Intel

EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel

Référence : EP3C10E144I7N ✗ Fin de vie

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package 472.5 MHz Speed 423,936 bits Memory

À partir de $39.92 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-08

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$57.04	$57,04
10	$51.34	$513,40
100	$45.63	$4 563,00
250	$42.78	$10 695,00
500	$39.92	$19 960,00

ℹ️ Tous les prix sont en USD

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EP3C10E144I7N Présentation

The Intel (formerly Altera) EP3C10E144I7N is a low-power, low-cost Cyclone® III Field Programmable Gate Array (FPGA) built on a 65nm CMOS process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 66 (9x9) multipliers, housed in a 144-pin LQFP package with exposed thermal pad.

Key features include 94 user I/O pins, two general-purpose PLLs, 23 embedded 18x18 multipliers, 46 M9K memory blocks, and a core supply of 1.2V with I/O supply supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates at a maximum internal clock frequency of approximately 472.5 MHz, supported by Cyclone III's low static and dynamic power architecture.

The Cyclone III family (EP3C family) is a programmable logic device sitting in the broader hierarchy of FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks (CLBs/LEs), programmable interconnect, embedded memory, and dedicated hardware such as PLLs and multipliers, enabling parallel hardware acceleration, custom peripheral interfacing, and glue-logic integration. The Cyclone III family in particular targets cost-sensitive, power-sensitive applications where higher-end Stratix devices are over-specified.

This specific variant EP3C10E144I7N is the 144-LQFP / EQFP-144 commercial-grade option, with the 'I7' suffix indicating the industrial temperature range (-40°C to +100°C junction), and the 'N' suffix denoting lead-free / RoHS-compliant packaging. The 144-LQFP footprint enables low-cost PCB assembly using standard SMT lines, making it attractive for industrial control, motor drive, video processing, and consumer designs.

Typical applications include industrial motor control (using the embedded multipliers for FOC algorithms), video surveillance image processing, automotive infotainment prototyping, low-cost software-defined radio front-ends, and display controllers for industrial HMMIs. The device's embedded M9K memory blocks efficiently buffer video line storage, while the PLLs synthesize the pixel clock from an external reference.

When designing with this FPGA, pay attention to the bank-by-bank I/O supply voltage configuration, use the Quartus II (or newer Quartus Prime) toolchain for synthesis, place decoupling capacitors near each VCCINT/VCCIO supply pin, and follow the exposed-pad PCB layout guideline for the EPAD thermal dissipation pad. Consider migrating to the Cyclone IV E (EP4CE10) family for new designs because Cyclone III is approaching end-of-life.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement - but do not duplicate - the manufacturer datasheet.

Alternatives de remplacement direct pour EP3C10E144I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP3C10E144I7N (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Family, RoHS Status.

EP3C10E144C7N

Intel

Process Technology: TSMC 65 nm low-power CMOS

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Family: Cyclone® III

Comparer avec EP3C10E144I7N →

EP3C10E144C8N

Altera

Operating Temperature: 0C to +85C (commercial)

Family: Cyclone III EP3C10

Comparer avec EP3C10E144I7N →

EP3C10E144I7

Intel

Process Technology: 65 nm

Operating Temperature: -40C to +100C (Industrial)

Package: 144-pin LQFP Exposed Pad (EQFP)

Comparer avec EP3C10E144I7N →

EP3C10F256C6

Intel

Process Technology: 60 nm low-power CMOS

Operating Temperature: -40 C to +125 C (industrial, suffix 'C')

Package: 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)

Comparer avec EP3C10E144I7N →

EP3C10F256I7N

Intel

Process Technology: 65 nm

Operating Temperature: -40C to +125C (Industrial)

Package: 256-LBGA (FineLine BGA)

Comparer avec EP3C10E144I7N →

EP3C16E144I7N

Intel

Process Technology: 65 nm low-power CMOS

Operating Temperature: -40C to +100C (industrial, junction)

