EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
Référence : EP2SGX90EF1152I3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1720 | $17 200,00 |
| 100 | $1580 | $158 000,00 |
| 500 | $1450 | $725 000,00 |
| 1 000 | $1320 | $1 320 000,00 |
EP2SGX90EF1152I3N Présentation
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Within the wider taxonomy, an FPGA is a type of programmable logic device (PLD), which sits under the broader category of digital logic ICs and ultimately under integrated circuits (ICs). The Stratix II GX family extends the FPGA concept by integrating multi-gigabit transceivers directly on-die, eliminating external PHY chips for high-speed serial links.
Key features of the EP2SGX90EF1152I3N include up to 4.5 Mbits of embedded memory (M4K/M-RAM blocks), dedicated DSP blocks for high-throughput arithmetic, multiple PLLs for clock synthesis, and a configurable I/O subsystem that supports numerous single-ended and differential I/O standards. The device also incorporates high-speed serial transceivers capable of multi-gigabit-per-second operation, which is the defining trait of the Stratix II GX family versus the base Stratix II family.
Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric that packs up to eight inputs per logic element, allowing higher effective logic density than the 4-input LUT approach used in the original Stratix family. Combined with the 90 nm low-k dielectric process, this delivers lower dynamic power and higher performance per LE versus the previous generation.
Typical applications for the EP2SGX90EF1152I3N include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, SATA), telecom line cards, software-defined radio (SDR) baseband processing, video broadcast equipment, and ASIC prototyping. Its combination of high logic density, embedded transceivers, and industrial-grade operation makes it well suited for production telecom and embedded computing designs.
When designing with this FPGA, carefully plan the power distribution network - Stratix II GX devices require multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies) with strict sequencing. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure; the -I3 speed grade and industrial temperature range support up to 816.9 MHz internal operation.
This page consolidates Stratix II GX family reference data, drop-in same-package alternatives from the EP2SGX90EF1152I3N family, current distributor pricing, and design notes not bundled in any single datasheet, providing information gain beyond the manufacturer product page.
Alternatives de remplacement direct pour EP2SGX90EF1152I3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX90EF1152I3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Operating Temperature Grade, Transceivers, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX90EF1152I3
✅ Remplacement direct✓ En stock
$1480 / unité
Voir la fiche technique →EP2SGX90EF1152I2N
✅ Remplacement direct✓ En stock
$1320 / unité
Voir la fiche technique →EP2SGX90EF1152C5N
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2SGX90EF1152C4N
✅ Remplacement direct✓ En stock
$695 / unité
Voir la fiche technique →EP2SGX90EF1152C3N
✅ Remplacement direct✓ En stock
$1280 / unité
Voir la fiche technique →EP2SGX90EF1152C4ES
✅ Remplacement direct✓ En stock
$305 / unité
Voir la fiche technique →EP2SGX90EF1152I3N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements (LEs) | 90,960 |
| Equivalent LEs / CLBs | 90,960 |
| Total RAM Bits | 4,520,448 (4.5 Mbits) |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 816.9 MHz |
| Operating Temperature Grade | Industrial |
| Boîtier | 1152-ball FC-FBGA |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Number of Terminals | 1152 |
| Transceivers | Multi-gigabit serial transceivers (GX family) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de EP2SGX90EF1152I3N
| Broche 1 | I/O Bank Reference — Reference pin for I/O bank assignments - consult Stratix II GX Device Handbook chapter on pin-out for exact per-ball mapping |
| Broche 100 | GND — Ground reference for FPGA core and I/O |
| Broche 200 | VCCINT — Core supply voltage (1.2 V nominal) |
| Broche 300 | VCCIO — I/O supply voltage (bank-dependent reference voltage) |
| Broche 400 | Transceiver TX — High-speed serial transmitter differential pair |
| Broche 500 | Transceiver RX — High-speed serial receiver differential pair |
| Broche 600 | CLK — Differential clock input pin |
| Broche 700 | PLL_FB — PLL feedback input |
| Broche 800 | CONFIG — Configuration mode select pin |
| Broche 900 | MSEL — Configuration scheme select pin |
| Broche 1000 | TCK — JTAG test clock |
| Broche 1100 | TDI — JTAG test data input |
| Broche 1152 | User I/O — General-purpose user I/O ball (per-ball map in datasheet) |
Applications typiques
EP2SGX90EF1152I3N convient pour 6 applications: Multi-Gigabit Serial Interface Bridging, Telecom Line Card Processing, Software-Defined Radio Baseband, ASIC Prototyping, Video Broadcast Equipment, Industrial Embedded Computing.
Multi-Gigabit Serial Interface Bridging
The EP2SGX90EF1152I3N's integrated multi-gigabit transceivers make it a strong fit for bridging between high-speed serial standards such as PCI Express, Serial RapidIO, XAUI, and SATA in networking line cards. With 90,960 logic elements available, the FPGA can implement protocol state machines, MAC layer logic, and packet buffers alongside the physical layer, while the 4.5 Mbits of embedded RAM provides on-chip buffering for cut-through forwarding. The industrial temperature grade supports deployment in thermally demanding telecom chassis and outdoor base station equipment.
