EP1S20F672I7 - Stratix FPGA, 18,460 LEs, 672-BGA | Intel / Altera
부품 번호: EP1S20F672I7 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP1S20F672I7 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy of integrated circuits, FPGAs sit between standard logic devices (ASICs, CPLDs) and software-programmable processors: like ASICs they offer hardware-level parallelism and deterministic timing, but unlike ASICs they can be re-programmed in the field. The Stratix family was Intel/Altera's first-generation high-performance FPGA platform, succeeding the APEX series and bridging to the Stratix II/GX/Cyclone families.
Key features of the EP1S20F672I7 include a maximum of 18,460 logic elements (LEs), 1,669,248 bits of TriMatrix embedded memory organized into three block sizes (512, 4K, and 512K bits), and DSP blocks optimized for high-speed multiplication and accumulation. The device also integrates high-speed LVDS I/O pairs capable of data rates up to several hundred Mbps per channel, multiple PLLs for clock management, and configuration support via JTAG, passive serial, or passive parallel modes. The 672-ball FineLine BGA package provides a compact footprint for high-density PCB designs while maintaining signal integrity for high-speed interfaces.
Architecturally, the EP1S20F672I7 employs a multi-level routing hierarchy with dedicated row/column interconnect, embedded RAM blocks pre-positioned for high-bandwidth data movement, and a logic element based on a 4-input look-up table with a programmable register. This structure supports both fine-grained state machines and coarse-grained data-path designs, making the part a versatile platform for ASIC prototyping, signal processing pipelines, and high-throughput communication protocol engines.
Typical applications include telecommunications base-station channel cards, high-speed serial protocol bridging (SPI-4.2, SFI-4, XAUI), military and aerospace signal processing, video and image processing accelerators, and ASIC emulation platforms where designers validate register-transfer-level (RTL) code before committing to mask production.
When designing with this device, pay close attention to power supply sequencing: the Stratix family requires multiple rails (VCCINT, VCCIO, VCCA, VCCD_PLL) that must ramp within datasheet-defined tolerances to avoid inrush damage. Use the Quartus II design software (version 13.0 SP1 or earlier is recommended for legacy Stratix support) for synthesis, place-and-route, and timing closure. Pin assignments and I/O standard settings should be locked early in the design cycle to avoid re-spin cost.
This page synthesizes distributor pricing, drop-in compatible Stratix-family variants, application examples, and practical design guidance not consolidated in the manufacturer datasheet. All figures are anchored to verified data retrieved on 2026-09-07.
드롭인 대체품: EP1S20F672I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S20F672I7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade, Family, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S20F672I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1S20F672C7N
✅ 드롭인✓ 재고 있음
$109.2 / 개
데이터시트 보기 →EP1S20F672C7
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S20F672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$68.9 / 개
데이터시트 보기 →EP1S20F672C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$470 / 개
데이터시트 보기 →EP1S20B672C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$320 / 개
데이터시트 보기 →EP1S20B672C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$425 / 개
데이터시트 보기 →EP1S20F672I7 최대 정격 & 전기적 특성
| Family | Stratix (first generation) |
| Logic Elements (LEs) | 18,460 |
| Maximum RAM Bits | 1,669,248 |
| Maximum User I/Os | 426 |
| Supply Voltage (VCCINT core) | 1.5 V |
| Logic Family | CMOS |
| 패키지 | 672-BBGA (FineLine BGA), 35 x 35 mm, 1.27 mm pitch |
| 동작 온도 | -40C to +85C (industrial grade, I7 suffix) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| Number of Pins / Balls | 672 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | unknown |
| Lead-Free / Finish | SnPb (e0 per Partstack datasheet extract) |
| MSL 레벨 | unknown |
| Status | Last Time Buy (per distributor notices) |
EP1S20F672I7 672-bbga (fineline bga), 35 x 35 mm, 1.27 mm pitch 핀 구성 가이드
EP1S20F672I7(672-bbga (fineline bga), 35 x 35 mm, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S20F672I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S20F672I7 적합 용도: 6 애플리케이션s: Telecommunications Base-Station Channel Cards, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Speed Protocol Bridging, Video and Image Processing Pipelines, Industrial Test and Measurement.
Telecommunications Base-Station Channel Cards
The EP1S20F672I7 is well suited to 3G/4G base-station channel cards where its 18,460 LEs and 1,669,248 bits of TriMatrix memory enable parallel implementation of chip-rate processing, scrambling, channel coding, and modulation. The 426 user I/Os accommodate multiple antenna paths and backhaul interfaces. Per the Stratix handbook, the device's high-speed LVDS pairs support SPI-4.2, SFI-4, and XAUI PHY interconnect. The industrial -40C to +85C grade matches outdoor cabinet and thermally-challenged enclosure environments common in telecom infrastructure.
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ASIC Prototyping and Emulation
The EP1S20F672I7's mid-density 18,460-LE fabric, 672-ball BGA, and Quartus II toolchain support make it a common target for ASIC register-transfer-level (RTL) prototyping. Designers partition large ASICs across multiple Stratix devices using TDM pin multiplexing, validating functional correctness, software/firmware interaction, and timing closure before committing to silicon. Per Intel/Altera application notes, multiple EP1S20F672I7 devices can be time-multiplexed on a single PCB to emulate ASICs up to several million gates, dramatically reducing pre-silicon design risk.
