EP20K100ETC144-1X - APEX 20KE FPGA 4160 Cells 144-TQFP | Intel
Référence : EP20K100ETC144-1X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2 985,00 |
| 500 | $26.4 | $13 200,00 |
| 1 000 | $23.1 | $23 100,00 |
EP20K100ETC144-1X Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets designers implement arbitrary digital logic through SRAM-based configuration cells, after the chip has been manufactured. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs (which are gate-array-style and non-volatile) and modern high-end SoC FPGAs with hard CPU cores. The APEX 20KE series specifically combines Look-Up Table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory, making it suitable for data-path and DSP-style glue logic in telecom, networking, and industrial systems.
Key specifications of the EP20K100ETC144-1X include 4160 logic elements, 53,248 typical gates, 92 available user I/O pins, a propagation delay figure of 1.6 ns through internal interconnect, 1.8 V core VCC, and a commercial operating temperature grade of 0 °C to 85 °C. The "-1X" speed-grade suffix designates the slowest APEX 20KE timing bin, while the "TC144" suffix denotes the TQFP-144 thermally enhanced gull-wing package.
From an architectural standpoint, the device combines a fine-grained LUT fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO blocks of up to 2 Kbits each. The LUT-and-EAB hybrid is a hallmark of the APEX 20K family and offers higher effective logic density per square millimetre than pure CPLD architectures when implementing wide datapath functions such as bus interfaces, protocol converters, and state machines.
Typical applications for the EP20K100ETC144-1X include glue logic in telecom line cards, industrial control backplanes, PCI bridge and bus-interfaces, protocol converters (UART, I2C, SPI bridges), and low-density DSP pre-processing blocks. The 144-pin TQFP is well-suited to through-hole-style prototyping or rework-friendly assembly, and the commercial temperature range covers most indoor equipment.
When designing with this part, engineers should note that the APEX 20KE family is no longer in active production and is supported primarily through the legacy Altera/Intel design flow with the Quartus II toolchain. Designers targeting new designs should evaluate Cyclone IV/V or MAX II equivalents unless footprint compatibility with the existing TQFP-144 PCB is required.
Alternatives de remplacement direct pour EP20K100ETC144-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100ETC144-1X (même facteur de forme et même empreinte) — différant par Process Technology, Family, Package, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100ETC144-1N
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →EP20K100ETC144-1N
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →EP20K100EFC144-1
✅ Remplacement direct✓ En stock
$61.75 / unité
Voir la fiche technique →EP20K100CT144C7
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP20K100CF144C7
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP4CE6E22C8N
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →EP20K100ETC144-1X Valeurs maximales et caractéristiques électriques
| Device Family | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 4160 cells |
| Typical Gates | 53248 |
| Macrocells | 416 |
| User I/Os | 92 |
| Core Voltage | 1.8 V |
| Maximum Frequency | 250 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.22 µm CMOS all-layer copper |
| Package Type | TQFP-144 |
| Type de montage | Surface Mount (gull-wing) |
| Température de fonctionnement | 0 °C to 85 °C |
| Speed Grade | -1 (slowest bin, "-1X") |
Configuration des broches de EP20K100ETC144-1X
| Broche 1 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 2 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 3 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 4 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 5 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 6 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 7 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 8 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 9 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 10 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 11 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 12 | VCCIO — I/O bank supply voltage |
| Broche 13 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 14 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 15 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 16 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 17 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 18 | GND — Ground |
| Broche 19 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 20 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 21 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 22 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 23 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 24 | VCCINT — Core supply voltage (1.8 V) |
| Broche 25 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 26 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 27 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 28 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 29 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 32 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 33 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 34 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 35 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 36 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 37 | VCCIO — I/O bank supply voltage |
| Broche 38 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 39 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 40 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 41 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 42 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 45 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 46 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 47 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 48 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 49 | VCCINT — Core supply voltage (1.8 V) |
| Broche 50 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 51 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 52 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 53 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 54 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 57 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 58 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 59 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 60 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 61 | VCCIO — I/O bank supply voltage |
