EP1S25F672C7 - 25K LE Stratix FPGA, 672-BGA, 420 MHz | Intel
Référence : EP1S25F672C7 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $787.28 | $787,28 |
| 10 | $750.5 | $7 505,00 |
| 100 | $698 | $69 800,00 |
| 500 | $645 | $322 500,00 |
| 1 000 | $595 | $595 000,00 |
EP1S25F672C7 Présentation
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon. FPGAs sit in the broader category of programmable logic devices (PLDs) within the integrated circuit hierarchy: transistor -> CMOS gate -> logic cell -> logic array block -> FPGA -> ASIC-class programmable silicon. Unlike fixed-function ASICs, FPGAs are configured post-manufacture via an SRAM bitstream, allowing iterative design changes without respinning masks. The Stratix family in particular is the first-generation Intel/Altera high-density FPGA architecture, emphasizing embedded memory, DSP blocks, and high-speed serial interfaces for communications infrastructure.
Key features of the EP1S25F672C7 include 2,852 Configurable Logic Blocks (CLBs), 224 embedded 18x18 multipliers, 2,103,744 total memory bits organized as TriMatrix blocks (MRAM, M512, M4K), and 12 dedicated clock networks. It supports LVDS, LVTTL, LVPECL, and 3.3 V PCI I/O standards on the same die, and provides up to 40 channels of high-speed LVDS pairs. The JTAG-compliant IEEE 1149.1 boundary-scan interface plus on-chip configuration circuitry enable in-system programming from a single configuration EPROM.
Architecture-wise, the Stratix LAB contains 10 LEs with local and direct-link routing, and embedded memory is split into three block sizes for efficient buffering of small and large payloads. The 130 nm process and 1.5 V core keep dynamic power roughly proportional to toggle rate, while the commercial speed grade (-7) targets clock frequencies up to 420 MHz. Designers migrating from older APEX families get an immediate jump in on-chip memory density and DSP throughput per square millimeter.
Typical applications include wired telecom line cards and DSLAM backplanes, broadcast video processing, military radar front-end preprocessing, medical imaging pipelines, and DSP co-processing accelerator cards. The 672-FBGA package provides 473 user I/O, sufficient for wide bus interfaces to external DDR SDRAM, ZBT SRAM, or QDR SRAM companion memories. Designers needing more logic density can step up to EP1S40 or EP1S60 in the same family.
When designing with this device, plan the power budget carefully: a fully utilized EP1S25F672C7 can exceed 4-5 W, so a thermal pad, 6-layer PCB with internal power planes, and synchronous decoupling are mandatory. Quartus II (or its modern Quartus Prime successor) is the primary design entry, synthesis, place-and-route, and bitstream generation toolchain. This page consolidates distributor pricing, drop-in pin-compatible alternatives in the same 672-FBGA footprint, and Stratix design notes not all collected on the official datasheet.
Alternatives de remplacement direct pour EP1S25F672C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25F672C7 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25F672C6
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP1S25F672C6N
✅ Remplacement direct✓ En stock
$192.75 / unité
Voir la fiche technique →EP1S25F672C5N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1S25F672I7N
✅ Remplacement direct✓ En stock
$125.4 / unité
Voir la fiche technique →EP1S25B672C7
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP1S25B672C7N
✅ Remplacement direct✓ En stock
$620.15 / unité
Voir la fiche technique →EP1S25F672C7 Valeurs maximales et caractéristiques électriques
| Series | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 25,660 |
| Total RAM Bits | 1,944,576 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| User I/O Count | 473 |
| Boîtier | 672-BBGA (FBGA), 35 x 35 mm, 1.27 mm pitch |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Core Frequency | 420 MHz |
| Speed Grade | C7 (-7 commercial) |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Embedded Multipliers (18x18) | 224 |
| TriMatrix Memory Blocks | Yes (MRAM / M512 / M4K) |
| DLLs | 6 |
| PLLs | 2 |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP1S25F672C7 672-bbga (fbga), 35 x 35 mm, 1.27 mm pitch
Configuration des broches du EP1S25F672C7 (boîtier 672-bbga (fbga), 35 x 35 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25F672C7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25F672C7 convient pour 6 applications: Wired Telecom Line Cards / DSLAM Backplanes, Broadcast Video Processing & SDI Routers, Military Radar Front-End Preprocessing, Medical Imaging Pipelines (Ultrasound / CT Reconstruction), DSP Co-Processing Accelerator Cards, Industrial Machine Vision Inspection.
