EPF6024ATC144-1N - FLEX 6000 FPGA, 1960 Cells, 144-TQFP | Intel EPF6024ATC144-1N par Intel - composant électronique
Intel

EPF6024ATC144-1N - FLEX 6000 FPGA, 1960 Cells, 144-TQFP | Intel

Référence : EPF6024ATC144-1N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.0 V to 3.6 V Vdss 144-LQFP / 144-TQFP (20 x 20 mm, 1.0 mm pitch) Package -1 (fastest for TQFP-144) Speed SRAM (volatile, requires EPC device or download cable) Memory
À partir de $20.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $34.2 $342,00
100 $28.75 $2 875,00
500 $24.1 $12 050,00
1 000 $20.95 $20 950,00
ℹ️ Tous les prix sont en USD
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EPF6024ATC144-1N Présentation

The Intel (formerly Altera) EPF6024ATC144-1N is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs) housed in a 144-pin TQFP (Thin Quad Flat Pack) package. The device integrates 1,960 logic elements across 196 Logic Array Blocks (LABs) and provides 117 user I/O pins, delivering approximately 24,000 typical gates of logic capacity on a 0.42 µm CMOS process. The -1N speed grade combined with the commercial 0°C to +85°C operating range targets mainstream glue-logic, bus-interface, and state-machine applications where deterministic timing and low unit cost matter more than raw logic density.

An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, programmable interconnects, and I/O cells that the user can define after manufacture via a configuration bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they offer ASIC-like parallel performance and hardware determinism while remaining re-programmable throughout the product lifecycle. FPGAs are widely used for protocol bridging, digital signal preprocessing, custom bus controllers, and ASIC prototyping. The FLEX 6000 series in particular was Altera's cost-optimized, SRAM-based family engineered for high-volume, cost-sensitive applications in the late 1990s and 2000s, and the EPF6024A series remains a popular choice for legacy industrial and telecom designs requiring long-term component availability.

Key features of the EPF6024ATC144-1N include a 3.3V core and I/O supply, 117 general-purpose I/O pins, on-chip SRAM configuration memory, JTAG (IEEE 1149.1) boundary-scan test support, and dedicated clock management with global and fast regional networks. The TQFP-144 package (JEDEC MS-026 designation) provides a 1.0 mm lead pitch and is rated for surface-mount reflow assembly up to JEDEC J-STD-020 peak temperatures. The -1 speed grade is the fastest of the FLEX 6000 family for the TQFP-144 footprint, with timing margins suitable for 33 MHz PCI and standard asynchronous SRAM interfaces.

Architecturally, the FLEX 6000 family uses a continuous, hierarchical routing structure that combines fast adjacent interconnect with a segmented long-line network, which delivers predictable timing closure for designs of 5,000–30,000 gates. Each LAB contains ten Logic Elements (LEs), and each LE includes a 4-input look-up table, a programmable register, and dedicated carry and cascade chains for arithmetic and wide-logic functions. The SRAM-based configuration cell allows unlimited re-programmability via the EPC configuration device or the ByteBlaster download cable in the legacy Altera MAX+PLUS II and Quartus Prime design flows.

Typical applications for the EPF6024ATC144-1N include PCI bus interface controllers, glue logic between microprocessors and peripherals, custom address decoders, UART and HDLC protocol bridges, video timing generators, industrial control state machines, and legacy telecommunications backplane glue. The 144-pin TQFP footprint is especially useful for designs that have already laid out the package and require a stable, long-lifecycle source of programmable logic with no firmware stack to maintain.

When designing with this device, ensure the 3.3V supply is well decoupled with a 0.1 µF ceramic capacitor per power pin pair and a bulk 10 µF tantalum or ceramic capacitor on each supply rail. The configuration EPC1, EPC2, or EPC16 memory device should be wired per the FLEX 6000 Handbook reference schematics. Note that the -1N suffix indicates the commercial (0°C to +85°C) temperature grade; the -1 industrial variant EPF6024ATC144-1 extends operation to the -40°C to +85°C range.

This page synthesizes distributor stock, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, providing information gain for engineers working with legacy FLEX 6000 designs.

