EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera
MPN: EP1S30F1020C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $355 | $3,550.00 |
| 100 | $318.5 | $31,850.00 |
| 500 | $285 | $142,500.00 |
| 1,000 | $262 | $262,000.00 |
Drop-in alternatives for EP1S30F1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F1020C7
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View Datasheet →EP1S30F1020C6N
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View Datasheet →EP1S30F1020C5N
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View Datasheet →EP1S25F1020C6
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View Datasheet →EP1S30F1020C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 micrometer SRAM, all-layer copper |
| Logic Elements | 32470 |
| Total RAM Bits | 3317184 |
| DSP Blocks | 28 |
| Embedded Multipliers | Yes, 9-bit x 9-bit elements |
| User I/O Pins | 726 |
| Package | 1020-ball FCBGA (BBGA) |
| Mounting Type | Surface Mount |
| Speed Grade | 6 |
| Temperature Grade | Commercial (C) |
| Configuration Method | SRAM-based, JTAG boundary-scan |
| Operating Temperature | 0C to +85C (commercial) |
EP1S30F1020C6 1020-ball fcbga (bbga) Pin Configuration Guide
Complete pinout information for EP1S30F1020C6 (1020-ball fcbga (bbga) package) with 726 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020C6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 726 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F1020C6 is suitable for 6 applications: High-Speed DSP and FFT Pipelines, Telecom Baseband Processing, Test and Measurement Instrumentation, Video and Imaging Pipelines, ASIC Prototyping and Hardware Emulation, Industrial Control and High-Density Glue Logic.
High-Speed DSP and FFT Pipelines
The EP1S30F1020C6 fits this application because of its 32470 logic elements and 28 dedicated DSP blocks with embedded 9-bit by 9-bit multipliers, which together sustain high throughput on FIR filters and FFT pipelines. Its TriMatrix embedded memory (M512, M4K, M-RAM blocks totaling 3.3 Mbits) provides the on-chip storage needed for coefficient tables and intermediate FFT stages without external memory accesses. With up to 726 user I/O pins, the device can aggregate multiple parallel data streams. Designers typically instantiate block RAM in M4K blocks for tap delays and use DSP blocks for multiply-accumulate paths. Trade-off: the EP1S30 lacks the high-speed transceivers of Stratix GX, so multi-Gbps serial links need companion SerDes ICs.
Recommended
Telecom Baseband Processing
Telecom baseband designs benefit from the EP1S30F1020C6 because it integrates hardware multipliers and a rich clock network with multiple PLLs, enabling parallel demodulation and channelization paths. The 1.5 V core on 0.13 micrometer SRAM process gives predictable timing margins for chip-rate processing, while 726 user I/O pins accommodate multiple antenna data streams and backhaul interfaces. The Stratix family supports external memory interfaces (DDR SDRAM, QDR SRAM) through dedicated I/O and hard IP, which the EP1S30 leverages for buffering air-interface samples. Compared with ASIC implementations, the FPGA path shortens time-to-market for evolving radio standards at the cost of higher per-unit power.
Recommended
Test and Measurement Instrumentation
Test equipment designers choose the EP1S30F1020C6 for its high logic density, deep embedded RAM, and flexible I/O that supports multiple logic-analyzer or protocol-analyzer front ends. The JTAG boundary-scan interface eases in-system test, while the SRAM-based configuration lets the same hardware be reused for many test patterns simply by reloading the bitstream. With 726 I/O pins, the part can interface with many simultaneous DUTs, and the 1020-ball BGA allows fine-grained I/O placement for controlled-impedance signal paths. Quantified benefit: engineers can fold protocol logic, capture buffers, and trigger engines into one device instead of multiple smaller FPGAs.
Recommended
Video and Imaging Pipelines
The EP1S30F1020C6 fits video processing because its 3.3 Mbits of block RAM hold line buffers and frame statistics, while the DSP blocks accelerate pixel-rate operations like color-space conversion and 2D filtering. The 726 I/O pins easily route parallel RGB, HDMI-style parallel buses, and camera link interfaces; dedicated PLL-rich clocking multiplies low-frequency reference clocks to the pixel clocks required by the pipeline. Compared with a discrete ASSP plus memory, the FPGA route lets the same hardware serve multiple video standards by changing the bitstream. Trade-off: large BGA and many I/O banks demand multi-layer PCB with controlled-impedance routing for LVDS data pairs.
