EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel
MPN: EP1S30F1020C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $721.59 | $721.59 |
| 10 | $690 | $6,900.00 |
| 100 | $640 | $64,000.00 |
| 250 | $605 | $151,250.00 |
| 500 | $575 | $287,500.00 |
Drop-in alternatives for EP1S30F1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S30F1020C6
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View Datasheet →EP1S25F1020C7
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View Datasheet →EP1S30F1020C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Logic Elements / Cells | 32470 |
| Logic Array Blocks (LABs) | 3247 |
| Number of I/O | 726 |
| Maximum Internal Frequency | 420.17 MHz |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Package Type | FC-FBGA-1020 (flip-chip) |
| Package Dimensions | 33 x 33 mm, 1 mm pitch |
| Pin Count | 1020 |
| Number of Terminals | 1020 |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM (AS / AP / PS / JTAG) |
| Speed Grade | C7 (medium speed bin) |
EP1S30F1020C7 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S30F1020C7 (33 x 33 mm, 1 mm pitch package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F1020C7 is suitable for 6 applications: High-Speed Digital Signal Processing, Telecommunications Infrastructure, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Test and Measurement Equipment, High-Performance Custom Computing.
High-Speed Digital Signal Processing
The EP1S30F1020C7 fits high-speed DSP workloads because its 32,470 logic cells and dedicated embedded multiplier blocks deliver high MAC throughput at the device's 420 MHz internal frequency. Hard multipliers reduce logic cell consumption for FIR filters, FFTs, and matrix operations compared to LUT-based implementations. The 726 user I/Os support wide parallel datapath ingress and egress, while TriMatrix memory blocks provide on-chip buffering for coefficient storage and line-delay elements. Typical designs include radar pulse compression, software-defined radio baseband processing, and high-frame-rate video pipelines.
Recommended
Telecommunications Infrastructure
Telecommunications infrastructure roles leverage the EP1S30F1020C7's abundant LVDS-capable I/O and PLLs for line-card aggregation, protocol bridging, and clock-domain conversion. The 726 I/Os comfortably host multiple SFI / XAUI interface widths, while dedicated PLLs synthesize low-jitter clocks required by serializer-deserializer companions. The 130 nm Stratix fabric implements framer-defamer state machines and protocol adaptation in a single device, replacing discrete ASSPs. Hardware engineers typically pair this part with external PHY devices and JTAG-based in-system programming for field upgrades.
Recommended
ASIC Prototyping and Emulation
The EP1S30F1020C7 is widely used in ASIC prototyping because its 32,470 logic cells map complex SoC blocks to a single device, accelerating design validation prior to tape-out. Multi-FPGA partitioning tools such as Synopsys Certify and Mentor Graphic Precision support the Stratix architecture, and the 726 I/Os expose the wide bus widths typical of ASIC emulation workloads. Designers can re-target RTL between Quartus II and downstream ASIC flows with established synthesis libraries. The FC-FBGA-1020 package supports the high pin-count required for full ASIC-pin visibility during emulation.
Recommended
Industrial Imaging and Machine Vision
Industrial imaging and machine vision systems rely on the EP1S30F1020C7 to process parallel Camera Link, CoaXPress, or LVDS-based sensor streams at high frame rates. Its 32,470 logic cells implement real-time image preprocessing - Bayer demosaicing, color matrix conversion, gamma correction - within the 420 MHz fabric budget. The 726 I/Os accommodate multi-tap camera inputs and frame-buffer hand-off to downstream DDR memory controllers. Designers take advantage of the embedded multipliers for convolution kernels and TriMatrix memory for line buffering, enabling deterministic latency in quality-control inspection lines.
Recommended
Test and Measurement Equipment
Test and measurement instrument designers choose the EP1S30F1020C7 for its ability to synthesize arbitrary waveform patterns, trigger logic, and protocol analyzers in programmable logic. The 726 I/Os support parallel instrument buses and front-panel connector counts typical of benchtop instruments. PLLs provide sub-nanosecond jitter performance for high-precision timing generators, and embedded multipliers accelerate digital down-conversion in spectrum analyzer signal paths. The legacy-but-supported Quartus II toolchain remains available for design maintenance and field upgrades on long-life-cycle instruments.
Recommended
High-Performance Custom Computing
The EP1S30F1020C7 powers custom computing accelerators by mapping parallel algorithms - cryptography, genomic alignment, financial Monte Carlo - into its 32,470-cell logic fabric. Hard multipliers implement integer and fixed-point MAC operations efficiently, while TriMatrix memory provides low-latency operand and result buffers. The 726 I/Os expose wide datapath channels to external host CPUs or coprocessor meshes, and PLLs synchronize parallel pipelines. The FC-FBGA package's low-inductance power delivery keeps voltage droop under control during high-fanout switching, supporting sustained peak throughput.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C6 | EP1S30F1020C6N | EP1S30F1020C5 | EP1S30F1020C5N | EP1S25F1020C7 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33x33 mm, 1 mm pitch) | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33x33 mm, 1 mm pitch) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Series | Stratix | Stratix | Stratix | Stratix | Stratix | Stratix |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C5 (slowest) | C5 (slowest) | C7 (same) |
| Logic Elements | 32470 | 32470 | 32470 | 32470 | 32470 | 25660 (-22%) |
| Number of I/O | 726 | 726 | 726 | 726 | 726 | 706 (-3%) |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free (N suffix) | No (C7 no N suffix) | No | Yes (N suffix) | No | Yes (N suffix) | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the Stratix FC-FBGA-1020 family (vs EP1S30F1020C6 / EP1S30F1020C5)
- Highest-density member of the Stratix family in the 1020-ball footprint (vs EP1S25F1020C7)
- Mature design ecosystem with extensive reference designs (vs EP1S30F1020C7 vs newer Agilex / Stratix 10)
Design Notes
The FC-FBGA-1020 substrate requires a high-density multilayer PCB stack-up with dedicated power and ground planes directly beneath the device. Use of microvia or stacked-via technology under the 1 mm pitch BGA is mandatory; through-hole vias alone cannot escape the inner-ball grid. Designers should follow Altera's Stratix Hardware Reference Manual pin-out-specific decoupling guidelines, with high-frequency decoupling capacitors placed on the opposite side of the FPGA within the ball-array projection area to minimize power-rail inductance.
Estimated: at maximum toggle rate and high I/O utilization, the EP1S30F1020C7 can dissipate up to 8-10 W. With the FC-FBGA-1020 package mounted on a JEDEC-standard test board, junction-to-ambient thermal resistance (theta_JA) is typically 15-20 C/W, supporting passive cooling in still air up to ~5 W dissipation. For high-density designs approaching maximum toggle activity, attach a heatsink via thermal interface material to the package top surface and provide forced-air cooling to keep junction temperature below 100 C at 85 C ambient.
Common pitfalls when designing with this part include selecting the wrong configuration scheme, neglecting the CONFIG_DONE and nSTATUS pull-up resistors required for AS mode, and underestimating the configuration time for large bitstreams. Always include a JTAG header for boundary-scan testing and in-field programming access. The Quartus II software has been declared end-of-life by Intel - new designs should consider Stratix IV/V or Agilex for long-term support unless legacy compatibility is mandatory.
Compliance Information
RoHS, REACH, and halogen-free status were not explicitly confirmed in the verified web data; lead-free status inferred from absence of the N suffix in the MPN. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified IC. Refer to manufacturer's product page for authoritative compliance documentation.
