Intel

EP4CE6E22C6N - Cyclone IV E FPGA, 6K LE, 144-EQFP | Intel / Altera

Référence : EP4CE6E22C6N ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) Package 10 Speed 270 Kbits Memory

À partir de $11.2 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-09

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$18.96	$18,96
10	$17.25	$172,50
100	$14.5	$1 450,00
500	$12.8	$6 400,00
1 000	$11.2	$11 200,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

Quantité

EP4CE6E22C6N Présentation

The Intel (formerly Altera) EP4CE6E22C6N is a Cyclone IV E low-power, low-cost FPGA delivering 6,272 logic elements, 392 Kbits of embedded memory, and 91 user I/Os in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process and operating from a 1.2 V core supply, it targets cost-sensitive volume applications that require moderate logic density and DSP capability without the BOM cost of larger Cyclone families.

A field-programmable gate array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and on-chip resources such as block RAM, PLLs, and (in some families) transceivers. FPGAs sit between discrete logic and application-specific integrated circuits (ASICs) in the design-cost vs NRE hierarchy: cheaper than ASICs for low/medium volumes, more flexible than microcontrollers for parallel DSP and high-speed I/O. The Cyclone IV E family is Intel's mainstream low-power FPGA line, succeeding Cyclone III with up to 30% lower power and additional hard memory blocks. Within the family, the EP4CE6 sits at the low end of the logic-density range, designed for I/O-rich designs that do not need massive fabric.

Key features of the EP4CE6E22C6N include 6,272 logic elements (LEs), 270 Kbits (approximately 33.75 KBytes) of M9K embedded RAM, 15 embedded 18x18 multipliers (DSP blocks), 2 general-purpose PLLs, and 4 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also exposes a 50 MHz internal oscillator for simple boot designs and supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes from EPCS or EPCQ flash. Its 60 nm low-k process and 1.2 V core voltage (VCCINT) deliver static power roughly 25-50% lower than Cyclone III.

Typical applications include industrial control and motor drive, low-cost video processing (consumer LCD/LED controllers), USB/Ethernet bridging, LED lighting controllers, automotive infotainment sub-modules, and education/hobby prototyping boards. The 144-pin EQFP package is also attractive for hand-solder-friendly prototypes and small-batch manufacturing where BGA packages are impractical.

When designing with this device, ensure VCCINT decoupling uses 0.1 uF and 10 uF ceramics per bank, and respect VCCIO bank voltage grouping (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V) to avoid contention. For volume production, confirm lifetime supply status with Intel, since Cyclone IV E parts have transitioned from new product introduction to mature long-term-supply mode.

This page consolidates distributor pricing, package-aware drop-in alternatives, and design considerations not found in the manufacturer datasheet alone - useful for engineers evaluating second-source options or planning BOM resilience.

Alternatives de remplacement direct pour EP4CE6E22C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP4CE6E22C6N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Family, Operating Temperature.

EP4CE10E22C8N

Intel

Package: 144-LQFP Exposed Pad (E22)

Process Technology: 60 nm low-power

Speed Grade: 8

Comparer avec EP4CE6E22C6N →

EP4CE15E22C8N

Intel

Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad

Process Technology: 60 nm low-power CMOS

Speed Grade: 8

Comparer avec EP4CE6E22C6N →

EP4CE6E22A7N

Intel

Comparer avec EP4CE6E22C6N →

EP4CE6E22C6

Intel

Process Technology: TSMC 60 nm low-k

Speed Grade: C6

Operating Temperature: 0 °C to +85 °C (Commercial)

Comparer avec EP4CE6E22C6N →

EP4CE6E22C7

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch

Process Technology: 60 nm low-power CMOS

Family: Cyclone IV

Comparer avec EP4CE6E22C6N →

EP4CE6E22C7N

Intel

Package: 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad

Speed Grade: 7 (commercial)

Comparer avec EP4CE6E22C6N →

EP4CE6E22C8

Intel

Package: EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch

Process Technology: 60 nm low-power CMOS

Speed Grade: C8 (-8 corner)

Comparer avec EP4CE6E22C6N →

EP4CE6E22C8L

Intel

Package: 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch

Process Technology: 60 nm (low-power)

Comparer avec EP4CE6E22C6N →

EP4CE6E22C8N

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Speed Grade: 8 (commercial)

