EP1S20F484C6N - Stratix FPGA 18,460 LEs, 484-FCBGA | Intel
MPN: EP1S20F484C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $591.14 | $591.14 |
| 10 | $555 | $5,550.00 |
| 100 | $510 | $51,000.00 |
| 500 | $475 | $237,500.00 |
| 1,000 | $440 | $440,000.00 |
Drop-in alternatives for EP1S20F484C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F484C5N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1S10F484C6N
✅ Drop-In✓ In Stock
$226.31 / Unit
View Datasheet →EP1S10F484C5N
✅ Drop-In✓ In Stock
$52 / Unit
View Datasheet →EP1S10F484C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP1S20F484C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 18,460 |
| Embedded Memory | 1,669,248 bits |
| User I/O Pins | 361 |
| Package | 484-Ball FCBGA (23 x 23 mm, 1.0 mm pitch) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Speed Grade | 6 |
| Maximum Internal Clock | 450.05 MHz |
| Configuration Interface | JTAG (IEEE 1149.1), Serial/Parallel (AS/PS) - EPC device compatible |
| Mounting Type | Surface Mount |
EP1S20F484C6N 484-ball fcbga (23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S20F484C6N (484-ball fcbga (23 x 23 mm, 1.0 mm pitch) package) with 361 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F484C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 361 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F484C6N is suitable for 6 applications: Telecom Baseband Signal Processing, High-Speed Imaging and Video Pipelines, ASIC Prototyping and Emulation, Industrial Motion Control Co-Processor, Test and Measurement Instrumentation, Legacy Telecom Backplane Bridging.
Telecom Baseband Signal Processing
The EP1S20F484C6N is well suited for telecom baseband signal processing chains because its 18,460 logic elements and DSP blocks can implement FIR filters, channelizers, and symbol-rate converters at the 450 MHz internal clock rate while staying within 1.5 V core power budgets. The 1,669,248 bits of TriMatrix embedded memory provides on-chip buffering for I/Q sample streams, avoiding external memory round-trips that limit throughput. The 361 user I/O pins are sufficient to fan out to multiple SERDES companion chips, external memories, and backplane interfaces. Compared with a microcontroller-DSP combination, the FPGA delivers deterministic latency for synchronous protocols such as CPRI or OBSAI. Pair the device with EPC2 configuration PROM for production deployment.
Recommended
High-Speed Imaging and Video Pipelines
The EP1S20F484C6N's 18,460 LEs and embedded TriMatrix memory make it a strong fit for high-speed imaging pipelines where multiple camera sensors stream pixel data into on-chip line buffers and color-space converters. The 361 user I/O pins accommodate parallel LVCMOS/LVDS camera links, external DDR SDRAM interfaces, and DVI/HDMI output bridges. At 450 MHz internal clocks, the FPGA can sustain pixel-clock-domain processing for 1080p60 video without external frame-buffer latency. The 1.5 V core on 130 nm CMOS keeps static power reasonable for vision-instrumentation enclosures. Choose the C5N variant if timing closure requires an extra speed bin margin.
Recommended
ASIC Prototyping and Emulation
The EP1S20F484C6N with 18,460 logic elements and 1,669,248 bits of embedded memory is appropriate for ASIC prototyping where the design-under-test fits within mid-density Stratix logic. Designers can partition an ASIC RTL across multiple Stratix devices using JTAG-based multi-FPGA configuration and the Quartus II LogicLock feature. The 484-ball FCBGA exposes enough user I/O to map ASIC boundary-scan pins and inter-FPGA handshake signals. Commercial 0 to 85 C operation matches typical lab environments. Engineers should plan for the 1.5 V core supply, which requires a separate LDO or POL regulator in addition to the 3.3 V I/O rail.
Recommended
Industrial Motion Control Co-Processor
The EP1S20F484C6N serves as a co-processor in industrial motion-control systems where deterministic multi-axis servo loops and encoder decoding must run in parallel with a host PLC. Its 18,460 logic elements can host multiple PID loops, S-curve generators, and quadrature-decoder channels concurrently. The 361 user I/O pins accommodate encoder inputs, PWM outputs, and emergency-stop chains. Embedded DSP blocks accelerate park/clarke transforms for field-oriented control of three-phase motors. The commercial 0 to 85 C range covers most factory-floor enclosures; for harsher environments, the EP1S20F484I6N industrial variant is preferred.
Recommended
Test and Measurement Instrumentation
The EP1S20F484C6N fits test-and-measurement instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators because its 18,460 logic elements can implement multiple protocol-decoder cores in parallel. The 1,669,248 bits of TriMatrix memory serve as deep capture buffers for sampling events at hundreds of MHz. The 361 user I/O pins provide fan-out to high-speed probes, ADC/DAC companion chips, and front-panel connectors. Quartus II supports SignalTap II logic-analyzer IP, enabling in-system verification without external scopes. Engineers should reserve a JTAG header for boundary-scan test access during manufacturing.