Alternatives de remplacement direct pour EPF6024ATC144-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6024ATC144-1N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Operating Temperature, Configuration Memory.

Intel
Package: 144-pin TQFP (20x20 mm, 0.5 mm pitch)
Process Technology: 0.42 µm CMOS
Operating Temperature: 0°C to +85°C (Commercial)
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-pin LQFP
Process Technology: 0.42 µm CMOS
Configuration Memory: SRAM-based (volatile)
Comparer avec EPF6024ATC144-1N →
Intel
Package: 144-pin TQFP
Process Technology: 0.42 um CMOS
Speed Grade: -1 (standard)
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-LQFP
Speed Grade: -10
Configuration Memory: SRAM
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-pin TQFP (T144)
Process Technology: 5 V CMOS, SRAM-based
Operating Temperature: 0 C to +70 C (commercial)
Comparer avec EPF6024ATC144-1N →
Intel
Package: 144-LQFP (LQFP-144, 20x20 mm, 0.5 mm pitch)
Process Technology: 0.42 µm CMOS
Speed Grade: -11
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-LQFP (TQFP-144)
Process Technology: 0.35 µm CMOS SRAM
Operating Temperature: Commercial 0°C to +70°C
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-LQFP (Plastic Low-Profile Quad Flat Pack)
Process Technology: 0.35 µm CMOS SRAM
Speed Grade: -20 (20 ns tPD)
Comparer avec EPF6024ATC144-1N →
Altera
Package: TQFP-144
Process Technology: 0.42 um CMOS, SRAM-based
Speed Grade: -23 (combined speed/temperature suffix)
Comparer avec EPF6024ATC144-1N →
Intel
Package: 144-pin TQFP (TQFP-144)
Process Technology: 0.42 µm CMOS SRAM
Speed Grade: A
Comparer avec EPF6024ATC144-1N →
Intel
Package: 144-LQFP (TQFP)
Process Technology: 0.42 µm CMOS SRAM
Speed Grade: -3 (mid speed bin)
Comparer avec EPF6024ATC144-1N →
Altera
Package: 144-pin LQFP (TQFP, 1.4 mm height)
Process Technology: 0.42 um CMOS, 4 metal layers
Operating Temperature: 0 °C to 85 °C (TJ)
Comparer avec EPF6024ATC144-1N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6024ATC144-1

✅ Remplacement direct
Intel
📦 144-LQFP / 144-TQFP
FLEX 6000 · 1960 · 24,000 · 196 · 117 · 3.3 V · 200 MHz · 0.42 um CMOS

✓ En stock

$8.2 / unité

Voir la fiche technique →

EPF6024ATC144

Altera
📦 144-LQFP / 144-TQFP
FLEX 6000 · OptiFLEX · 24,000 · 1,960 · 196 · 117 · 144-pin LQFP · 0.42 µm CMOS

✓ En stock

$21.8 / unité

Voir la fiche technique →

EPF6024ATC144-10

✅ Remplacement direct
Altera
📦 144-LQFP / 144-TQFP
FLEX 6000 · 1,960 LE · 24,000 · 117 · 196 · -10 · SRAM · 144-LQFP

✓ En stock

$11.1 / unité

Voir la fiche technique →

EPF6024ATC144-10N

✅ Remplacement direct
Altera
📦 144-LQFP / 144-TQFP
FLEX 6000 · EPF6024A · 1960 · 196 · 117 · 144-pin TQFP (T144) · -10 speed grade (10 ns class) · 5 V CMOS, SRAM-based

✓ En stock

$14.95 / unité

Voir la fiche technique →

EPF6016ATC144-1N

✅ Remplacement direct
Intel
📦 144-LQFP / 144-TQFP
FLEX 6000 FPGA · FLEX 6000 · 16,000 · 1,320 · 117 · 3.0 V to 3.6 V · 172 MHz · 0°C to +85°C (Commercial)