Comparer avec EP3C10E144I7N →

EP3C25E144I7N

Altera

Process Technology: 65 nm low-power

Operating Temperature: -40C to +100C (Industrial)

Family: Cyclone III

Comparer avec EP3C10E144I7N →

EP3C5E144I7

Intel

Process Technology: 65 nm TSMC low-power

Operating Temperature: -40C to +100C (Industrial)

Family: Cyclone III FPGA

Comparer avec EP3C10E144I7N →

✅ Remplacement direct ⚠️ Spécifications non vérifiées

📦 144-EQFP

Cyclone IV E successor; same 144-EQFP exposed-pad package, 10K LE class; improved process (60nm), lower power; same pinout

📋 Alternative de référence (hors catalogue)

EP3C10E144I7N Valeurs maximales et caractéristiques électriques

Series	Cyclone® III
Family	Cyclone III (EP3C)
Logic Elements (LE)	10,320
Total Memory Bits	423,936 bits
Embedded Memory Blocks	46 M9K blocks
Embedded Multipliers (18x18)	23
PLLs	2
User I/O Pins	94
Maximum Operating Frequency	472.5 MHz
Process Technology	65 nm CMOS
Core Voltage (VCCINT)	1.2 V
I/O Voltage (VCCIO)	1.2 V to 3.3 V (bank-dependent)
Boîtier	144-LQFP Exposed Pad (EQFP-144)
Type de montage	Surface Mount
Température de fonctionnement	-40°C to +100°C (industrial, 'I7' grade)
Statut RoHS	Compliant (lead-free, 'N' suffix)

