EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera
Référence : EP1SGX10CF672C6NGA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2 680,00 |
| 100 | $245 | $24 500,00 |
| 500 | $220 | $110 000,00 |
| 1 000 | $198 | $198 000,00 |
EP1SGX10CF672C6NGA Présentation
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy, below custom ASICs and above CPLDs in density and complexity, and they form a core sub-category of programmable logic devices (PLDs) within digital logic ICs. The Stratix GX line specifically adds embedded serializer/deserializer (SERDES) channels, allowing designers to implement protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon without external PHY chips.
Key features of the EP1SGX10CF672C6NGA include embedded transceiver channels, embedded memory blocks, dedicated DSP blocks for high-throughput signal processing, and support for a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 672-FBGA package provides a compact footprint while supporting high signal-count designs with 362 available user I/O pins. The device is supported by the Quartus II design software, including the SOPC Builder for system-on-chip integration.
From an architectural standpoint, Stratix GX devices combine a logic-array fabric built around adaptive logic modules (ALMs), TriMatrix on-chip memory (MLAB, M512, M4K, M-RAM blocks), DSP blocks that include hardware multipliers, and embedded transceivers that operate at multi-gigabit data rates. Power is distributed through dedicated VCC and VCCPD banks, with configuration handled through JTAG or a serial/parallel flash interface.
Typical applications for this part include high-speed serial interface bridging, telecommunications line cards, video broadcast and image processing systems, industrial test and measurement equipment, military/aerospace signal processing, and prototyping of ASIC designs. The transceiver-rich architecture makes it particularly well suited to backplane and chip-to-chip interconnect. Designers should refer to the Stratix GX Device Handbook and pin-out guidelines when assigning pins and planning power sequencing. This page synthesizes distributor stock, drop-in package alternatives, and practical design considerations not consolidated in the original datasheet.
Alternatives de remplacement direct pour EP1SGX10CF672C6NGA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX10CF672C6NGA (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX10CF672C6N
✅ Remplacement direct✓ En stock
$152 / unité
Voir la fiche technique →EP1SGX10CF672C6
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP1SGX25F672C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1SGX25F672C6
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP1SGX25F672C7N
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP1SGX10CF672C6NGA Valeurs maximales et caractéristiques électriques
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Series | Stratix GX |
| Device Family | Stratix GX (EP1SGX10) |
| Max User I/O | 362 |
| Boîtier | 672-FBGA (Fine-Pitch BGA) |
| Speed Grade | 6 |
| Temperature Grade | Commercial |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead Free | Yes |
| Configuration Interface | JTAG / Serial / Parallel flash |
| Design Software | Quartus II |
Guide de configuration des broches du EP1SGX10CF672C6NGA 672-fbga (fine-pitch bga)
Configuration des broches du EP1SGX10CF672C6NGA (boîtier 672-fbga (fine-pitch bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX10CF672C6NGA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX10CF672C6NGA convient pour 6 applications: Telecommunications Line Cards, High-Speed Serial Interface Bridging, Video Broadcast and Image Processing, Industrial Test and Measurement Equipment, Aerospace and Defense Signal Processing, ASIC Prototyping and Emulation.
Telecommunications Line Cards
The EP1SGX10CF672C6NGA's embedded multi-gigabit transceivers and 362 user I/O make it well-suited to telecom line cards implementing protocols such as SPI-4.2, SFI-4.1, and XAUI. The Stratix GX SERDES channels handle backplane interconnect directly without external PHY chips, while the programmable logic fabric implements framing, queue management, and protocol conversion. Compared to ASIC alternatives, this FPGA approach reduces NRE cost and enables late-stage feature changes. Pin-compatibility with the EP1SGX25F672C6N in the same 672-FBGA package gives a clear scaling path for ports or bandwidth growth.
Recommandé
High-Speed Serial Interface Bridging
Designers use the EP1SGX10CF672C6NGA to bridge between incompatible high-speed serial standards - for example, converting between Serial RapidIO and Gigabit Ethernet or between PCI Express and XAUI. The on-chip SERDES channels support multi-gigabit data rates, while the logic fabric implements protocol adaptation. The 672-FBGA package exposes enough user I/O for parallel sideband interfaces, status LEDs, and management buses. Quartus II's transceiver toolkit provides built-in PMA settings for BER testing and eye-diagram analysis during bring-up.
Recommandé
Video Broadcast and Image Processing
The Stratix GX family's dedicated DSP blocks and embedded memory make the EP1SGX10CF672C6NGA a viable platform for video broadcast equipment such as SDI embedders/de-embedders, format converters, and real-time image-processing pipelines. Hardware multipliers accelerate FFT, FIR, and color-space-conversion algorithms, while the multi-gigabit SERDES handles SDI, HD-SDI, or 3G-SDI interconnect. The 672-FBGA package supplies sufficient user I/O for parallel video buses, GPIO, and external memory interfaces such as DDR/DDR2 SDRAM.