✓ En stock

$18.2 / unité

Voir la fiche technique →

EPF6024ATC144-1N Valeurs maximales et caractéristiques électriques

Series FLEX 6000
Family Name FLEX 6000
Logic Elements / Cells 1,960
Number of LABs/CLBs 196
Number of Logic Elements 1,960
Number of I/O 117
Number of Gates 24,000 (typical)
Voltage - Supply 3.0 V to 3.6 V
Température de fonctionnement 0°C to +85°C (commercial, -1N grade)
Speed Grade -1 (fastest for TQFP-144)
Boîtier / Format 144-LQFP / 144-TQFP (20 x 20 mm, 1.0 mm pitch)
Type de montage Surface Mount
Process Technology 0.42 µm CMOS, SRAM-based
Configuration Memory SRAM (volatile, requires EPC device or download cable)
JTAG / Boundary Scan Yes (IEEE 1149.1)

Configuration des broches de EPF6024ATC144-1N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank-specific)
Broche 2 I/O — User I/O
Broche 3 I/O — User I/O
Broche 4 I/O — User I/O
Broche 5 VCCIO — I/O supply voltage (3.3V)
Broche 6 I/O — User I/O
Broche 7 GND — Ground
Broche 8 I/O — User I/O
Broche 9 I/O — User I/O
Broche 10 I/O — User I/O
Broche 11 GND — Ground
Broche 12 I/O — User I/O
Broche 13 I/O — User I/O
Broche 14 I/O — User I/O
Broche 15 VCCINT — Core supply voltage (3.3V)
Broche 16 I/O — User I/O
Broche 17 I/O — User I/O
Broche 18 I/O — User I/O
Broche 19 GND — Ground
Broche 20 I/O — User I/O
Broche 21 I/O — User I/O
Broche 22 I/O — User I/O
Broche 23 I/O — User I/O
Broche 24 VCCIO — I/O supply voltage (3.3V)
Broche 25 I/O — User I/O
Broche 26 GND — Ground
Broche 27 I/O — User I/O
Broche 28 I/O — User I/O
Broche 29 I/O — User I/O
Broche 30 I/O — User I/O
Broche 31 GND — Ground
Broche 32 I/O — User I/O
Broche 33 I/O — User I/O
Broche 34 I/O — User I/O
Broche 35 VCCINT — Core supply voltage (3.3V)
Broche 36 I/O — User I/O
Broche 37 I/O — User I/O
Broche 38 I/O — User I/O
Broche 39 GND — Ground
Broche 40 I/O — User I/O
Broche 41 I/O — User I/O
Broche 42 I/O — User I/O
Broche 43 I/O — User I/O
Broche 44 VCCIO — I/O supply voltage (3.3V)
Broche 45 I/O — User I/O
Broche 46 GND — Ground
Broche 47 I/O — User I/O
Broche 48 I/O — User I/O
Broche 49 I/O — User I/O
Broche 50 I/O — User I/O
Broche 51 GND — Ground
Broche 52 I/O — User I/O
Broche 53 I/O — User I/O
Broche 54 I/O — User I/O
Broche 55 VCCINT — Core supply voltage (3.3V)
Broche 56 I/O — User I/O
Broche 57 I/O — User I/O
Broche 58 I/O — User I/O
Broche 59 GND — Ground
Broche 60 I/O — User I/O
Broche 61 I/O — User I/O
Broche 62 I/O — User I/O
Broche 63 I/O — User I/O
Broche 64 VCCIO — I/O supply voltage (3.3V)
Broche 65 I/O — User I/O
Broche 66 GND — Ground
Broche 67 I/O — User I/O
Broche 68 I/O — User I/O
Broche 69 I/O — User I/O
Broche 70 I/O — User I/O
Broche 71 GND — Ground
Broche 72 I/O — User I/O
Broche 73 nCONFIG — Configuration control (active low)
Broche 74 nSTATUS — Configuration status (active low)
Broche 75 CONF_DONE — Configuration done indicator
Broche 76 DCLK — Configuration clock input
Broche 77 DATA0 — Configuration data input (FLEX 6000 PS mode)
Broche 78 I/O — User I/O
Broche 79 I/O — User I/O
Broche 80 GND — Ground
Broche 81 I/O — User I/O
Broche 82 I/O — User I/O
Broche 83 I/O — User I/O
Broche 84 I/O — User I/O
Broche 85 VCCINT — Core supply voltage (3.3V)
Broche 86 I/O — User I/O
Broche 87 I/O — User I/O
Broche 88 I/O — User I/O
Broche 89 GND — Ground
Broche 90 I/O — User I/O
Broche 91 I/O — User I/O
Broche 92 I/O — User I/O
Broche 93 I/O — User I/O
Broche 94 VCCIO — I/O supply voltage (3.3V)
Broche 95 I/O — User I/O
Broche 96 GND — Ground
Broche 97 I/O — User I/O
Broche 98 I/O — User I/O
Broche 99 I/O — User I/O
Broche 100 I/O — User I/O
Broche 101 GND — Ground
Broche 102 I/O — User I/O
Broche 103 I/O — User I/O
Broche 104 I/O — User I/O
Broche 105 VCCINT — Core supply voltage (3.3V)
Broche 106 I/O — User I/O
Broche 107 I/O — User I/O
Broche 108 I/O — User I/O
Broche 109 GND — Ground
Broche 110 I/O — User I/O
Broche 111 I/O — User I/O
Broche 112 I/O — User I/O
Broche 113 I/O — User I/O
Broche 114 VCCIO — I/O supply voltage (3.3V)
Broche 115 I/O — User I/O
Broche 116 GND — Ground
Broche 117 I/O — User I/O
Broche 118 I/O — User I/O
Broche 119 I/O — User I/O
Broche 120 I/O — User I/O
Broche 121 TCK — JTAG test clock
Broche 122 TMS — JTAG test mode select
Broche 123 TDI — JTAG test data in
Broche 124 TDO — JTAG test data out
Broche 125 I/O — User I/O
Broche 126 I/O — User I/O
Broche 127 GND — Ground
Broche 128 I/O — User I/O
Broche 129 I/O — User I/O
Broche 130 I/O — User I/O
Broche 131 I/O — User I/O
Broche 132 VCCINT — Core supply voltage (3.3V)
Broche 133 I/O — User I/O
Broche 134 I/O — User I/O
Broche 135 I/O — User I/O
Broche 136 GND — Ground
Broche 137 I/O — User I/O
Broche 138 I/O — User I/O
Broche 139 I/O — User I/O
Broche 140 I/O — User I/O
Broche 141 VCCIO — I/O supply voltage (3.3V)
Broche 142 I/O — User I/O
Broche 143 I/O — User I/O
Broche 144 I/O — User I/O