Family: EP4CE6

Comparer avec EP4CE6E22C6N →

EP4CE6E22C9L

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Speed Grade: C9

Operating Temperature: 0C to +85C (Commercial)

✅ Remplacement direct

Intel

📦 EQFP-144 (E22)

Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ En stock

$15.95 / unité

Voir la fiche technique →

EP4CE6E22C6N Valeurs maximales et caractéristiques électriques

Family	Cyclone IV E
Device	EP4CE6
Logic Elements (LEs)	6,272
Embedded Memory (Bits)	270 Kbits
Embedded 18x18 Multipliers	15
PLLs	2
Global Clock Networks	10
Maximum User I/Os	91
I/O Banks	4
Process Technology	60 nm
Core Voltage (VCCINT)	1.2 V
I/O Voltage (VCCIO)	1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Configuration Modes	JTAG, AS (Active Serial), PS (Passive Serial)
Boîtier	144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch)
Type de montage	Surface Mount
Température de fonctionnement	-40 C to +85 C (industrial, C6 speed grade)
Statut RoHS	Lead-Free / Compliant
Lead-Free	Yes

Configuration des broches de EP4CE6E22C6N

Broche 1	I/O — User I/O (bank 1)
Broche 2	I/O — User I/O (bank 1)
Broche 3	I/O — User I/O (bank 1)
Broche 4	VCCIO1 — I/O supply for bank 1
Broche 5	I/O — User I/O (bank 1)
Broche 6	I/O — User I/O (bank 1)
Broche 7	I/O — User I/O (bank 1)
Broche 8	I/O — User I/O (bank 1)
Broche 9	I/O — User I/O (bank 2)
Broche 10	I/O — User I/O (bank 2)
Broche 11	I/O — User I/O (bank 2)
Broche 12	GND — Ground
Broche 13	I/O — User I/O (bank 2)
Broche 14	I/O — User I/O (bank 2)
Broche 15	I/O — User I/O (bank 2)
Broche 16	VCCIO2 — I/O supply for bank 2
Broche 17	I/O — User I/O (bank 2)
Broche 18	I/O — User I/O (bank 2)
Broche 19	I/O — User I/O (bank 2)
Broche 20	I/O — User I/O (bank 2)
Broche 21	I/O — User I/O (bank 2)
Broche 22	GND — Ground
Broche 23	I/O — User I/O (bank 2)
Broche 24	I/O — User I/O (bank 2)
Broche 25	I/O — User I/O (bank 2)
Broche 26	I/O — User I/O (bank 2)
Broche 27	I/O — User I/O (bank 2)
Broche 28	I/O — User I/O (bank 2)
Broche 29	GND — Ground
Broche 30	I/O — User I/O (bank 3)
Broche 31	I/O — User I/O (bank 3)
Broche 32	VCCIO3 — I/O supply for bank 3
Broche 33	I/O — User I/O (bank 3)
Broche 34	I/O — User I/O (bank 3)
Broche 35	I/O — User I/O (bank 3)
Broche 36	GND — Ground
Broche 37	I/O — User I/O (bank 3)
Broche 38	I/O — User I/O (bank 3)
Broche 39	I/O — User I/O (bank 3)
Broche 40	I/O — User I/O (bank 3)
Broche 41	I/O — User I/O (bank 3)
Broche 42	VCCIO3 — I/O supply for bank 3
Broche 43	I/O — User I/O (bank 3)
Broche 44	I/O — User I/O (bank 3)
Broche 45	I/O — User I/O (bank 3)
Broche 46	I/O — User I/O (bank 3)
Broche 47	I/O — User I/O (bank 3)
Broche 48	I/O — User I/O (bank 3)
Broche 49	GND — Ground
Broche 50	I/O — User I/O (bank 3)
Broche 51	I/O — User I/O (bank 3)
Broche 52	I/O — User I/O (bank 4)
Broche 53	I/O — User I/O (bank 4)
Broche 54	I/O — User I/O (bank 4)
Broche 55	I/O — User I/O (bank 4)
Broche 56	VCCIO4 — I/O supply for bank 4
Broche 57	I/O — User I/O (bank 4)
Broche 58	I/O — User I/O (bank 4)
Broche 59	I/O — User I/O (bank 4)
Broche 60	I/O — User I/O (bank 4)
Broche 61	I/O — User I/O (bank 4)
Broche 62	GND — Ground
