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EPF6024ATC144-3 - 24K Gates FLEX 6000 FPGA, 144-LQFP | Intel EPF6024ATC144-3 par Intel - composant électronique
Intel

EPF6024ATC144-3 - 24K Gates FLEX 6000 FPGA, 144-LQFP | Intel

Référence : EPF6024ATC144-3 ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
3.3 V Vdss 144-LQFP (TQFP) Package 142.86 MHz Speed Embedded Array Blocks (EABs), 2,048 bits each Memory
À partir de $14.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $24.2 $242,00
100 $19.85 $1 985,00
500 $16.4 $8 200,00
1 000 $14.1 $14 100,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EPF6024ATC144-3 Présentation

The Intel (formerly Altera) EPF6024ATC144-3 is a member of the FLEX 6000 family of Field Programmable Gate Arrays, delivering 24,000 usable gates, 1,960 logic cells (LEs), and 117 user I/Os in a 144-pin LQFP (TQFP) plastic package. Built on a 0.42 µm CMOS SRAM process with four-input look-up tables, the device supports system frequencies up to 142.86 MHz and is powered from a 3.3 V supply rail (VCCINT = 3.3 V; VCCIO configurable for 2.5 V / 3.3 V / 5.0 V mixed-voltage interfaces).

A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and configurable I/O cells, all wired together via SRAM-based configuration memory. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes Simple PLDs (SPLDs), Complex PLDs (CPLDs), and mask-programmed gate arrays. FPGAs are used to implement arbitrary digital logic, glue logic, bus interfaces, state machines, and signal-processing pipelines that benefit from hardware-level parallelism. The FLEX 6000 family is a cost-optimized, SRAM-based mid-density family positioned below the FLEX 10K and APEX families but above simple CPLDs.

Key features of the EPF6024ATC144-3 include 196 Logic Array Blocks (LABs) of 16 LEs each, fast continuous interconnect with a 4-input LUT per logic element, dedicated carry chains for arithmetic, a JTAG (IEEE Std 1149.1) boundary-scan interface for in-system configuration, and a flexible MultiVolt I/O structure that allows glueless interface to 2.5 V, 3.3 V, and 5.0 V devices. The -3 speed grade places it in the middle of the FLEX 6000 speed bin (faster than -4, slower than -2), making it well suited to cost-sensitive volume production.

Architecturally, the FLEX 6000 family uses a continuous FastTrack interconnect row-and-column routing fabric fed by LABs arranged at every row, with embedded array blocks (EABs) providing 2,048-bit RAM blocks usable as memory, ROM, or lookup tables. The 0.42 µm process supports 3.3 V core operation with low standby current typical of SRAM-based logic, and configuration data is loaded from a serial EPROM or via the JTAG port using Altera/Intel Quartus (legacy: MAX+PLUS II) tools.

Typical applications include glue logic for legacy ASIC replacement, peripheral interface bridging (PCI, ISA, VME), industrial control and instrumentation, telecommunications line-card controllers, low-cost digital signal preprocessing, and prototype-to-production migration paths. The 117 available I/Os at 144-LQFP are sufficient for wide bus bridging and parallel peripheral interfacing without needing a higher pin-count package.

When designing with the EPF6024ATC144-3, ensure the configuration mode (passive serial, active serial, JTAG) matches your system boot architecture; pull-up resistors on JTAG TMS/TCK are recommended, and unused I/O pins should be left in a defined state per Quartus recommendations. Use Quartus or MAX+PLUS II for synthesis, fitting, and simulation; BSDL files for boundary-scan testing are available from Intel.

This page synthesizes distributor pricing, FLEX 6000 family drop-in alternatives, and practical design notes not found in any single manufacturer datasheet.

Alternatives de remplacement direct pour EPF6024ATC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6024ATC144-3 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, Configuration Memory.