Applications typiques

EPF6024ATC144-1N convient pour 6 applications: PCI Bus Interface Controller, Custom Address Decoder / Glue Logic, UART / HDLC Protocol Bridge, Video Timing Generator, Industrial Control State Machine, Legacy Telecom Backplane Glue.

🖥️

PCI Bus Interface Controller

The EPF6024ATC144-1N is a strong match for legacy 33 MHz PCI target controllers and bus bridges thanks to its 1,960 logic elements, 117 user I/O pins, and -1 (fastest) FLEX 6000 speed grade. The 144-TQFP footprint exposes enough I/O for 32-bit PCI plus auxiliary control signals, while the 3.3V I/O bank is natively PCI-signaling-environment compatible. Designers typically allocate roughly 1,400 LEs for the PCI state machine, parity generator, and target decoder, leaving headroom for custom application logic. Because the device is in NRND status with stable long-term supply, it remains a common choice for industrial backplane controllers that must remain bitstream-stable across multi-year production runs.

Recommandé

EPC2 (Configuration memory (2 Mbit) for bitstream storage) EPF6016ATC144-1N · Intel
🔧

Custom Address Decoder / Glue Logic

For microprocessor-to-peripheral address decoding and bus-interface glue logic, the EPF6024ATC144-1N offers a compelling blend of capacity, JTAG support, and 3.3V I/O. The 117 user I/O pins easily handle 24- or 32-bit address buses plus chip-select fan-out, and the 196 LABs keep fanout delays predictable for asynchronous decode. Compared to discrete 74-series TTL, a single FPGA reduces board area, BOM count, and power consumption. The 144-TQFP footprint is also drop-in compatible with the EPF6016 family when a smaller, lower-cost variant is sufficient.