| Broche 62 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 63 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 64 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 65 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 66 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 69 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 70 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 71 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 72 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 73 | VCCINT — Core supply voltage (1.8 V) |
| Broche 74 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 75 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 76 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 77 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 78 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 81 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 82 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 83 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 84 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 85 | VCCIO — I/O bank supply voltage |
| Broche 86 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 87 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 88 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 89 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 90 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 93 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 94 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 95 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 96 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 97 | VCCINT — Core supply voltage (1.8 V) |
| Broche 98 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 99 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 100 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 101 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 102 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 105 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 106 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 107 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 108 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 109 | VCCIO — I/O bank supply voltage |
| Broche 110 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 111 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 112 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 113 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 114 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 117 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 118 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 119 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 120 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 121 | VCCINT — Core supply voltage (1.8 V) |
| Broche 122 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 123 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 124 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 125 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 126 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 129 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 130 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 131 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 132 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 133 | VCCIO — I/O bank supply voltage |
| Broche 134 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 135 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 136 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 137 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 138 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 141 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 142 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 143 | I/O — User I/O pin (bank-dependent voltage) |
| Broche 144 | I/O — User I/O pin (bank-dependent voltage) |
Applications typiques
EP20K100ETC144-1X convient pour 6 applications: Telecom Line-Card Glue Logic, Industrial Control Backplane Interface, PCI Bridge and Bus-Interface Logic, Protocol Converter (UART / SPI / I2C Bridges), Low-Density DSP Pre-Processing, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP20K100ETC144-1X is well-suited to telecom line-card glue logic because its 4160 logic elements and 92 user I/Os are sufficient to bridge TDM buses, E1/T1 framers, and serial backplane interfaces. The 1.8 V core with multi-voltage I/O banks allows direct interfacing to legacy 3.3 V LVCMOS framers without level shifters. The TQFP-144 package simplifies rework on low-volume line-card prototypes, and the 250 MHz toggle rate comfortably exceeds the 50-77 MHz bus speeds typical of TDM and H.110 backplanes.
Recommandé
Industrial Control Backplane Interface
The 144-pin TQFP package and 0 °C to 85 °C commercial temperature range make the EP20K100ETC144-1X a fit for industrial control backplane interfaces such as VME, CompactPCI bridge logic, and proprietary field-bus controllers. The embedded array blocks (EABs) implement on-chip dual-port RAM for FIFO buffering between backplane domains. The 1.6 ns propagation delay supports deterministic interrupt handling in real-time control loops. Engineers targeting industrial -40 °C to +85 °C should select the EP20K100ETC144-1N variant.
Recommandé
PCI Bridge and Bus-Interface Logic
With 4160 logic elements, the EP20K100ETC144-1X is well-matched to PCI 32-bit/33 MHz bridge logic, including target and initiator state machines, parity generation/checking, and arbiter glue. The 92 user I/Os comfortably accommodate the 49-pin PCI bus plus address/data multiplexing for a secondary local bus. The 250 MHz internal performance gives 4x headroom over the 33 MHz PCI clock, easing timing closure. The APEX 20KE EABs can also be configured as 32x36 FIFOs for PCI burst transactions.
Recommandé
Protocol Converter (UART / SPI / I2C Bridges)
The EP20K100ETC144-1X serves as a flexible multi-protocol converter for legacy equipment where a host CPU needs UART-to-SPI, SPI-to-I2C, or GPIO expansion bridges. Its 4160 logic elements are more than sufficient for eight or more concurrent serial channels with FIFO buffering in EAB memory. The 1.8 V core with selectable I/O bank voltages enables direct connection to 1.8 V, 2.5 V, or 3.3 V peripherals without external level shifters, reducing BOM cost in cost-sensitive industrial gateways.
Recommandé
Low-Density DSP Pre-Processing
The APEX 20KE EABs allow the EP20K100ETC144-1X to function as a pre-processing block for low-density DSP workloads such as FIR filters, FFT butterflies, and digital down-conversion. Each EAB can store coefficient tables for up to 2 Kbits of data, and the LUT fabric implements the multipliers/accumulators at clock rates up to 250 MHz. While not competitive with modern DSP silicon, the device remains useful in legacy radar and sonar pre-processing subsystems that already include APEX 20KE on the bill of materials.
