EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
Référence : EP3C10E144I7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.44 | $38,44 |
| 10 | $35.2 | $352,00 |
| 100 | $30.5 | $3 050,00 |
| 500 | $27.1 | $13 550,00 |
| 1 000 | $24.75 | $24 750,00 |
EP3C10E144I7 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems.
Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly.
Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power.
Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production.
When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture.
This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP3C10E144I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C10E144I7 (même facteur de forme et même empreinte) — différant par Family, Process Technology, Package, Operating Temperature, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C10E144C8N
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →EP3C10E144C7N
✅ Remplacement direct✓ En stock
$45.2 / unité
Voir la fiche technique →EP3C10E144I7N
✅ Remplacement direct✓ En stock
$39.92 / unité
Voir la fiche technique →EP3C16E144I7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C10E144A7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C10E144I7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 10,320 |
| Total Memory Bits | 423,936 |
| Embedded Multipliers (18x18) | 23 |
| User I/O Count | 94 |
| PLLs | 4 |
| Process Technology | 65 nm |
| Operating Voltage (Core) | 1.2 V |
| Boîtier | 144-pin LQFP Exposed Pad (EQFP) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Grade | Industrial (I7) |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Statut RoHS | Compliant (lead-free) |
Configuration des broches de EP3C10E144I7
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | I/O — User I/O (bank 2) |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 3) |
| Broche 26 | I/O — User I/O (bank 3) |
| Broche 27 | I/O — User I/O (bank 3) |
| Broche 28 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | I/O — User I/O (bank 3) |
| Broche 32 | I/O — User I/O (bank 3) |
| Broche 33 | I/O — User I/O (bank 3) |
| Broche 34 | I/O — User I/O (bank 3) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O (bank 4) |
| Broche 37 | I/O — User I/O (bank 4) |
| Broche 38 | I/O — User I/O (bank 4) |
| Broche 39 | I/O — User I/O (bank 4) |
| Broche 40 | I/O — User I/O (bank 4) |
| Broche 41 | I/O — User I/O (bank 4) |
| Broche 42 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 43 | I/O — User I/O (bank 4) |
| Broche 44 | I/O — User I/O (bank 4) |
| Broche 45 | I/O — User I/O (bank 4) |
| Broche 46 | I/O — User I/O (bank 4) |
| Broche 47 | I/O — User I/O (bank 5) |
| Broche 48 | I/O — User I/O (bank 5) |
| Broche 49 | I/O — User I/O (bank 5) |
| Broche 50 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 51 | I/O — User I/O (bank 5) |
| Broche 52 | I/O — User I/O (bank 5) |
| Broche 53 | I/O — User I/O (bank 5) |
| Broche 54 | I/O — User I/O (bank 5) |
| Broche 55 | I/O — User I/O (bank 5) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O (bank 6) |
| Broche 58 | I/O — User I/O (bank 6) |
| Broche 59 | I/O — User I/O (bank 6) |
| Broche 60 | I/O — User I/O (bank 6) |
| Broche 61 | I/O — User I/O (bank 6) |
| Broche 62 | I/O — User I/O (bank 6) |
| Broche 63 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 64 | I/O — User I/O (bank 6) |
| Broche 65 | I/O — User I/O (bank 6) |
| Broche 66 | I/O — User I/O (bank 6) |
| Broche 67 | I/O — User I/O (bank 6) |
| Broche 68 | I/O — User I/O (bank 7) |
| Broche 69 | I/O — User I/O (bank 7) |
| Broche 70 | I/O — User I/O (bank 7) |