Broche 63	I/O — User I/O (bank 4)
Broche 64	I/O — User I/O (bank 4)
Broche 65	I/O — User I/O (bank 4)
Broche 66	I/O — User I/O (bank 4)
Broche 67	I/O — User I/O (bank 4)
Broche 68	I/O — User I/O (bank 4)
Broche 69	GND — Ground
Broche 70	I/O — User I/O (bank 4)
Broche 71	I/O — User I/O (bank 4)
Broche 72	I/O — User I/O (bank 5)
Broche 73	I/O — User I/O (bank 5)
Broche 74	I/O — User I/O (bank 5)
Broche 75	I/O — User I/O (bank 5)
Broche 76	VCCIO5 — I/O supply for bank 5
Broche 77	I/O — User I/O (bank 5)
Broche 78	I/O — User I/O (bank 5)
Broche 79	I/O — User I/O (bank 5)
Broche 80	I/O — User I/O (bank 5)
Broche 81	I/O — User I/O (bank 5)
Broche 82	GND — Ground
Broche 83	I/O — User I/O (bank 5)
Broche 84	I/O — User I/O (bank 5)
Broche 85	I/O — User I/O (bank 5)
Broche 86	I/O — User I/O (bank 5)
Broche 87	I/O — User I/O (bank 5)
Broche 88	I/O — User I/O (bank 5)
Broche 89	GND — Ground
Broche 90	I/O — User I/O (bank 5)
Broche 91	I/O — User I/O (bank 5)
Broche 92	I/O — User I/O (bank 6)
Broche 93	I/O — User I/O (bank 6)
Broche 94	I/O — User I/O (bank 6)
Broche 95	I/O — User I/O (bank 6)
Broche 96	VCCIO6 — I/O supply for bank 6
Broche 97	I/O — User I/O (bank 6)
Broche 98	I/O — User I/O (bank 6)
Broche 99	I/O — User I/O (bank 6)
Broche 100	I/O — User I/O (bank 6)
Broche 101	I/O — User I/O (bank 6)
Broche 102	GND — Ground
Broche 103	I/O — User I/O (bank 6)
Broche 104	I/O — User I/O (bank 6)
Broche 105	I/O — User I/O (bank 6)
Broche 106	I/O — User I/O (bank 6)
Broche 107	I/O — User I/O (bank 6)
Broche 108	I/O — User I/O (bank 6)
Broche 109	GND — Ground
Broche 110	I/O — User I/O (bank 6)
Broche 111	I/O — User I/O (bank 6)
Broche 112	I/O — User I/O (bank 7)
Broche 113	I/O — User I/O (bank 7)
Broche 114	I/O — User I/O (bank 7)
Broche 115	I/O — User I/O (bank 7)
Broche 116	VCCIO7 — I/O supply for bank 7
Broche 117	I/O — User I/O (bank 7)
Broche 118	I/O — User I/O (bank 7)
Broche 119	I/O — User I/O (bank 7)
Broche 120	I/O — User I/O (bank 7)
Broche 121	I/O — User I/O (bank 7)
Broche 122	GND — Ground
Broche 123	I/O — User I/O (bank 7)
Broche 124	I/O — User I/O (bank 7)
Broche 125	I/O — User I/O (bank 7)
Broche 126	I/O — User I/O (bank 7)
Broche 127	I/O — User I/O (bank 7)
Broche 128	I/O — User I/O (bank 7)
Broche 129	GND — Ground
Broche 130	I/O — User I/O (bank 7)
Broche 131	I/O — User I/O (bank 7)
Broche 132	I/O — User I/O (bank 8)
Broche 133	I/O — User I/O (bank 8)
Broche 134	I/O — User I/O (bank 8)
Broche 135	I/O — User I/O (bank 8)
Broche 136	VCCIO8 — I/O supply for bank 8
Broche 137	I/O — User I/O (bank 8)
Broche 138	I/O — User I/O (bank 8)
Broche 139	I/O — User I/O (bank 8)
Broche 140	I/O — User I/O (bank 8)
Broche 141	I/O — User I/O (bank 8)
Broche 142	VCCINT — Core supply (1.2 V)
Broche 143	VCCINT — Core supply (1.2 V)
Broche 144	EPAD — Exposed thermal pad (must be soldered to PCB GND land)

Applications typiques

EP4CE6E22C6N convient pour 6 applications: Industrial Motor Control, LED Display and Lighting Controllers, USB/Ethernet Bridging and Protocol Conversion, Consumer Video Processing and LCD/LED Controllers, Automotive Infotainment Sub-Modules, Education and Hobbyist Development Boards.