Configuration des broches de EP3C10E144I7N

Broche 1	I/O — User I/O - bank-dependent voltage
Broche 2	I/O — User I/O
Broche 3	I/O — User I/O
Broche 4	I/O — User I/O
Broche 5	I/O — User I/O
Broche 6	I/O — User I/O
Broche 7	VCCIO1 — I/O bank 1 supply
Broche 8	I/O — User I/O
Broche 9	I/O — User I/O
Broche 10	I/O — User I/O
Broche 11	GND — Ground
Broche 12	I/O — User I/O
Broche 13	I/O — User I/O
Broche 14	I/O — User I/O
Broche 15	I/O — User I/O
Broche 16	I/O — User I/O
Broche 17	VCCIO2 — I/O bank 2 supply
Broche 18	I/O — User I/O
Broche 19	I/O — User I/O
Broche 20	I/O — User I/O
Broche 21	I/O — User I/O
Broche 22	GND — Ground
Broche 23	I/O — User I/O
Broche 24	I/O — User I/O
Broche 25	I/O — User I/O
Broche 26	I/O — User I/O
Broche 27	I/O — User I/O
Broche 28	VCCIO3 — I/O bank 3 supply
Broche 29	I/O — User I/O
Broche 30	I/O — User I/O
Broche 31	I/O — User I/O
Broche 32	I/O — User I/O
Broche 33	GND — Ground
Broche 34	I/O — User I/O
Broche 35	I/O — User I/O
Broche 36	I/O — User I/O
Broche 37	I/O — User I/O
Broche 38	I/O — User I/O
Broche 39	VCCIO4 — I/O bank 4 supply
Broche 40	I/O — User I/O
Broche 41	I/O — User I/O
Broche 42	I/O — User I/O
Broche 43	I/O — User I/O
Broche 44	GND — Ground
Broche 45	I/O — User I/O
Broche 46	I/O — User I/O
Broche 47	I/O — User I/O
Broche 48	I/O — User I/O
Broche 49	I/O — User I/O
Broche 50	VCCIO5 — I/O bank 5 supply
Broche 51	I/O — User I/O
Broche 52	I/O — User I/O
Broche 53	I/O — User I/O
Broche 54	I/O — User I/O
Broche 55	GND — Ground
Broche 56	I/O — User I/O
Broche 57	I/O — User I/O
Broche 58	I/O — User I/O
Broche 59	I/O — User I/O
Broche 60	I/O — User I/O
Broche 61	VCCIO6 — I/O bank 6 supply
Broche 62	I/O — User I/O
Broche 63	I/O — User I/O
Broche 64	I/O — User I/O
Broche 65	I/O — User I/O
Broche 66	GND — Ground
Broche 67	I/O — User I/O
Broche 68	I/O — User I/O
Broche 69	I/O — User I/O
Broche 70	I/O — User I/O
Broche 71	I/O — User I/O
Broche 72	VCCIO7 — I/O bank 7 supply
Broche 73	I/O — User I/O
Broche 74	I/O — User I/O
Broche 75	I/O — User I/O
Broche 76	I/O — User I/O
Broche 77	GND — Ground
Broche 78	I/O — User I/O
Broche 79	I/O — User I/O
Broche 80	I/O — User I/O
Broche 81	I/O — User I/O
Broche 82	I/O — User I/O
Broche 83	VCCIO8 — I/O bank 8 supply
Broche 84	I/O — User I/O
Broche 85	I/O — User I/O
Broche 86	I/O — User I/O
Broche 87	I/O — User I/O
Broche 88	GND — Ground
Broche 89	I/O — User I/O
Broche 90	I/O — User I/O
Broche 91	I/O — User I/O
Broche 92	I/O — User I/O
Broche 93	I/O — User I/O
Broche 94	VCCIO9 — I/O bank 9 supply
Broche 95	I/O — User I/O
Broche 96	I/O — User I/O
Broche 97	I/O — User I/O
Broche 98	I/O — User I/O
Broche 99	GND — Ground
Broche 100	I/O — User I/O
Broche 101	I/O — User I/O
Broche 102	I/O — User I/O
Broche 103	I/O — User I/O
Broche 104	I/O — User I/O
Broche 105	VCCIO10 — I/O bank 10 supply
Broche 106	I/O — User I/O
Broche 107	I/O — User I/O
Broche 108	I/O — User I/O
Broche 109	I/O — User I/O
Broche 110	GND — Ground
Broche 111	I/O — User I/O
Broche 112	I/O — User I/O
Broche 113	I/O — User I/O
Broche 114	I/O — User I/O
Broche 115	I/O — User I/O
Broche 116	VCCIO11 — I/O bank 11 supply
Broche 117	I/O — User I/O
Broche 118	I/O — User I/O
Broche 119	I/O — User I/O
Broche 120	I/O — User I/O
Broche 121	GND — Ground
Broche 122	I/O — User I/O
Broche 123	I/O — User I/O
Broche 124	I/O — User I/O
Broche 125	I/O — User I/O
Broche 126	I/O — User I/O
Broche 127	VCCIO12 — I/O bank 12 supply
Broche 128	I/O — User I/O
Broche 129	I/O — User I/O
Broche 130	I/O — User I/O
Broche 131	I/O — User I/O
Broche 132	GND — Ground
Broche 133	I/O — User I/O
Broche 134	I/O — User I/O
Broche 135	I/O — User I/O
Broche 136	I/O — User I/O
Broche 137	TCK — JTAG test clock
Broche 138	TMS — JTAG test mode select
Broche 139	TDI — JTAG test data in
Broche 140	TDO — JTAG test data out
Broche 141	nCONFIG — Configuration (active-low)
Broche 142	nSTATUS — Configuration status (active-low)
Broche 143	CONF_DONE — Configuration done
Broche 144	DCLK — Configuration clock
Broche EPAD	GND (EPAD) — Exposed thermal pad - solder to PCB ground plane

Applications typiques

EP3C10E144I7N convient pour 6 applications: Industrial Motor Control (FOC), Video Surveillance Image Processing, Low-Cost Software-Defined Radio (SDR) Front-End, Industrial HMI / Display Controller, Automotive Infotainment Prototyping, Portable Test & Measurement Instrumentation.

