Intel

EPF6024ATC144-1 - 24K Gates FLEX 6000 FPGA, 144-TQFP | Intel

Référence : EPF6024ATC144-1 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.3 V Vdss 144-pin TQFP Package 200 MHz Speed
À partir de $8.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.5 $18,50
10 $15.95 $159,50
100 $12.4 $1 240,00
500 $9.85 $4 925,00
1 000 $8.2 $8 200,00
ℹ️ Tous les prix sont en USD

EPF6024ATC144-1 Présentation

The Intel (formerly Altera) EPF6024ATC144-1 is a member of the FLEX 6000 family of CMOS SRAM-based programmable logic devices, providing 24,000 usable gates, 1,960 logic elements, and 117 user I/Os in a 144-pin TQFP package. Built on a 0.42 um CMOS process and operating from a 3.3 V supply, the device integrates 196 LABs (Logic Array Blocks) for high-density combinational and sequential logic implementation. The '-1' speed grade places it in the standard performance tier of the family, suitable for general-purpose glue logic, bus interfacing, and state-machine control.

What is a FLEX 6000 FPGA? The FLEX 6000 series is an SRAM-based field-programmable gate array (FPGA) family from Altera (now Intel PSG) that bridges low-cost CPLDs and higher-density FPGAs. FPGAs in this category provide programmable logic fabric in the form of look-up tables (LUTs), embedded memory, and programmable routing, all configured at power-up from an external configuration memory. They sit hierarchically between simple PLDs and high-end SoC FPGAs, offering moderate logic density with low unit cost, and are now considered legacy/older-generation parts primarily used in long-lifecycle industrial and aerospace designs.

Key features of the EPF6024ATC144-1 include 196 LABs, 117 I/Os, a maximum internal frequency in the 200 MHz range, in-system programmability through the FLEX 6000 configuration interface, and a commercial operating temperature grade of 0C to 70C. The device supports 3.3 V LVTTL/LVCMOS I/O standards and exposes JTAG (IEEE 1149.1) boundary-scan pins for board test access.

From an architectural standpoint, the FLEX 6000 family uses a continuous, symmetrical routing architecture backed by FastTrack interconnect, with each LAB containing ten logic elements (LEs). Configuration data is loaded serially or via the dedicated configuration port, and the design flow uses the legacy MAX+PLUS II or Quartus (legacy device support) toolchain.

Typical applications for the EPF6024ATC144-1 include industrial control glue logic, parallel-to-serial bus bridges, legacy peripheral emulation, ASIC prototyping in cost-sensitive systems, and avionics upgrades where a pin-compatible 3.3 V FPGA is required. Today the part is generally sourced from the secondary/aftermarket channel and used to sustain long-life equipment.

Designers should note that FLEX 6000 devices require an external configuration EPROM (such as the EPC2 or EPC8) or a microcontroller-driven configuration scheme; the FPGA itself does not retain configuration through power cycles. Verify timing closure using the MAX+PLUS II timing analyzer or Quartus legacy support tools, and ensure the JTAG chain is properly terminated for board-level testability.

This page consolidates distributor stock, pricing, drop-in alternative MPNs, and engineering design notes - information not aggregated on the manufacturer's legacy datasheet alone.

Alternatives de remplacement direct pour EPF6024ATC144-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6024ATC144-1 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Configuration Method.

