EP1S10F484I6N - Stratix 10,570 LEs FPGA 484-FBGA | Intel (Altera)
MPN: EP1S10F484I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $474.02 | $474.02 |
| 10 | $432.5 | $4,325.00 |
| 100 | $388.1 | $38,810.00 |
| 500 | $345.75 | $172,875.00 |
| 1,000 | $305.2 | $305,200.00 |
Drop-in alternatives for EP1S10F484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F484C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP1S10F484C7
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1S10F484C6N
✅ Drop-In✓ In Stock
$226.31 / Unit
View Datasheet →EP1S10F484C5N
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$52 / Unit
View Datasheet →EP1S10F484I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (Bits) | 920,448 |
| DSP Blocks | 48 |
| Maximum User I/O | 335 |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Number of PLLs | 6 |
| Operating Temperature | 0C to +85C (Industrial) |
| Package | 484-ball FBGA (FCBGA), 23 x 23 mm, 1 mm pitch |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Peak Reflow Temperature | 245 C |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Internal Core Speed | up to 450 MHz |
| Logic Family | CMOS |
| Terminal Finish | Tin-Silver-Copper (SnAgCu) |
EP1S10F484I6N 484-ball fbga (fcbga), 23 x 23 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F484I6N (484-ball fbga (fcbga), 23 x 23 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F484I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F484I6N is suitable for 6 applications: Software-Defined Radio (SDR) Baseband Processing, Telecom Line-Card Glue Logic and Packet Processing, High-Speed Video and Image Processing Pipeline, Radar and Lidar Signal Acquisition Front-End, Industrial Test and Measurement Chassis, Medical Imaging Pre-Processing Back-End.
Software-Defined Radio (SDR) Baseband Processing
The EP1S10F484I6N's 10,570 logic elements and 48 dedicated DSP blocks deliver the parallel multiply-accumulate throughput needed for SDR baseband processing. Its 920,448 bits of embedded TriMatrix memory - split across M512, M4K, and M-RAM blocks - hold FIR filter coefficients, FFT twiddle factors, and packet buffers without external SRAM, reducing PCB complexity and latency. The six PLLs generate the multiple sample clocks (e.g. 122.88 MHz for LTE) required by multi-standard radio designs, while the 335 user I/O pins connect to high-speed ADC/DAC front-ends. Power budget at typical 200 MHz operation is dominated by dynamic switching; the 1.5 V core supply simplifies power-tree design versus newer 1.0 V FPGAs.
Recommended
Telecom Line-Card Glue Logic and Packet Processing
Stratix FPGAs were designed for telecom infrastructure, and the EP1S10F484I6N specifically targets line cards that need a high I/O count and flexible I/O standards. The 335 user I/Os accept LVDS, LVPECL, HSTL, and SSTL interfaces to framers, mappers, SERDES, and network processors, eliminating discrete glue logic. Its 450 MHz core performance runs header classification, CRC, and traffic-shaping algorithms in parallel, while the JTAG configuration interface enables in-system field updates for protocol changes. Industrial temperature grade (0-85C) suits central-office and outdoor-cabinet deployments.
Recommended
High-Speed Video and Image Processing Pipeline
The 48 dedicated DSP blocks each contain four 18x18 multipliers plus adders, enabling real-time video-processing kernels such as 2D filters, color-space conversion, and motion estimation at full HD resolutions. The 920 Kbits of on-chip memory hold line buffers and DCT coefficients without off-chip DRAM round-trips, eliminating the latency and bandwidth bottlenecks that limit video throughput. The 335 I/Os comfortably connect to CameraLink, HDMI transmitters, and DDR memory controllers. Industrial temperature grade suits machine-vision factory-floor cameras and broadcast equipment.
Recommended
Radar and Lidar Signal Acquisition Front-End
The EP1S10F484I6N's combination of high-speed serial LVDS (840 Mbps), parallel 335 I/O count, and embedded DSP blocks makes it well-suited to radar pulse compression and lidar time-of-flight processing. The PLLs generate the precise 100+ MHz ADC sample clocks required by phased-array beamforming, and the TriMatrix memory holds chirp-replica tables for matched-filter correlation. Industrial 0-85C operation supports outdoor defense and automotive test installations. Power consumption at 200 MHz with moderate DSP utilization runs ~3-4 W typical, manageable with passive heatsinking.
