EPF6024ATC144-1 - 24K Gates FLEX 6000 FPGA, 144-TQFP | Intel
Référence : EPF6024ATC144-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $15.95 | $159,50 |
| 100 | $12.4 | $1 240,00 |
| 500 | $9.85 | $4 925,00 |
| 1 000 | $8.2 | $8 200,00 |
EPF6024ATC144-1 Présentation
What is a FLEX 6000 FPGA? The FLEX 6000 series is an SRAM-based field-programmable gate array (FPGA) family from Altera (now Intel PSG) that bridges low-cost CPLDs and higher-density FPGAs. FPGAs in this category provide programmable logic fabric in the form of look-up tables (LUTs), embedded memory, and programmable routing, all configured at power-up from an external configuration memory. They sit hierarchically between simple PLDs and high-end SoC FPGAs, offering moderate logic density with low unit cost, and are now considered legacy/older-generation parts primarily used in long-lifecycle industrial and aerospace designs.
Key features of the EPF6024ATC144-1 include 196 LABs, 117 I/Os, a maximum internal frequency in the 200 MHz range, in-system programmability through the FLEX 6000 configuration interface, and a commercial operating temperature grade of 0C to 70C. The device supports 3.3 V LVTTL/LVCMOS I/O standards and exposes JTAG (IEEE 1149.1) boundary-scan pins for board test access.
From an architectural standpoint, the FLEX 6000 family uses a continuous, symmetrical routing architecture backed by FastTrack interconnect, with each LAB containing ten logic elements (LEs). Configuration data is loaded serially or via the dedicated configuration port, and the design flow uses the legacy MAX+PLUS II or Quartus (legacy device support) toolchain.
Typical applications for the EPF6024ATC144-1 include industrial control glue logic, parallel-to-serial bus bridges, legacy peripheral emulation, ASIC prototyping in cost-sensitive systems, and avionics upgrades where a pin-compatible 3.3 V FPGA is required. Today the part is generally sourced from the secondary/aftermarket channel and used to sustain long-life equipment.
Designers should note that FLEX 6000 devices require an external configuration EPROM (such as the EPC2 or EPC8) or a microcontroller-driven configuration scheme; the FPGA itself does not retain configuration through power cycles. Verify timing closure using the MAX+PLUS II timing analyzer or Quartus legacy support tools, and ensure the JTAG chain is properly terminated for board-level testability.
This page consolidates distributor stock, pricing, drop-in alternative MPNs, and engineering design notes - information not aggregated on the manufacturer's legacy datasheet alone.
Alternatives de remplacement direct pour EPF6024ATC144-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024ATC144-1 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024ATC144
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →EPF6016ATC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPF6016ATC144-3
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPF6016ATC144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6010ATC144-1
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPF6024ATC144-1 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Logic Elements | 1960 |
| Usable Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 117 |
| Tension d'alimentation | 3.3 V |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.42 um CMOS |
| Boîtier | 144-pin TQFP |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to 70C (commercial) |
| Speed Grade | -1 (standard) |
| Configuration | SRAM, external configuration EPROM required |
| I/O Standard | 3.3 V LVTTL/LVCMOS |
| JTAG (IEEE 1149.1) | Supported |
| Configuration Device Compatibility | EPC2, EPC8 (or MCU-driven) |
Configuration des broches de EPF6024ATC144-1
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCINT — Core supply voltage (3.3 V) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | VCCINT — Core supply voltage (3.3 V) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | nSTATUS — Configuration status (open-drain) |
| Broche 38 | DCLK — Configuration clock input |
| Broche 39 | DATA0 — Configuration data input |
| Broche 40 | nCONFIG — Configuration control (active-low) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | VCCINT — Core supply voltage (3.3 V) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | I/O — User I/O pin (bank 2) |
| Broche 64 | GND — Ground |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | VCCINT — Core supply voltage (3.3 V) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | I/O — User I/O pin (bank 3) |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | I/O — User I/O pin (bank 4) |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | TDI — JTAG Test Data Input |
| Broche 105 | TMS — JTAG Test Mode Select |
| Broche 106 | TCK — JTAG Test Clock |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | VCCINT — Core supply voltage (3.3 V) |
| Broche 110 | I/O — User I/O pin (bank 4) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | GND — Ground |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | VCCINT — Core supply voltage (3.3 V) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | I/O — User I/O pin (bank 4) |
| Broche 136 | I/O — User I/O pin (bank 4) |
| Broche 137 | TDO — JTAG Test Data Output |
| Broche 138 | MSEL0 — Configuration mode select 0 |
| Broche 139 | MSEL1 — Configuration mode select 1 |
| Broche 140 | I/O — User I/O pin (bank 4) |
| Broche 141 | I/O — User I/O pin (bank 4) |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O pin (bank 4) |
| Broche 144 | nCE — Chip enable (active-low) |
Applications typiques
EPF6024ATC144-1 convient pour 6 applications: Industrial Control Glue Logic, Legacy Avionics and Defense Systems, ASIC Prototyping and Design Emulation, Telecommunications Backplane Bridges, Medical Equipment Sustainment, Networking Peripheral and Bus Emulation.