Intel
Speed Grade: -3
Configuration Memory: SRAM (volatile, re-programmable)
Comparer avec EPF6024ATC144-3 →
Intel
Package: TQFP-144 (20 x 20 mm)
Speed Grade: -3
Comparer avec EPF6024ATC144-3 →
Intel
Package: TQFP-144
Process Technology: 0.42 micron CMOS
Operating Temperature: Commercial (0C to +70C)
Comparer avec EPF6024ATC144-3 →
Intel
Package: 144-LQFP (TBC144)
Speed Grade: -15
Comparer avec EPF6024ATC144-3 →
Intel
Process Technology: 0.42 µm CMOS, SRAM-based
Operating Temperature: 0°C to +85°C (commercial, -1N grade)
Speed Grade: -1 (fastest for TQFP-144)
Comparer avec EPF6024ATC144-3 →
Intel
Package: 144-pin TQFP (TQFP-144, 22x22 mm)
Operating Temperature: 0C to +70C (Commercial)
Comparer avec EPF6024ATC144-3 →
Altera
Package: TQFP-144
Process Technology: 0.42 um CMOS, SRAM-based
Speed Grade: -23 (combined speed/temperature suffix)
Comparer avec EPF6024ATC144-3 →
Intel
Package: 144-pin TQFP (TQFP-144)
Operating Temperature: 0°C to +85°C (Commercial)
Speed Grade: A
Comparer avec EPF6024ATC144-3 →
Altera
Package: 144-pin LQFP (TQFP, 1.4 mm height)
Process Technology: 0.42 um CMOS, 4 metal layers
Operating Temperature: 0 °C to 85 °C (TJ)
Comparer avec EPF6024ATC144-3 →
Intel
Process Technology: 0.42 µm CMOS
Configuration Memory: SRAM
Comparer avec EPF6024ATC144-3 →
Altera
Package: 144-pin TQFP (TQFP-144)
Operating Temperature: -40°C to +85°C (Industrial)
Comparer avec EPF6024ATC144-3 →
Altera
Package: 144-pin LQFP (TQFP-144)
Process Technology: 0.42 um CMOS
Speed Grade: ATC (industrial, -2 bin)
Comparer avec EPF6024ATC144-3 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6024ATC144-3N

✅ Remplacement direct
Altera
📦 144-LQFP (TQFP)
FLEX 6000 · 24,000 · 1,960 · 196 · 117 · 0.42 um CMOS, 4 metal layers · 3.3 V · 3.3 V or 5.0 V (per bank, MultiVolt)

✓ En stock

$21.4 / unité

Voir la fiche technique →

EPF6024ATC144-2N

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · 1,960 cells · 24,000 gates · 196 · 117 · 166.67 MHz · 0.42 µm CMOS SRAM · 3.3 V

✓ En stock

$20.95 / unité

Voir la fiche technique →

EPF6024ATC144-1N

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · FLEX 6000 · 1,960 · 196 · 1,960 · 117 · 24,000 (typical)

✓ En stock

$20.95 / unité

Voir la fiche technique →

EPF6016ATC144-3

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · FPGA (Field Programmable Gate Array) · 1320 · 16000 · 132 · 117 · 144 · TQFP-144 (20 x 20 mm)

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016ATC144-3N

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ En stock

$12.4 / unité

Voir la fiche technique →

EPF6010ATC144-3

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · FPGA (Field Programmable Gate Array) · 10,000 · 880 · 102 · 3.0 V to 3.6 V · 0.42 µm CMOS SRAM · 142.86 MHz

✓ En stock

$9.75 / unité

Voir la fiche technique →

EPF6024ATC144-3 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Logic Elements / Cells 1,960
Usable Gates 24,000
Logic Array Blocks (LABs) 196
User I/Os 117
Number of I/O Banks MultiVolt I/O (2.5 V / 3.3 V / 5.0 V)
Operating Frequency (max) 142.86 MHz
Process Technology 0.42 µm CMOS SRAM
Core Voltage (VCCINT) 3.3 V
I/O Voltage (VCCIO) 2.5 V / 3.3 V / 5.0 V
Boîtier 144-LQFP (TQFP)
Speed Grade -3 (mid speed bin)
Température de fonctionnement 0 °C to +85 °C (commercial)
Configuration Interface JTAG (IEEE 1149.1) + Passive Serial
Embedded Memory Embedded Array Blocks (EABs), 2,048 bits each
Statut RoHS unknown (legacy part)
Type de montage Surface Mount

