EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera
料号： EP1SGX10CF672C6NGA ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
EP1SGX10CF672C6NGA 概述
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy, below custom ASICs and above CPLDs in density and complexity, and they form a core sub-category of programmable logic devices (PLDs) within digital logic ICs. The Stratix GX line specifically adds embedded serializer/deserializer (SERDES) channels, allowing designers to implement protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon without external PHY chips.
Key features of the EP1SGX10CF672C6NGA include embedded transceiver channels, embedded memory blocks, dedicated DSP blocks for high-throughput signal processing, and support for a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 672-FBGA package provides a compact footprint while supporting high signal-count designs with 362 available user I/O pins. The device is supported by the Quartus II design software, including the SOPC Builder for system-on-chip integration.
From an architectural standpoint, Stratix GX devices combine a logic-array fabric built around adaptive logic modules (ALMs), TriMatrix on-chip memory (MLAB, M512, M4K, M-RAM blocks), DSP blocks that include hardware multipliers, and embedded transceivers that operate at multi-gigabit data rates. Power is distributed through dedicated VCC and VCCPD banks, with configuration handled through JTAG or a serial/parallel flash interface.
Typical applications for this part include high-speed serial interface bridging, telecommunications line cards, video broadcast and image processing systems, industrial test and measurement equipment, military/aerospace signal processing, and prototyping of ASIC designs. The transceiver-rich architecture makes it particularly well suited to backplane and chip-to-chip interconnect. Designers should refer to the Stratix GX Device Handbook and pin-out guidelines when assigning pins and planning power sequencing. This page synthesizes distributor stock, drop-in package alternatives, and practical design considerations not consolidated in the original datasheet.
直接替换替代料： EP1SGX10CF672C6NGA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX10CF672C6NGA （相同外形与封装尺寸） ——差异在于 Package, RoHS Status, Speed Grade, Operating Temperature, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP1SGX10CF672C6N
✅ 直接替换✓ 有现货
$152 / 个
查看数据手册 →EP1SGX10CF672C6
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP1SGX25F672C6N
✅ 直接替换📋 参考替代料（不在目录中）
EP1SGX25F672C6
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →EP1SGX25F672C7N
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP1SGX10CF672C6NGA 最大额定值与电气特性
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Series | Stratix GX |
| Device Family | Stratix GX (EP1SGX10) |
| Max User I/O | 362 |
| 封装 | 672-FBGA (Fine-Pitch BGA) |
| Speed Grade | 6 |
| Temperature Grade | Commercial |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
| Configuration Interface | JTAG / Serial / Parallel flash |
| Design Software | Quartus II |
EP1SGX10CF672C6NGA 672-fbga (fine-pitch bga) 引脚配置指南
EP1SGX10CF672C6NGA（672-fbga (fine-pitch bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX10CF672C6NGA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX10CF672C6NGA 适用于 6 应用s: Telecommunications Line Cards, High-Speed Serial Interface Bridging, Video Broadcast and Image Processing, Industrial Test and Measurement Equipment, Aerospace and Defense Signal Processing, ASIC Prototyping and Emulation.
Telecommunications Line Cards
The EP1SGX10CF672C6NGA's embedded multi-gigabit transceivers and 362 user I/O make it well-suited to telecom line cards implementing protocols such as SPI-4.2, SFI-4.1, and XAUI. The Stratix GX SERDES channels handle backplane interconnect directly without external PHY chips, while the programmable logic fabric implements framing, queue management, and protocol conversion. Compared to ASIC alternatives, this FPGA approach reduces NRE cost and enables late-stage feature changes. Pin-compatibility with the EP1SGX25F672C6N in the same 672-FBGA package gives a clear scaling path for ports or bandwidth growth.
推荐
High-Speed Serial Interface Bridging
Designers use the EP1SGX10CF672C6NGA to bridge between incompatible high-speed serial standards - for example, converting between Serial RapidIO and Gigabit Ethernet or between PCI Express and XAUI. The on-chip SERDES channels support multi-gigabit data rates, while the logic fabric implements protocol adaptation. The 672-FBGA package exposes enough user I/O for parallel sideband interfaces, status LEDs, and management buses. Quartus II's transceiver toolkit provides built-in PMA settings for BER testing and eye-diagram analysis during bring-up.
推荐
Video Broadcast and Image Processing
The Stratix GX family's dedicated DSP blocks and embedded memory make the EP1SGX10CF672C6NGA a viable platform for video broadcast equipment such as SDI embedders/de-embedders, format converters, and real-time image-processing pipelines. Hardware multipliers accelerate FFT, FIR, and color-space-conversion algorithms, while the multi-gigabit SERDES handles SDI, HD-SDI, or 3G-SDI interconnect. The 672-FBGA package supplies sufficient user I/O for parallel video buses, GPIO, and external memory interfaces such as DDR/DDR2 SDRAM.
