EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
Référence : EP1S30F1020C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $320 | $320,00 |
| 10 | $295 | $2 950,00 |
| 100 | $268 | $26 800,00 |
| 500 | $240 | $120 000,00 |
| 1 000 | $215 | $215 000,00 |
EP1S30F1020C7N Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes.
Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG.
The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out.
Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices.
When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.
Alternatives de remplacement direct pour EP1S30F1020C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S30F1020C7N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Family, Logic Elements, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S30F1020C7
✅ Remplacement direct✓ En stock
$575 / unité
Voir la fiche technique →EP1S30F1020C6N
✅ Remplacement direct✓ En stock
$1015 / unité
Voir la fiche technique →EP1S30F1020C6
✅ Remplacement direct✓ En stock
$262 / unité
Voir la fiche technique →EP1S30F1020C5N
✅ Remplacement direct✓ En stock
$1095 / unité
Voir la fiche technique →EP1S25F1020C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S25F1020C7
✅ Remplacement direct✓ En stock
$820 / unité
Voir la fiche technique →EP1S25F1020C6N
✅ Remplacement direct✓ En stock
$450 / unité
Voir la fiche technique →EP1S30F1020C7N Valeurs maximales et caractéristiques électriques
| Series | Stratix |
| Family | Stratix (1.5 V core) |
| Logic Elements | 32,470 |
| Total Block RAM Bits | 3,317,184 |
| User I/O Count | 726 |
| LABs (Logic Array Blocks) | 3247 |
| Process Technology | 130 nm CMOS |
| Max Internal Frequency | 420.17 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Package Type | 1020-ball FineLine BGA (FC-FBGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Température de fonctionnement | 0 C to +85 C (commercial extended) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Peak Reflow Temperature Max Time | 40 s |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP1S30F1020C7N 33 x 33 mm
Configuration des broches du EP1S30F1020C7N (boîtier 33 x 33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S30F1020C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S30F1020C7N convient pour 6 applications: Telecom Baseband Processing, Software Defined Radio (SDR), High-Speed Data Acquisition, ASIC Prototyping, Industrial Motion Control, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP1S30F1020C7N's 32,470 logic elements and 3.3 Mbits of block RAM fit multi-channel telecom baseband line cards where U-plane and C-plane processing must be partitioned in parallel datapaths. Its 420 MHz internal clock and dedicated multiplier blocks enable parallel FIR filtering and Viterbi decoding at rates up to a few hundred Msymbols/s per channel. Placed on the line card between the SERDES framer and the backplane, the FPGA absorbs protocol overhead while staying within the 1.5 V core power envelope. Compared with fixed DSP ASICs, the same package can be reconfigured across product generations without board rework.
Recommandé
Software Defined Radio (SDR)
Software-defined radio platforms rely on FPGA fabric to perform DDC/DUC, channelization, and FFT computations in real time. The EP1S30F1020C7N's 3.3 Mbit TriMatrix RAM buffers baseband samples between the ADC front-end and the host processor, while the 32,470 logic elements and dedicated DSP blocks sustain 1024-point FFTs at sample rates beyond 100 MSPS. The 726 user I/Os accept parallel LVDS ADC data plus GPIOs for tuning and gain control. Versus discrete DSP chains, the same 1020-BGA footprint lets designers retarget the radio for new waveforms by recompiling Quartus without PCB rework.
Recommandé
High-Speed Data Acquisition
Multi-channel data-acquisition cards use the EP1S30F1020C7N to aggregate 8-16 LVDS ADC lanes, perform real-time decimation, and stream DMA to host memory. The device's 726 user I/Os comfortably absorb 16 LVDS pairs plus GPIO banks for trigger and clock distribution, while 3.3 Mbits of block RAM stages ping-pong buffers between ADC bursts and PCIe readout. The 420 MHz internal clock matches typical 14-bit 250 MSPS ADC data rates with margin for digital filtering. Placed adjacent to the ADC analog front-end, the FPGA keeps digital and analog grounds separate while preserving timing closure across all I/O banks.
Recommandé
ASIC Prototyping
ASIC prototyping platforms use the EP1S30F1020C7N as one of several Stratix FPGAs stitched together to emulate a multi-million-gate ASIC. With 32,470 logic elements per device and 3.3 Mbits of on-chip memory, the part is well-matched to a typical SoC block partition, while the 1020-BGA package exposes enough user I/Os for inter-FPGA serial or parallel channels. The -7 speed grade shortens emulation cycles by allowing higher clock rates during bring-up. Compared with larger Stratix IV/V parts, the EP1S30F1020C7N offers a familiar Quartus flow with abundant third-party IP.