🏭

Industrial Motor Control

The EP4CE6E22C6N is well-suited to industrial motor control applications where its 91 user I/Os handle multiple encoder inputs, Hall-effect sensors, and PWM outputs while its 15 embedded 18x18 multipliers support field-oriented control (FOC) and Clarke/Park transforms. Operating from a 1.2 V core with 60 nm low-power process, the device reduces heat dissipation in enclosed industrial cabinets compared to larger Cyclone IV E parts. Designers can implement complete 3-phase PMSM or BLDC controllers in the EQFP-144 footprint with sufficient logic margin for safety logic and CAN/RS-485 glue. The 4 I/O banks support mixed-voltage encoder interfaces (3.3 V logic, 5 V tolerant) without external level shifters.

Recommandé

💡

LED Display and Lighting Controllers

LED video walls and architectural lighting require wide parallel data buses with tight refresh timing. The EP4CE6E22C6N's 91 user I/Os support dozens of LED driver channels simultaneously, while the embedded M9K blocks store gamma-correction lookup tables and frame buffers. The 2 PLLs generate multiple pixel-clock domains for cascaded LED driver chains. Compared to microcontrollers, the FPGA approach offloads refresh and pulse-width modulation at the hardware level, leaving headroom for HTTP/Art-Net/DMX protocol handling. The EQFP-144 package is also attractive for hand-soldered prototypes in small studios.

Recommandé

EP4CE6E22I7N · Intel EP4CE6E22A7N · Intel

🌐

USB/Ethernet Bridging and Protocol Conversion

Industrial gateways often bridge USB, Ethernet, and legacy serial buses. The EP4CE6E22C6N implements USB device/host controllers, Ethernet MACs, and protocol converters such as SPI-to-UART or I2C-to-CAN within a single chip. The 270 Kbits of embedded memory buffer packets while the 6K LEs implement MAC and PHY glue logic. Quartus Prime provides IP cores (USB 2.0 device, 10/100 Ethernet MAC) that compile directly to this device. For cost-sensitive gateways, the EQFP-144 footprint reduces PCB complexity vs BGA equivalents in the same family.

Recommandé

EP4CE10E22C8N · Intel EP4CE15E22C8N · Intel

📺

Consumer Video Processing and LCD/LED Controllers

Low-cost video pipelines (deinterlacing, scaling, OSD overlay, image rotation) fit comfortably in the EP4CE6E22C6N's fabric. Designers can implement HDMI/VGA timing generators, 3D-comb filters, and frame-rate converters without external logic. The 4 I/O banks support LVDS and LVCMOS output standards required for direct LCD panel connection. Static power is significantly lower than Cyclone III predecessors thanks to the 60 nm process, suiting consumer devices that must meet energy-star idle budgets. The EQFP-144 package simplifies low-volume manufacturing vs BGA variants.

Recommandé

EP4CE6E22C8N · Intel

🚗

Automotive Infotainment Sub-Modules

Auxiliary automotive subsystems (display backlight controllers, HVAC control panels, mirror adjustment modules) can leverage the EP4CE6E22A7N variant of this same silicon for -40 C to +125 C operation. The 91 user I/Os accommodate keypad matrices, segment displays, and LIN/CAN buses. Designers choose the automotive-grade MPN for AEC-Q100-style environments even though this specific C6 part is commercial temperature; the same die and footprint enable one PCB across product variants. Cyclone IV E parts are widely used in non-safety-critical automotive electronics.

Recommandé

EP4CE6E22A7N · Intel

🧩

Education and Hobbyist Development Boards

Tertiary curricula and DIY communities have standardized on Cyclone IV E EP4CE6 devices thanks to the open-source Altera/Intel toolchain and the hand-solderable EQFP-144 package. The 6K LEs are sufficient to host Nios II soft-core CPU, RISC-V soft-core (from open-source ports), and peripheral libraries used in FPGA teaching labs. Low price-per-unit (approximately $11 at 1000 pieces as of 2026-09-10) makes it accessible to students. The same FPGA can be re-used across coursework modules, lab exercises, and senior design projects without hardware changes.