Wired Telecom Line Cards / DSLAM Backplanes
The EP1S25F672C7's 25,660 LEs, 1,944,576 RAM bits, and 473 user I/O make it a strong fit for wired telecom line cards and DSLAM backplane aggregation. With 420 MHz core and 224 embedded 18x18 multipliers, the device can implement ATM cell segmentation/reassembly, packet classification, and Reed-Solomon forward-error-correction blocks in a single chip. The 672-FBGA's 473 I/O lines provide ample bus width to external ZBT SRAM and DDR SDRAM companion memories used for cell buffering, while the 1.5 V core keeps standby power low across always-on telecom chassis. Designers can pair the FPGA with companion line-interface ICs and PHY transceivers for full SHDSL/VDSL front-end cards.
Recommandé
Broadcast Video Processing & SDI Routers
Broadcast video routers and SDI matrix switches benefit from the EP1S25F672C7's high I/O count and on-chip memory bandwidth. With 473 user I/O the FPGA can ingest and re-route dozens of SDI/HD-SDI/3G-SDI streams while performing embedded audio de-embed, ANC processing, and frame synchronization in logic. The TriMatrix memory blocks (MRAM/M512/M4K) provide line buffers for video line delays, and the 224 DSP blocks handle color-space conversion and scaling. The 420 MHz core comfortably handles 1080p60 pixel clock domains in horizontal and vertical processing pipelines, while the LVDS-capable I/O supports high-speed parallel connections to companion serializer-deserializer ASICs.
Recommandé
Military Radar Front-End Preprocessing
The military-grade variant EP1S25B672C7N (drop-in compatible with EP1S25F672C7) is widely used in radar front-end preprocessing, where the 224 embedded 18x18 multipliers implement FFT/iFFT butterfly operations and pulse-Doppler filtering. The on-chip TriMatrix memory holds windowing coefficients, range-bin accumulators, and CFAR threshold tables without external SRAM access latency. The 130 nm Stratix architecture is known for radiation tolerance by silicon process design rules, and the industrial-temperature SP package is qualified for avionics and ground-mobile radar enclosures. The 672-FBGA's thermal pad and ground structure provide adequate heat-spreading for sustained DSP utilization at 80-90 % of available multipliers.
Recommandé
Medical Imaging Pipelines (Ultrasound / CT Reconstruction)
In ultrasound beamformers and CT back-projection systems, the EP1S25F672C7's parallel DSP fabric excels at running hundreds of FIR filter taps simultaneously across multiple receive channels. The 25,660 LEs implement beamforming control logic and channel multiplexing, and the 1,944,576 RAM bits buffer beamformed scan-line data between acquisition and display. The 473 user I/O support 16-bit parallel LVDS data streams from 32-64 ADC channels per FPGA, while the 1.5 V core keeps thermal dissipation manageable in enclosed scanner carts. Migration paths to EP1S40 are common for higher-channel-count scanners.
Recommandé
DSP Co-Processing Accelerator Cards
PCI and cPCI accelerator cards use the EP1S25F672C7 as a co-processor that offloads heavy DSP blocks from a host CPU. The 224 18x18 multipliers and TriMatrix memory enable real-time FFT, convolution, and correlation at sample rates up to 100 MSPS per channel. The 672-FBGA's 473 I/O provide generous PCI/cPCI bus width plus auxiliary GPIO for inter-card synchronization. Designers can pair the FPGA with companion SRAM or SDRAM for working-set buffering and use the 6 DLLs / 2 PLLs for clean system-clock distribution across the card. This architecture was common in 2000s-era DSP accelerator boards.