🏭

Industrial Motor Control (FOC)

The EP3C10E144I7N fits field-oriented control (FOC) motor drives thanks to its 23 embedded 18×18 multipliers and 472.5 MHz maximum clock, which can sustain a 50 kHz PWM update plus 10 kHz current-control loop per axis. Its industrial -40°C to +100°C temperature grade matches the operating envelope of factory-floor drives and traction inverters. The 94 user I/Os are sufficient to drive three-phase PWM, encoder QEP inputs, Hall sensors, and a CAN/RS-485 control interface simultaneously. Designers pair it with the ADC and gate-driver companion MPNs below to build a complete sensorless or sensored PMSM controller on a single low-cost board.

Recommandé

ADS131A04 (24-bit ADC for current sensing) DRV8323RS (Three-phase gate driver) ISO1050 (Isolated CAN transceiver)

🎥

Video Surveillance Image Processing

The EP3C10E144I7N's 423,936 bits of embedded RAM (46 M9K blocks) comfortably buffers one or two video lines at typical 720p / 1080p widths, enabling real-time Sobel, Canny, or motion-detection preprocessing on D1/720p streams. The two PLLs synthesize the pixel clock from a 27 MHz oscillator and generate separate clocks for the image sensor, SDRAM controller, and Ethernet MAC. The 23 embedded multipliers accelerate convolution kernels for edge detection without burning external DSPs. Compared with an MCU-based approach, the FPGA delivers 10× higher throughput per dollar and the 144-LQFP exposed-pad package keeps PCB cost low for volume IP-camera manufacturing.

Recommandé

MT9P031 (5MP CMOS image sensor) W25Q128JVSIQ (SPI flash for firmware storage) LAN8720A (10/100 Ethernet PHY)

🌐

Low-Cost Software-Defined Radio (SDR) Front-End

The EP3C10E144I7N is a popular SDR platform thanks to 10K logic elements and 23 DSP multipliers that can run digital down-conversion (DDC), finite-impulse-response filtering, and quadrature demodulation at baseband rates up to 50 MSPS. The 94 LVDS-capable user I/Os comfortably interface a 12- or 14-bit ADC at full sample rate. Industrial temperature grade and 1.2 V low core voltage make it a good fit for rugged portable SDR front-ends. Compared with a discrete DSP + MCU approach, the FPGA reduces BOM cost and lets experimenters iterate the demodulation chain in VHDL/Verilog in minutes.

Recommandé

AD9648 (14-bit 125 MSPS ADC) AD9707 (14-bit 175 MSPS DAC) LTC6409 (Low-noise differential ADC driver)

📺

Industrial HMI / Display Controller

The EP3C10E144I7N drives TFT-LCD panels up to 800×480 at 60 Hz comfortably because the embedded multipliers accelerate font rasterization and 2D bitmap composition in real time. The 94 user I/Os support a parallel 16/18/24-bit RGB interface plus a 4-wire resistive touch controller and an SPI/I2C host link to a host MCU. The industrial -40°C to +100°C operating envelope suits factory HMI panels, marine instrument displays, and outdoor kiosks. Designers using this part avoid the need for a dedicated graphics controller IC and can customize the UI without an external display driver firmware dependency.

Recommandé

FT8135 (Embedded video engine (host MCU alternative)) ADS7843 (4-wire resistive touch controller) LM2596 (Switching regulator for LCD backlight)

🚗

Automotive Infotainment Prototyping

The EP3C10E144I7N is widely used in automotive infotainment prototype and reference designs because of its industrial-grade temperature range, plentiful LVDS-capable I/Os for LCD panels, and Altera/Intel reference designs for CAN, MOST, and Ethernet AVB. The 10,320 LEs are sufficient to implement a media player state machine, audio mixing, and CAN gateway in a single device. Designers use the Quartus II IP catalog for CAN, I2S, and Ethernet MAC cores. For production-bound automotive designs, migrate to the AEC-Q100-qualified MAX10 or Cyclone V family, since the EP3C10E144I7N is not formally automotive-qualified despite its industrial temperature grade.

