EP1S20F672I7 - Stratix FPGA, 18,460 LEs, 672-BGA | Intel / Altera
Référence : EP1S20F672I7 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 250 | $213.75 | $53 437,50 |
| 500 | $199.5 | $99 750,00 |
EP1S20F672I7 Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy of integrated circuits, FPGAs sit between standard logic devices (ASICs, CPLDs) and software-programmable processors: like ASICs they offer hardware-level parallelism and deterministic timing, but unlike ASICs they can be re-programmed in the field. The Stratix family was Intel/Altera's first-generation high-performance FPGA platform, succeeding the APEX series and bridging to the Stratix II/GX/Cyclone families.
Key features of the EP1S20F672I7 include a maximum of 18,460 logic elements (LEs), 1,669,248 bits of TriMatrix embedded memory organized into three block sizes (512, 4K, and 512K bits), and DSP blocks optimized for high-speed multiplication and accumulation. The device also integrates high-speed LVDS I/O pairs capable of data rates up to several hundred Mbps per channel, multiple PLLs for clock management, and configuration support via JTAG, passive serial, or passive parallel modes. The 672-ball FineLine BGA package provides a compact footprint for high-density PCB designs while maintaining signal integrity for high-speed interfaces.
Architecturally, the EP1S20F672I7 employs a multi-level routing hierarchy with dedicated row/column interconnect, embedded RAM blocks pre-positioned for high-bandwidth data movement, and a logic element based on a 4-input look-up table with a programmable register. This structure supports both fine-grained state machines and coarse-grained data-path designs, making the part a versatile platform for ASIC prototyping, signal processing pipelines, and high-throughput communication protocol engines.
Typical applications include telecommunications base-station channel cards, high-speed serial protocol bridging (SPI-4.2, SFI-4, XAUI), military and aerospace signal processing, video and image processing accelerators, and ASIC emulation platforms where designers validate register-transfer-level (RTL) code before committing to mask production.
When designing with this device, pay close attention to power supply sequencing: the Stratix family requires multiple rails (VCCINT, VCCIO, VCCA, VCCD_PLL) that must ramp within datasheet-defined tolerances to avoid inrush damage. Use the Quartus II design software (version 13.0 SP1 or earlier is recommended for legacy Stratix support) for synthesis, place-and-route, and timing closure. Pin assignments and I/O standard settings should be locked early in the design cycle to avoid re-spin cost.
This page synthesizes distributor pricing, drop-in compatible Stratix-family variants, application examples, and practical design guidance not consolidated in the manufacturer datasheet. All figures are anchored to verified data retrieved on 2026-09-07.
Alternatives de remplacement direct pour EP1S20F672I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S20F672I7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Family, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S20F672I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$198 / unité
Voir la fiche technique →EP1S20F672C7N
✅ Remplacement direct✓ En stock
$109.2 / unité
Voir la fiche technique →EP1S20F672C7
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1S20F672C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$68.9 / unité
Voir la fiche technique →EP1S20F672C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$470 / unité
Voir la fiche technique →EP1S20B672C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$320 / unité
Voir la fiche technique →EP1S20B672C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$425 / unité
Voir la fiche technique →EP1S20F672I7 Valeurs maximales et caractéristiques électriques
| Family | Stratix (first generation) |
| Logic Elements (LEs) | 18,460 |
| Maximum RAM Bits | 1,669,248 |
| Maximum User I/Os | 426 |
| Supply Voltage (VCCINT core) | 1.5 V |
| Logic Family | CMOS |
| Boîtier | 672-BBGA (FineLine BGA), 35 x 35 mm, 1.27 mm pitch |
| Température de fonctionnement | -40C to +85C (industrial grade, I7 suffix) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| Number of Pins / Balls | 672 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | unknown |
| Lead-Free / Finish | SnPb (e0 per Partstack datasheet extract) |
| Niveau MSL | unknown |
| Status | Last Time Buy (per distributor notices) |
Guide de configuration des broches du EP1S20F672I7 672-bbga (fineline bga), 35 x 35 mm, 1.27 mm pitch
Configuration des broches du EP1S20F672I7 (boîtier 672-bbga (fineline bga), 35 x 35 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S20F672I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S20F672I7 convient pour 6 applications: Telecommunications Base-Station Channel Cards, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Speed Protocol Bridging, Video and Image Processing Pipelines, Industrial Test and Measurement.
Telecommunications Base-Station Channel Cards
The EP1S20F672I7 is well suited to 3G/4G base-station channel cards where its 18,460 LEs and 1,669,248 bits of TriMatrix memory enable parallel implementation of chip-rate processing, scrambling, channel coding, and modulation. The 426 user I/Os accommodate multiple antenna paths and backhaul interfaces. Per the Stratix handbook, the device's high-speed LVDS pairs support SPI-4.2, SFI-4, and XAUI PHY interconnect. The industrial -40C to +85C grade matches outdoor cabinet and thermally-challenged enclosure environments common in telecom infrastructure.
Recommandé
ASIC Prototyping and Emulation
The EP1S20F672I7's mid-density 18,460-LE fabric, 672-ball BGA, and Quartus II toolchain support make it a common target for ASIC register-transfer-level (RTL) prototyping. Designers partition large ASICs across multiple Stratix devices using TDM pin multiplexing, validating functional correctness, software/firmware interaction, and timing closure before committing to silicon. Per Intel/Altera application notes, multiple EP1S20F672I7 devices can be time-multiplexed on a single PCB to emulate ASICs up to several million gates, dramatically reducing pre-silicon design risk.
