EP1SGX25F672C6 - Stratix GX FPGA, 25K LE, 672-Pin FBGA | Intel
MPN: EP1SGX25F672C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $198 | $19,800.00 |
| 500 | $175 | $87,500.00 |
Drop-in alternatives for EP1SGX25F672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25CF672C6
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View Datasheet →EP1SGX25CF672I6
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View Datasheet →EP1SGX25CF672I6N
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View Datasheet →EP1SGX25F672C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements (LE) | 25,660 |
| Logic Array Blocks (LAB) | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Pins | 455 |
| Process Node | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V |
| Package | 672-pin FBGA (FC-FBGA), 33x33 mm, 1.0 mm pitch |
| Speed Grade | C6 |
| Operating Temperature (Commercial) | 0 C to 85 C (junction) |
| Transceivers | Multi-channel high-speed serial (Stratix GX integrated) |
| Configuration | SRAM-based, configurable via Quartus II / JTAG / serial |
| Mounting Type | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per datasheet marking) |
| Logic Family | CMOS |
EP1SGX25F672C6 672-pin fbga (fc-fbga), 33x33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25F672C6 (672-pin fbga (fc-fbga), 33x33 mm, 1.0 mm pitch package) with 455 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25F672C6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 455 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25F672C6 is suitable for 6 applications: Gigabit Ethernet MAC and Rate-Matching Pipeline, PCI Express Endpoint and Root Complex Prototyping, Software Defined Radio (SDR) Baseband Processing, SONET/SDH Framer and Telecom Line Card, High-Throughput Video Processing and Image Pipeline, Industrial Automation and Motion Control Platform.
Gigabit Ethernet MAC and Rate-Matching Pipeline
The EP1SGX25F672C6's integrated multi-gigabit transceivers and 25,660 logic elements make it well-suited for 1G/10G Ethernet MAC and rate-matching pipeline implementations. Per the Stratix GX datasheet, the rate matcher adheres to IEEE 802.3 clause 36 specifications for idle additions/removals, performing clock compensation only on /I2/ ordered sets composed of /K28.5/ followed by /D16.2/. The FPGA's 1,944,576 RAM bits buffer Ethernet frames while 455 user I/O pins support parallel PHY interfaces and external memory. Unlike pure ASIC implementations, this FPGA allows in-system MAC protocol updates and is placed between PHY transceivers and the network processor with deterministic latency.
Recommended
PCI Express Endpoint and Root Complex Prototyping
With embedded transceivers and abundant logic resources, the EP1SGX25F672C6 supports PCI Express Gen1 endpoint and root-complex prototyping in pre-silicon validation environments. The 25,660 LE fabric implements PIPE/PCS logic, transaction layer, and data link layer state machines, while the device's 1.5 V core and FBGA package deliver signal integrity for the multi-gigabit serial link. The FPGA's reconfigurable nature accelerates firmware-hardware co-design, allowing iterative PHY tuning versus fixed-ASIC implementations. Per the Stratix GX datasheet, the transceiver channels support common SerDes protocols including PCI Express, Serial RapidIO, and Gigabit Ethernet simultaneously.
Recommended
Software Defined Radio (SDR) Baseband Processing
The EP1SGX25F672C6's DSP blocks and embedded multipliers enable real-time baseband processing for software-defined radio platforms. With 25,660 LE and hardware-accelerated multiply-accumulate units, the device implements FFT cores, channelization filters, and modulation/demodulation algorithms at sample rates exceeding 100 MSPS. Compared to DSP-processor implementations, this FPGA approach delivers deterministic latency and higher throughput per watt. The transceiver channels digitize IF or RF signals directly, while the 455 I/O pins interface to ADC/DAC converters and host processors. Source: Altera application note on DSP implementation in Stratix GX.
Recommended
SONET/SDH Framer and Telecom Line Card
Telecom line card designers use the EP1SGX25F672C6 to implement SONET/SDH framers, pointer processors, and overhead extractors. The integrated transceivers handle OC-48/STM-16 line-side serialization at 2.488 Gbps, while the 25,660 LE fabric implements the framer state machine and overhead processing. The 1,944,576 RAM bits buffer payload data, and 455 user I/O pins connect to backplane interfaces, TDM buses, and clock recovery circuits. Unlike ASIC implementations, the FPGA enables multi-protocol line card support - one board design can carry SONET, Ethernet, and Fibre Channel simultaneously via firmware configuration.