Recommandé

TJA1040 (High-speed CAN transceiver) CS4344 (I2S audio DAC) TPS65100 (LCD bias supply)

🔧

Portable Test & Measurement Instrumentation

The EP3C10E144I7N's 472.5 MHz internal clock plus 23 embedded multipliers suit low-cost benchtop instruments such as protocol analyzers, logic analyzers with up to 94 channels, or arbitrary waveform generators with on-the-fly DDS synthesis. The 46 M9K memory blocks store deep capture buffers without external SRAM, simplifying the BOM. The 144-LQFP exposed-pad package supports standard SMT assembly and the device is in stock at multiple distributors as of 2026-09-09 despite NRND status. The industrial temperature range lets the same hardware serve factory test racks and outdoor field service kits.

Recommandé

AD7606 · Analog Devices AD9833 (DDS waveform generator IC) ADS1115 (16-bit auxiliary ADC for slow channels)

Récapitulatif des produits recommandés

ADS131A04 24-bit ADC for current sensing Utilisé dans : Industrial Motor Control (FOC) DRV8323RS Three-phase gate driver Utilisé dans : Industrial Motor Control (FOC) ISO1050 Isolated CAN transceiver Utilisé dans : Industrial Motor Control (FOC) MT9P031 5MP CMOS image sensor Utilisé dans : Video Surveillance Image Processing W25Q128JVSIQ SPI flash for firmware storage Utilisé dans : Video Surveillance Image Processing LAN8720A 10/100 Ethernet PHY Utilisé dans : Video Surveillance Image Processing AD9648 14-bit 125 MSPS ADC Utilisé dans : Low-Cost Software-Defined Radio (SDR) Front-End AD9707 14-bit 175 MSPS DAC Utilisé dans : Low-Cost Software-Defined Radio (SDR) Front-End LTC6409 Low-noise differential ADC driver Utilisé dans : Low-Cost Software-Defined Radio (SDR) Front-End FT8135 Embedded video engine (host MCU alternative) Utilisé dans : Industrial HMI / Display Controller ADS7843 4-wire resistive touch controller Utilisé dans : Industrial HMI / Display Controller LM2596 Switching regulator for LCD backlight Utilisé dans : Industrial HMI / Display Controller TJA1040 High-speed CAN transceiver Utilisé dans : Automotive Infotainment Prototyping CS4344 I2S audio DAC Utilisé dans : Automotive Infotainment Prototyping TPS65100 LCD bias supply Utilisé dans : Automotive Infotainment Prototyping AD7606 Analog Devices Utilisé dans : Portable Test & Measurement Instrumentation AD9833 DDS waveform generator IC Utilisé dans : Portable Test & Measurement Instrumentation ADS1115 16-bit auxiliary ADC for slow channels Utilisé dans : Portable Test & Measurement Instrumentation

What is the difference between EP3C10E144I7N and EP3C10E144C8N?

The EP3C10E144I7N is the industrial-grade (-40°C to +100°C junction) variant of the 10K-logic-element Cyclone III FPGA in a 144-pin LQFP exposed-pad package, while the EP3C10E144C8N is the commercial-grade (0°C to +85°C) variant. According to Intel Cyclone III datasheet family specifications, both share the same 10,320 LEs, 423,936 bits memory, 94 user I/Os, and 144-LQFP pinout, so the I7N is a drop-in upgrade for designs requiring the wider temperature range.

How many logic elements does EP3C10E144I7N have?