Recommandé

EPF6024ATC144-1 · Intel
🌐

UART / HDLC Protocol Bridge

The EPF6024ATC144-1N's 1,960 logic elements comfortably implement multi-channel UART, HDLC, or custom serial protocol bridges for telecom and industrial-control backplanes. Each protocol block typically consumes 200-400 LEs, leaving room for 4-8 channels plus a host-side register interface. The 117 I/O pins accommodate 8-16 serial data lines, modems control, and host-side parallel bus, while the -1 speed grade supports 10-50 Mbps serial rates. Designers appreciate the SRAM-based configuration because field firmware updates can be deployed via JTAG without re-spinning the board.

Recommandé

EPF6024ATC144-10N · Altera
📺

Video Timing Generator

Legacy VGA, NTSC, and PAL timing generators are well served by the EPF6024ATC144-1N's predictable 3.3V I/O banks and 117 user I/O count. Typical designs consume 600-900 LEs for H-sync, V-sync, blanking, and pixel-clock generation, with 1,000+ LEs left for overlay rendering or chroma keying. The 144-TQFP footprint has 117 available user I/O, which is more than enough for 24-bit digital video plus control signals. The FLEX 6000 deterministic routing structure helps achieve clean sub-nanosecond timing for CRT-era pixel clocks up to 100 MHz.

Recommandé

EPF6016ATC144-1N · Intel
🏭

Industrial Control State Machine

For industrial control state machines in PLCs, motor drives, and process automation, the EPF6024ATC144-1N offers industrial-grade reliability when the -1 temperature variant is selected. The device's 196 LABs support complex multi-stage state machines with parallel datapath logic, and the JTAG boundary-scan simplifies board test in volume production. The 144-TQFP package is widely supported by contract assemblers for both leaded and lead-free reflow profiles. Compared to a microcontroller-based state machine, an FPGA implementation provides deterministic cycle-time and immunity to software stack overhead, which is critical for safety-related control loops.

Recommandé

EPF6024ATC144-1 · Intel
📡

Legacy Telecom Backplane Glue

The EPF6024ATC144-1N was designed precisely for the high-density backplane glue logic used in 1990s-2000s telecom and datacom equipment, and it remains a long-life option for sustaining such systems. The 1,960-LE capacity, 117 I/O, and 3.3V I/O bank natively support LVTTL and LVCMOS signaling at the bus speeds typical of T1/E1, H.110, and CompactPCI backplanes. Its NRND status with continuing Intel/Altera support means telecom OEMs can safely continue to source the part for sustaining engineering of installed base products.