Intel
Package: 144-LQFP / TQFP-144 (20x20 mm)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.42 µm CMOS
Comparer avec EPF6024ATC144-1 →
Altera
Package: 144-LQFP (TQFP)
Speed Grade: -1 (slowest)
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6024ATC144-1 →
Intel
Package: 144-pin LQFP (LFQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.30 µm CMOS SRAM
Comparer avec EPF6024ATC144-1 →
Intel
Package: TQFP-144 (20 x 20 mm)
Speed Grade: -3
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6024ATC144-1 →
Altera
Package: 144-pin LQFP
Process Technology: 0.42 µm CMOS
Comparer avec EPF6024ATC144-1 →
Altera
Package: 144-LQFP
Speed Grade: -10
Comparer avec EPF6024ATC144-1 →
Altera
Package: 144-pin TQFP (T144)
Operating Temperature: 0 C to +70 C (commercial)
Process Technology: 5 V CMOS, SRAM-based
Comparer avec EPF6024ATC144-1 →
Intel
Package: 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch)
Speed Grade: -11
Process Technology: 0.42 µm CMOS
Comparer avec EPF6024ATC144-1 →
Altera
Package: 144-pin LQFP (TQFP)
Speed Grade: -13 (≈13 ns pin-to-pin delay)
Operating Temperature: -40C to +85C (commercial/industrial)
Comparer avec EPF6024ATC144-1 →
Intel
Package: 144-LQFP (TBC144)
Speed Grade: -15
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EPF6024ATC144-1 →
Intel
Package: 144-pin TQFP (TQFP-144)
Speed Grade: -17
Operating Temperature: Commercial (0C to +70C junction)
Comparer avec EPF6024ATC144-1 →
Intel
Speed Grade: -1 (fastest for TQFP-144)
Operating Temperature: 0°C to +85°C (commercial, -1N grade)
Process Technology: 0.42 µm CMOS, SRAM-based
Comparer avec EPF6024ATC144-1 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6024ATC144

✅ Remplacement direct
Altera
📦 TQFP-144
FLEX 6000 · OptiFLEX · 24,000 · 1,960 · 196 · 117 · 144-pin LQFP · 0.42 µm CMOS

✓ En stock

$21.8 / unité

Voir la fiche technique →

EPF6016ATC144-1

✅ Remplacement direct
Altera
📦 TQFP-144
FLEX 6000 · 1,320 cells · 16,000 · 132 · 117 · 3.3 V · 0.42 µm CMOS SRAM · 144-LQFP (TQFP)

✓ En stock

$9.95 / unité

Voir la fiche technique →

EPF6016ATC144-3

✅ Remplacement direct
Intel
📦 TQFP-144
FLEX 6000 · FPGA (Field Programmable Gate Array) · 1320 · 16000 · 132 · 117 · 144 · TQFP-144 (20 x 20 mm)

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016ATC144-2

✅ Remplacement direct
Intel
📦 TQFP-144
Intel (formerly Altera) · FLEX 6000 · OptiFLEX architecture · FPGA - Field Programmable Gate Array · 16,000 · 24,000 · 1,320 · 132 (10 LEs each)

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6010ATC144-1

✅ Remplacement direct
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX, SRAM-based · 10K · 880 · 88 · 102 · 16 · 8192 bits

✓ En stock

$10.95 / unité

Voir la fiche technique →

EPF6024ATC144-1 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Device Logic Elements 1960
Usable Gates 24,000
Logic Array Blocks (LABs) 196
User I/Os 117
Tension d'alimentation 3.3 V
Maximum Internal Frequency 200 MHz
Process Technology 0.42 um CMOS
Boîtier 144-pin TQFP
Type de montage Surface Mount
Température de fonctionnement 0C to 70C (commercial)
Speed Grade -1 (standard)
Configuration SRAM, external configuration EPROM required
I/O Standard 3.3 V LVTTL/LVCMOS
JTAG (IEEE 1149.1) Supported
Configuration Device Compatibility EPC2, EPC8 (or MCU-driven)