| Broche 71 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 72 | I/O — User I/O (bank 7) |
| Broche 73 | I/O — User I/O (bank 7) |
| Broche 74 | I/O — User I/O (bank 7) |
| Broche 75 | I/O — User I/O (bank 7) |
| Broche 76 | I/O — User I/O (bank 7) |
| Broche 77 | I/O — User I/O (bank 7) |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O (bank 8) |
| Broche 80 | I/O — User I/O (bank 8) |
| Broche 81 | I/O — User I/O (bank 8) |
| Broche 82 | I/O — User I/O (bank 8) |
| Broche 83 | I/O — User I/O (bank 8) |
| Broche 84 | I/O — User I/O (bank 8) |
| Broche 85 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 86 | I/O — User I/O (bank 8) |
| Broche 87 | I/O — User I/O (bank 8) |
| Broche 88 | I/O — User I/O (bank 8) |
| Broche 89 | I/O — User I/O (bank 8) |
| Broche 90 | I/O — User I/O (bank 8) |
| Broche 91 | VCCINT — Core voltage supply (1.2V) |
| Broche 92 | VCCINT — Core voltage supply (1.2V) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O (bank 1) |
| Broche 95 | I/O — User I/O (bank 1) |
| Broche 96 | I/O — User I/O (bank 1) |
| Broche 97 | I/O — User I/O (bank 1) |
| Broche 98 | I/O — User I/O (bank 1) |
| Broche 99 | I/O — User I/O (bank 1) |
| Broche 100 | MSEL0 — Configuration mode select 0 |
| Broche 101 | MSEL1 — Configuration mode select 1 |
| Broche 102 | MSEL2 — Configuration mode select 2 |
| Broche 103 | MSEL3 — Configuration mode select 3 |
| Broche 104 | nCONFIG — Configuration control (active-low) |
| Broche 105 | nSTATUS — Configuration status (active-low) |
| Broche 106 | CONF_DONE — Configuration done indicator |
| Broche 107 | DCLK — Configuration clock |
| Broche 108 | DATA0 — Configuration data bit 0 |
| Broche 109 | DATA1 — Configuration data bit 1 |
| Broche 110 | DATA2 — Configuration data bit 2 |
| Broche 111 | DATA3 — Configuration data bit 3 |
| Broche 112 | DATA4 — Configuration data bit 4 |
| Broche 113 | DATA5 — Configuration data bit 5 |
| Broche 114 | DATA6 — Configuration data bit 6 |
| Broche 115 | DATA7 — Configuration data bit 7 |
| Broche 116 | TCK — JTAG test clock |
| Broche 117 | TMS — JTAG test mode select |
| Broche 118 | TDI — JTAG test data in |
| Broche 119 | TDO — JTAG test data out |
| Broche 120 | nCE — Chip enable (active-low, multi-device chains) |
| Broche 121 | nCEO — Chip enable out (active-low, multi-device chains) |
| Broche 122 | CLK0 — Clock input 0 (PLL reference) |
| Broche 123 | CLK1 — Clock input 1 |
| Broche 124 | CLK2 — Clock input 2 |
| Broche 125 | CLK3 — Clock input 3 |
| Broche 126 | I/O — User I/O (bank 8) |
| Broche 127 | I/O — User I/O (bank 8) |
| Broche 128 | I/O — User I/O (bank 8) |
| Broche 129 | I/O — User I/O (bank 8) |
| Broche 130 | I/O — User I/O (bank 8) |
| Broche 131 | I/O — User I/O (bank 8) |
| Broche 132 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 133 | I/O — User I/O (bank 8) |
| Broche 134 | I/O — User I/O (bank 8) |
| Broche 135 | I/O — User I/O (bank 8) |
| Broche 136 | I/O — User I/O (bank 1) |
| Broche 137 | I/O — User I/O (bank 1) |
| Broche 138 | I/O — User I/O (bank 1) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | I/O — User I/O (bank 1) |
| Broche 141 | I/O — User I/O (bank 1) |
| Broche 142 | I/O — User I/O (bank 1) |
| Broche 143 | I/O — User I/O (bank 1) |
| Broche 144 | I/O — User I/O (bank 1) |
Applications typiques
EP3C10E144I7 convient pour 7 applications: Industrial Motor Control, Video Format Bridge / Display Controller, PCI / PCIe Protocol Bridge, Consumer Electronics - Smart Appliance Controller, Education / Development Platform / FPGA Prototyping, Test and Measurement Front-End, Communications - Telecom Interface Card.
