are typically not auto-qualified at the device level). Halogen-free status not stated on the distributor listings reviewed.
