EP1SGX25F672C7N - Stratix GX FPGA, 25K LEs, 672-BGA | Intel
Référence : EP1SGX25F672C7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $320 | $320,00 |
| 10 | $295 | $2 950,00 |
| 100 | $268 | $26 800,00 |
| 500 | $240 | $120 000,00 |
| 1 000 | $215 | $215 000,00 |
EP1SGX25F672C7N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of programmable logic blocks (CLBs/LABs) interconnected by a configurable routing fabric and surrounded by programmable I/O cells. Unlike ASICs, FPGAs are reprogrammable after manufacture, making them ideal for prototyping, low-volume production, and designs where time-to-market is critical. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. The Stratix GX family specifically adds embedded multi-gigabit transceivers, positioning it for serial connectivity, baseband processing, and high-bandwidth data path applications.
Key features include 25660 logic elements, 4 maximum user I/O banks, support for 3.125 Gbps serial transceivers, embedded DSP blocks for high-speed arithmetic, and tri-state 8/10/16/32/64/128-bit multiplier support. The device supports LVDS, LVTTL, LVCMOS, SSTL, HSTL, and LVPECL I/O standards, with 25660 registers and a 672-ball 1.0 mm pitch FineLine BGA (FBGA672) package. Operating temperature spans 0°C to 85°C (commercial grade).
The architecture combines a TriMatrix memory structure with up to 1.94 Mbit of RAM, embedded multiplier blocks, and a hierarchical clock network with up to 16 global clocks and 8 PLLs per quadrant. The integrated 3.125 Gbps transceivers support protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and PCI Express (via external PHY), eliminating external serializer/deserializer chips and reducing BOM cost.
Typical applications include high-speed serial interface bridges, baseband signal processing for wireless infrastructure, network packet processing, high-speed data acquisition, and prototype ASIC emulation. Designers choose this family when they need embedded multi-gigabit serial I/O without paying the full cost of newer 10 Gbps-capable devices.
When designing with this device, ensure that the 672-ball BGA PCB layout uses microvia or via-in-pad technology with proper breakout fanout to minimize signal integrity loss on high-speed serial lanes. Power-supply sequencing must follow the recommended 1.5 V core / 3.3 V I/O / 1.5 V PLL ramp profile.
This page synthesizes distributor availability, Stratix GX family drop-in alternatives, and design notes not found in the original manufacturer datasheet. All specifications verified against the Intel (Altera) Stratix GX Device Handbook as of 2026-09-07.
Alternatives de remplacement direct pour EP1SGX25F672C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25F672C7N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Transceiver Data Rate, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25CF672C7N
✅ Remplacement direct✓ En stock
$338.5 / unité
Voir la fiche technique →EP1SGX25DF672C7N
✅ Remplacement direct✓ En stock
$245 / unité
Voir la fiche technique →EP1SGX25FF672C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1SGX25GF672C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1SGX25DF672C7ES
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1SGX25DF672I7N
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP1SGX25F672C7N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Number of I/O Banks | 4 |
| Number of Registers | 25,660 |
| Number of Transceivers | Up to 20 |
| Transceiver Data Rate | 3.125 Gbps |
| Operating Supply Voltage (Core) | 1.5 V nominal |
| Plage de température de fonctionnement | 0°C to 85°C (commercial) |
| Process Technology | CMOS |
| Boîtier | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant (lead-free FBGA) |
Guide de configuration des broches du EP1SGX25F672C7N 672-ball fineline bga (fbga672), 1.00 mm pitch
Configuration des broches du EP1SGX25F672C7N (boîtier 672-ball fineline bga (fbga672), 1.00 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX25F672C7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX25F672C7N convient pour 6 applications: Multi-Gigabit Serial Interface Bridge, Wireless Baseband Signal Processing, Network Packet Processing, High-Speed Data Acquisition, ASIC Prototyping and Emulation, Industrial Control and Embedded Vision.
Multi-Gigabit Serial Interface Bridge
The EP1SGX25F672C7N's 20 embedded transceivers at 3.125 Gbps make it ideal for bridging between serial protocols (Gigabit Ethernet to Serial RapidIO, XAUI to PCIe, etc.) without external PHYs. With 25,660 LEs and 1.94 Mbit embedded RAM, it can implement stateful MAC-layer logic, packet buffers, and rate-matching FIFOs between protocols. The 672-ball FBGA package supports the high pin density needed for differential serial lane breakout, and commercial temperature rating suits indoor networking equipment.
Recommandé
Wireless Baseband Signal Processing
The EP1SGX25F672C7N's embedded multiplier blocks, 25,660 LEs, and 1.94 Mbit TriMatrix memory provide the DSP fabric needed for wireless baseband processing (channelization, modulation/demodulation, equalization) at the edge of base stations and wireless backhaul. Its 3.125 Gbps transceivers handle CPRI/OBSAI links to remote radio heads. The 1.5 V core and 672-ball FBGA footprint integrate cleanly into existing base-station RF front-end cards.
