EP1S20F484I6N - Stratix FPGA, 18,460 LEs, 484-FBGA | Intel / Altera
MPN: EP1S20F484I6N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $896.66 | $896.66 |
| 10 | $870 | $8,700.00 |
| 50 | $845 | $42,250.00 |
| 100 | $820 | $82,000.00 |
| 250 | $795 | $198,750.00 |
Drop-in alternatives for EP1S20F484I6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1S20F484C7N
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View Datasheet βEP1S20F484C6N
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View Datasheet βEP1S20F484C5N
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View Datasheet βEP1S20F484C7
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View Datasheet βEP1S10F484I6N
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View Datasheet βEP1S20F484I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 18,460 |
| Total RAM Bits | 1,669,248 |
| User I/O Count | 361 |
| Number of LABs/CLBs | 1846 |
| Package | 484-FBGA, FineLine BGA |
| Operating Temperature | -40C to +85C (Industrial) |
| Voltage - Supply (Core) | 1.5 V |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free) |
| MSL Level | 3 |
| Process Technology | 0.13 micron |
| Embedded Memory | TriMatrix (RAM/ROM/FIFO) |
| PLL Count | 6 |
| DSP Blocks | Yes (dedicated multipliers) |
| Configuration Method | SRAM, JTAG, Passive Serial |
EP1S20F484I6N Pin Configuration
| Pin A1 | I/O β User I/O pin (bank-dependent voltage) |
| Pin A2 | I/O β User I/O pin |
| Pin A3 | I/O β User I/O pin |
| Pin A4 | I/O β User I/O pin |
| Pin A5 | I/O β User I/O pin |
| Pin A6 | I/O β User I/O pin |
| Pin A7 | I/O β User I/O pin |
| Pin A8 | I/O β User I/O pin |
| Pin A9 | I/O β User I/O pin |
| Pin A10 | I/O β User I/O pin |
| Pin A11 | I/O β User I/O pin |
| Pin A12 | I/O β User I/O pin |
| Pin B1 | I/O β User I/O pin |
| Pin B2 | VCCIO1 β I/O bank 1 supply |
| Pin B3 | VCCIO1 β I/O bank 1 supply |
| Pin B4 | GND β Ground |
| Pin B5 | GND β Ground |
| Pin B6 | GND β Ground |
| Pin B7 | GND β Ground |
| Pin B8 | I/O β User I/O pin |
| Pin B9 | I/O β User I/O pin |
| Pin B10 | I/O β User I/O pin |
| Pin B11 | I/O β User I/O pin |
| Pin B12 | I/O β User I/O pin |
| Pin C1 | I/O β User I/O pin |
| Pin C2 | I/O β User I/O pin |
| Pin C3 | GND β Ground |
| Pin C4 | I/O β User I/O pin |
| Pin C5 | I/O β User I/O pin |
| Pin C6 | I/O β User I/O pin |
| Pin C7 | I/O β User I/O pin |
| Pin C8 | I/O β User I/O pin |
| Pin C9 | GND β Ground |
| Pin C10 | I/O β User I/O pin |
| Pin C11 | I/O β User I/O pin |
| Pin C12 | I/O β User I/O pin |
| Pin D1 | VCCINT β Core supply 1.5 V |
| Pin D2 | I/O β User I/O pin |
| Pin D3 | I/O β User I/O pin |
| Pin D4 | I/O β User I/O pin |
| Pin D5 | VCCIO2 β I/O bank 2 supply |
| Pin D6 | VCCIO2 β I/O bank 2 supply |
| Pin D7 | I/O β User I/O pin |
| Pin D8 | I/O β User I/O pin |
| Pin D9 | I/O β User I/O pin |
| Pin D10 | I/O β User I/O pin |
| Pin D11 | I/O β User I/O pin |
| Pin D12 | VCCINT β Core supply 1.5 V |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F484I6N is suitable for 6 applications: High-Speed DSP Pipeline (FIR / FFT), ASIC Prototyping and Emulation, Communications Infrastructure (SONET/SDH, Protocol Bridging), Industrial Imaging and Machine-Vision Pre-Processing, PCI/PCI-X Add-In Card Controller, Legacy Industrial Control and Test Equipment.
High-Speed DSP Pipeline (FIR / FFT)
The EP1S20F484I6N's 18,460 logic elements combined with dedicated multiplier-based DSP blocks make it well-suited for high-throughput FIR filters, FFT engines, and baseband processing. Each DSP block accelerates 9-bit x 9-bit multiplies, and the TriMatrix embedded RAM (1.67 Mbits total) holds coefficient banks and ping-pong data buffers for streaming pipelines. In a typical 256-tap FIR running at 200 MHz, the device consumes roughly 30-40% of its DSP resources with headroom for cascaded stages, while the 484-FBGA package accommodates wide parallel buses for I/Q sample streams and offers generous ground balls for low-noise power delivery. Compared with a DSP processor, this FPGA delivers 10x-100x throughput per watt for fixed-coefficient filters.
Recommended
ASIC Prototyping and Emulation
With 18,460 LEs, 1.67 Mbits of distributed RAM, and 361 user I/Os, the EP1S20F484I6N served as a popular mid-density ASIC prototyping platform in the early 2000s. Engineers partition ASIC RTL across multiple Stratix devices using boundary-scan chains, leveraging the 484-FBGA package's high I/O count to connect sibling FPGAs in a multi-FPGA emulator. The 1.5 V core and 0.13-micron process yield predictable timing correlation with the target ASIC library when back-annotated SDFs are applied. Industrial temperature grade (-40C to +85C) allows prototyping of automotive and ruggedized designs. Modern migrations often target Stratix IV EP4SGX230 or Stratix 10 for larger ASICs.