Recommandé
Legacy Test & Measurement Equipment
Test and measurement equipment designed in the late 1990s and early 2000s often integrated the EP20K100ETC144-1X as a pattern-generator or timing-controller core. The 250 MHz internal performance and 92 user I/Os are well-suited to driving 32-channel digital pattern generators with per-channel timing skew control. The TQFP-144 package allows easy replacement during field repair of legacy instruments such as ATE loadboards, protocol analyzers, and boundary-scan controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100ETC144-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100ETC144-1 | EP20K100ETC144-1N | EP20K100EFC144-1 | EP20K100CT144C7 | EP4CE6E22C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera legacy) | Intel | Intel | Intel | Intel | Intel (Cyclone IV) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 (E22) - same footprint |
| Family | APEX 20KE (EAB-equipped) | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20K (non-E) | Cyclone IV |
| Logic Elements | 4160 | 4160 | 4160 | 4160 | 4160 | 6272 (Cyclone IV LE) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V |
| User I/Os | 92 | 92 | 92 | 92 | 92 | 91 (E22 pinout) |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
Principaux différenciateurs
- Same silicon density across the -1 / -1X / -1N speed grades (vs EP20K100ETC144-1)
- Industrial temperature variant available in same footprint (vs EP20K100ETC144-1N)
- Active modern alternative available in same footprint (vs EP4CE6E22C8N)
Notes de conception
The EP20K100ETC144-1X requires a clean 1.8 V core supply (VCCINT) plus one or more VCCIO bank voltages for the I/O ring. Decoupling should follow the Altera reference design: one 100 µF bulk + ten 4.7 µF mid-frequency + one 0.1 µF high-frequency capacitor per VCCINT pin, placed as close to the package as possible. I/O bank VCCIO pins (typically 1.8 V, 2.5 V, or 3.3 V) require their own decoupling network. A ferrite bead between the 1.8 V regulator and VCCINT improves PSRR for noise-sensitive logic designs.
Estimated: at typical industrial utilization (~30% LE switching, 125 MHz fMAX, 1.8 V VCCINT), the EP20K100ETC144-1X dissipates approximately 0.5-1.0 W of core power in a TQFP-144 package with no integrated heatsink. The TQFP-144 has a θJA of approximately 35-45 °C/W on a standard JEDEC 4-layer test board with 1 oz copper. At 1 W dissipation this yields a 35-45 °C junction-temperature rise above ambient. Designers should provide adequate airflow or thermal copper area when operating near the upper 85 °C commercial limit, and must derate if the device is used in sealed enclosures.
The TQFP-144 package uses 0.5 mm lead pitch and requires careful PCB layout. Recommended pad design is the IPC-7351 nominal land pattern with a 0.30 mm pad width and 0.55 mm pad length to ensure reliable solder fillets. A 4-layer stack-up with continuous GND plane on layer 2 and a 1.8 V power plane on layer 3 is the recommended configuration for the TQFP-144 APEX 20KE family. JTAG pins TCK, TMS, TDI, TDO, and TRST should be routed with 4-5 mil traces and guarded by GND on both sides.
Three common pitfalls when designing with the EP20K100ETC144-1X: (1) The APEX 20KE family uses SRAM-based configuration and requires a configuration device (EPC2, EPC4, or EPC8) - do not assume the device is non-volatile. (2) The I/O banks have specific VCCIO requirements per I/O standard; mixing 1.8 V and 3.3 V in the same bank will damage the device. (3) The Quartus II toolchain (not Quartus Prime) is required for compilation - newer toolchains have dropped APEX 20KE support.
Informations de conformité
The -1X suffix indicates lead-free (Pb-free) terminal finish per JEDEC JESD97 e3/e4. RoHS and REACH compliance status were not present in the verified web data - marked unknown pending manufacturer confirmation. Part is not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade FPGA portfolio (Cyclone IV EQ, Cyclone V EQ).