Recommandé

EPF6016ATC144-1N · Intel

Récapitulatif des produits recommandés

EPC2 Configuration memory (2 Mbit) for bitstream storage Utilisé dans : PCI Bus Interface Controller EPF6016ATC144-1N Intel Utilisé dans : PCI Bus Interface Controller, Video Timing Generator, Legacy Telecom Backplane Glue EPF6024ATC144-1 Intel Utilisé dans : Custom Address Decoder / Glue Logic, Industrial Control State Machine EPF6024ATC144-10N Altera Utilisé dans : UART / HDLC Protocol Bridge
What is the EPF6024ATC144-1N?
The EPF6024ATC144-1N is an Altera (now Intel) FLEX 6000 family SRAM-based Field-Programmable Gate Array with 1,960 logic elements, 196 LABs, and 117 user I/O pins, housed in a 144-pin TQFP package. It operates from a 3.3V supply and is specified for the 0°C to +85°C commercial temperature range. According to the FLEX 6000 family datasheet, it is a cost-optimized FPGA targeting legacy glue-logic and bus-interface designs.
How many logic elements does the EPF6024ATC144-1N have?
The EPF6024ATC144-1N integrates 1,960 logic elements organized into 196 Logic Array Blocks (LABs), with each LAB containing 10 Logic Elements. According to distributor listings, this is the largest member of the FLEX 6000 family, equivalent to approximately 24,000 typical ASIC gates. The capacity comfortably supports designs such as 32-bit PCI interfaces, custom bus bridges, and complex state machines.
What package does the EPF6024ATC144-1N use?
The EPF6024ATC144-1N is supplied in a 144-pin TQFP (Thin Quad Flat Pack) measuring 20 mm × 20 mm with a 1.0 mm lead pitch, JEDEC MS-026 compliant. The 144-TQFP footprint exposes 117 user I/O pins plus dedicated JTAG, configuration, clock, and power pins. This footprint is shared with other FLEX 6000 -1 speed-grade variants for direct board-level substitution.
What is the difference between EPF6024ATC144-1N and EPF6024ATC144-1?
The EPF6024ATC144-1N specifies the commercial 0°C to +85°C temperature range, while the EPF6024ATC144-1 extends operation to the industrial -40°C to +85°C range. Both share the same 144-TQFP package, 1,960 logic elements, and -1 speed grade, making them mechanically and functionally drop-in compatible. Choose the -1N for indoor commercial equipment and the -1 for industrial and outdoor deployments.
Where can I buy the EPF6024ATC144-1N today?
The EPF6024ATC144-1N is currently listed as a Not Recommended for New Designs (NRND) part by Intel but is still stocked in distributor channels. As of 2026-09-12, Octopart reports availability from 3 distributors and DigiKey lists it as a ship-today part. Verified distributors include DigiKey, Mouser, Origin-IC, and Sierra IC, with broker inventory also listed on Partstack and Xecor.
What is the price of the EPF6024ATC144-1N at quantity 1?
As of 2026-09-12, the EPF6024ATC144-1N carries a single-unit list price of approximately $38.50 USD on DigiKey, with volume pricing dropping to roughly $20.95 USD at 1,000 pieces. Pricing reflects the part's mature, NRND status, and brokers may offer wider price spreads. Always request a current quote before issuing a PO, as obsolete-distribution parts can move significantly week-to-week.
What is the lead time for the EPF6024ATC144-1N?
As of 2026-09-12, the EPF6024ATC144-1N ships same-day from DigiKey and is in stock at Mouser and Origin-IC, with lead times generally under 1 week. Because the part is in NRND status, lead times can extend quickly when distributor inventory depletes. For long-running production programs, XAIPART recommends qualifying a second source such as the EPF6016ATC144 or other FLEX 6000 family drop-in parts.
What is the best drop-in replacement for the EPF6024ATC144-1N?
The closest drop-in replacement is the EPF6024ATC144-1, which shares the same 144-TQFP package, 1,960 logic elements, and -1 speed grade but extends to the -40°C to +85°C industrial range. For designs that can tolerate lower logic density, the EPF6016ATC144 family offers the same 144-TQFP footprint and -1 speed grade with 1,320 logic elements (a 33% reduction). All three parts accept the same FLEX 6000 configuration bitstream family.
EPF6024ATC144-1N vs EPF6016ATC144-1N - which is better for my design?
The EPF6024ATC144-1N provides 1,960 logic elements versus 1,320 for the EPF6016ATC144-1N, a 48% capacity advantage at the same -1 speed grade and 144-TQFP footprint. Choose the EPF6024ATC144-1N when your design approaches the 1,600-LE utilization ceiling, and choose the EPF6016ATC144-1N when the smaller density is sufficient, since it typically costs 20–30% less in open-market channels as of 2026-09-12.
Is the EPF6024ATC144-1N suitable for a new product design in 2026?
The EPF6024ATC144-1N is officially Not Recommended for New Designs (NRND) by Intel, meaning Intel discourages new adoption but continues to support the part for existing customers. For new product development in 2026, XAIPART recommends selecting a current-generation Cyclone, MAX 10, or Lattice MachXO2/MachXO3 part. The EPF6024ATC144-1N remains an excellent choice for sustaining engineering, legacy board support, and long-life industrial systems already deployed in the field.
What is the difference between EPF6024ATC144-1N and EPF6024AQC240-3?
The EPF6024ATC144-1N is in a 144-TQFP package with 117 I/O pins at the -1 speed grade, while the EPF6024AQC240-3 is in a 240-pin QFP with a -3 speed grade. The two parts share the same 1,960-LE FLEX 6000 die, so design compile is identical, but the PCB footprints differ. The -1N is the pin-compatible choice when a 144-TQFP footprint is required; the -3 in QFP-240 is not drop-in but provides 31 additional I/O pins for board re-spins.
What configuration device does the EPF6024ATC144-1N require?
Because the EPF6024ATC144-1N uses SRAM-based configuration memory, the bitstream is volatile and must be reloaded at every power-up. According to the FLEX 6000 handbook, compatible configuration devices include the EPC1 (1 Mbit), EPC2 (2 Mbit), and EPC16 (16 Mbit) serial configuration memories. JTAG in-system programming via a ByteBlasterMV or USB-Blaster download cable is also supported for prototyping and field updates.
How do I download the EPF6024ATC144-1N datasheet PDF?
The official EPF6024ATC144-1N datasheet is published by Intel (formerly Altera) as part of the FLEX 6000 Device Family datasheet (DSF6000). It can be downloaded from the Altera literature archive at https://www.altera.com/literature/ds/dsf6000.pdf. The document covers DC characteristics, AC timing, pinout, package outlines, and configuration schematics for the entire FLEX 6000 family including the EPF6024ATC144-1N.
Where can I find the EPF6024ATC144-1N pinout?
The complete EPF6024ATC144-1N 144-TQFP pinout is documented in the FLEX 6000 Device Family datasheet section 'Pin-Out Information for 144-Pin TQFP Package.' Each pin is labeled with its primary function (I/O, GND, VCC, JTAG TMS/TDI/TDO/TCK, configuration nSTATUS/CONF_DONE/nCONFIG, dedicated clock input) and its bank assignment. The pinout is also embedded in the Altera Quartus Prime and MAX+PLUS II pin-planner tools for design capture.
What is the operating temperature of EPF6024ATC144-1N?
The EPF6024ATC144-1N operates over the commercial 0°C to +85°C junction temperature range, as indicated by the 'N' suffix in the ordering code. The part is specified for 3.0V to 3.6V supply, and absolute maximum junction temperature is 135°C. For applications requiring industrial -40°C to +85°C operation, the EPF6024ATC144-1 variant is the direct drop-in alternative in the same 144-TQFP package.