Recommended
Communications Infrastructure (SONET/SDH, Protocol Bridging)
The EP1S20F484I6N was deployed in telecom line cards for SONET/SDH framer functions, HDLC/PPP encapsulation, and protocol bridging between TDM and packet networks. Its 6 PLLs support multiple clock domains (line rate, system, payload), while LVDS I/O enables source-synchronous links to network processors and SERDES framer ICs at speeds up to 840 Mbps per LVDS pair. The 361 I/O accommodate 32-bit data buses plus extensive framing and timing overhead. Industrial temperature rating suits outdoor cabinet deployments. Power estimation with Quartus PowerPlay is essential because the 1.5 V core can draw several amps at full utilization.
Recommended
Industrial Imaging and Machine-Vision Pre-Processing
Industrial cameras and inspection systems leveraged the EP1S20F484I6N for real-time image pre-processing: Bayer demosaicing, color-space conversion, Sobel edge detection, and histogram equalization. The TriMatrix RAM acts as line buffers for multi-tap pipelined kernels, and the 361 I/Os connect directly to Camera Link or LVDS-based image sensors without external bridge chips. Industrial temperature grade (-40C to +85C) suits factory-floor deployments, and the 484-FBGA's low-inductance power/ground balls reduce switching noise that would otherwise degrade ADC SNR on the analog front end. Throughput exceeds 200 MPixels/s at 100 MHz pixel clock with 3x3 convolution kernels.
Recommended
PCI/PCI-X Add-In Card Controller
The EP1S20F484I6N's 361 I/Os and PCI-compliant I/O buffers make it suitable for PCI 32/64-bit and PCI-X add-in card designs where a custom bus-master controller or co-processor is needed. The device implements PCI target and master state machines in logic, exposes a 64-bit data bus plus arbitration/control signals, and supports 66 MHz PCI-X via its PLL-driven clock domain. The 484-FBGA package provides enough I/O for PCI signals plus local SRAM, Flash, and a companion ASIC. With Quartus II, designers can instantiate PCI MegaCore functions to accelerate verification.
Recommended
Legacy Industrial Control and Test Equipment
The EP1S20F484I6N remains in service as a control and timing FPGA inside long-lifecycle industrial test equipment, ATE (automatic test equipment) platforms, and avionics ground stations where re-certification costs prohibit redesign. Its 1.5 V core, 6 PLLs, and 18,460 LEs provide ample logic for multi-axis motion controllers, custom timing generators, and protocol analyzers. The 484-FBGA package is mechanically robust and supports industrial temperature. Sustainment requires sourcing through obsolete-component distributors like Heisener, Fusion Worldwide, and ICComponents, often with uprated pricing and longer quotations.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F484I6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F484C7N | EP1S20F484C6N | EP1S20F484C5N | EP1S20F484C7 | EP1S10F484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA FineLine | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same | 484-FBGA FineLine - same |
| Logic Elements | 18,460 | 18,460 (same) | 18,460 (same) | 18,460 (same) | 18,460 (same) | 10,570 (-43%) |
| Total RAM Bits | 1,669,248 | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45%) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -5 (slower) | -7 (faster) | -6 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| User I/O Count | 361 | 361 (same) | 361 (same) | 361 (same) | 361 (same) | 335 (-7%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature range coverage (vs EP1S20F484C7N)
- Mid-range speed grade balance (vs EP1S20F484C5N)
- Higher density than Stratix EP1S10 (vs EP1S10F484I6N)
Design Notes
The EP1S20F484I6N requires a 1.5 V core supply (VCCINT) capable of delivering up to 3-5 A at full utilization, plus multiple VCCIO rails (1.5 V, 1.8 V, 2.5 V, 3.3 V typical) for each I/O bank. Use a low-impedance power distribution network with decoupling capacitors placed within 100 mils of every power pin, and isolate analog and digital grounds with a single-point connection. The Quartus II PowerPlay tool provides pre-layout power estimates that should drive your regulator selection and thermal budgeting.
The 484-FBGA FineLine BGA has a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvias or via-in-pad construction for inner-row escape. Fanout follows a dog-bone or staggered-via pattern; signal layers must maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS. Reference the Altera AN 114: Stratix Device Package Information and AN 315: BGA PCB Design Guidelines for detailed stack-up and routing recommendations. Keep all BGA balls connected to planes or traces - no floating or unused balls.
A frequent mistake is configuring the Stratix with an unsupported configuration mode or missing the nCONFIG pull-up resistor. The nCONFIG, nSTATUS, and CONF_DONE signals must be pulled high to VCCIO of the configuration bank through 10 kohm resistors, and a configuration device (EPCS4, EPCS16, or EPC16) or download cable must be present at power-up. Verify JTAG chain integrity with the Quartus programmer before attempting SRAM configuration. Designers also frequently overlook MSL 3 moisture sensitivity - the FBGA package must be baked before reflow if exposure exceeds the floor-life limit.
Differential pair routing for LVDS must maintain length matching within 20 mils and keep 100 ohm differential impedance with no more than two vias per pair. Use ground-copex stripline or microstrip with reference planes unbroken beneath the entire pair. For source-synchronous buses (e.g., DDR, Camera Link), match clock-to-data skew at the FPGA pins and apply Quartus II's delay-chain tuning to align strobe capture windows. Keep high-speed traces away from I/O bank power inductors and switching regulators by at least 200 mils.
Compliance Information
Lead-free and RoHS-compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGAs are typically not auto-qualified at the device level). Halogen-free status not stated on the distributor listings reviewed.