Industrial Control Glue Logic
The EPF6024ATC144-1 is well suited for industrial control glue logic because its 24K usable gates, 196 LABs, and 117 user I/Os provide enough logic density to consolidate multiple discrete 74LS/74HC glue-logic functions onto a single programmable device. The 3.3 V LVCMOS I/O standard integrates cleanly with legacy 5 V PLC backplanes via external level shifters, and the 144-pin TQFP package is easy to hand-rework on industrial-grade PCBs. Designers use the FLEX 6000 device to implement bus arbitrators, encoder/decoder state machines, and PWM generators. The MAX+PLUS II design flow is well documented for industrial customers, and the SRAM-based configuration can be reloaded in the field to support firmware updates.
Recommandé
Legacy Avionics and Defense Systems
The EPF6024ATC144-1 is widely deployed in legacy avionics, military, and aerospace systems that were qualified against the FLEX 6000 family in the late 1990s and early 2000s, where re-qualification cost makes redesign impractical. Its 3.3 V supply, 0C to 70C commercial operating temperature range, and the rugged TQFP-144 package provide the long-term reliability profile demanded by defense integrators. The device implements mission-specific interfaces including MIL-STD-1553 databus bridges, ARINC 429 transceivers, and discrete-to-LVDS converters. Because the part is now sourced through the authorized/aftermarket channel with full traceability, defense customers can sustain fielded systems for another decade without PCB redesign.
Recommandé
ASIC Prototyping and Design Emulation
Engineers historically used the EPF6024ATC144-1 as an ASIC prototyping vehicle because its 24K usable gates and 196 LABs fit typical mid-complexity ASIC designs (state machines, peripheral controllers, simple DSP pipelines). The 200 MHz internal fMAX supports real-time verification of timing-critical blocks before committing to mask costs, and the JTAG boundary-scan (IEEE 1149.1) interface accelerates board-level bring-up. The 117 user I/Os expose enough signals to map most ASIC peripheral interfaces including 32-bit parallel buses, UARTs, and SPI/I2C bridges. Universities and design-services firms continue to use FLEX 6000 parts in coursework and proof-of-concept builds because the MAX+PLUS II toolchain is mature and freely available from Altera's legacy archive.
Recommandé
Telecommunications Backplane Bridges
The EPF6024ATC144-1 is used in telecom backplanes for protocol bridging between E1/T1 framers, HDLC controllers, and TDM switches that need flexible glue logic between rigid ASSP devices. Its 117 user I/Os comfortably handle 8-bit parallel datastreams plus framing and clock signals, while the 196 LABs implement the protocol-conversion state machines. The 3.3 V I/O standard interfaces directly with contemporary telecom ASSPs and ASICs, and the commercial temperature range is suitable for controlled-environment central-office installations. Long-term telecom customers benefit from FLEX 6000 parts because their installed base spans 20+ years and the silicon is well characterized for jitter and crosstalk behavior.