Industrial Motor Control
The EP3C10E144I7's combination of 23 dedicated 18x18 multipliers, 94 user I/O pins, and industrial temperature rating (-40C to +100C) makes it well-suited for sensorless FOC motor controllers driving BLDC and PMSM motors up to several kW. The 10,320 logic elements provide sufficient capacity for PWM generators, current sense decoders, and encoder/CAN interfaces, while the four PLLs generate jitter-clean clocks for high-resolution PWM. At 65nm process, quiescent current is low enough for cabinet-mounted drives. Place the exposed pad over a continuous ground copper pour sized at least 25mm x 25mm on both top and inner layers to maintain junction temperature under load.
Recommandé
Video Format Bridge / Display Controller
The EP3C10E144I7 handles real-time video conversion between formats (RGB->LVDS, HDMI->MIPI, parallel->V-by-One HS) with sufficient bandwidth from its M9K memory blocks. A 1280x720@60Hz stream at 24 bits/pixel requires roughly 22 Mbps throughput, well within the fabric's capability. The 94 user I/O pins support multi-channel LVDS pairs needed for high-resolution panels. Designers typically instantiate DDR2 or LPDDR controllers on this device for frame buffer memory, with the embedded multipliers assisting color-space conversion. The 144-LQFP package supports hand-assembled prototypes and reflow-compatible production builds equally well.
Recommandé
PCI / PCIe Protocol Bridge
Use the EP3C10E144I7 to bridge legacy PCI or parallel local buses to modern serial interfaces. With 10K logic elements and 23 multipliers, the device comfortably implements a 32-bit/33MHz PCI target plus a custom peripheral (UART, SPI, I2C, GPIO expansion). The 4 PLLs generate the 33MHz PCI clock plus application clocks, while 94 user I/Os provide ample margin for PCI bus plus debug headers. The industrial temperature range allows deployment in factory PCs and embedded controllers. Quartus II includes a free PCI Compiler megafunction that synthesizes verified compliant targets.
Recommandé
Consumer Electronics - Smart Appliance Controller
The EP3C10E144I7 is well-matched to smart appliance main boards (washing machines, dishwashers, induction cooktops) where it acts as both user-interface controller (driving segment LCDs, touch keypads, buzzer PWM) and appliance controller (relay drivers, sensor I/O, motor control). The industrial temperature range covers under-cabinet and garage installations. Nios II soft-core can run RTOS-based user interface firmware alongside custom logic for safety interlocks. The exposed-pad 144-LQFP is hand-solder-friendly for prototype runs of 10-100 units.
Recommandé
Education / Development Platform / FPGA Prototyping
The EP3C10E144I7 is the standard device for Cyclone III starter kits (Terasic DE0-Nano-style boards), making it the de-facto training vehicle for first-time FPGA users. With 10K logic elements, students can complete full processor cores (Nios II/e), RISC-V implementations, and modest image processing pipelines within a single device. Quartus II Web Edition supports the part free of charge. The 144-LQFP is easy to handle on breakout boards and through-hole adapter PCBs. Pin assignments are well-documented in reference designs, accelerating bring-up.
Recommandé
Test and Measurement Front-End
The EP3C10E144I7's 94 user I/Os and embedded multipliers make it a versatile front-end for low-speed digitizers, logic analyzers, and protocol exercisers (I2C/SPI/CAN/JTAG). At 65nm, input threshold sensitivity allows direct interfacing to 3.3V and 2.5V signals without external comparators. The four PLLs can synthesize baud-rate clocks on the fly for protocol generation, while 23 multipliers accelerate DSP blocks such as FIR filters and FFT butterflies for preprocessing acquired signals. Industrial temperature rating covers lab and field deployment.
