EP1S20F484C5N - Stratix FPGA 18,460 LEs FBGA-484 | Intel
MPN: EP1S20F484C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $118 | $118,000.00 |
Drop-in alternatives for EP1S20F484C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F484C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP1S20F484C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$440 / Unit
View Datasheet →EP1S20F484I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$795 / Unit
View Datasheet →EP1S20F484C6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10F484C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52 / Unit
View Datasheet →EP1S20F484C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix (EP1S20) |
| Logic Elements | 18,460 |
| Total RAM Bits | 1,669,248 |
| User I/Os | 361 |
| LABs | 1,846 |
| Process Node | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C5 |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package | 484-ball FBGA (FBGA-484) |
| Package Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Lead Free | Yes (FBGA-484) |
| Configuration Modes | PS, FPP, JTAG |
EP1S20F484C5N 23 x 23 mm Pin Configuration Guide
Complete pinout information for EP1S20F484C5N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F484C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F484C5N is suitable for 6 applications: Telecommunications Line Cards, Software-Defined Radio Baseband, Video Format Conversion, Test and Measurement Instrumentation, Industrial Motion Control, High-Speed Serial Protocol Bridging.
Telecommunications Line Cards
The EP1S20F484C5N's 18,460 logic elements and 1,669,248 RAM bits provide the DSP and buffering density required for telecommunications line-card datapaths. Its dedicated 18x18 hardware multipliers accelerate Viterbi, Reed-Solomon, and turbo decoding at wire speed, while the 361 user I/Os support multiple S/PDIF, E1/T1, or Ethernet MAC interfaces without external bus multiplexing. The FBGA-484 footprint integrates cleanly into line-card PCBs that already use Altera tooling, and the LVDS capability at 840 Mbps enables glueless connection to serializer/deserializer chips. The part's commercial 0 to 85 C range is sufficient for climate-controlled central-office deployments.
Recommended
Software-Defined Radio Baseband
The EP1S20F484C5N is well matched to software-defined radio (SDR) baseband processing where the Stratix DSP blocks implement channel filters, FFT/iFFT engines, and digital up/down converters in hardware. The 1,669,248 RAM bits hold complex-coefficient lookup tables and cyclic-prefix buffers, eliminating external SRAM. The 130 nm CMOS fabric is sufficient for baseband clock rates up to several hundred MHz, while the LVDS I/Os interface directly to ADC/DAC converters such as the AD9862 or AD6645. Pin compatibility across the Stratix EP1S20 family lets designers iterate between EP1S20 and EP1S10 densities using the same PCB.
Recommended
Video Format Conversion
The 18,460 logic elements and 1,669,248 RAM bits of the EP1S20F484C5N are well suited to video format converters that rescale, deinterlace, and color-space-convert SD/HD streams in real time. The TriMatrix memory blocks implement line buffers and frame stores without external SDRAM in many designs. The 361 I/Os support multiple video ports (BT.656, BT.1120, DVI) plus overlay and alpha-blending buses. Designers also use the FPGA's embedded multipliers for polyphase scaler kernels. Quartus II video IP cores target the Stratix EP1S20 platform directly.
Recommended
Test and Measurement Instrumentation
The EP1S20F484C5N provides the logic density and DSP bandwidth needed for digital oscilloscope acquisition paths, arbitrary waveform generators, and protocol analyzers. Its 361 user I/Os support parallel LVDS or LVCMOS probe buses, while the embedded multipliers implement real-time FFT, decimation, and arbitrary filter responses. The FBGA-484 footprint is friendly to multi-board instruments where the FPGA drives both the analog front-end and the display controller. Stratix EP1S20 reference designs from Altera include oscilloscope front ends and protocol analyzers.