推荐
Industrial Test and Measurement Equipment
Test equipment vendors choose the EP1SGX10CF672C6NGA for protocol-aware instruments such as protocol analyzers, BERT testers, and compliance fixtures, because the embedded transceivers implement the physical layer while the programmable logic implements custom analysis, triggering, and display logic. Industrial temperature tolerance and the 362 user I/O support dense front-panel interfaces, LCD/video outputs, and high-speed probe connections. The Quartus II SignalTap logic analyzer provides real-time on-chip debug without external scope pins.
推荐
Aerospace and Defense Signal Processing
Defense contractors have historically deployed the EP1SGX10CF672C6NGA in radar front-end processing, electronic-warfare subsystems, and secure communications where the combination of multi-gigabit transceivers and DSP blocks delivers deterministic throughput for SDR and SIGINT workloads. The commercial-grade temperature range limits deployment to benign environments; for harsh environments designers must migrate to industrial or military-grade equivalents. The 672-FBGA package supports the high pin count typical of these systems.
推荐
ASIC Prototyping and Emulation
The EP1SGX10CF672C6NGA is well suited as an ASIC prototyping platform because the Stratix GX fabric offers enough logic capacity to map sizable ASIC RTL blocks, while embedded SERDES allows real-world I/O at multi-gigabit rates rather than slow testbench stubs. The Quartus II design flow accepts standard HDL and supports incremental compilation, which shortens compile iterations during bring-up. Multiple FPGAs of this family are typically combined on a multi-FPGA prototyping board to emulate ASICs that exceed single-chip density.
推荐
推荐产品汇总
工程参考数据： EP1SGX10CF672C6NGA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX25F672C6N | EP1SGX25F672C6 | EP1SGX25F672C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Series | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Density Tier | EP1SGX10 (base) | EP1SGX10 (base) | EP1SGX10 (base) | EP1SGX25 (higher density, ~2.5x) | EP1SGX25 (higher density, ~2.5x) | EP1SGX25 (higher density, ~2.5x) |
| Speed Grade | 6 (commercial) | 6 (commercial) | 6 (commercial) | 6 (commercial) | 6 (commercial) | 7 (faster Fmax) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| User I/O | 362 | 362 | 362 | 362 | 362 | 362 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Pin-compatible upgrade path within Stratix GX family （对比 EP1SGX25F672C6N)
- Same-die alternate catalog number for EOL mitigation （对比 EP1SGX10CF672C6N)
- Embedded multi-gigabit transceivers eliminate external PHY chips （对比 EP1S10F672C6 (non-GX Stratix))
设计说明
The 672-FBGA package has a fine ball pitch (typically 1.0 mm). Use escape routing rules of 4 mil trace/4 mil space with microvia stack-ups (e.g., 4-2-4 or 6-2-6) and follow Intel/Altera's Stratix GX board design guidelines for BGA fan-out. Maintain continuous ground reference planes under the BGA and stitch vias around the perimeter to suppress simultaneous-switching-noise (SSN) on the user I/O banks.
Stratix GX FPGAs require multiple supply rails (VCCINT core, VCCPD for pre-drivers, VCCIO for I/O banks, VCCA_PLL/VCCD_PLL for PLLs, and VCCHIP for transceivers). Decouple each rail with 0.1 uF + 10 uF capacitors placed within 100 mils of the respective balls. Use a dedicated VRM for the transceiver supply with ferrite-bead isolation to prevent core-noise injection into SERDES PLLs, which directly impacts jitter and eye-mask margin.
Estimated: at 100% logic utilization and 50% transceiver utilization, total power can reach 10-15 W. With a 672-FBGA theta_JA in the 15-25 C/W range (depending on PCB stack-up), a junction temperature rise of 150-375 C above ambient is theoretically possible. Use at least 4 inner ground/power planes for heat spreading, and consider a thermal pad/BGA heat-sink if the enclosure does not provide forced-air cooling. Always measure Theta_JA on your actual board with a thermal test die before qualifying the thermal design.
Transceiver channels operating at multi-gigabit data rates require controlled-impedance differential pairs (100 ohm differential for most protocols). Keep intra-pair skew below 1 ps per inch and match lengths within 5 mils across the entire channel. Use AC-coupling capacitors of 100 nF at the transmitter output, and follow the Stratix GX Device Handbook's reference board stack-up for the specific data rate class you are targeting.
Configuration mode pin (MSEL) settings must match the chosen configuration source (JTAG, serial flash, or parallel flash). A common mistake is leaving configuration pins floating during power-up, which can cause the device to enter an undefined mode. Tie MSEL, nCONFIG, and nSTATUS through appropriate pull-up/pull-down resistors. Always keep the JTAG TCK pin pulled low during power-up to prevent unintended JTAG state changes.
合规信息
RoHS and lead-free per Altera/Intel product page (NGA suffix denotes RoHS-compliant lead-free finish). AEC-Q100 is not applicable for FPGAs. Halogen-free and conflict-minerals status were not present in the provided data; set to 'unknown' rather than guessed.