Recommandé
Communications - Telecom Interface Card
The EP3C10E144I7 implements glue logic and protocol adaptation for telecom line cards, framing E1/T1 streams, implementing HDLC controllers, and providing 8-bit parallel interfaces to legacy ASICs. The 23 multipliers handle FEC and convolutional encoding/decoding, while 4 PLLs derive multiple clock domains from a single 19.44MHz telecom reference. Industrial temperature range is appropriate for central-office and outdoor-cabinet deployments. The 144-LQFP footprint is widely accepted by telecom ODM partners.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C10E144I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C10E144C8N | EP3C10E144C7N | EP3C10E144I7N | EP3C16E144I7 | EP3C10E144A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) | 144-LQFP Exposed Pad (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+49%) | 10,320 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +125C (Automotive) |
| Speed Grade | I7 (8 speed) | C8 (8 speed) | C7 (7 speed, slower) | I7 | I7 | A7 (automotive, 7 speed) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits (+22%) | 423,936 bits |
| User I/O Pins | 94 | 94 | 94 | 94 | 94 | 94 |
| Process / Family | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III | 65nm Cyclone III (Automotive) |
Principaux différenciateurs
- Industrial temperature grade with fastest I7 speed grade (vs EP3C10E144C8N / EP3C10E144C7N)
- Pin-compatible with 16K LE upgrade for design headroom (vs EP3C16E144I7)
- Lower unit cost than larger LE-count Cyclone III variants (vs EP3C16E144I7 / EP3C25E144)
Notes de conception
The EP3C10E144I7 requires a clean 1.2V core supply (VCCINT) plus per-bank VCCIO supplies (1.2V/1.5V/1.8V/2.5V/3.0V/3.3V depending on I/O standard). Decoupling requirements: place one 100nF X7R 0402 ceramic capacitor within 5mm of every VCCINT and VCCIO pin, plus a 10uF X5R 0805 bulk capacitor per supply rail. Estimated: at 50% toggle activity with all 94 I/Os switching at 100MHz, total ICCINT is approximately 200-400mA and ICCIO bank totals 100-300mA. Use a dedicated LDO (e.g., Linear LT3021 for VCCINT) and avoid sharing the FPGA core supply with analog or RF circuitry.
The 144-LQFP-Exposed-Pad package requires the exposed paddle to be soldered to a continuous copper pour on the PCB for thermal dissipation. Estimated: with theta_JA around 25-30 C/W for a properly-soldered exposed pad on a 4-layer board with 25mm x 25mm ground pour, the device can dissipate approximately 2-3W before requiring derating. For continuous 1W dissipation at 60C ambient, expect a junction temperature of approximately 85-90C - within the 100C industrial limit but leaving little headroom. Add thermal vias (10-16 vias, 0.3mm drill) under the exposed pad stitched to inner ground planes.
Plan configuration mode pins (MSEL[3:0]) early in schematic capture. Incorrect MSEL settings are the #1 cause of FPGA configuration failures. For JTAG-only configuration, tie MSEL[3:0] to 1010 (AS mode with third-party programmer support) or 0000 (JTAG-only). The nCONFIG pin should be pulled high to VCCIO through a 10k resistor. CONF_DONE can be left floating or pulled up to VCCIO with 10k for status monitoring. Reserve a 2x5 or 1x6 0.1-inch header for the JTAG connector - keep the trace from the FPGA TDI/TDO/TMS/TCK pins to the header under 2 inches to avoid signal integrity issues.
Do not connect I/O pins directly to signals exceeding the VCCIO voltage of their bank. Mixing 5V signals into a 3.3V bank destroys the I/O cell. Verify bank assignments in Quartus II Pin Planner before PCB layout. Additionally, differential pair (LVDS) signals must be routed as 100-ohm differential pairs with matched lengths (skew under 20ps) - do not route them as single-ended traces. For Nios II designs, plan for at least one EPCS4 or EPCS16 configuration flash, plus sufficient M9K blocks for the on-chip RAM and data caches.
Group high-speed clock and global signal traces on the top layer with a continuous ground plane underneath. Keep clock traces short and use 45-degree bends (avoid 90-degree turns). Separate analog and digital grounds if the FPGA interfaces to ADCs/DACs, joining them at a single point near the FPGA. For LVDS pairs, maintain 100-ohm differential impedance using a 4-layer stackup with controlled impedance (typical: 8mil trace/8mil space on FR4 with 1oz copper). Estimated trace width for 100-ohm differential on 0.5mm pitch packages is approximately 8-10 mils.
Informations de conformité
RoHS-compliant per distributor product pages (Heisener, DigiKey). The I7 suffix denotes industrial temperature grade; AEC-Q100 qualification is NOT applicable - select EP3C10E144A7N for automotive-grade applications.