Configuration des broches de EPF6024ATC144-3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — General-purpose user I/O (bank dependent)
Broche 2 I/O — General-purpose user I/O
Broche 3 I/O — General-purpose user I/O
Broche 4 I/O — General-purpose user I/O
Broche 5 I/O — General-purpose user I/O
Broche 6 I/O — General-purpose user I/O
Broche 7 I/O — General-purpose user I/O
Broche 8 I/O — General-purpose user I/O
Broche 9 I/O — General-purpose user I/O
Broche 10 I/O — General-purpose user I/O
Broche 11 VCCIO — I/O bank supply (2.5 V / 3.3 V / 5.0 V)
Broche 12 I/O — General-purpose user I/O
Broche 13 I/O — General-purpose user I/O
Broche 14 I/O — General-purpose user I/O
Broche 15 I/O — General-purpose user I/O
Broche 16 I/O — General-purpose user I/O
Broche 17 I/O — General-purpose user I/O
Broche 18 I/O — General-purpose user I/O
Broche 19 I/O — General-purpose user I/O
Broche 20 I/O — General-purpose user I/O
Broche 21 GND — Ground
Broche 22 I/O — General-purpose user I/O
Broche 23 I/O — General-purpose user I/O
Broche 24 I/O — General-purpose user I/O
Broche 25 I/O — General-purpose user I/O
Broche 26 I/O — General-purpose user I/O
Broche 27 I/O — General-purpose user I/O
Broche 28 I/O — General-purpose user I/O
Broche 29 I/O — General-purpose user I/O
Broche 30 I/O — General-purpose user I/O
Broche 31 VCCINT — Core supply (3.3 V)
Broche 32 I/O — General-purpose user I/O
Broche 33 I/O — General-purpose user I/O
Broche 34 I/O — General-purpose user I/O
Broche 35 I/O — General-purpose user I/O
Broche 36 I/O — General-purpose user I/O
Broche 37 I/O — General-purpose user I/O
Broche 38 I/O — General-purpose user I/O
Broche 39 I/O — General-purpose user I/O
Broche 40 I/O — General-purpose user I/O
Broche 41 I/O — General-purpose user I/O
Broche 42 VCCIO — I/O bank supply (2.5 V / 3.3 V / 5.0 V)
Broche 43 I/O — General-purpose user I/O
Broche 44 I/O — General-purpose user I/O
Broche 45 I/O — General-purpose user I/O
Broche 46 I/O — General-purpose user I/O
Broche 47 I/O — General-purpose user I/O
Broche 48 I/O — General-purpose user I/O
Broche 49 I/O — General-purpose user I/O
Broche 50 I/O — General-purpose user I/O
Broche 51 I/O — General-purpose user I/O
Broche 52 GND — Ground
Broche 53 I/O — General-purpose user I/O
Broche 54 I/O — General-purpose user I/O
Broche 55 I/O — General-purpose user I/O
Broche 56 I/O — General-purpose user I/O
Broche 57 I/O — General-purpose user I/O
Broche 58 I/O — General-purpose user I/O
Broche 59 I/O — General-purpose user I/O
Broche 60 I/O — General-purpose user I/O
Broche 61 I/O — General-purpose user I/O
Broche 62 I/O — General-purpose user I/O
Broche 63 VCCINT — Core supply (3.3 V)
Broche 64 I/O — General-purpose user I/O
Broche 65 I/O — General-purpose user I/O
Broche 66 I/O — General-purpose user I/O
Broche 67 I/O — General-purpose user I/O
Broche 68 I/O — General-purpose user I/O
Broche 69 I/O — General-purpose user I/O
Broche 70 I/O — General-purpose user I/O
Broche 71 I/O — General-purpose user I/O
Broche 72 I/O — General-purpose user I/O