Données de référence d'ingénierie pour EPF6024ATC144-1N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6024ATC144-1N when you need the largest FLEX 6000 logic capacity (1,960 LEs) in a 144-TQFP at the fastest -1 speed grade, and your end equipment operates in the commercial 0°C to +85°C range. For designs that exceed 1,600 LEs, this is the right part; for smaller designs, the EPF6016ATC144-1N offers the same footprint and speed grade at lower cost. For industrial temperature operation (-40°C to +85°C), the EPF6024ATC144-1 is the drop-in replacement in the same package. For long-life telecom and industrial sustaining engineering, the EPF6024ATC144-1N remains an excellent choice thanks to Intel's continuing support of the FLEX 6000 family; for new product designs in 2026, consider current-generation Cyclone, MAX 10, or Lattice MachXO2/MachXO3 devices instead.

Comparaison avec les alternatives

Paramètre Ce produit EPF6024ATC144-1 EPF6024ATC144 EPF6024ATC144-10 EPF6016ATC144-1N
Brand Intel (formerly Altera) Intel Intel Intel Intel
Package 144-LQFP / 144-TQFP 144-LQFP / 144-TQFP (same) 144-LQFP / 144-TQFP (same) 144-LQFP / 144-TQFP (same) 144-LQFP / 144-TQFP (same)
Logic Elements 1,960 1,960 1,960 1,960 1,320 (-33%)
Speed Grade -1 (fastest) -1 (fastest) unspecified -10 (slower) -1 (fastest)
Temperature Range 0°C to +85°C (commercial) -40°C to +85°C (industrial) 0°C to +85°C (commercial) 0°C to +70°C (commercial) 0°C to +85°C (commercial)
Number of LABs 196 196 196 196 132 (-33%)
User I/O Count 117 117 117 117 117
Supply Voltage 3.0V to 3.6V 3.0V to 3.6V 3.0V to 3.6V 3.0V to 3.6V 3.0V to 3.6V
Configuration Memory SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile) SRAM (volatile)
Lifecycle Status NRND NRND NRND Obsolete NRND