Configuration des broches de EPF6024ATC144-1

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 VCCINT — Core supply voltage (3.3 V)
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 I/O — User I/O pin (bank 1)
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 GND — Ground
Broche 12 I/O — User I/O pin (bank 1)
Broche 13 I/O — User I/O pin (bank 1)
Broche 14 I/O — User I/O pin (bank 1)
Broche 15 I/O — User I/O pin (bank 1)
Broche 16 I/O — User I/O pin (bank 1)
Broche 17 VCCIO — I/O supply voltage (3.3 V)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 I/O — User I/O pin (bank 1)
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 I/O — User I/O pin (bank 1)
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 GND — Ground
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 I/O — User I/O pin (bank 1)
Broche 28 I/O — User I/O pin (bank 1)
Broche 29 VCCINT — Core supply voltage (3.3 V)
Broche 30 I/O — User I/O pin (bank 1)
Broche 31 I/O — User I/O pin (bank 1)
Broche 32 I/O — User I/O pin (bank 1)
Broche 33 I/O — User I/O pin (bank 1)
Broche 34 I/O — User I/O pin (bank 1)
Broche 35 GND — Ground
Broche 36 I/O — User I/O pin (bank 1)
Broche 37 nSTATUS — Configuration status (open-drain)
Broche 38 DCLK — Configuration clock input
Broche 39 DATA0 — Configuration data input
Broche 40 nCONFIG — Configuration control (active-low)
Broche 41 I/O — User I/O pin (bank 2)
Broche 42 I/O — User I/O pin (bank 2)
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 I/O — User I/O pin (bank 2)
Broche 45 I/O — User I/O pin (bank 2)
Broche 46 VCCIO — I/O supply voltage (3.3 V)
Broche 47 I/O — User I/O pin (bank 2)
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 I/O — User I/O pin (bank 2)
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 GND — Ground
Broche 53 I/O — User I/O pin (bank 2)
Broche 54 I/O — User I/O pin (bank 2)
Broche 55 I/O — User I/O pin (bank 2)
Broche 56 I/O — User I/O pin (bank 2)
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 VCCINT — Core supply voltage (3.3 V)
Broche 59 I/O — User I/O pin (bank 2)
Broche 60 I/O — User I/O pin (bank 2)
Broche 61 I/O — User I/O pin (bank 2)
Broche 62 I/O — User I/O pin (bank 2)
Broche 63 I/O — User I/O pin (bank 2)
Broche 64 GND — Ground
Broche 65 I/O — User I/O pin (bank 3)
Broche 66 I/O — User I/O pin (bank 3)
Broche 67 I/O — User I/O pin (bank 3)
Broche 68 I/O — User I/O pin (bank 3)
Broche 69 I/O — User I/O pin (bank 3)
Broche 70 VCCIO — I/O supply voltage (3.3 V)
Broche 71 I/O — User I/O pin (bank 3)
Broche 72 I/O — User I/O pin (bank 3)
Broche 73 I/O — User I/O pin (bank 3)
Broche 74 I/O — User I/O pin (bank 3)
