EP1S10F780C7N - Stratix FPGA 10,570 LEs, 780-FBGA | Intel
Référence : EP1S10F780C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $118 | $11 800,00 |
| 500 | $105.75 | $52 875,00 |
| 1 000 | $96.2 | $96 200,00 |
EP1S10F780C7N Présentation
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit at the top of the programmable logic hierarchy: programmable logic -> FPGA -> high-density FPGA -> SoC FPGA. They are widely used to implement custom datapath, glue logic, and signal-processing pipelines that would otherwise require an ASIC or a bank of discrete logic ICs.
Key features of the EP1S10F780C7N include 6 dedicated PLL+ DLL blocks for clock synthesis and skew management, embedded multiplier blocks for DSP-style arithmetic, and Stratix-tier TriMatrix memory architecture (MLAB, M512, M4K blocks). The 426 user I/Os support LVDS at up to several hundred Mbps per channel, making the part suitable for high-speed parallel interfaces and external memory controllers (DDR SDRAM, QDR SRAM, ZBT SRAM).
The Stratix architecture combines a multi-level routing fabric with embedded array blocks and high-speed serial capability through dedicated serializer/deserializer resources on speed-grade -7 silicon. The C7 speed grade positions the device in the mid-band of the Stratix family, providing a balance of Fmax and power consumption for industrial and commercial designs.
Typical applications include telecommunications line cards, ASIC prototyping, image and video processing pipelines, and industrial control systems where a high logic density and rich memory resources are required. The wide I/O count also makes it suitable for test-and-measurement backplanes and high-channel-count data acquisition front-ends.
Designers should pay attention to thermal management on the 780-ball FBGA - the Stratix data sheet recommends a minimum 4-layer PCB stack-up with continuous ground and power planes, plus adequate airflow for sustained high-utilization workloads. Configuration scheme selection (AS, PS, JTAG) and dual-purpose pin planning are also critical upfront tasks for any Stratix design.
This page synthesizes distributor pricing, drop-in alternative part numbers from the same Stratix family, and practical design notes that go beyond the manufacturer datasheet's typical-application section.
Alternatives de remplacement direct pour EP1S10F780C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S10F780C7N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Process Technology, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S10F780C7
✅ Remplacement direct✓ En stock
$128.4 / unité
Voir la fiche technique →EP1S10F780C6N
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →EP1S10F780C6
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1S10F780C5N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1S10F780C5
✅ Remplacement direct✓ En stock
$460 / unité
Voir la fiche technique →EP1S10F780C7N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements (LEs) | 10,570 |
| Embedded Memory | 920 Kbits (TriMatrix: MLAB, M512, M4K) |
| Embedded Multipliers | Yes (DSP blocks) |
| PLLs / DLLs | 6 PLL + DLL blocks |
| User I/O Count | Up to 426 |
| Core Supply Voltage | 1.5 V |
| Boîtier | FBGA-780 (29 × 29 mm, 1.0 mm pitch) |
| Température de fonctionnement | 0°C to 85°C (Commercial) |
| Speed Grade | C7 |
| Process Technology | 0.13 μm CMOS, 1.5 V core |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, LVCMOS, LVTTL |
| Configuration Modes | AS, PS, JTAG |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP1S10F780C7N fbga-780 (29 × 29 mm, 1.0 mm pitch)
Configuration des broches du EP1S10F780C7N (boîtier fbga-780 (29 × 29 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S10F780C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S10F780C7N convient pour 6 applications: Telecommunications Line Cards, ASIC Prototyping, Image and Video Processing Pipelines, Industrial Control Systems, Test and Measurement Backplanes, High-Channel-Count Data Acquisition Front-Ends.
Telecommunications Line Cards
The EP1S10F780C7N fits telecommunications line cards because its 426 user I/Os and 920 Kbits of TriMatrix memory provide enough interconnect and buffering for backplane bridging, protocol conversion, and traffic-management fabrics. Six PLL+DLL blocks generate low-jitter clocks for TDM buses, SERDES macros, and external PHY chips, while dedicated DSP blocks accelerate Viterbi, Reed-Solomon, and Turbo decoding at line-rate throughput. The 1.5 V core keeps per-channel power reasonable in dense multi-port line cards, and the FBGA-780 package exposes LVDS-capable I/Os that are essential for parallel telecom buses.
Recommandé
ASIC Prototyping
Engineers use the EP1S10F780C7N as an ASIC prototyping vehicle because 10,570 LEs and 920 Kbits of embedded memory can map medium-complexity ASIC RTL blocks without partitioning. The high logic density supports multi-million-gate-equivalent ASICs when combined with multiple FPGAs, while the 426 user I/Os ease PCB-level signal mapping from ASIC pinout to FPGA bank pins. Dedicated PLL/DLL blocks model ASIC clock trees, and the TriMatrix memory reproduces SRAM/ROM macros from the original ASIC. Quartus II synthesis flows support incremental compile, making iteration between RTL and FPGA fast.