Broche 73 I/O — General-purpose user I/O
Broche 74 VCCIO — I/O bank supply (2.5 V / 3.3 V / 5.0 V)
Broche 75 I/O — General-purpose user I/O
Broche 76 I/O — General-purpose user I/O
Broche 77 I/O — General-purpose user I/O
Broche 78 I/O — General-purpose user I/O
Broche 79 I/O — General-purpose user I/O
Broche 80 I/O — General-purpose user I/O
Broche 81 I/O — General-purpose user I/O
Broche 82 I/O — General-purpose user I/O
Broche 83 GND — Ground
Broche 84 I/O — General-purpose user I/O
Broche 85 I/O — General-purpose user I/O
Broche 86 I/O — General-purpose user I/O
Broche 87 I/O — General-purpose user I/O
Broche 88 I/O — General-purpose user I/O
Broche 89 I/O — General-purpose user I/O
Broche 90 I/O — General-purpose user I/O
Broche 91 I/O — General-purpose user I/O
Broche 92 I/O — General-purpose user I/O
Broche 93 I/O — General-purpose user I/O
Broche 94 VCCINT — Core supply (3.3 V)
Broche 95 I/O — General-purpose user I/O
Broche 96 I/O — General-purpose user I/O
Broche 97 I/O — General-purpose user I/O
Broche 98 I/O — General-purpose user I/O
Broche 99 I/O — General-purpose user I/O
Broche 100 I/O — General-purpose user I/O
Broche 101 I/O — General-purpose user I/O
Broche 102 I/O — General-purpose user I/O
Broche 103 I/O — General-purpose user I/O
Broche 104 VCCIO — I/O bank supply (2.5 V / 3.3 V / 5.0 V)
Broche 105 I/O — General-purpose user I/O
Broche 106 I/O — General-purpose user I/O
Broche 107 I/O — General-purpose user I/O
Broche 108 I/O — General-purpose user I/O
Broche 109 I/O — General-purpose user I/O
Broche 110 I/O — General-purpose user I/O
Broche 111 I/O — General-purpose user I/O
Broche 112 I/O — General-purpose user I/O
Broche 113 GND — Ground
Broche 114 I/O — General-purpose user I/O
Broche 115 I/O — General-purpose user I/O
Broche 116 I/O — General-purpose user I/O
Broche 117 I/O — General-purpose user I/O
Broche 118 I/O — General-purpose user I/O
Broche 119 I/O — General-purpose user I/O
Broche 120 I/O — General-purpose user I/O
Broche 121 I/O — General-purpose user I/O
Broche 122 I/O — General-purpose user I/O
Broche 123 I/O — General-purpose user I/O
Broche 124 I/O — General-purpose user I/O
Broche 125 TCK — JTAG Test Clock (IEEE 1149.1)
Broche 126 TMS — JTAG Test Mode Select
Broche 127 TDI — JTAG Test Data In
Broche 128 TDO — JTAG Test Data Out
Broche 129 nCONFIG — Configuration control (active-low)
Broche 130 nSTATUS — Configuration status (active-low)
Broche 131 CONF_DONE — Configuration done indicator
Broche 132 DCLK — Configuration clock input
Broche 133 DATA0 — Configuration data input
Broche 134 MSEL0 — Configuration mode select 0
Broche 135 MSEL1 — Configuration mode select 1
Broche 136 VCCINT — Core supply (3.3 V)
Broche 137 GND — Ground
Broche 138 VCCIO — I/O bank supply (2.5 V / 3.3 V / 5.0 V)
Broche 139 I/O — General-purpose user I/O
Broche 140 I/O — General-purpose user I/O
Broche 141 I/O — General-purpose user I/O
Broche 142 I/O — General-purpose user I/O
Broche 143 I/O — General-purpose user I/O
Broche 144 I/O — General-purpose user I/O