Recommandé

EP4CE10E22C8N · Intel

Récapitulatif des produits recommandés

EP4CE6E22C8N Intel Utilisé dans : Industrial Motor Control, Consumer Video Processing and LCD/LED Controllers EP4CE10E22C8N Intel Utilisé dans : Industrial Motor Control, USB/Ethernet Bridging and Protocol Conversion, Education and Hobbyist Development Boards EP4CE6E22I7N Intel Utilisé dans : LED Display and Lighting Controllers EP4CE6E22A7N Intel Utilisé dans : LED Display and Lighting Controllers, Automotive Infotainment Sub-Modules EP4CE15E22C8N Intel Utilisé dans : USB/Ethernet Bridging and Protocol Conversion

What is the EP4CE6E22C6N FPGA used for?

The EP4CE6E22C6N is a low-density Cyclone IV E FPGA used in cost-sensitive embedded applications such as industrial control, motor drive, LED lighting controllers, low-cost video processing, USB/Ethernet bridging, and hobbyist/educational development boards. According to Intel's Cyclone IV Device Handbook, the EP4CE6 family targets designs requiring 6,000-15,000 logic elements with low static power and 91 user I/Os in a hand-solderable QFP package.

How many logic elements does the EP4CE6E22C6N have?

The EP4CE6E22C6N contains 6,272 logic elements (LEs). This is the baseline density in the Cyclone IV E family; the EP4CE10, EP4CE15, and larger devices scale up from this floor. For most glue-logic, simple state machines, and modest DSP/buffering tasks, 6K LEs is sufficient when paired with the 270 Kbits of embedded M9K memory.

What package does the EP4CE6E22C6N use?

The EP4CE6E22C6N ships in a 144-pin Plastic Enhanced QFP (EQFP-144) measuring 22 x 22 mm with a 0.5 mm lead pitch. The 'E' suffix in 'E22' denotes this EQFP package. The exposed pad aids thermal dissipation and must be soldered to the PCB land pattern for electrical and thermal performance.

What is the difference between EP4CE6E22C6N and EP4CE6E22C8N?

Both parts are identical silicon and identical 144-pin EQFP packages; they differ only in speed grade. The 'C6' suffix denotes speed grade 6 (slower, more affordable), while 'C8' denotes speed grade 8 (faster, slightly more expensive). They are drop-in pin-compatible in the same footprint - you can substitute a C6 with a C8 for timing margin improvement without any PCB change.

What is the difference between EP4CE6E22C6N and EP4CE6E22A7N?

The 'C' suffix indicates a commercial temperature range (0 C to +85 C) while 'A' indicates an automotive-grade temperature range (-40 C to +125 C). The 'C6' speed grade pairs with the commercial range; 'A7' pairs with the automotive range. Both use the same 144-pin EQFP package, but the EP4CE6E22A7N is qualified for harsher environments and costs more.

Where can I buy the EP4CE6E22C6N at the best price?

According to distributor listings as of 2026-09-10, the EP4CE6E22C6N is in stock at DigiKey, Mouser, LCSC, and Heisener. LCSC shows the lowest unit price at approximately $5.05 at high volumes, while DigiKey and Mouser typically range from $11-19 depending on quantity breaks. Octopart can be used to compare live distributor pricing across all sources.

What is the lead time for the EP4CE6E22C6N?

According to Heisener's listing as of 2026-09-10, the EP4CE6E22C6N ships with a typical lead time of approximately 5-7 days for stock-on-hand units. Major distributors like DigiKey and Mouser generally ship same-day for in-stock orders. Volume orders (1000+ pieces) may require 4-6 weeks if distributor stock is depleted and the order must be back-filled from Intel's channel.

Is the EP4CE6E22C6N in stock today?

Based on distributor listings retrieved on 2026-09-10, the EP4CE6E22C6N is reported in stock at Heisener (5,600 pieces), LCSC, and via the Altera/Intel channel. DigiKey and Mouser listings indicate limited stock with some back-order. For real-time availability, consult Octopart or contact the distributor directly before placing a purchase order.

EP4CE6E22C6N vs Lattice ECP5 - which is better for low-power FPGA designs?