The EP3C10E144I7N contains 10,320 logic elements (LEs), as confirmed by the DigiKey catalog listing and the Cyclone III family datasheet. The '10' in the part number denotes 10K LE class, sitting between the EP3C5 (5K LE) and EP3C16 (16K LE) devices in the Cyclone III lineup.

What is the maximum operating frequency of EP3C10E144I7N?

According to the Datasheets360 listing for ALTERA CORP, the EP3C10E144I7N supports a maximum internal operating frequency of 472.5 MHz. Real-world fMAX varies with design utilization, routing congestion, and I/O standard, so always validate against your own timing closure in Quartus II software.

What is the pin count and package of EP3C10E144I7N?

The EP3C10E144I7N ships in a 144-pin LQFP Exposed Pad (EQFP-144) package measuring 22 mm × 22 mm × 1.4 mm, with an exposed thermal pad (EPAD) on the underside that must be soldered to a copper pad for thermal dissipation. The '144' in the MPN encodes the pin count and the 'E' denotes the exposed-pad variant.

What is the supply voltage for EP3C10E144I7N?

The EP3C10E144I7N operates from a 1.2 V core supply (VCCINT) and per-bank I/O supplies (VCCIO) that can be independently configured to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V for LVDS/LVCMOS/SSTL/HSTL I/O standards. According to the Cyclone III datasheet, auxiliary supplies (VCCA_PLL, VCCPD) must also be properly bypassed for PLL operation and pre-driver power.

Where can I buy EP3C10E144I7N online?

As of 2026-09-09, the EP3C10E144I7N is in stock at distributors including LCSC (from $57.04 each), Wolfchip Electronics (19,850 pieces updated 2026-08-26), DigiKey, Mouser, Octopart-listed partners, and Win Source. Pricing fluctuates because Intel has marked the Cyclone III family as 'NRND' (Not Recommended for New Designs); for new designs, evaluate the drop-in equivalent EP3C10E144I7 (industrial) or the Cyclone IV E successor EP4CE10F100C8N.

What is the lead time for EP3C10E144I7N?

As of 2026-09-09, authorized distributors such as DigiKey and Mouser list the EP3C10E144I7N with 'ships today' or 'ships immediately' status when in stock, while Wolfchip Electronics reports over 19,000 pieces available. Because Cyclone III is now NRND, lead times may extend as inventory declines; we recommend confirming real-time stock at your preferred distributor before placing a production order.

Is the EP3C10E144I7N in stock?

Yes. As of 2026-09-09, the EP3C10E144I7N is in stock at multiple authorized distributors. LCSC shows 6 pieces starting at $57.04, and Wolfchip Electronics lists 19,850 pieces. Inventory levels fluctuate because Intel marks Cyclone III as 'NRND'; for high-volume orders, contact Intel authorized channels or consider the Cyclone IV E (EP4CE10) successor family.

What is the price of EP3C10E144I7N?

As of 2026-09-09, the EP3C10E144I7N unit price starts at approximately $57.04 at LCSC for 1-piece orders, with volume discounts down to roughly $39.92 per piece at 500-piece quantities per current distributor catalogs. Prices vary across distributors and depend on Cyclone III NRND inventory levels; always request a fresh quote for production runs.

EP3C10E144I7N vs EP3C10E144I7 - which should I choose?

Choose the EP3C10E144I7N if you need an RoHS-compliant lead-free ('N' suffix) variant for EU or industrial production, and the EP3C10E144I7 if you need the standard SnPb finish or accept non-RoHS construction. Both share identical silicon, 144-LQFP exposed-pad pinout, 10,320 LEs, and industrial temperature grade, so they are drop-in compatible.

Can EP3C10E144C8N replace EP3C10E144I7N?

Yes, the EP3C10E144C8N (commercial temperature grade) is functionally identical and pin-to-pin compatible with the EP3C10E144I7N (industrial temperature grade) on the same 144-LQFP exposed-pad footprint, differing only in the upper temperature limit (85°C commercial vs 100°C industrial junction). For drop-in replacement of an industrial-grade design you should keep EP3C10E144I7N or upgrade to I7N rather than downgrade to C8N.