Recommandé
Image and Video Processing Pipelines
The EP1S10F780C7N handles image and video processing pipelines because its dedicated DSP blocks deliver hundreds of parallel multiply-accumulate operations per clock, which is essential for real-time convolution, filtering, and motion-estimation kernels. TriMatrix memory buffers line-scan and frame data with M4K blocks optimized for video line widths, while the 426 user I/Os accept multi-channel LVDS camera or display data. Designers typically feed the FPGA with a high-speed ADC over LVDS and route pixel data into a frame buffer in external DDR SDRAM, with the EP1S10F780C7N driving external memory controllers and post-processing pipelines.
Recommandé
Industrial Control Systems
The EP1S10F780C7N suits industrial control systems where many sensors and actuators must be scanned at deterministic intervals, because the part's 426 I/Os and 6 PLL/DLL blocks support dense parallel I/O expansion with synchronized timing. Industrial logic typically combines PID controllers, state machines, and high-speed serial links to drives - all of which map efficiently onto Stratix DSP blocks and LAB structures. The commercial 0-85°C operating range covers most factory-floor enclosures; designs that need extended temperature can be migrated to the EP1S10F780I7N industrial variant using the same FBGA-780 footprint.
Recommandé
Test and Measurement Backplanes
Test-and-measurement backplanes rely on the EP1S10F780C7N's 426 I/Os to consolidate many parallel test points into a single FPGA-managed instrument. The high logic count supports complex stimulus generation and response capture, while the dedicated DSP blocks enable real-time FFT and correlation analysis on captured waveforms. Six PLL+DLL blocks align sampling clocks across multiple ADC channels, and the FBGA-780 package routes differential signals (LVDS) cleanly with controlled-impedance traces. Designers pair the FPGA with high-speed ADCs and DACs on a multi-layer PCB to build modular PXI or LXI instruments.
Recommandé
High-Channel-Count Data Acquisition Front-Ends
The EP1S10F780C7N is well-suited to multi-channel data acquisition front-ends because 426 user I/Os can serialize data from many parallel ADCs, while 920 Kbits of TriMatrix memory provides local buffering before DMA to external SDRAM. Designers can fan out the FPGA across 32+ LVDS data channels, each operating at hundreds of Mbps, using the dedicated SERDES resources on C7-speed silicon. The 6 PLL+DLL blocks generate per-channel sampling clocks with deterministic phase relationships - critical for coherent multi-channel acquisition in radar, ultrasound, and vibration monitoring.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S10F780C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S10F780C7 | EP1S10F780C6N | EP1S10F780C6 | EP1S10F780C5N | EP1S10F780C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29 × 29 mm) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded Memory | 920 Kbits | 920 Kbits | 920 Kbits | 920 Kbits | 920 Kbits | 920 Kbits |
| User I/O Count | Up to 426 | Up to 426 | Up to 426 | Up to 426 | Up to 426 | Up to 426 |
| Speed Grade | C7 | C7 | C6 (slower) | C6 (slower) | C5 (slowest) | C5 (slowest) |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
Principaux différenciateurs
- Higher speed grade than other Stratix FBGA-780 EP1S10 variants (vs EP1S10F780C5N)
- FBGA-780 footprint preserves full 426 I/O count vs smaller FBGA-484 variant (vs EP1S10F484C7N)
- Six PLL+DLL blocks for high-density clock tree design (vs EP1S10F780C6N)
Notes de conception
The 780-ball FBGA package concentrates significant heat flux at high toggle rates - place a thermal pad footprint under the package and stitch vias to inner ground/power planes. For sustained high-utilization designs (above 80% LE usage with active DSP blocks), use a minimum 4-layer PCB stack-up with continuous ground and power planes and provide forced-air cooling to keep junction temperature within the 0-85°C commercial range.
Use controlled-impedance routing for LVDS pairs (100 Ω differential) and matched-length tuning within 50 mil for clock-to-data pairs. Decouple every VCCIO bank with 0.1 µF and 10 µF capacitors placed close to the ball, and add bulk 100 µF capacitors at the FPGA supply entry point. The 1.0 mm BGA pitch requires PCB fabrication with 4-mil/4-mil line/space or finer for escape routing.
Plan pin assignments upfront using the Quartus II Pin Planner to balance I/O bank usage and avoid placing high-speed LVDS pairs next to noisy switching signals. Use dedicated PLL/DLL input clock pins rather than routing clocks through general-purpose I/O for best jitter performance. Reserve dual-purpose configuration pins early in the schematic so they are not needed as user I/O after configuration.
Do not assume drop-in compatibility between speed grades without revalidating timing - C7 to C5 migration can cause setup violations on critical paths. Verify configuration mode pin strapping (MSEL) matches the configuration device selected (EPCS, EPC2, or JTAG). The N suffix in MPN typically denotes lead-free / RoHS packaging; check the exact variant ordering code for compliance.
Informations de conformité
Compliance information not present in the verified web data. The N suffix in MPN ordering codes typically denotes lead-free packaging per Intel/Altera convention, but RoHS/REACH certifications should be confirmed against the manufacturer certificate of conformance before production use.