The EP4CE6E22C6N (Cyclone IV E) and Lattice ECP5 (LFE5U-12 / LFE5U-25) both target low-power FPGA applications but differ in architecture. Cyclone IV E uses a 60 nm process with 1.2 V core; ECP5 uses 40 nm with 1.1 V core and offers hardened SERDES lanes, which the EP4CE6 lacks. For pure glue-logic designs in hand-solderable QFP, the EP4CE6E22C6N is preferable; for designs requiring SERDES, ECP5 in TQFP-144 is the better fit.

What is the best drop-in replacement for the EP4CE6E22C6N?

The closest drop-in replacements for the EP4CE6E22C6N are EP4CE6E22C8N (faster speed grade, same 144-pin EQFP package) and EP4CE6E22I7N (industrial temperature grade, same 144-pin EQFP package). All three share identical pinouts in the EQFP-144 footprint, so they can be soldered onto the same PCB without modification. For higher logic density, the EP4CE10E22C8N offers ~10K LEs in the same package.

Can the EP4CE6E22C6N replace a Cyclone III EP3C5 in the same footprint?

No, the EP4CE6E22C6N and Cyclone III EP3C5E22/EP3C16E22 are not pin-compatible - Cyclone III and Cyclone IV E use different EQFP-144 pin assignments. A PCB redesign is required when migrating between generations, even though the packages look similar. Use the Cyclone III to Cyclone IV E migration guide to map pin functions if a drop-in is required.

Is the EP4CE6E22C6N still in production by Intel?

The Cyclone IV E family was moved by Intel from new product introduction to mature long-term-supply (LTS) status. As of 2026-09-10, the EP4CE6E22C6N remains orderable from the Intel authorized channel and from authorized distributors, but new design wins should evaluate Cyclone 10 LP (10CL006) for long-term continuity. Lifecycle details are available on Intel's product change notification page.

Where can I download the EP4CE6E22C6N datasheet PDF?

The official Intel Cyclone IV Device Datasheet can be downloaded from Intel's FPGA documentation library at intel.com/content/www/us/en/products/details/fpga/cyclone/iv/e.html. The datasheet covers device features, package information, electrical characteristics, and configuration specifications. Mirror copies of the legacy Altera datasheet are also available on alldatasheet.com and findic.us.

Where can I find the EP4CE6E22C6N pinout for the EQFP-144 package?

The complete EQFP-144 pinout is documented in Chapter 7 (Pin Information) of the Cyclone IV Device Datasheet. The same pinout table is reproduced on distributor product pages and in the Altera/Intel device pin-out files (.pin) which are part of the Quartus Prime installation under /quartus/bin. For the E22 (EQFP-144) package, the I/O ball/pin assignment is identical across speed grades C6, C7, C8, I7, I8, and A7.

What tools support the EP4CE6E22C6N for FPGA development?

The EP4CE6E22C6N is fully supported by Intel Quartus Prime Lite Edition (free) and Quartus Prime Standard/Pro editions. The device is mature enough that Quartus II 13.1 also supports it. Common HDL tools (Verilog, VHDL, SystemVerilog) and IP cores (DDR2/DDR3 controllers, Nios II soft processor, Ethernet MAC) work out-of-the-box. ModelSim-Intel FPGA Starter Edition is the default simulator bundled with Quartus.

Données de référence d'ingénierie pour EP4CE6E22C6N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP4CE6E22C6N when you need the lowest-cost entry into the Cyclone IV E family for designs using 5-6K logic elements and 91 user I/Os in a hand-solderable package. Choose EP4CE6E22C8N if timing closure requires the faster speed grade. Choose EP4CE6E22I7N for industrial temperature environments and EP4CE6E22A7N for automotive-grade applications. Step up to EP4CE10E22C8N or EP4CE15E22C8N only when the EP4CE6 fabric is insufficient - all four share the same EQFP-144 footprint, so one PCB supports the entire family. For new long-life designs, evaluate the Cyclone 10 LP (10CL006) family instead, since Cyclone IV E is in mature LTS status.