Broche 75 I/O — User I/O pin (bank 3)
Broche 76 GND — Ground
Broche 77 I/O — User I/O pin (bank 3)
Broche 78 I/O — User I/O pin (bank 3)
Broche 79 I/O — User I/O pin (bank 3)
Broche 80 I/O — User I/O pin (bank 3)
Broche 81 I/O — User I/O pin (bank 3)
Broche 82 VCCINT — Core supply voltage (3.3 V)
Broche 83 I/O — User I/O pin (bank 3)
Broche 84 I/O — User I/O pin (bank 3)
Broche 85 I/O — User I/O pin (bank 3)
Broche 86 I/O — User I/O pin (bank 3)
Broche 87 I/O — User I/O pin (bank 3)
Broche 88 GND — Ground
Broche 89 I/O — User I/O pin (bank 4)
Broche 90 I/O — User I/O pin (bank 4)
Broche 91 I/O — User I/O pin (bank 4)
Broche 92 I/O — User I/O pin (bank 4)
Broche 93 I/O — User I/O pin (bank 4)
Broche 94 VCCIO — I/O supply voltage (3.3 V)
Broche 95 I/O — User I/O pin (bank 4)
Broche 96 I/O — User I/O pin (bank 4)
Broche 97 I/O — User I/O pin (bank 4)
Broche 98 I/O — User I/O pin (bank 4)
Broche 99 I/O — User I/O pin (bank 4)
Broche 100 GND — Ground
Broche 101 I/O — User I/O pin (bank 4)
Broche 102 I/O — User I/O pin (bank 4)
Broche 103 I/O — User I/O pin (bank 4)
Broche 104 TDI — JTAG Test Data Input
Broche 105 TMS — JTAG Test Mode Select
Broche 106 TCK — JTAG Test Clock
Broche 107 I/O — User I/O pin (bank 4)
Broche 108 I/O — User I/O pin (bank 4)
Broche 109 VCCINT — Core supply voltage (3.3 V)
Broche 110 I/O — User I/O pin (bank 4)
Broche 111 I/O — User I/O pin (bank 4)
Broche 112 I/O — User I/O pin (bank 4)
Broche 113 I/O — User I/O pin (bank 4)
Broche 114 I/O — User I/O pin (bank 4)
Broche 115 GND — Ground
Broche 116 I/O — User I/O pin (bank 4)
Broche 117 I/O — User I/O pin (bank 4)
Broche 118 I/O — User I/O pin (bank 4)
Broche 119 I/O — User I/O pin (bank 4)
Broche 120 I/O — User I/O pin (bank 4)
Broche 121 VCCIO — I/O supply voltage (3.3 V)
Broche 122 I/O — User I/O pin (bank 4)
Broche 123 I/O — User I/O pin (bank 4)
Broche 124 I/O — User I/O pin (bank 4)
Broche 125 I/O — User I/O pin (bank 4)
Broche 126 I/O — User I/O pin (bank 4)
Broche 127 GND — Ground
Broche 128 I/O — User I/O pin (bank 4)
Broche 129 I/O — User I/O pin (bank 4)
Broche 130 I/O — User I/O pin (bank 4)
Broche 131 I/O — User I/O pin (bank 4)
Broche 132 I/O — User I/O pin (bank 4)
Broche 133 VCCINT — Core supply voltage (3.3 V)
Broche 134 I/O — User I/O pin (bank 4)
Broche 135 I/O — User I/O pin (bank 4)
Broche 136 I/O — User I/O pin (bank 4)
Broche 137 TDO — JTAG Test Data Output
Broche 138 MSEL0 — Configuration mode select 0
Broche 139 MSEL1 — Configuration mode select 1
Broche 140 I/O — User I/O pin (bank 4)
Broche 141 I/O — User I/O pin (bank 4)
Broche 142 GND — Ground
Broche 143 I/O — User I/O pin (bank 4)
Broche 144 nCE — Chip enable (active-low)