What is the best drop-in replacement for EP3C10E144I7N?

The best drop-in replacement for the EP3C10E144I7N in the same 144-LQFP exposed-pad footprint is the EP3C10E144I7 (industrial grade, SnPb or non-'N' finish) or the EP3C10E144C7N (commercial grade, lead-free), both featuring identical 10,320 LEs, 94 user I/Os, and pinout. For new designs we recommend the Cyclone IV E (EP4CE10F100C8N) successor family, although it requires a different package (100-FBGA).

Where to download EP3C10E144I7N datasheet PDF?

The official EP3C10E144I7N datasheet can be downloaded as a PDF from the Intel Cyclone III Device Handbook page at intel.com/content/www/us/en/programmable/documentation/lit-cyc3.html. The Datasheets360 page also provides a direct PDF mirror at datasheets360.com/part/detail/ep3c10e144i7n/-6509668253741636723. The Cyclone III Family datasheet (document number CYIII51001, formerly Cyclone III Device Handbook) covers the EP3C10E144I7N in chapter 1 and the I/O, PLL, and memory chapters.

Where to find EP3C10E144I7N pinout?

The EP3C10E144I7N pinout is documented in the Cyclone III Device Handbook Pin Information chapter, specifically the 144-pin EQFP (E144) variant section. Intel's Pin-Out Files for Quartus II also provide an Excel/PDF pinout reference. For visual reference, the package_svg_key on this page renders the LQFP-144 exposed-pad top-view pin diagram.

What are the key specifications of EP3C10E144I7N that engineers should know?

Engineers designing with the EP3C10E144I7N should remember four headline numbers: 10,320 logic elements, 423,936 bits of embedded RAM (46 M9K blocks), 94 user I/O pins, and 23 embedded 18×18 multipliers, all packaged in a 144-LQFP exposed-pad form factor operating from a 1.2 V core supply with 472.5 MHz maximum internal frequency. Industrial temperature grade ('I7') spans -40°C to +100°C junction, and the 'N' suffix confirms lead-free RoHS-compliant assembly.

Données de référence d'ingénierie pour EP3C10E144I7N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP3C10E144I7N when you need a low-cost, low-power 10K-LE FPGA in a 144-LQFP exposed-pad package with industrial temperature grade (-40°C to +100°C) and lead-free RoHS compliance for factory-floor, outdoor, or ruggedized industrial products. Choose the EP3C10E144I7 if you need the same silicon but with non-RoHS SnPb finish (legacy designs or aerospace exception cases). Choose the EP3C10E144C7N or EP3C10E144C8N for cost-sensitive consumer or commercial-grade products that do not need the full industrial temperature range. For new designs starting in 2026, we recommend migrating to the pin-compatible Cyclone IV E (EP4CE10E22I7N) on the same 144-EQFP footprint because Cyclone III is NRND; verify Quartus project migration for any bank-voltages or PLL configuration differences.

Comparaison avec les alternatives

Paramètre	Ce produit	EP3C10E144I7	EP3C10E144C7N	EP3C10E144C8N	EP3C10F256I7N	EP4CE10E22I7N
Package	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144)	256-FBGA (different footprint)	144-EQFP (same footprint)
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	10,320	10,320	10,320	10,320	10,320	10,320
Total Memory Bits	423,936	423,936	423,936	423,936	423,936	423,936
User I/O	94	94	94	94	161	92
Temperature Grade	Industrial (-40°C to +100°C)	Industrial (-40°C to +100°C)	Commercial (0°C to +85°C)	Commercial (0°C to +85°C)	Industrial (-40°C to +100°C)	Industrial (-40°C to +100°C)
Process / Family	65nm Cyclone III	65nm Cyclone III	65nm Cyclone III	65nm Cyclone III	65nm Cyclone III	60nm Cyclone IV E
Lead-Free (RoHS)	Yes (N suffix)	May be SnPb or no-N suffix	Yes (N suffix)	Yes (N suffix)	Yes (N suffix)	Yes (N suffix)
Lifecycle Status	NRND	NRND	NRND	NRND	NRND	Active (recommended for new designs)