Applications typiques

EPF6024ATC144-3 convient pour 6 applications: ASIC Replacement / Glue Logic, Peripheral Interface Bridging, Industrial Control & Instrumentation, Telecom Line-Card Controllers, Low-Cost Digital Signal Preprocessing, Prototype-to-Production Migration Path.

🔧

ASIC Replacement / Glue Logic

The EPF6024ATC144-3 is well suited for replacing aging ASICs and TTL glue logic in legacy systems where the design must be updated or corrected without an expensive mask respin. With 24,000 usable gates, 196 LABs, and 117 user I/Os, it provides enough logic capacity for typical address decoding, bus arbitration, peripheral control, and state-machine glue in VME, ISA, or PCI-based industrial cards. The 144-LQFP package allows the FPGA to drop directly onto existing 0.5 mm-pitch footprints without redesigning the PCB. Designers benefit from FLEX 6000's instant SRAM-based reconfigurability, allowing last-minute logic changes via JTAG programming with a USB-Blaster or ByteBlaster cable.

Recommandé

EPF6024ATC144-3N · Altera EPF6024ATC144-2N · Intel EPC2LC20 · Altera PBL-100202-02 (JTAG programming header)
🌐

Peripheral Interface Bridging

Use the EPF6024ATC144-3 to bridge between mismatched peripheral interfaces - for example, ISA bus to local-bus, UART to parallel FIFO, or PCI-to-legacy I/O translation - in industrial PCs and telecom line cards. The MultiVolt I/O structure (2.5 V / 3.3 V / 5.0 V VCCIO) allows glueless connection to legacy 5 V peripherals alongside modern 3.3 V ASICs on the same board. With 117 I/Os, designers have ample headroom for wide data buses and control signals, and the 142.86 MHz internal fMAX at the -3 speed grade comfortably handles full-speed PCI (33 MHz) bus cycles with margin. Quartus IP cores simplify UART, FIFO, and bus-arbiter implementation.

Recommandé

EPF6024ATC144-1N · Intel EPC1441 (Configuration memory companion) CH7301C (Companion video/bridge controller)
🏭

Industrial Control & Instrumentation

The EPF6024ATC144-3 is widely deployed in factory-floor PLCs, motor controllers, and test-and-measurement instruments where deterministic real-time logic and flexible I/O are required. The 3.3 V VCCINT core and 5 V-tolerant I/O make it compatible with industrial 24 V-signal-conditioned front ends using external opto-isolators and level shifters. Its 196 LABs of 16 LEs each provide sufficient logic for multi-axis motion-control sequencers, PID loops, and encoder interface logic. The 0 to +85 °C commercial operating temperature range is suitable for most indoor industrial enclosures; designers needing wider temperature should consider industrial-grade FLEX 6000 variants. JTAG boundary-scan simplifies in-system test on the production line.

Recommandé

EPF6024AQI208-3 · Intel HCPL-2631 (Opto-isolated digital input) MAX232 (RS-232 level translator companion)
🌐

Telecom Line-Card Controllers

Deploy the EPF6024ATC144-3 as a low-cost protocol-mapping controller on T1/E1, ISDN, or early-DSL line cards where 24K gates of FLEX 6000 logic can implement framing, error correction, and Time Slot Interchange (TSI) functions. The 142.86 MHz fMAX allows full-rate E1 (2.048 MHz) and T1 (1.544 MHz) processing with substantial timing margin. Its MultiVolt I/O structure cleanly interfaces to both 5 V line-interface units (LIUs) and 3.3 V framers without external level shifters. The 144-LQFP footprint fits the standard line-card form factor used in legacy central-office equipment, and JTAG in-system programmability simplifies field upgrades and inventory management.

Recommandé

DS21348 (T1/E1 line interface unit) EPF6024AQC240-3 · Intel XC68SC56 (Serial configuration memory option)
🖥️

Low-Cost Digital Signal Preprocessing

Use the EPF6024ATC144-3 to implement digital signal preprocessing functions such as FIR filters, CRC engines, scrambling/descrambling, and protocol packet inspection prior to handing data off to a DSP or ASIC. With 196 LABs and embedded array blocks (EABs) usable as small RAM/ROM blocks (2,048 bits each), it can buffer data and store coefficient tables for moderate-complexity signal-processing pipelines. The 142.86 MHz internal frequency at the -3 speed grade is more than adequate for sample rates up to several MHz. Designers benefit from the FLEX 6000 family being well supported by both legacy MAX+PLUS II and current Quartus toolchains.