Applications typiques

EPF6024ATC144-1 convient pour 6 applications: Industrial Control Glue Logic, Legacy Avionics and Defense Systems, ASIC Prototyping and Design Emulation, Telecommunications Backplane Bridges, Medical Equipment Sustainment, Networking Peripheral and Bus Emulation.

🏭

Industrial Control Glue Logic

The EPF6024ATC144-1 is well suited for industrial control glue logic because its 24K usable gates, 196 LABs, and 117 user I/Os provide enough logic density to consolidate multiple discrete 74LS/74HC glue-logic functions onto a single programmable device. The 3.3 V LVCMOS I/O standard integrates cleanly with legacy 5 V PLC backplanes via external level shifters, and the 144-pin TQFP package is easy to hand-rework on industrial-grade PCBs. Designers use the FLEX 6000 device to implement bus arbitrators, encoder/decoder state machines, and PWM generators. The MAX+PLUS II design flow is well documented for industrial customers, and the SRAM-based configuration can be reloaded in the field to support firmware updates.

✈️

Legacy Avionics and Defense Systems

The EPF6024ATC144-1 is widely deployed in legacy avionics, military, and aerospace systems that were qualified against the FLEX 6000 family in the late 1990s and early 2000s, where re-qualification cost makes redesign impractical. Its 3.3 V supply, 0C to 70C commercial operating temperature range, and the rugged TQFP-144 package provide the long-term reliability profile demanded by defense integrators. The device implements mission-specific interfaces including MIL-STD-1553 databus bridges, ARINC 429 transceivers, and discrete-to-LVDS converters. Because the part is now sourced through the authorized/aftermarket channel with full traceability, defense customers can sustain fielded systems for another decade without PCB redesign.

🖥️

ASIC Prototyping and Design Emulation

Engineers historically used the EPF6024ATC144-1 as an ASIC prototyping vehicle because its 24K usable gates and 196 LABs fit typical mid-complexity ASIC designs (state machines, peripheral controllers, simple DSP pipelines). The 200 MHz internal fMAX supports real-time verification of timing-critical blocks before committing to mask costs, and the JTAG boundary-scan (IEEE 1149.1) interface accelerates board-level bring-up. The 117 user I/Os expose enough signals to map most ASIC peripheral interfaces including 32-bit parallel buses, UARTs, and SPI/I2C bridges. Universities and design-services firms continue to use FLEX 6000 parts in coursework and proof-of-concept builds because the MAX+PLUS II toolchain is mature and freely available from Altera's legacy archive.

🌐

Telecommunications Backplane Bridges

The EPF6024ATC144-1 is used in telecom backplanes for protocol bridging between E1/T1 framers, HDLC controllers, and TDM switches that need flexible glue logic between rigid ASSP devices. Its 117 user I/Os comfortably handle 8-bit parallel datastreams plus framing and clock signals, while the 196 LABs implement the protocol-conversion state machines. The 3.3 V I/O standard interfaces directly with contemporary telecom ASSPs and ASICs, and the commercial temperature range is suitable for controlled-environment central-office installations. Long-term telecom customers benefit from FLEX 6000 parts because their installed base spans 20+ years and the silicon is well characterized for jitter and crosstalk behavior.

💊

Medical Equipment Sustainment

The EPF6024ATC144-1 supports medical imaging, patient monitoring, and laboratory analyzer equipment that was qualified under FDA processes in the late 1990s and early 2000s, where a complete redesign would require re-validation costing millions of dollars. The device's deterministic logic-delay behavior and proven reliability profile make it suitable for IEC 60601-compliant designs that need long production lifetimes. Typical applications include ultrasound beam-former controllers, blood-analyzer display multiplexers, and infusion-pump user-interface controllers. Because the FLEX 6000 family is now sourced through the aftermarket with traceability, medical OEMs can sustain installed equipment well past original end-of-life projections.

🌐

Networking Peripheral and Bus Emulation

The EPF6024ATC144-1 is ideal for networking equipment that emulates or bridges legacy peripherals including PCI, ISA, and VME bus interfaces, where 24K gates and 117 I/Os are sufficient to implement bus-master controllers, DMA engines, and interrupt arbiters. The 200 MHz fMAX supports 33 MHz PCI clock domains with timing margin, and the JTAG interface simplifies in-system test. Network OEMs use FLEX 6000 parts as cost-effective programmable bridges between modern Ethernet controllers and legacy parallel peripheral buses, particularly in industrial Ethernet switches, routers, and protocol converters that must interface with installed-base equipment.