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Military and Aerospace Signal Processing
The EP1S20F672I7's industrial -40C to +85C operating range, high DSP block count, and abundant LVDS I/O make it suitable for radar signal processing, electronic warfare, and software-defined radio platforms. The wide TriMatrix memory provides fast data-path buffering between antenna samples and DSP pipelines, while the 1.5 V core delivers predictable power consumption for airborne and shipboard power budgets. Per the Stratix handbook, the device's radiation-tolerant characteristics have been used in satellite payload processing with appropriate derating.
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High-Speed Protocol Bridging
The EP1S20F672I7 integrates 426 user I/Os with LVDS support up to 840 Mbps per channel (per the Stratix handbook), enabling high-speed bridging between legacy parallel interfaces (UTOPIA, POS-PHY, SPI-4.2) and newer serial protocols. The dedicated PLLs handle multi-clock-domain bridging, while TriMatrix memory implements elastic buffers to absorb rate mismatches. The 672-ball BGA provides sufficient signal integrity for parallel buses up to 64 bits wide at 200 MHz DDR. This makes the EP1S20F672I7 a popular choice for storage area network (SAN) routers and SONET/SDH muxponder designs.
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Video and Image Processing Pipelines
Broadcast and medical imaging systems leverage the EP1S20F672I7's 18,460 LEs and DSP blocks to implement real-time video processing pipelines, including de-interlacing, scaling, color-space conversion, and motion compensation. The TriMatrix memory holds several lines of video for block-level operations, while the 426 user I/Os accept parallel video buses (BT.1120, BT.656, DVI/HDMI bridges). Per Intel application notes, the Stratix DSP blocks can also accelerate JPEG/JPEG2000 and H.264 codec functions. The industrial temperature grade supports medical imaging carts and outdoor broadcast vehicles.
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Industrial Test and Measurement
Automated test equipment (ATE) and laboratory instrumentation use the EP1S20F672I7 for pattern generation, signal capture, and protocol-aware triggering. The FPGA's parallel logic fabric generates stimulus waveforms at rates exceeding discrete processor capabilities, while the TriMatrix memory buffers captured samples for downstream analysis. Per the Stratix handbook, the 1.5 V core and configurable I/O standards (LVTTL, LVCMOS, SSTL, HSTL) allow direct interface to virtually any digital logic family. The industrial temperature range supports factory-floor and outdoor test installations.
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추천 제품 요약
엔지니어링 참조 데이터: EP1S20F672I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S20F672I7N | EP1S20F672C7N | EP1S20F672C7 | EP1S20F672C6N | EP1S20F672C6 | EP1S20B672C7N | EP1S20B672C6N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (FineLine BGA), 35x35 mm, 1.27 mm pitch | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 (B variant) | 18,460 (B variant) |
| RAM Bits | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 | 1,669,248 (B variant) | 1,669,248 (B variant) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -7 | -7 | -7 | -7 | -6 | -6 | -7 (B variant) | -6 (B variant) |
| Lead-Free / Finish | SnPb (e0) | Lead-free (N suffix) | Lead-free (N suffix) | SnPb (e0) | Lead-free (N suffix) | SnPb (e0) | Lead-free (N suffix) | Lead-free (N suffix) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Industrial temperature grade (-40C to +85C) (vs EP1S20F672C7)
- Same-package drop-in replacement within Intel Stratix family (vs EP1S20F672C7N)
- Higher performance tier than B-variant Stratix devices (vs EP1S20B672C7N)
설계 노트
The EP1S20F672I7 requires four separate power rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V selectable per bank), VCCA (1.5 V analog supply for PLLs), and VCCD_PLL (digital PLL supply). Per the Stratix handbook, all rails must ramp monotonically and reach within 5% of nominal within 100 ms to avoid inrush damage. Decoupling recommendations: 100 uF bulk + 10 uF + 1 uF + 0.1 uF per rail with the smallest caps placed closest to the balls. Estimated: at 80% utilization and 200 MHz operation, expect 4-6 W core power plus 0.5-1.5 W IO power.
The 672-ball FineLine BGA on 1.27 mm pitch requires 6+ layer PCB stack-up with microvia or via-in-pad technology for breakout. Per Altera AN 315 (BGA design guidelines), maintain a continuous reference plane under the BGA, escape on inner layers through microvias, and stitch GND vias around the perimeter for return path integrity. Use differential pair routing with 100 ohm differential impedance for LVDS signals and 50 ohm single-ended for general-purpose I/O. A 4-layer stack-up is feasible but constrains routing density significantly.
Estimated: Quoting the Quartus II compilation report for IO timing is essential because Speed Grade -7 is approximately 15% faster than -6 but only 5-7% faster than -8. The Stratix handbook recommends running Slow 1100 mV 85C model for industrial-grade timing closure and Slow 1100 mV 0C for commercial. A common pitfall is using the wrong temperature corner: for industrial-grade parts, designs must close timing over the full -40C to +85C range. Also note that BGA rework without proper reflow profile can damage the FineLine substrate - use pre-qualified profiles per J-STD-020.
규정 준수 정보
Per Partstack and DigChip datasheet extracts, the EP1S20F672I7 base part uses SnPb finish (JESD-609 e0). Lead-free (RoHS-compliant) variants carry the 'N' suffix, e.g. EP1S20F672I7N. AEC-Q100 not applicable (FPGA, not an automotive-grade IC in the AEC sense).