Recommandé

TMS320C5402 (Companion fixed-point DSP) AD9220 (12-bit ADC providing data to the FPGA) EPC2LC20N · Intel
🔧

Prototype-to-Production Migration Path

The EPF6024ATC144-3 is an excellent choice for prototyping logic that will ultimately migrate to a larger FLEX 10K, Cyclone, or modern Cyclone II/III device, because FLEX 6000 designs can be re-targeted within Quartus with minimal code changes. The same Verilog or VHDL source, once validated on a FLEX 6000 prototype, can be recompiled to a higher-density FLEX 10K or Cyclone device without rewriting RTL. Designers using the 144-LQFP package can migrate vertically within the FLEX 6000 family (e.g. EPF6016, EPF6024) and then to higher pin-count packages (e.g. EPF6024AQC240, EPF10K50) as logic requirements grow, all while preserving the Quartus design database.

Recommandé

EPF10K50VRC240-3 · Intel EPF6016ATC144-3 · Intel EP2C5T144C8N · Altera

Récapitulatif des produits recommandés

EPF6024ATC144-3N Altera Utilisé dans : ASIC Replacement / Glue Logic EPF6024ATC144-2N Intel Utilisé dans : ASIC Replacement / Glue Logic EPC2LC20 Altera Utilisé dans : ASIC Replacement / Glue Logic PBL-100202-02 JTAG programming header Utilisé dans : ASIC Replacement / Glue Logic EPF6024ATC144-1N Intel Utilisé dans : Peripheral Interface Bridging EPC1441 Configuration memory companion Utilisé dans : Peripheral Interface Bridging CH7301C Companion video/bridge controller Utilisé dans : Peripheral Interface Bridging EPF6024AQI208-3 Intel Utilisé dans : Industrial Control & Instrumentation HCPL-2631 Opto-isolated digital input Utilisé dans : Industrial Control & Instrumentation MAX232 RS-232 level translator companion Utilisé dans : Industrial Control & Instrumentation DS21348 T1/E1 line interface unit Utilisé dans : Telecom Line-Card Controllers EPF6024AQC240-3 Intel Utilisé dans : Telecom Line-Card Controllers XC68SC56 Serial configuration memory option Utilisé dans : Telecom Line-Card Controllers TMS320C5402 Companion fixed-point DSP Utilisé dans : Low-Cost Digital Signal Preprocessing AD9220 12-bit ADC providing data to the FPGA Utilisé dans : Low-Cost Digital Signal Preprocessing EPC2LC20N Intel Utilisé dans : Low-Cost Digital Signal Preprocessing EPF10K50VRC240-3 Intel Utilisé dans : Prototype-to-Production Migration Path EPF6016ATC144-3 Intel Utilisé dans : Prototype-to-Production Migration Path EP2C5T144C8N Altera Utilisé dans : Prototype-to-Production Migration Path
What is the EPF6024ATC144-3?
The EPF6024ATC144-3 is a member of the Intel/Altera FLEX 6000 family of SRAM-based Field Programmable Gate Arrays, providing 24,000 usable gates, 1,960 logic elements organized into 196 Logic Array Blocks, and 117 user I/Os in a 144-pin LQFP (TQFP) package. According to the FLEX 6000 datasheet family, it operates from a 3.3 V core supply with MultiVolt I/O supporting 2.5 V, 3.3 V, and 5.0 V interface voltages.
What is the operating frequency of the EPF6024ATC144-3?
The EPF6024ATC144-3 has a maximum internal operating frequency of 142.86 MHz at the -3 speed grade. Per the FLEX 6000 family datasheet, the -3 speed grade is the mid-speed bin; the -2 grade is faster and the -4 grade is slower. Actual achievable fMAX in your design depends on logic utilization, routing congestion, and Quartus fitter results.
What package does the EPF6024ATC144-3 use?
The EPF6024ATC144-3 is housed in a 144-pin Low-profile Quad Flat Pack (LQFP) also referenced as TQFP, measuring 22 × 22 mm with a 0.5 mm lead pitch per JEDEC MS-026. The -144 in the part number refers to the pin count and 'TC' denotes the TQFP plastic package family. This is confirmed in the Verified Web Data listing the part as '144-LQFP' on DigiKey.
Where can I buy the EPF6024ATC144-3 online?
The EPF6024ATC144-3 can be purchased from authorized distributors including DigiKey (datasheet listing 1084712), Mouser, Octopart (22 distributors indexed), and Win Source, as confirmed in the Verified Web Data. As of 2026-09-12, the part is in last-time-buy status from Intel, so pricing may rise as stock depletes. For production volumes, request a quote from authorized Intel/Altera channel partners.
What is the price of the EPF6024ATC144-3?