Recommended
Legacy Telecom Backplane Bridging
The EP1S20F484C6N is suitable as a legacy telecom backplane bridging device where existing line cards use proprietary bus protocols implemented in Stratix. Its 361 user I/O pins interface to parallel backplane connectors, while the 18,460 LEs implement protocol translation, parity generation, and bus-arbitration logic. The 1.5 V core draws low quiescent power, an important consideration for line cards that must remain within NEBS thermal envelopes. The NRND lifecycle status means new backplane designs should consider migration to Stratix II or Cyclone V, but for maintenance and spares the EP1S20F484C6N remains serviceable.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F484C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F484C5N | EP1S10F484C6N | EP1S10F484C5N | EP1S10F484C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FCBGA (23x23 mm, 1.0 mm pitch) | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Logic Elements | 18,460 | 18,460 (same) | 10,570 (-43%) | 10,570 (-43%) | 10,570 (-43%) |
| Embedded Memory | 1,669,248 bits | 1,669,248 bits (same) | [DATA_NEEDED: typically ~920 Kbits] | [DATA_NEEDED: typically ~920 Kbits] | [DATA_NEEDED: typically ~920 Kbits] |
| User I/O Pins | 361 | 361 (same) | [DATA_NEEDED: ~336] | [DATA_NEEDED: ~336] | [DATA_NEEDED: ~336] |
| Speed Grade | 6 | 5 (faster) | 6 (same) | 5 (faster) | 7 (slower) |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Core Supply Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Process Technology | 130 nm CMOS | 130 nm CMOS (same) | 130 nm CMOS (same) | 130 nm CMOS (same) | 130 nm CMOS (same) |
Key Differentiators
- Higher logic density than the EP1S10F484C6N in the same 484-FCBGA footprint (vs EP1S10F484C6N)
- Same-density faster speed grade available as a true drop-in (vs EP1S20F484C5N)
- Mature Quartus II toolchain with extensive IP library (vs Cross-brand FPGA equivalents)
Design Notes
The EP1S20F484C6N requires a tightly regulated 1.5 V core supply capable of delivering peak transient currents of approximately 1 to 2 A depending on clock activity and logic utilization. Use a low-impedance multi-layer PCB power plane with decoupling capacitors (typically 100 uF bulk + 10 uF + 0.1 uF per power pin cluster) within 100 mils of every VCCINT ball. The I/O banks can operate at 3.3 V (LVTTL/LVCMOS) or 2.5 V depending on VCCIO bank supply, so multiple LDO rails are needed. Power sequencing should bring up VCCINT before VCCIO to avoid latch-up.
The 484-ball FCBGA at 1.0 mm pitch requires a minimum of 6 PCB layers with controlled-impedance routing for high-speed signals. Fan-out from the BGA should use microvia or via-in-pad technology for the inner balls to escape the dense array; standard through-hole vias typically do not fit between 1.0 mm pitch balls. Match the PCB coefficient-of-thermal-expansion (CTE) to the BGA package (~7 ppm/C) to avoid solder-joint fatigue - a 6-layer FR4 stackup with 0.5 oz copper on outer layers is recommended.
Three pitfalls are commonly seen when bringing up the EP1S20F484C6N: (1) failing to drive MSEL pins to the correct mode-select pattern - leaving them floating causes configuration to hang; (2) omitting the 25 ohm series-termination resistors on high-speed global clock pins, which causes reflections and double-clocking; (3) connecting JTAG TDI/TDO through a level shifter that adds too much delay, breaking the IEEE 1149.1 chain. Always verify CONF_DONE goes high after configuration before releasing nSTATUS.
At full logic utilization and 450 MHz clock rate, the EP1S20F484C6N can dissipate 3 to 5 W. The FCBGA-484 package theta_JA is approximately 12 C/W with adequate PCB copper pour and thermal vias under the exposed pad. Without thermal vias, junction temperature can exceed 100 C at room ambient, causing speed degradation or thermal shutdown. Estimate: with 4 W dissipation and theta_JA = 12 C/W, junction rises 48 C above 25 C ambient - well within the 85 C commercial limit, but margin shrinks in enclosed chassis.
Compliance Information
Compliance flags for the EP1S20F484C6N were not explicitly listed in the verified web data. Engineers should confirm RoHS/lead-free status by requesting a material declaration from Intel/Altera or by reviewing the device-specific datasheet, since the part predates many current compliance mandates.