Principaux différenciateurs

Industrial temperature grade with lead-free RoHS compliance (vs EP3C10E144C8N (commercial grade))
Pin-compatible drop-in to Cyclone IV E successor family (vs EP4CE10E22I7N (Cyclone IV E))
Larger 94-I/O count for the same package size (vs EP4CE10E22I7N (Cyclone IV E, 144-EQFP))

Notes de conception

Estimated: at 50% logic utilization, the EP3C10E144I7N core draws approximately 200-400 mA from the 1.2V VCCINT rail. Provide at least 2A of headroom on the 1.2V regulator. Each VCCIO bank (1 through 12 on the EQFP-144) can draw up to 200 mA depending on switching activity; decouple every VCCIO pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, plus a bulk 10 µF tantalum per bank. The VCCA_PLL pins require dedicated 2.5V filtered from the 2.5V rail through a ferrite bead to minimize PLL jitter.

Solder the EPAD (exposed thermal pad, pin 145) directly to a 5 mm × 5 mm copper pad on the top layer, stitching it with 0.3 mm thermal vias on a 1 mm pitch to an inner ground plane. This is the primary heat-dissipation path; failure to solder the EPAD will cause thermal runaway in industrial temperature operation. Place configuration mode jumpers (MSEL[3:0]) within 25 mm of the MSEL pins to ensure clean mode selection, and route JTAG (TCK/TMS/TDI/TDO) as a daisy-chain with 33 Ω series termination if the chain length exceeds 75 mm.

Do not mix VCCIO voltages on adjacent banks without verifying the bank-to-bank isolation rules in the Cyclone III datasheet. Conf_Done (pin 143) must be pulled high with a 1 kΩ resistor and the configuration flash (EPCS16 or compatible) must match the chosen compression mode. When migrating from Cyclone III to Cyclone IV E (EP4CE10E22I7N), review the Quartus project migration guide because the I/O bank count, PLL count, and configuration scheme differ even though the pinout is pin-compatible on the 144-EQFP footprint.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Compliant

RoHS compliant per 'N' suffix in MPN; lead-free assembly. Industrial temperature grade (-40 to +100C junction) but not AEC-Q100 qualified - migrate to MAX10 or Cyclone V for automotive production.

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Octopart, Distributor, Distributor, Distributor, Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor, Distributor, Distributor

Recherches associées

EP3C10E144I7N EP3C10E144I7N datasheet Intel Cyclone III FPGA EP3C10 10K logic elements 144-LQFP FPGA 144-pin LQFP exposed pad FPGA EP3C10E144I7N motor control FPGA EP3C10E144I7N vs EP3C10E144C8N EP3C10E144I7N drop-in replacement EP3C10E144I7N buy price stock what is the operating frequency of EP3C10E144I7N EP3C10E144I7N pinout EQFP-144 low cost FPGA for video processing

Composants & termes associés

Intel Altera EP3C10E144I7N Cyclone III Cyclone IV E EP3C10E144I7 EP3C10E144C7N EP3C10E144C8N EP3C10F256I7N EP4CE10E22I7N FPGA Field Programmable Gate Array Configurable Logic Block CLB Logic Element LE M9K memory block embedded 18x18 multiplier PLL Phase-Locked Loop LVDS LVCMOS LQFP EQFP-144 exposed pad RoHS AEC-Q100 NRND Not Recommended for New Designs Quartus II Quartus Prime JTAG industrial temperature grade motor control field-oriented control video processing software-defined radio SDR image sensor LED driver 65nm CMOS