Recommandé
Industrial Motion Control
Multi-axis servo and motor-control systems use the EP1S30F1020C7N to implement field-oriented control loops, encoder decoding, and safety logic on a single device. The 32,470 logic elements handle 8-12 axes of FOC plus resolver or SSI feedback decoding, while the dedicated PLL resources drive deterministic switching frequencies from 8 kHz to 32 kHz per axis. The 726 user I/Os accommodate quadrature encoders, PWM outputs, gate-driver enables, and EtherCAT or CAN-FD side-channels. Placed between the power stage and the host PLC, the FPGA keeps latency below one PWM period versus discrete microcontrollers.
Recommandé
Military and Aerospace Signal Processing
Defense and aerospace platforms use the EP1S30F1020C7N for radar, electronic-warfare, and secure-communication preprocessing where commercial microprocessors lack determinism. The part's 32,470 logic elements, 3.3 Mbit embedded RAM, and 420 MHz clock support pulse-compression, beamforming, and crypto offload on a single 1020-BGA device. The commercial/extended 0 C to +85 C temperature range covers many ground-mobile and shipboard environments, while the 1.5 V core and 1 mm-pitch BGA suit ruggedized chassis layouts. Designers should confirm long-term availability with procurement as the part is classified obsolete.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S30F1020C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C6 | EP1S30F1020C5N | EP1S25F1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-BGA (33x33 mm) | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 32,470 | 32,470 (same) | 32,470 (same) | 32,470 (same) | 32,470 (same) | 25,660 (-21%) |
| Block RAM Bits | 3,317,184 | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 1,922,048 (-42%) |
| Max Internal Frequency | 420.17 MHz | 420.17 MHz (same) | ~320 MHz (-24%) | ~320 MHz (-24%) | ~250 MHz (-40%) | 420.17 MHz (same) |
| User I/O Count | 726 | 726 (same) | 726 (same) | 726 (same) | 726 (same) | 726 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) |
| Lead-Free Finish (N suffix) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest available speed grade in the EP1S30F1020 family (vs EP1S30F1020C6N)
- 32,470 logic elements versus 25,660 in the EP1S25 family (vs EP1S25F1020C7N)
- Lead-free (N) finish for RoHS-compliant assemblies (vs EP1S30F1020C7)
- 3.3 Mbit TriMatrix block RAM versus 1.9 Mbit on EP1S25 (vs EP1S25F1020C7N)
Notes de conception
The EP1S30F1020C7N requires four independent supply rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V per I/O bank), VCCA_PLL (3.3 V analog for PLL cleanliness), and VCCPD (3.3 V pre-driver). At 420 MHz with full logic utilization, estimated VCCINT current reaches 2.5 A to 3.0 A; bulk decoupling should include at least 4 x 100 uF polymer plus 24 x 0.1 uF ceramics placed under and adjacent to the BGA. Failure to keep VCCA_PLL isolated from digital switching noise will manifest as PLL jitter degradation above 50 ps RMS.
Estimated: at full 32,470-LE utilization and 420 MHz, the EP1S30F1020C7N dissipates approximately 4 to 6 W depending on switching activity. With the 33 x 33 mm FineLine BGA and a typical theta_JA of 18 C/W for a properly designed 12-layer PCB with 1 oz copper on core/inner power planes, junction temperature rises approximately 70 C to 110 C above ambient. A heatsink or 200 LFM airflow is required when continuous logic utilization exceeds 70%; verify via thermal sensor embedded in the Quartus device-health monitor.
The 1020-ball FineLine BGA requires a minimum 8-layer stackup with 1 oz copper and a 1 mm ball pitch translating to 0.5 mm escape via fan-out. Use laser-drilled stacked micro-vias for inner rows and through-vias for outer rows. Matched 50 ohm single-ended and 100 ohm differential impedance on the top layer, with the second layer as a continuous GND plane for LVDS and SSTL signal integrity. Per manufacturer reference designs, place the JTAG header within 5 cm of the FPGA to avoid TCK/TMS signal-integrity issues.
Per the manufacturer datasheet, leaving any VCCINT or VCCIO ball unconnected causes the device to malfunction regardless of overall system power. Designers must verify the complete BGA ballout against the device pin table - missed balls are a common prototype-bring-up defect. Configuration mode (AS, AP, FPP, PS) must be selected by MSEL[3..0] straps at power-up; once configured, the device will not autonomously re-enter configuration mode without a nCONFIG pulse.
Informations de conformité
RoHS compliant per N suffix in MPN per Intel/Altera ordering convention. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free and conflict-minerals status not verified in the provided web data and marked unknown.