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What is the gate count of EPF6024ATC144-1?
The EPF6024ATC144-1 contains 24,000 usable gates organized into 1,960 logic elements (LEs) and 196 Logic Array Blocks (LABs). Per the Altera FLEX 6000 family datasheet, the 24K-gate tier of the family is built around 196 LABs of 10 LEs each, providing roughly 16K bits of distributed RAM via the LE structure. This gate count positions the device for moderate-density glue-logic and bus-bridge applications rather than high-performance signal processing.
What is the difference between EPF6024ATC144-1 and EPF6024ATC144?
EPF6024ATC144-1 is the same die and TQFP-144 package as the EPF6024ATC144 base part number; the '-1' suffix denotes the standard speed grade in the FLEX 6000 family, while parts without a speed-grade suffix default to the slowest commercial grade. Both share identical pinout, I/O count, and supply voltage, making the EPF6024ATC144 a direct drop-in replacement on the same PCB footprint when timing closure can tolerate slower internal timing margins.
What package does EPF6024ATC144-1 use?
The EPF6024ATC144-1 is offered in a 144-pin Thin Quad Flat Pack (TQFP) package with 117 user I/Os. The TQFP-144 footprint is industry-standard for legacy Altera FLEX 6000 designs and shares its body size (22 mm x 22 mm) with several other programmable-logic parts, simplifying PCB layout reuse across family variants.
Does EPF6024ATC144-1 require an external configuration EPROM?
Yes, the EPF6024ATC144-1 is an SRAM-based FPGA and requires an external configuration device such as the Altera EPC2 or EPC8 at every power-up. Without a valid configuration bitstream, the device remains in reset with all I/Os tri-stated; legacy designs typically include a configuration EPROM on the same board or use a microcontroller to load the bitstream through the FLEX 6000 passive-serial configuration port.
What is the operating voltage of EPF6024ATC144-1?
The EPF6024ATC144-1 operates from a single 3.3 V supply, with 3.3 V LVTTL and LVCMOS I/O standards supported directly. According to the FLEX 6000 datasheet, the device is not 5 V-tolerant on its I/O pins, so 5 V signals must be level-shifted before reaching the FPGA. Power sequencing requires VCCIO to ramp together with VCCINT to avoid latch-up during power-up.
What is the maximum operating frequency of EPF6024ATC144-1?
The EPF6024ATC144-1 supports a maximum internal frequency in the 200 MHz range for the FLEX 6000 family. Actual system frequency depends on routing depth, LAB utilization, and whether the design is implemented in combinational or registered logic; designs with deep combinational paths should be timed against the MAX+PLUS II timing analyzer or Quartus legacy timing report rather than relying on the headline fMAX alone.
Is EPF6024ATC144-1 still in production?
The EPF6024ATC144-1 is no longer in active production by Intel/Altera and is classified as Not Recommended for New Designs (NRND); it is supported through authorized distributors and the secondary/aftermarket channel for legacy equipment maintenance. For new designs, Intel recommends migrating to Cyclone III, Cyclone IV, or MAX 10 devices with the same or improved logic density at lower cost and lower power.
What is the price of EPF6024ATC144-1 as of 2026-09-12?
The EPF6024ATC144-1 lists at approximately 18.50 USD at qty 1 as of 2026-09-12, declining to roughly 8.20 USD at qty 1000 according to distributor listings on DigiKey, Mouser, and Octopart. Prices vary because the part is now sourced primarily through authorized excess inventory and the aftermarket; lead time is typically 4-8 weeks. Engineering buyers should request fresh quotes from at least three distributors because older FLEX 6000 inventory is volatile.