Recommended
Industrial Motion Control
The EP1S20F484C5N's combination of hardware multipliers, TriMatrix memory, and 361 I/Os suits multi-axis servo drives, CNC controllers, and robotic controllers. The DSP blocks execute PID loops and field-oriented control algorithms at sub-microsecond rates, while the LVDS I/Os interface directly to resolver-to-digital converters and encoder feedback. The commercial 0 to 85 C range covers most factory-floor enclosures; for harsher environments the pin-compatible EP1S20F484I6N industrial variant is preferred. Quartus II motor-control IP accelerates time-to-market for these designs.
Recommended
High-Speed Serial Protocol Bridging
Although the EP1S20F484C5N lacks the dedicated transceivers of Stratix GX, its LVDS I/Os at 840 Mbps can still bridge SPI, I2C, UART, and parallel protocols between ASICs, microcontrollers, and backplane connectors. The 1,669,248 RAM bits hold packet buffers and protocol state machines, while the 18,460 LEs implement bus-arbitration and clock-domain crossing logic. The FBGA-484 footprint integrates into dense backplane cards. For designs that need multi-gigabit transceivers, the Stratix GX family (EP1SGX) is the migration path, but for sub-gigabit bridging the EP1S20 remains a cost-effective choice.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F484C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F484C7N | EP1S20F484C6N | EP1S20F484I6N | EP1S20F484C6 | EP1S10F484C5N |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | Stratix (EP1S20) | Stratix EP1S20 - same | Stratix EP1S20 - same | Stratix EP1S20 - same | Stratix EP1S20 - same | Stratix EP1S10 - lower density |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 10,570 (-43%) |
| Total RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 920,448 (-45%) |
| User I/Os | 361 | 361 | 361 | 361 | 361 | 336 (-7%) |
| Speed Grade | C5 | C7 (faster) | C6 (faster) | I6 | C6 (faster) | C5 - same |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-die drop-in with faster speed grade (vs EP1S20F484C7N)
- Industrial temperature drop-in option (vs EP1S20F484I6N)
- Same-family density upgrade path (vs EP1S10F484C5N)
Design Notes
The EP1S20F484C5N uses a 1.0 mm pitch FBGA-484 footprint that requires microvia or via-in-pad escape for the inner balls. Use a 4-layer minimum stack-up with dedicated VCCINT (1.5 V) and GND planes. Per the Stratix Device Handbook, place bulk decoupling capacitors within 100 mils of every power ball, and route high-speed LVDS pairs with matched lengths (mismatch under 50 ps) to avoid skew-induced errors. Estimated: total via count for full fanout is roughly 484 vias plus escape microvias; design rule checks must be run before tape-out.
The 23 x 23 mm FBGA-484 package dissipates between 1 W (typical) and 4 W (full utilization) at commercial ambient. Theta-JA for the FBGA-484 on a JEDEC 4-layer test board is approximately 14 C/W with thermal vias under the die pad. Estimated: at 3 W dissipation the junction rises 42 C above ambient, leaving 43 C headroom to the 85 C commercial limit - acceptable but with limited margin. For high-utilization designs, add a heat spreader or forced-air cooling.
Avoid using the EP1S20F484C5N in new designs because it is obsolete and last-time-buy has closed. Designers commonly forget that Stratix I configuration bitstreams are NOT compatible with Stratix II/III; migrating to EP2S20 or EP3S requires full re-implementation in Quartus II. Also, JTAG ID codes differ across speed grades (C5 vs C6 vs C7), so programmers must use the exact device ID when loading via JTAG - using a generic EP1S20 ID will fail boundary-scan.
LVDS signaling on the EP1S20F484C5N runs up to 840 Mbps per the Stratix Device Handbook. Use 100 ohm differential impedance traces with matched pair lengths, and place a 100 ohm termination resistor within 250 mils of the receiver pin. Do not route LVDS pairs across plane splits - the return-path discontinuity destroys the differential signal. For SSTL/HSTL memory interfaces, follow the JEDEC termination and length-matching guidelines exactly.
Compliance Information
FBGA-484 marked lead-free per datasheet. RoHS compliance indicated by Intel/Altera product records; REACH and halogen-free status not explicitly stated in the verified web data.