Recommandé
Industrial Test and Measurement Equipment
Test equipment vendors choose the EP1SGX10CF672C6NGA for protocol-aware instruments such as protocol analyzers, BERT testers, and compliance fixtures, because the embedded transceivers implement the physical layer while the programmable logic implements custom analysis, triggering, and display logic. Industrial temperature tolerance and the 362 user I/O support dense front-panel interfaces, LCD/video outputs, and high-speed probe connections. The Quartus II SignalTap logic analyzer provides real-time on-chip debug without external scope pins.
Recommandé
Aerospace and Defense Signal Processing
Defense contractors have historically deployed the EP1SGX10CF672C6NGA in radar front-end processing, electronic-warfare subsystems, and secure communications where the combination of multi-gigabit transceivers and DSP blocks delivers deterministic throughput for SDR and SIGINT workloads. The commercial-grade temperature range limits deployment to benign environments; for harsh environments designers must migrate to industrial or military-grade equivalents. The 672-FBGA package supports the high pin count typical of these systems.
Recommandé
ASIC Prototyping and Emulation
The EP1SGX10CF672C6NGA is well suited as an ASIC prototyping platform because the Stratix GX fabric offers enough logic capacity to map sizable ASIC RTL blocks, while embedded SERDES allows real-world I/O at multi-gigabit rates rather than slow testbench stubs. The Quartus II design flow accepts standard HDL and supports incremental compilation, which shortens compile iterations during bring-up. Multiple FPGAs of this family are typically combined on a multi-FPGA prototyping board to emulate ASICs that exceed single-chip density.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX10CF672C6NGA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX25F672C6N | EP1SGX25F672C6 | EP1SGX25F672C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Series | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Density Tier | EP1SGX10 (base) | EP1SGX10 (base) | EP1SGX10 (base) | EP1SGX25 (higher density, ~2.5x) | EP1SGX25 (higher density, ~2.5x) | EP1SGX25 (higher density, ~2.5x) |
| Speed Grade | 6 (commercial) | 6 (commercial) | 6 (commercial) | 6 (commercial) | 6 (commercial) | 7 (faster Fmax) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| User I/O | 362 | 362 | 362 | 362 | 362 | 362 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Pin-compatible upgrade path within Stratix GX family (vs EP1SGX25F672C6N)
- Same-die alternate catalog number for EOL mitigation (vs EP1SGX10CF672C6N)
- Embedded multi-gigabit transceivers eliminate external PHY chips (vs EP1S10F672C6 (non-GX Stratix))
Notes de conception
The 672-FBGA package has a fine ball pitch (typically 1.0 mm). Use escape routing rules of 4 mil trace/4 mil space with microvia stack-ups (e.g., 4-2-4 or 6-2-6) and follow Intel/Altera's Stratix GX board design guidelines for BGA fan-out. Maintain continuous ground reference planes under the BGA and stitch vias around the perimeter to suppress simultaneous-switching-noise (SSN) on the user I/O banks.
Stratix GX FPGAs require multiple supply rails (VCCINT core, VCCPD for pre-drivers, VCCIO for I/O banks, VCCA_PLL/VCCD_PLL for PLLs, and VCCHIP for transceivers). Decouple each rail with 0.1 uF + 10 uF capacitors placed within 100 mils of the respective balls. Use a dedicated VRM for the transceiver supply with ferrite-bead isolation to prevent core-noise injection into SERDES PLLs, which directly impacts jitter and eye-mask margin.
Estimated: at 100% logic utilization and 50% transceiver utilization, total power can reach 10-15 W. With a 672-FBGA theta_JA in the 15-25 C/W range (depending on PCB stack-up), a junction temperature rise of 150-375 C above ambient is theoretically possible. Use at least 4 inner ground/power planes for heat spreading, and consider a thermal pad/BGA heat-sink if the enclosure does not provide forced-air cooling. Always measure Theta_JA on your actual board with a thermal test die before qualifying the thermal design.
Transceiver channels operating at multi-gigabit data rates require controlled-impedance differential pairs (100 ohm differential for most protocols). Keep intra-pair skew below 1 ps per inch and match lengths within 5 mils across the entire channel. Use AC-coupling capacitors of 100 nF at the transmitter output, and follow the Stratix GX Device Handbook's reference board stack-up for the specific data rate class you are targeting.
Configuration mode pin (MSEL) settings must match the chosen configuration source (JTAG, serial flash, or parallel flash). A common mistake is leaving configuration pins floating during power-up, which can cause the device to enter an undefined mode. Tie MSEL, nCONFIG, and nSTATUS through appropriate pull-up/pull-down resistors. Always keep the JTAG TCK pin pulled low during power-up to prevent unintended JTAG state changes.
Informations de conformité
RoHS and lead-free per Altera/Intel product page (NGA suffix denotes RoHS-compliant lead-free finish). AEC-Q100 is not applicable for FPGAs. Halogen-free and conflict-minerals status were not present in the provided data; set to 'unknown' rather than guessed.