Recommended
High-Throughput Video Processing and Image Pipeline
The EP1SGX25F672C6 implements real-time video processing pipelines including deinterlacing, scaling, color space conversion, and MPEG/H.264 preprocessing. Its 1,944,576 RAM bits store multiple video frame buffers, while 455 user I/O pins support parallel video buses (BT.656, BT.1120) and DDR memory interfaces. With 25,660 logic elements, the FPGA delivers sustained pixel rates above 150 MP/s in typical 2D filter pipelines, outperforming DSP processors for pixel-parallel operations. The integrated transceivers enable SDI/HD-SDI serial video transport, eliminating external serializer chips. Reference: Altera video reference design library.
Recommended
Industrial Automation and Motion Control Platform
In industrial automation, the EP1SGX25F672C6 functions as a high-speed motion controller and protocol bridge, supporting EtherCAT, Profinet, and SERCOS implementations. With 25,660 LE, the device achieves sub-microsecond cycle times for multi-axis servo control loops, while the 1,944,576 RAM bits enable trajectory planning tables and PID parameter storage. The 455 I/O pins support encoder feedback, digital I/O expansion, and high-speed ADC interfaces. Compared to microcontroller implementations, this device delivers deterministic real-time performance and parallel multi-protocol bridging on a single chip, simplifying line controller architectures.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25F672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C6 | EP1SGX25CF672C6N | EP1SGX25CF672C7 | EP1SGX25CF672I6 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA (33x33 mm, 1.0 mm pitch) | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Speed Grade | C6 (commercial) | C6 - same | C6 - same | C7 (faster) | I6 (industrial temp, same speed) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O Pins | 455 | 455 | 455 | 455 | 455 |
| Temperature Range | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Industrial -40C to +100C |
| Terminal Finish | SnPb (standard) / lead-free variant available | SnPb | Pb-free (matte Sn) | SnPb | SnPb |
Key Differentiators
- Same-package Pb-free variant for RoHS compliance (vs EP1SGX25CF672C6)
- Faster speed grade option for timing closure (vs EP1SGX25CF672C7)
- Industrial temperature grade option (vs EP1SGX25CF672I6)
Design Notes
The 672-ball FBGA with 1.0 mm pitch requires a PCB stackup with microvia (laser-drilled) technology or HDI build-up layers per IPC-6012 Class 3 for reliable assembly. BGA pad design should follow the manufacturer's recommended NSMD (non-solder mask defined) land pattern with 0.5 mm pad diameter, and via-in-pad is recommended for the inner rows to escape the high pin density. Plan at least 6 PCB layers (4 signal + 2 ground/power) for signal integrity on the multi-gigabit transceiver channels.
The Stratix GX requires multiple sequenced power rails: VCCINT (1.5 V core), VCCIO banks (multiple voltages for mixed I/O standards), VCCA_PLL (analog PLL supply), and VCCA_TX/RX (transceiver analog supplies). Per the Stratix GX datasheet power-on sequencing section, all supplies must ramp within 100 ms and meet monotonic rise requirements. Use a power management IC with tracking capability, and place 10 uF + 0.1 uF + 10 nF decoupling capacitor arrays on every supply pin within 5 mm trace length.
Estimated: at 25,660 LE utilization of approximately 70% toggle rate and 1.5 V core at 25 C ambient, the EP1SGX25F672C6 typically dissipates 4-6 W. With a 672-pin FBGA, the package thermal resistance theta_JA is approximately 18-22 C/W on a standard 4-layer JEDEC test board. Designers should perform application-specific thermal simulation using the device power estimator and confirm that junction temperature stays below 85 C for commercial grade. Consider adding a heatsink or thermal via array under the package center for high-utilization designs.
Do not use newer Quartus Prime versions to compile EP1SGX25F672C6 designs - the Stratix GX device support was removed from Quartus after version 13.0sp1. Always specify the JTAG configuration mode at board bring-up and verify the nCONFIG and nSTATUS pull-up resistors per the configuration handbook chapter. For multi-FPGA designs, use the same configuration scheme on all devices and avoid mixing passive serial with active serial modes on a shared chain.
Multi-gigabit transceiver channels require 100 ohm differential impedance-controlled routing with maximum intra-pair skew of 1 ps per cm. Per the Stratix GX datasheet transceiver specifications, AC-coupling capacitors must be placed near the TX side and use 0.01 uF X7R ceramic dielectric. Reference clock routing to the transceiver REFCLK pins must be length-matched within 25 mils across all channels and isolated from noisy digital signals by ground guard traces.
Compliance Information
Lead-free variants available (CF672C6N/C7N/I6N suffixes). RoHS compliance per Altera product marking; the standard F672C6 without N suffix carries SnPb terminal finish for non-RoHS applications. AEC-Q100 not applicable for FPGA in this family.