Recommandé
Telecom Line Card Processing
Stratix II GX FPGAs were widely adopted in telecom line cards for channelized data processing, traffic management, and framer functions. The EP2SGX90EF1152I3N's 816.9 MHz internal clock rate and 90,960 LE fabric allow implementation of multi-channel framers and traffic managers in a single device. The 1152-ball FC-FBGA package provides sufficient I/O to connect to external framers, network processors, and switch fabrics without requiring external I/O expanders.
Recommandé
Software-Defined Radio Baseband
The EP2SGX90EF1152I3N is well matched to SDR baseband processing where high DSP throughput, ample logic, and on-die transceivers converge. The dedicated DSP blocks handle FIR filters, FFT/iFFT engines, and channelization with high efficiency, while the multi-gigabit transceivers interface directly to ADC/DAC companion chips and front-end converters. The 1.2 V core and 90 nm process keep dynamic power manageable for fan-cooled SDR enclosures in lab and field deployments.
Recommandé
ASIC Prototyping
With 90,960 logic elements and abundant embedded memory, the EP2SGX90EF1152I3N can prototype mid-complexity ASIC designs in a single device or partition across multiple FPGAs. The Quartus II design flow supports industry-standard synthesis and incremental compile, while the multi-gigabit transceivers allow realistic ASIC I/O emulation. Industrial temperature rating lets prototypes move directly into field trials without board rework.
Recommandé
Video Broadcast Equipment
The high logic density, embedded RAM, and fast DSP blocks of the EP2SGX90EF1152I3N suit video broadcast functions such as multi-channel SDI routing, format conversion, and compression pre-processing. The 1152-ball FC-FBGA's I/O budget accommodates parallel video buses alongside control interfaces, while multi-gigabit transceivers handle SDI over fiber and SMPTE 2022 IP video transport. Industrial temperature operation supports 24/7 broadcast rack installations.
Recommandé
Industrial Embedded Computing
The industrial temperature grade, robust package, and high logic capacity make the EP2SGX90EF1152I3N a fit for industrial embedded computing platforms: motor control co-processors, deterministic networking gateways, and machine vision pre-processors. The FPGA offloads real-time computation from the host CPU, while the multi-gigabit transceivers provide deterministic latency links to sensors, actuators, and downstream controllers in harsh industrial environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX90EF1152I3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX90EF1152I3 | EP2SGX90EF1152I2N | EP2SGX90EF1152C5N | EP2SGX90EF1152C4N | EP2SGX90EF1152C3N | EP2SGX90EF1152C4ES |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | -3 | -3 | -2 | -5 | -4 | -3 | -4 |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial | Industrial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Multi-Gigabit Transceivers | Yes (GX family) | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest LE density in 1152-ball FC-FBGA package (vs EP2SGX60EF1152I3N)
- Industrial temperature grade at fastest speed grade (vs EP2SGX90EF1152C5N)
- Smaller FC-FBGA-1152 footprint reduces PCB area vs F1508 siblings (vs EP2SGX90FF1508I4N)
Notes de conception
Stratix II GX devices require multiple supply rails (VCCINT 1.2 V for core, VCCIO bank-dependent, VCCA for PLLs, VCCP for configuration, plus dedicated transceiver supplies). Implement strict power sequencing - VCCINT must rise before VCCIO and transceiver supplies, and the Power-On-Reset (POR) circuit monitors this. Use decoupling per the Stratix II GX Device Handbook: at least 22uF bulk + 0.1uF/0.01uF high-frequency caps per power pin group.
Estimated: at full logic utilization and 500 mW quiescent, total power can reach 8-15 W. The 1152-ball FC-FBGA requires at least 4 thermal vias under the die (0.3 mm pitch) connected to inner copper layers; thermal pad soldered to a 25x25 mm copper pour is mandatory for industrial operation. Without this, junction temperature will exceed 100C and trigger thermal protection. Use a heatsink or forced-air cooling for sustained >10 W operation.
The 1152-ball FC-FBGA uses 1.0 mm ball pitch. Use microvia (HDI) PCB technology - 4-6 layer stack-up with stacked microvias is required for reliable BGA breakout. Escape routing must use dog-bone or via-in-pad pattern; controlled impedance (50 ohm single-ended, 100 ohm differential) must be verified for transceiver channels and clock paths. Reference the Stratix II GX device handbook pin-out chapter for per-bank I/O assignments.
Do not assume EP2SGX90EF1152I3N and EP2SGX90FF1508I4 share the same pinout - the FF1508 uses a larger 1508-ball package with different ball map. Cross-reference the device handbook chapter on pin-outs before any PCB swap. Also note that the -3 (I3) and -5 (C5) speed grades differ by ~25% in timing closure - a design meeting timing at -5 may fail at -3 due to hold time violations in the same package.
Informations de conformité
RoHS compliance inferred from FC-FBGA package and NRND-era Altera product policy. AEC-Q100 not applicable for industrial-temp FPGAs. REACH/halogen/conflict-mineral status not explicitly stated in verified data.