Recommended
ASIC Prototyping and Hardware Emulation
Engineers use the EP1S30F1020C6 as an ASIC prototype target because its 32470 LEs can map sizable blocks of an RTL design while the embedded multipliers and block RAM substitute for DSP and memory macros. Multiple EP1S30 parts can be tiled together on a multi-FPGA prototyping board to emulate larger ASICs, using LVDS between boards for inter-chip signals. The SRAM-based configuration allows fast design iterations, since each RTL revision just requires a new bitstream rather than a new chip spin. Trade-off: timing closure for very high-frequency ASIC IP needs the -7 speed grade rather than the -6, and power is higher than the final ASIC.
Recommended
Industrial Control and High-Density Glue Logic
The EP1S30F1020C6 fits industrial control systems where many parallel buses, encoder counters, and safety interlocks must be aggregated into one programmable platform. Its 726 I/O pins can directly interface with legacy parallel peripherals, while the 28 DSP blocks accelerate motor-control math such as Park/Clarke transforms and field-weakening loops. The commercial temperature grade (0C to +85C) suits most factory-floor enclosures, and the SRAM configuration allows field updates when control algorithms evolve. Compared with discrete CPLD plus MCU architectures, the FPGA approach consolidates logic into a single device but trades power efficiency for flexibility.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C5N | EP1S30F1020C5 | EP1S25F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA (FCBGA) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Logic Elements | 32470 | 32470 | 32470 | 32470 | 32470 | [DATA_NEEDED] |
| Embedded RAM Bits | 3317184 | 3317184 | 3317184 | 3317184 | 3317184 | [DATA_NEEDED] |
| User I/O Pins | 726 | 726 | 726 | 726 | 726 | [DATA_NEEDED] |
| Speed Grade | 6 | 7 (faster) | 6 (same) | 5 (slower) | 5 (slower) | 6 (same) |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) |
| Terminal Finish | SnPb (non-N suffix) | SnPb | Lead-free (Pb-free) | Lead-free (Pb-free) | SnPb | SnPb |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Same die, faster speed grade for high-margin timing closure (vs EP1S30F1020C7)
- Lead-free terminal finish variant for RoHS products (vs EP1S30F1020C6N)
- Lower-cost lead-free option with reduced speed (vs EP1S30F1020C5N)
- Reduced-logic variant in the same package for cost optimization (vs EP1S25F1020C6)
Design Notes
The EP1S30F1020C6 requires a 1.5 V core rail plus separate VCCIO supplies per I/O bank (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on standards). Place 0.1 uF X7R decoupling capacitors within 5 mm of each BGA ball group covering the core, and add bulk 22-47 uF tantalum or polymer capacitors per rail to handle transient in-rush during configuration. Estimated in-rush on the 1.5 V core at configuration can exceed 4 A on a 1020-BBGA Stratix device; size the regulator for at least 5 A continuous and 8 A transient.
The 1020-ball FCBGA has a ball pitch near 1.0 mm; escape routing requires at least a 6-layer stack-up with 0.0762 mm (3 mil) line width and 0.1016 mm (4 mil) spaces on outer microvia layers, and 0.127 mm (5 mil) width/space on inner stripline layers. Use laser-drilled stacked microvias under the BGA pads and ensure signal-integrity simulation is done for LVDS pairs routed between adjacent balls. Matched-length routing within 150 ps is needed for parallel LVDS buses such as LVDS or LVPECL interfaces to the EP1S30.
LVDS and LVPECL outputs on the Stratix need 100 ohm differential termination at the receiver placed as close to the receiver pins as possible. Keep series-termination resistors (22-33 ohm) on point-to-point LVDS for stub-length tuning. Maintain at least 3W spacing between LVDS pairs and other high-speed signals. Use ground-reference stitching vias every 50 mil along the route for return-path continuity. The EP1S30 supports True-LVDS and emulated-LVDS; True-LVDS has dedicated hardware SERDES pins and is preferred for >400 Mbps operation.
Common pitfalls when designing with the EP1S30F1020C6: (1) attempting to source obsolete parts from a single distributor - lead times can stretch 8-12 weeks; (2) ignoring MSL floor-life requirements when opening the dry-pack bag - the 1020-BBGA is moisture-sensitive and reflow without proper bake-out causes delamination; (3) using the wrong bitstream file - speed-grade specific .sof/.pof files must be selected to match the device variant; (4) mixing configuration modes between JTAG and fast passive serial without proper MSEL pin pull configuration, which can brick the boot.
Compliance Information
RoHS and REACH status not confirmed in the verified distributor listings provided; the EP1S30F1020C6N variant is the lead-free option in the family. AEC-Q100 is not applicable to FPGAs. Conflict-minerals and halogen-free status unknown from the supplied data.