Comparaison avec les alternatives

Paramètre	Ce produit	EP4CE6E22C8N	EP4CE6E22C7N	EP4CE6E22I7N	EP4CE6E22A7N	EP4CE10E22C8N	EP4CE15E22C8N
Package	EQFP-144 (E22)	EQFP-144 (E22) - same	EQFP-144 (E22) - same	EQFP-144 (E22) - same	EQFP-144 (E22) - same	EQFP-144 (E22) - same	EQFP-144 (E22) - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	6,272	6,272	6,272	6,272	6,272	10,320 (+64%)	15,408 (+145%)
Speed Grade	C6	C8 (faster)	C7	I7 (industrial)	A7 (automotive)	C8	C8
Temperature Grade	Commercial 0 C to +85 C	Commercial 0 C to +85 C	Commercial 0 C to +85 C	Industrial -40 C to +100 C	Automotive -40 C to +125 C	Commercial	Commercial
Embedded Memory	270 Kbits	270 Kbits	270 Kbits	270 Kbits	270 Kbits	414 Kbits	504 Kbits
Embedded 18x18 Multipliers	15	15	15	15	15	23	56
Maximum User I/Os	91	91	91	91	91	91	91

Principaux différenciateurs

Lowest-density Cyclone IV E in hand-solderable EQFP-144 footprint (vs EP4CE10E22C8N)
Hand-solderable EQFP-144 package (no BGA required) (vs Lattice ECP5 LFE5U-12 in TQFP-144)
Multi-temperature variants in the same EQFP-144 footprint (vs Cyclone III EP3C5E22 (single temperature option))

Notes de conception

The EP4CE6E22C6N requires separate VCCINT (1.2 V core) and VCCIOx (per-bank I/O) supplies. Per Intel's Cyclone IV Device Handbook, each VCCIO bank may be independently set to 1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V but mixing voltages within one bank is not allowed. Decouple each VCCINT pin with one 0.1 uF X7R ceramic plus one 10 uF bulk per supply plane; decouple each VCCIO bank with one 0.1 uF ceramic. Total quiescent current scales with logic utilization - estimate 200-400 mA typical at 6K LEs fully routed.

The exposed thermal pad (EPAD, pin 144) must be soldered to a PCB land pattern of at least the same area as the package EPAD, with thermal vias to the inner GND plane for heat dissipation. Although the EP4CE6 is low-power, neglecting the EPAD solder connection degrades thermal performance and increases junction temperature during sustained logic activity. Per IPC-7351 land pattern guidelines, place 0.5 mm-pitch QFP leads on 0.3 mm-wide pads with 0.2 mm solder mask expansion for reliable paste deposition.

Route configuration pins (MSEL, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) carefully - they are sensitive to noise and stub lengths. Keep configuration trace lengths under 50 mm and avoid running them parallel to high-speed switching signals. JTAG signals (TCK, TMS, TDI, TDO) require a 10 kohm pull-up on TCK as specified by IEEE 1149.1 - the EP4CE6E22C6N does not include internal TCK pull-up on all variants.

Do not migrate directly from Cyclone III EP3C5/EP3C16 EQFP-144 to Cyclone IV E EP4CE6E22 - the pinouts differ even though packages look identical. Use the Cyclone III to Cyclone IV E migration guide from Intel to remap pins. Also note that the EP4CE6E22C6N does not include hard PCIe or SERDES; if your design requires transceivers, choose Cyclone IV GX or Cyclone V instead. Do not exceed the absolute maximum junction temperature of 125 C - derate by 10 C in enclosed industrial enclosures.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Compliant

Lead-free per Cyclone IV E product page. The C6 part is commercial temperature and not AEC-Q100 qualified; choose EP4CE6E22A7N for AEC-Q100-grade automotive applications. RoHS and REACH compliance confirmed via Heisener and DigiKey product listings.

Données vérifiées le : 2026-09-10 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Octopart, Distributor, Distributor, Manufacturer Datasheet, Manufacturer Product Page

Recherches associées

EP4CE6E22C6N EP4CE6E22C6N datasheet Intel Cyclone IV E FPGA EP4CE6E22C6N price buy Cyclone IV E EQFP-144 FPGA EP4CE6E22C6N vs EP4CE6E22C8N EP4CE6E22C6N motor control application EP4CE6E22C6N drop-in replacement Cyclone IV E 6000 LE FPGA how many user I/Os EP4CE6E22C6N EP4CE6E22C6N pinout Cyclone IV E lead time stock

Composants & termes associés

Intel Altera EP4CE6E22C6N EP4CE6 Cyclone IV E FPGA Field-Programmable Gate Array Logic Element LAB M9K embedded memory DSP block PLL JTAG Active Serial Passive Serial EPCS EQFP-144 Plastic Enhanced QFP RoHS REACH AEC-Q100 industrial temperature automotive temperature Quartus Prime Nios II 60 nm process VCCINT VCCIO