Recommandé
Military and Aerospace Signal Processing
The EP1S20F672I7's industrial -40C to +85C operating range, high DSP block count, and abundant LVDS I/O make it suitable for radar signal processing, electronic warfare, and software-defined radio platforms. The wide TriMatrix memory provides fast data-path buffering between antenna samples and DSP pipelines, while the 1.5 V core delivers predictable power consumption for airborne and shipboard power budgets. Per the Stratix handbook, the device's radiation-tolerant characteristics have been used in satellite payload processing with appropriate derating.
Recommandé
High-Speed Protocol Bridging
The EP1S20F672I7 integrates 426 user I/Os with LVDS support up to 840 Mbps per channel (per the Stratix handbook), enabling high-speed bridging between legacy parallel interfaces (UTOPIA, POS-PHY, SPI-4.2) and newer serial protocols. The dedicated PLLs handle multi-clock-domain bridging, while TriMatrix memory implements elastic buffers to absorb rate mismatches. The 672-ball BGA provides sufficient signal integrity for parallel buses up to 64 bits wide at 200 MHz DDR. This makes the EP1S20F672I7 a popular choice for storage area network (SAN) routers and SONET/SDH muxponder designs.
Recommandé
Video and Image Processing Pipelines
Broadcast and medical imaging systems leverage the EP1S20F672I7's 18,460 LEs and DSP blocks to implement real-time video processing pipelines, including de-interlacing, scaling, color-space conversion, and motion compensation. The TriMatrix memory holds several lines of video for block-level operations, while the 426 user I/Os accept parallel video buses (BT.1120, BT.656, DVI/HDMI bridges). Per Intel application notes, the Stratix DSP blocks can also accelerate JPEG/JPEG2000 and H.264 codec functions. The industrial temperature grade supports medical imaging carts and outdoor broadcast vehicles.
Recommandé
Industrial Test and Measurement
Automated test equipment (ATE) and laboratory instrumentation use the EP1S20F672I7 for pattern generation, signal capture, and protocol-aware triggering. The FPGA's parallel logic fabric generates stimulus waveforms at rates exceeding discrete processor capabilities, while the TriMatrix memory buffers captured samples for downstream analysis. Per the Stratix handbook, the 1.5 V core and configurable I/O standards (LVTTL, LVCMOS, SSTL, HSTL) allow direct interface to virtually any digital logic family. The industrial temperature range supports factory-floor and outdoor test installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S20F672I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S20F672I7N | EP1S20F672C7N | EP1S20F672C7 | EP1S20F672C6N | EP1S20F672C6 | EP1S20B672C7N | EP1S20B672C6N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (FineLine BGA), 35x35 mm, 1.27 mm pitch | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 (B variant) | 18,460 (B variant) |
| RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 (B variant) | 1,669,248 (B variant) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -7 | -7 | -7 | -7 | -6 | -6 | -7 (B variant) | -6 (B variant) |
| Lead-Free / Finish | SnPb (e0) | Lead-free (N suffix) | Lead-free (N suffix) | SnPb (e0) | Lead-free (N suffix) | SnPb (e0) | Lead-free (N suffix) | Lead-free (N suffix) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Industrial temperature grade (-40C to +85C) (vs EP1S20F672C7)
- Same-package drop-in replacement within Intel Stratix family (vs EP1S20F672C7N)
- Higher performance tier than B-variant Stratix devices (vs EP1S20B672C7N)
Notes de conception
The EP1S20F672I7 requires four separate power rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V selectable per bank), VCCA (1.5 V analog supply for PLLs), and VCCD_PLL (digital PLL supply). Per the Stratix handbook, all rails must ramp monotonically and reach within 5% of nominal within 100 ms to avoid inrush damage. Decoupling recommendations: 100 uF bulk + 10 uF + 1 uF + 0.1 uF per rail with the smallest caps placed closest to the balls. Estimated: at 80% utilization and 200 MHz operation, expect 4-6 W core power plus 0.5-1.5 W IO power.
The 672-ball FineLine BGA on 1.27 mm pitch requires 6+ layer PCB stack-up with microvia or via-in-pad technology for breakout. Per Altera AN 315 (BGA design guidelines), maintain a continuous reference plane under the BGA, escape on inner layers through microvias, and stitch GND vias around the perimeter for return path integrity. Use differential pair routing with 100 ohm differential impedance for LVDS signals and 50 ohm single-ended for general-purpose I/O. A 4-layer stack-up is feasible but constrains routing density significantly.
Estimated: Quoting the Quartus II compilation report for IO timing is essential because Speed Grade -7 is approximately 15% faster than -6 but only 5-7% faster than -8. The Stratix handbook recommends running Slow 1100 mV 85C model for industrial-grade timing closure and Slow 1100 mV 0C for commercial. A common pitfall is using the wrong temperature corner: for industrial-grade parts, designs must close timing over the full -40C to +85C range. Also note that BGA rework without proper reflow profile can damage the FineLine substrate - use pre-qualified profiles per J-STD-020.
Informations de conformité
Per Partstack and DigChip datasheet extracts, the EP1S20F672I7 base part uses SnPb finish (JESD-609 e0). Lead-free (RoHS-compliant) variants carry the 'N' suffix, e.g. EP1S20F672I7N. AEC-Q100 not applicable (FPGA, not an automotive-grade IC in the AEC sense).