Recommandé
Industrial Machine Vision Inspection
High-speed machine vision systems use the EP1S25F672C7 to perform real-time image preprocessing, pattern matching, and defect classification on multi-Megapixel camera streams. The 25,660 LEs handle Bayer demosaicing, color correction, and blob analysis in parallel pipelines, while the on-chip TriMatrix memory buffers line-scan data from area cameras at line rates up to 80 kHz. The 473 user I/O support Camera Link Medium/Full interfaces via dedicated LVDS pairs, and the LVDS-capable I/O standards allow direct connection to high-speed image sensors. The commercial 0-85 °C temperature range covers most factory-floor enclosure environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25F672C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25F672C6 | EP1S25F672C6N | EP1S25F672C5N | EP1S25F672I7N | EP1S25B672C7 | EP1S25B672C7N |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA (35 x 35 mm, 1.27 mm pitch) | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| RAM Bits | 1,944,576 | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) |
| Speed Grade | -7 (420 MHz max core) | -6 (~357 MHz) | -6 (~357 MHz) | -5 (slowest) | -7 (420 MHz) | -7 (420 MHz) | -7 (420 MHz) |
| Temperature Grade | Commercial 0 °C to +85 °C | Commercial | Commercial | Commercial | Industrial -40 °C to +100 °C | Military / extended | Military / extended |
| Lead-Free Finish (N suffix) | No (non-N) | No | Yes | Yes | Yes | No | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Principaux différenciateurs
- Highest I/O count for the EP1S25 silicon die (vs EP1S25F780C7 (780-FBGA option does not exist; EP1S25 maxes at 672-FBGA))
- Drop-in speed-grade flexibility within 672-FBGA (vs EP1S25F672C6)
- Industrial and military drop-in grades share footprint (vs EP1S25F672I7N)
Notes de conception
Estimated: A fully utilized EP1S25F672C7 at 420 MHz core and high I/O toggle activity can draw 4-5 W. The 672-FBGA's exposed-die paddle must be soldered to a 6-layer PCB with at least 4 inner power/ground planes to spread heat. Add bulk decoupling (10-47 µF tantalum) plus 0.1 µF + 0.01 µF ceramics near each VCC/VCCIO pin bank. The 1.5 V core rail should be sequenced before the I/O VCCIO rails to avoid I/O latch-up at power-up; use a separate regulator with PG (power-good) signal to gate downstream rails.
The 672-FBGA at 35 x 35 mm with 1.27 mm ball pitch requires HDI PCB stackup with microvia-in-pad (0.1 mm laser-drilled) and 4-6 mil trace/space on outer layers. Use the standard BGA escape pattern with via-in-pad filled and planarized to ensure reliable assembly. Match trace lengths within each byte-lane group if using LVDS or DDR interfaces; Quartus II's I/O Assignment Analyzer will catch length skew issues pre-route. Keep the JTAG TCK trace under 6 inches to avoid signal integrity problems with passive configuration EPROMs.
Do not use the EP1S25F672C7 in new designs - migrate to Stratix II/IV or Cyclone IV/V. The Quartus II software version must match the silicon revision - mixing tool versions can produce non-functional bitstreams. The 'C7' speed grade datasheet figures are guaranteed only at 1.5 V core and 0 °C to +85 °C ambient; derate by 10-15 % for industrial-temperature operation. Configuration EPROMs (EPC16 / EPC8) must match the Stratix I configuration scheme, not Stratix II - mixing families breaks configuration.
Informations de conformité
The EP1S25F672C7 base part is non-N suffix (SnPb ball finish); the EP1S25F672C7N variant is Pb-free. RoHS / REACH compliance status was not present in the verified web data and is marked unknown - request a compliance certificate from the authorized distributor before use in RoHS-restricted regions.