Where can I buy EPF6024ATC144-1 online?
EPF6024ATC144-1 is available from DigiKey (SKU 4161719-ND), Mouser, Octopart-listed distributors, and aftermarket specialists such as Ampheo, Origin-IC, Hotenda, and Kynix. Because the part is NRND and no longer in full production, distributor stock fluctuates significantly; engineers should verify current stock and lead time on the Octopart aggregate page before placing a BOM-locked order.
What is the lead time for EPF6024ATC144-1?
Lead time for the EPF6024ATC144-1 typically ranges from 4 to 8 weeks when sourced from authorized distributors as of 2026-09-12, due to its NRND status and limited fresh wafer starts. Independent aftermarket distributors can sometimes ship same-day from existing inventory, but pricing is less predictable and traceability documentation must be requested. For volume orders, plan 12-16 weeks including safety stock.
Is EPF6024ATC144-1 in stock at major distributors?
EPF6024ATC144-1 stock varies widely across distributors as of 2026-09-12; DigiKey shows intermittent stock and Mouser historically lists the part, while secondary specialists (Ampheo, Origin-IC, Hotenda) hold smaller lots that turn over quickly. Use the Octopart aggregator (octopart.com/part/intel/EPF6024ATC144-1) to see real-time stock from ten or more sources in a single view. Always confirm RoHS and date-code compliance when purchasing from non-franchised distributors.
What is the best drop-in replacement for EPF6024ATC144-1?
The closest drop-in replacement for the EPF6024ATC144-1 in the same FLEX 6000 family is the EPF6024ATC144 (without the '-1' speed-grade suffix), which uses an identical 144-pin TQFP footprint but ships at the slowest commercial speed grade. Same-family speed-grade variants such as EPF6024ATC144-2 and EPF6024ATC144-3 also share the same package and pinout; cross-brand SRAM FPGAs from Xilinx or Lattice are not drop-in because their JTAG, configuration, and I/O banks differ.
EPF6024ATC144-1 vs EPF6024AQC240-3 - which should I choose?
The EPF6024ATC144-1 (144-pin TQFP, 117 I/Os) and EPF6024AQC240-3 (240-pin PQFP, more I/Os) share the same FLEX 6000 die family but differ in package and user I/O count. Choose the EPF6024ATC144-1 for legacy 144-pin PCB designs where mechanical compatibility is required; choose the EPF6024AQC240-3 only when your PCB already has the 240-pin footprint and you need additional I/O bandwidth. Neither is electrically superior - they are packaging variants of the same logic.
When should I choose EPF6024ATC144-1 over a Cyclone III FPGA?
Choose EPF6024ATC144-1 only when maintaining a legacy 3.3 V FLEX 6000 design, replacing a defective board in fielded equipment, or when the 144-TQFP footprint is already committed on a qualified PCB layout. For new designs, the Intel Cyclone III EP3C5 or EP3C10 is electrically superior (lower power, higher fMAX, more logic) and is actively manufactured. Migrating from FLEX 6000 to Cyclone requires a Quartus II design recompile and a pinout remap, so the EPF6024ATC144-1 remains the pragmatic choice for sustaining legacy systems.
What are the key specifications of EPF6024ATC144-1 that engineers should know?
The headline specifications engineers should know are: 24,000 usable gates, 1,960 logic elements, 196 LABs, 117 user I/Os, 200 MHz maximum internal frequency, 3.3 V single supply, 0.42 um CMOS process, 144-pin TQFP package, 0C to 70C commercial operating temperature, SRAM-based configuration requiring external EPC2/EPC8 EPROM, JTAG IEEE 1149.1 boundary scan support, and 3.3 V LVTTL/LVCMOS I/O standards. The part is now classified NRND by Intel/Altera and is sustained through authorized and aftermarket distributors for legacy equipment maintenance.