Principaux différenciateurs

  • Largest FLEX 6000 family density in 144-TQFP (vs EPF6016ATC144-1N)
  • Fastest speed grade available for 144-TQFP (vs EPF6024ATC144-10N)
  • JTAG boundary scan and in-system programmability (vs Discrete 74-series TTL glue logic)

Notes de conception

The EPF6024ATC144-1N requires a single 3.3V supply for both VCCINT (core) and VCCIO (I/O banks). Per the FLEX 6000 datasheet DC characteristics, the typical Icc is in the 50-150 mA range depending on toggle rate and design utilization. Place one 0.1 µF X7R ceramic decoupling capacitor adjacent to every VCCINT/VCCIO pin pair (28 pairs total on the 144-TQFP), plus a single 10 µF bulk tantalum or ceramic capacitor on the main 3.3V rail. Estimated: at 100% utilization and 50 MHz toggle rate, Icc ≈ 120 mA; at 10% utilization, Icc ≈ 50 mA. Designers targeting low standby current should gate the 3.3V rail downstream of a power switch because the part does not include an internal power-down mode.

Because the FLEX 6000 uses SRAM-based configuration, the bitstream is volatile and must be reloaded at every power-up. A common design pitfall is omitting the configuration memory device (EPC1, EPC2, or EPC16) or wiring nCONFIG, nSTATUS, and CONF_DONE incorrectly. Per the FLEX 6000 handbook, nCONFIG must be held low for at least 8 µs after VCC stabilizes to initiate configuration, and CONF_DONE must be monitored to detect successful completion. Engineers new to the FLEX 6000 should use the Altera reference design schematic for the EPC2 + 144-TQFP configuration chain as a starting point.

The 144-TQFP uses a 0.5 mm lead pitch and 1.0 mm body footprint with JEDEC MS-026 land-pattern recommendations. PCB layout should provide 0.6 mm wide SMT pads with 0.2 mm solder-mask dam, a ground plane on layer 2 directly under the device, and 4-via stitching patterns on each GND pin. Signal traces should be length-matched within 50 mils for bus interfaces and avoid running parallel to the JTAG signals (TCK/TMS/TDI/TDO) for more than 500 mils to prevent crosstalk during boundary-scan testing. Per the FLEX 6000 datasheet, unused user I/O should be left floating; configuring them as inputs with internal pull-ups adds leakage of approximately 10 µA per pin.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS, REACH, and lead-free status not confirmed in the verified web data for this specific MPN suffix. The Altera FLEX 6000 family was launched before mandatory RoHS compliance for FPGA products; some -1N variants may be non-RoHS. Engineers should request the latest material declaration from Intel before placing the part in a RoHS-restricted assembly.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6024ATC144-1N EPF6024ATC144-1N datasheet Altera EPF6024ATC144-1N FLEX 6000 FPGA 144-TQFP 1960 logic elements FPGA 3.3V EPF6024ATC144-1N PCI controller FPGA EPF6024ATC144-1N vs EPF6016ATC144-1N EPF6024ATC144-1N drop-in replacement buy EPF6024ATC144-1N in stock EPF6024ATC144-1N price quote FLEX 6000 144-pin TQFP pinout Altera FLEX 6000 glue logic FPGA what is the operating temperature of EPF6024ATC144-1N

Composants & termes associés

Intel Altera EPF6024ATC144-1N EPF6024ATC144-1 EPF6024ATC144 EPF6024ATC144-10 EPF6016ATC144-1N FLEX 6000 FPGA Field-Programmable Gate Array Logic Array Block (LAB) Logic Element (LE) TQFP-144 LQFP-144 JEDEC MS-026 3.3V CMOS SRAM configuration JTAG (IEEE 1149.1) EPC2 configuration memory ByteBlaster Quartus Prime MAX+PLUS II PCI bus interface glue logic RoHS
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