Recommandé
Medical Equipment Sustainment
The EPF6024ATC144-1 supports medical imaging, patient monitoring, and laboratory analyzer equipment that was qualified under FDA processes in the late 1990s and early 2000s, where a complete redesign would require re-validation costing millions of dollars. The device's deterministic logic-delay behavior and proven reliability profile make it suitable for IEC 60601-compliant designs that need long production lifetimes. Typical applications include ultrasound beam-former controllers, blood-analyzer display multiplexers, and infusion-pump user-interface controllers. Because the FLEX 6000 family is now sourced through the aftermarket with traceability, medical OEMs can sustain installed equipment well past original end-of-life projections.
Recommandé
Networking Peripheral and Bus Emulation
The EPF6024ATC144-1 is ideal for networking equipment that emulates or bridges legacy peripherals including PCI, ISA, and VME bus interfaces, where 24K gates and 117 I/Os are sufficient to implement bus-master controllers, DMA engines, and interrupt arbiters. The 200 MHz fMAX supports 33 MHz PCI clock domains with timing margin, and the JTAG interface simplifies in-system test. Network OEMs use FLEX 6000 parts as cost-effective programmable bridges between modern Ethernet controllers and legacy parallel peripheral buses, particularly in industrial Ethernet switches, routers, and protocol converters that must interface with installed-base equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024ATC144-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024ATC144 | EPF6016ATC144-1 | EPF6016ATC144-3 | EPF6016ATC144-2 | EPF6010ATC144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Usable Gates | 24,000 | 24,000 (same) | 16,000 (-33%) | 16,000 (-33%) | 16,000 (-33%) | 10,000 (-58%) |
| Speed Grade | -1 (standard) | no suffix (slowest) | -1 (same) | -3 (faster) | -2 (faster) | -1 (same) |
| Supply Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| User I/Os | 117 | 117 (same) | 117 (same) | 117 (same) | 117 (same) | 117 (same) |
| Approx. Unit Price (qty 1) | USD 18.50 | USD 12-15 (est) | USD 10-14 (est) | USD 11-15 (est) | USD 10-14 (est) | USD 8-12 (est) |
Principaux différenciateurs
- 24K usable gates with 117 user I/Os in TQFP-144 (vs EPF6016ATC144-1)
- Standard speed grade optimized for commercial timing closure (vs EPF6024ATC144 (no suffix))
- Pin-compatible upgrade path within FLEX 6000 family (vs Cyclone III EP3C5 (TQFP-144))
Notes de conception
The EPF6024ATC144-1 requires a clean 3.3 V supply on both VCCINT (core) and VCCIO (I/O) rails. Place 0.1 uF decoupling capacitors as close as possible to every VCC pin and a bulk 10-47 uF tantalum or ceramic capacitor near the device to suppress switching transients during configuration. Because FLEX 6000 FPGAs draw significant inrush current during configuration, ensure the regulator has at least 500 mA of headroom and ramps VCCINT/VCCIO together. If using a separate analog 3.3 V rail for the configuration EPROM, add a ferrite bead to isolate switching noise between rails.
Route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS) as short traces away from high-speed user I/O to avoid coupling. Keep JTAG signals (TDI, TMS, TCK, TDO) accessible for in-system programming and boundary-scan test; if JTAG is unused, leave TCK low and TDI/TMS pulled to a defined logic level. The TQFP-144 has 0.5 mm lead pitch, requiring fine-pitch PCB assembly capability and a solder paste stencil of 4-5 mil thickness. Provide a solid ground plane on layer 2 directly under the device to minimize return-path inductance for switching I/Os.
The most common EPF6024ATC144-1 design mistake is forgetting that the device is SRAM-based and loses configuration at every power-down; a configuration EPROM (EPC2 or EPC8) or microcontroller-driven bitstream is mandatory. Another pitfall is mixing 5 V signals directly into the 3.3 V I/O banks - the FPGA is NOT 5 V-tolerant and requires external level shifters for legacy 5 V peripherals. Finally, do not assume the '-1' speed grade is the fastest; the FLEX 6000 family uses higher numbers (-2, -3) for faster grades, so a '-1' suffix actually denotes the standard speed grade. Verify timing closure with MAX+PLUS II or Quartus legacy timing analysis before committing to PCB layout.
Informations de conformité
RoHS/REACH compliance not stated in verified web data. Part is NRND by Intel/Altera. Commercial temperature grade only (0C to 70C).