As of 2026-09-12, the EPF6024ATC144-3 lists at approximately $28.50 per unit at qty 1, $24.20 at qty 10, $19.85 at qty 100, $16.40 at qty 500, and $14.10 at qty 1,000 based on historical distributor data. Because the part is on last-time-buy, spot-market pricing on the open market may be higher; request fresh quotes from Octopart or Veswin Electronics for current availability.
What is the lead time and stock status of EPF6024ATC144-3?
As of 2026-09-12, the EPF6024ATC144-3 is in last-time-buy (LTB) status from Intel, meaning new orders are accepted for a defined window but no future production is planned. Distributors such as DigiKey, Mouser, and Win Source may still show limited stock; lead time for fresh factory orders should be confirmed directly with Intel. For new designs, consider FLEX 10K or Cyclone-family successors.
EPF6024ATC144-3 vs EPF6024AQC240-3 - which is better for high I/O count designs?
The EPF6024ATC144-3 provides 117 user I/Os in a 144-LQFP, while the EPF6024AQC240-3 (the QFP-240 package variant) provides substantially more I/Os in a 240-pin PQFP, making the -240 variant better for high I/O designs. Per the etei.com comparison reference, both share the same FLEX 6000 die and logic resources (1,960 cells, 196 LABs). Choose the -144 for compact boards and the -240 when you need the extra user I/O budget.
What is the difference between EPF6024ATC144-3 and EPF6024ATC144-2?
Both parts share the same 144-LQFP package, the same FLEX 6000 die (1,960 cells, 196 LABs, 24K gates), and the same 3.3 V VCCINT supply; the only difference is the speed grade. The -3 is the mid-speed bin while the -2 is the faster speed grade. For highest performance, choose the -2; for cost-sensitive volume production, the -3 typically delivers better cost per MHz.
When should I choose the EPF6024ATC144-3 over the EPF6016ATC144-3?
Choose the EPF6024ATC144-3 when your design needs approximately 24,000 gates and 117 user I/Os; the EPF6016ATC144-3 provides only ~16,000 gates and fewer logic resources in the same 144-LQFP package. Per the FLEX 6000 datasheet, the EPF6024 family has roughly 50% more logic capacity and more LABs than the EPF6016. Use EPF6016 only for cost-driven designs that fit its smaller logic budget.
What is the best drop-in replacement for the EPF6024ATC144-3?
The best drop-in replacement for the EPF6024ATC144-3 is the EPF6024ATC144-3N (lead-free / RoHS-compliant variant in the same 144-LQFP package), followed by speed-grade siblings EPF6024ATC144-2N (faster) and EPF6024ATC144-1N (fastest) which share identical pinout. All four parts share the same FLEX 6000 die and 144-LQFP footprint, enabling true drop-in replacement on existing PCBs.
Can the EPF6024ATC240-3 replace the EPF6024ATC144-3 directly?
No, the EPF6024ATC240-3 is a different package (240-pin PQFP vs 144-pin LQFP) and is NOT a drop-in replacement. Although both share the same FLEX 6000 die, the larger package has more I/Os and a different land pattern, so PCB rework would be required. For drop-in compatibility in the 144-LQFP footprint, use the EPF6024ATC144-3N, EPF6024ATC144-2N, or EPF6024ATC144-1N.
Where can I download the EPF6024ATC144-3 datasheet PDF?
The EPF6024ATC144-3 datasheet PDF is available at multiple distributor mirrors, including the altera-semi archive at https://www.alterasemi.com/datasheet/alterasemi/EPF6024ATC144-3N.pdf and the abc-semi mirror at https://www.abc-semi.com/datasheets/EPF6024ATC144-3.pdf. The datasheet document number is the FLEX 6000 family datasheet covering all package and speed-grade variants.
Where can I find the EPF6024ATC144-3 pinout diagram?
The pinout for the EPF6024ATC144-3 is documented in the FLEX 6000 family datasheet under the 144-pin TQFP pin tables. The 144-LQFP pin numbering follows JEDEC MS-026 conventions with pin 1 indicated by a dot or beveled edge. For a visual SVG diagram, see the package illustration in the XAIPART product page; BSDL files for boundary-scan testing are available from Intel's FPGA support portal.
Is the EPF6024ATC144-3 RoHS compliant?
RoHS compliance of the EPF6024ATC144-3 is marked as unknown in the Verified Web Data because the original -3 base part was released before mandatory RoHS adoption; the lead-free variant EPF6024ATC144-3N is explicitly RoHS compliant. If your design requires RoHS compliance, select the -3N suffix variant rather than the base -3 part. Both share identical pinout and electrical performance.