Recommended
Industrial Test and Measurement Chassis
Test-and-measurement equipment such as protocol analyzers, logic-analyzer backends, and automated-test rigs demand high pin-count FPGAs that can interface to many parallel buses simultaneously. The Stratix EP1S10F484I6N's 335 I/Os handle multiple DUT channels in parallel, while its 6 PLLs generate the multi-rate clocks required for JTAG, SWD, I2C, SPI, and parallel-bus capture. On-chip DSP blocks accelerate post-processing such as eye-diagram statistics, and TriMatrix memory stores captured waveforms before offload to host PC. Industrial temperature grade supports bench-top and chassis-mounted test gear.
Recommended
Medical Imaging Pre-Processing Back-End
Medical imaging modalities - ultrasound, endoscopy, and digital X-ray - generate high-bandwidth data streams that require real-time beamforming, color-Doppler, and image reconstruction. The EP1S10F484I6N's DSP block density handles ultrasound beamformer requirements at 4-16 channels, while the TriMatrix memory stores line buffers for image reconstruction. Its industrial 0-85C operating range suits cart-based and stationary imaging equipment. JTAG configuration enables post-deployment firmware updates that are critical for medical-device lifecycle management.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F484C7N | EP1S10F484C7 | EP1S10F484C6N | EP1S10F484C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (23x23 mm, 1 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Operating Temperature | 0C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | 6 | 7 (fastest) | 7 (fastest) | 6 | 5 (slowest) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits |
| DSP Blocks | 48 | 48 | 48 | 48 | 48 |
| Number of PLLs | 6 | 6 | 6 | 6 | 6 |
| Maximum User I/O | 335 | 335 | 335 | 335 | 335 |
Key Differentiators
- Industrial 0-85C temperature grade for harsh-environment deployment (vs EP1S10F484C7N)
- Balanced logic, memory, and DSP density for mid-complexity designs (vs EP1S20F484 / EP1S30F484)
- Standard 484-FBGA ball pitch enables mature PCB processes (vs Stratix II EP2S15F484C8 (256-pin BGA option))
Design Notes
The EP1S10F484I6N requires four distinct 1.5 V rails: VCCINT (core), VCCIO (I/O banks, set per bank to 1.5/1.8/2.5/3.3 V), VCC_PLL (PLL analog - must be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF capacitors), and VCC_PD (configuration pre-driver). VCCINT and VCCIO must ramp monotonically; VCCINT must reach stable voltage before VCCIO per Stratix Hardware Reference manual. Use a power sequencer IC to enforce ordering.
The 484-ball FBGA has 1.0 mm ball pitch requiring microvia (HDI) PCB stack-up, ideally 1+N+1 with 4-6 layer construction. Escape routing requires 0.5 mm drill microvias to inner layers. The thermal pad array under the package (typical of Stratix flip-chip BGA) must be soldered to a copper pour with thermal vias (0.3 mm pitch, 12+ vias) to dissipate the ~3-5 W typical core power. Signal-integrity simulation with the IBIS model is recommended for LVDS at 600+ Mbps.
Stratix configuration memory is volatile - the FPGA loses all logic on power-down and must be reconfigured via JTAG or EPC configuration memory on every boot. Forcing the nCONFIG pin low at inappropriate times can leave the device in an unknown state. The MSEL[2:0] pins select configuration mode and must be pulled correctly; an incorrect setting causes configuration failure. Finally, the JTAG chain must be terminated to 1.5 V (not 3.3 V) to avoid I/O stress.
Stratix LVDS transmitters and receivers support up to 840 Mbps, but traces longer than ~5 inches require 100 ohm differential impedance control and matched length pairs within 5 ps. Use the LVDS-specific Altmega OBUF/IBUF primitives instead of generic I/O buffers; misconfigured LVDS termination can cause bit-error rates 10-100x worse than expected. For source-synchronous buses, place the FPGA and the companion ASIC/ADC in matched I/O banks with identical VCCIO.
Compliance Information
Terminal finish Tin-Silver-Copper (SnAgCu) per Partstack data is consistent with lead-free SMT; RoHS, REACH, AEC-Q100 status not stated in verified web data. Industrial grade (I-suffix) extends operating temperature to 85C but is not an automotive qualification.