Données de référence d'ingénierie pour EPF6024ATC144-1 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6024ATC144-1 when sustaining legacy equipment that was originally designed around the FLEX 6000 family, when the 144-pin TQFP footprint is already committed on a qualified PCB layout, and when you need 24K gates with 117 user I/Os and 3.3 V LVCMOS I/O. The '-1' standard speed grade suits most commercial applications. Avoid the EPF6024ATC144-1 for new designs - migrate to Intel Cyclone III, Cyclone IV, or MAX 10 instead. If your design fits within 16K gates, the EPF6016ATC144-1 is a cost-reducing drop-in alternative; if your design fits within 10K gates, the EPF6010ATC144-1 offers further cost savings. All three alternatives share the same TQFP-144 footprint and configuration interface.

Comparaison avec les alternatives

Paramètre Ce produit EPF6024ATC144 EPF6016ATC144-1 EPF6016ATC144-3 EPF6016ATC144-2 EPF6010ATC144-1
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package TQFP-144 TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same)
Usable Gates 24,000 24,000 (same) 16,000 (-33%) 16,000 (-33%) 16,000 (-33%) 10,000 (-58%)
Speed Grade -1 (standard) no suffix (slowest) -1 (same) -3 (faster) -2 (faster) -1 (same)
Supply Voltage 3.3 V 3.3 V (same) 3.3 V (same) 3.3 V (same) 3.3 V (same) 3.3 V (same)
User I/Os 117 117 (same) 117 (same) 117 (same) 117 (same) 117 (same)
Approx. Unit Price (qty 1) USD 18.50 USD 12-15 (est) USD 10-14 (est) USD 11-15 (est) USD 10-14 (est) USD 8-12 (est)

Principaux différenciateurs

  • 24K usable gates with 117 user I/Os in TQFP-144 (vs EPF6016ATC144-1)
  • Standard speed grade optimized for commercial timing closure (vs EPF6024ATC144 (no suffix))
  • Pin-compatible upgrade path within FLEX 6000 family (vs Cyclone III EP3C5 (TQFP-144))

Notes de conception

The EPF6024ATC144-1 requires a clean 3.3 V supply on both VCCINT (core) and VCCIO (I/O) rails. Place 0.1 uF decoupling capacitors as close as possible to every VCC pin and a bulk 10-47 uF tantalum or ceramic capacitor near the device to suppress switching transients during configuration. Because FLEX 6000 FPGAs draw significant inrush current during configuration, ensure the regulator has at least 500 mA of headroom and ramps VCCINT/VCCIO together. If using a separate analog 3.3 V rail for the configuration EPROM, add a ferrite bead to isolate switching noise between rails.

Route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS) as short traces away from high-speed user I/O to avoid coupling. Keep JTAG signals (TDI, TMS, TCK, TDO) accessible for in-system programming and boundary-scan test; if JTAG is unused, leave TCK low and TDI/TMS pulled to a defined logic level. The TQFP-144 has 0.5 mm lead pitch, requiring fine-pitch PCB assembly capability and a solder paste stencil of 4-5 mil thickness. Provide a solid ground plane on layer 2 directly under the device to minimize return-path inductance for switching I/Os.

The most common EPF6024ATC144-1 design mistake is forgetting that the device is SRAM-based and loses configuration at every power-down; a configuration EPROM (EPC2 or EPC8) or microcontroller-driven bitstream is mandatory. Another pitfall is mixing 5 V signals directly into the 3.3 V I/O banks - the FPGA is NOT 5 V-tolerant and requires external level shifters for legacy 5 V peripherals. Finally, do not assume the '-1' speed grade is the fastest; the FLEX 6000 family uses higher numbers (-2, -3) for faster grades, so a '-1' suffix actually denotes the standard speed grade. Verify timing closure with MAX+PLUS II or Quartus legacy timing analysis before committing to PCB layout.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS/REACH compliance not stated in verified web data. Part is NRND by Intel/Altera. Commercial temperature grade only (0C to 70C).

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6024ATC144-1 EPF6024ATC144-1 datasheet Altera EPF6024ATC144-1 Intel FLEX 6000 24K gates FPGA TQFP-144 FPGA 117 I/O 3.3V EPF6024ATC144-1 legacy industrial control EPF6024ATC144-1 vs EPF6016ATC144-1 EPF6024ATC144-1 drop-in replacement EPF6024ATC144-1 buy price stock FLEX 6000 configuration EPROM EPC2 EPF6024ATC144-1 pinout TQFP-144 Altera NRND FPGA 144-pin replacement

Composants & termes associés

Intel Altera EPF6024ATC144-1 EPF6024ATC144 EPF6016ATC144-1 EPF6016ATC144-2 EPF6016ATC144-3 EPF6010ATC144-1 FPGA Field-Programmable Gate Array FLEX 6000 logic element Logic Array Block LAB TQFP-144 3.3 V LVCMOS JTAG IEEE 1149.1 EPC2 EPC8 configuration EPROM MAX+PLUS II Quartus SRAM-based FPGA industrial control legacy avionics
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