Recommandé
Network Packet Processing
The EP1SGX25F672C7N combines 25,660 LEs and 1.94 Mbit of fast embedded RAM (with true dual-port modes up to 256 Kbit blocks) for high-throughput packet classification, queue management, and header processing. Its 20 transceivers at 3.125 Gbps aggregate multiple 1 GbE links into 10 Gbps uplinks (via XAUI), while the 4 I/O banks allow mixed-voltage interfacing to TCAMs, RLDRAM, and QDR SRAM.
Recommandé
High-Speed Data Acquisition
For test and measurement equipment, the EP1SGX25F672C7N's combination of high-speed LVDS I/O, embedded RAM for sample buffering, and 20 transceivers for backhaul to host PCs makes it well-suited for digitizers, oscilloscopes, and protocol analyzers. The 25,660 LEs support real-time FFT and triggering logic, while the 1.5 V core keeps per-channel power within thermal budget of a fan-cooled chassis.
Recommandé
ASIC Prototyping and Emulation
The EP1SGX25F672C7N's 25,660 LEs, multiple I/O banks, and 672-ball FBGA package with abundant high-speed serial I/O make it a viable prototype target for ASIC blocks up to ~20 Kgates. Multi-FPGA partitioning is possible using the 3.125 Gbps transceivers for chip-to-chip links. Quartus II synthesis and incremental compile support shorten prototype iteration cycles.
Recommandé
Industrial Control and Embedded Vision
The EP1SGX25F672C7N's robust I/O standard support (LVDS, LVTTL, SSTL, HSTL) and 25,660 LEs enable camera interface bridging (LVDS to parallel), motion-control loops, and machine-vision preprocessing. The 20 transceivers connect to multi-camera GigE Vision or Camera Link streams. Commercial temperature rating fits factory-floor enclosures with internal cooling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25F672C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25CF672C7N | EP1SGX25DF672C7N | EP1SGX25FF672C7N | EP1SGX25GF672C7N | EP1SGX25DF672C7ES | EP1SGX25DF672I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (FBGA672, 1.0 mm pitch) | 672-ball FBGA (same) | 672-ball FBGA (same) | 672-ball FBGA (same) | 672-ball FBGA (same) | 672-ball FBGA (same) | 672-ball FBGA (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Transceivers | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Operating Temperature | 0°C to 85°C (commercial) | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | -40°C to 100°C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Drop-in silicon revision compatibility (vs EP1SGX25DF672C7N)
- Industrial temperature option available within same family (vs EP1SGX25DF672I7N)
- Embedded 3.125 Gbps transceivers eliminate external PHYs (vs Stratix (non-GX) EP1S25F672C7N)
Notes de conception
The 672-ball FBGA package with 1.0 mm pitch requires microvia (or via-in-pad) PCB technology for reliable signal breakout, especially on high-speed serial transceiver lanes where via stubs degrade signal integrity at multi-Gbps data rates. Use a 1-2-1 or 1-2-3-2-1 stack-up with controlled-impedance stripline routing for the transceiver differential pairs (target 100 ohm differential). Stitching vias around the BGA field and a continuous ground plane beneath the package are essential for return-path continuity.
The EP1SGX25F672C7N requires multiple supply rails: 1.5 V for core logic, 3.3 V for I/O banks, and 1.5 V for PLL analog supplies. Power sequencing must follow the manufacturer's recommended ramp profile (core before I/O) to avoid latch-up. Decoupling should include 0.1 uF and 0.01 uF ceramic capacitors placed as close as possible to each power pin, plus bulk 47-100 uF tantalum or polymer caps near each rail entry. Estimated power consumption for a typical 20-transceiver design: ~3-5 W from VCCINT (1.5 V core) plus ~1 W from VCCIO banks.
Do not mix obsolete Stratix GX parts from different silicon revisions (F, C, D, G masks) on the same design unless you have verified JTAG ID, configuration file compatibility, and pinout revision against the Quartus II device database. Configuration via the legacy EPC16 or EPCS4 serial configuration device requires correct MSEL pin settings. Programming files (.sof and .pof) generated for one mask are generally NOT bitstream-compatible with another - always re-run a full compile when switching silicon revisions.
Each 3.125 Gbps transceiver channel requires a clean, isolated supply plane (VCCR_PLL, VCCA, VCCH) with ferrite-bead isolation from the digital core supply. Use a 4-layer minimum PCB with a dedicated analog-power island. Reference clock inputs (REFCLK) must be routed as 50 ohm controlled-impedance single-ended or differential traces with length matching to within +/-50 mils of the data lane clocks for proper CDR lock.
Informations de conformité
RoHS compliant per Altera/Intel product documentation. Lead-free FBGA package. Halogen-free status not explicitly documented in verified web data - marked unknown. Not AEC-Q100 qualified (commercial-grade IC, not automotive).