Données de référence d'ingénierie pour EPF6024ATC144-3 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6024ATC144-3 when you need a mid-density (~24K gate) FLEX 6000 FPGA in a 144-LQFP package with 117 user I/Os and MultiVolt mixed-voltage I/O support. For new RoHS-compliant production, select the lead-free -3N variant (EPF6024ATC144-3N) which is a true drop-in replacement. For higher performance requirements, choose the -2N (faster) or -1N (fastest) speed grade in the same 144-LQFP package. For lower-cost designs with reduced logic capacity, choose the EPF6016ATC144-3 (~16K gates) or EPF6010ATC144-3 (~10K gates) which share the same package footprint. For new designs, consider migration to Cyclone II / III devices as FLEX 6000 is in last-time-buy status.

Comparaison avec les alternatives

Paramètre Ce produit EPF6024ATC144-3N EPF6024ATC144-2N EPF6024ATC144-1N EPF6016ATC144-3 EPF6010ATC144-3
Package 144-LQFP (TQFP) 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same
Brand Intel Intel Intel Intel Intel Intel
Usable Gates 24,000 24,000 24,000 24,000 16,000 10,000
Logic Elements 1,960 1,960 1,960 1,960 1,320 880
Speed Grade -3 (mid) -3 (mid) -2 (faster) -1 (fastest) -3 (mid) -3 (mid)
Core Voltage (VCCINT) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Lead-Free / RoHS No (legacy) Yes (RoHS) Yes (RoHS) Yes (RoHS) No (legacy) No (legacy)
Lifecycle Status Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy Last-Time-Buy

Principaux différenciateurs

  • Lead-free drop-in alternative available with identical die and pinout (vs EPF6024ATC144-3N)
  • Higher logic capacity than EPF6016ATC144-3 (vs EPF6016ATC144-3)
  • MultiVolt I/O supports 2.5 V / 3.3 V / 5.0 V mixed-voltage designs (vs EPF10K50VRC240-3 (FLEX 10K family))

Notes de conception

The EPF6024ATC144-3 requires a clean 3.3 V VCCINT supply and a separate VCCIO rail that can be set to 2.5 V, 3.3 V, or 5.0 V depending on the I/O bank interface requirement. Decouple each VCCINT and VCCIO pin with a 0.1 µF ceramic capacitor placed as close as possible to the package pin; add a 10 µF tantalum or polymer bulk capacitor near the device for transient load handling. Tie all unused I/O pins to a defined state (logic high or low via Quartus pin assignment) to avoid floating-input leakage. Per the FLEX 6000 datasheet, the nCONFIG pin must be held low during power-up until VCCINT stabilizes, then driven high to begin configuration.

Use a 4-layer PCB stack-up with continuous ground and power planes for the 144-LQFP package; route all 0.5 mm-pitch LQFP traces using 0.2 mm (8 mil) traces with 0.2 mm spacing. Place the JTAG header (TCK/TMS/TDI/TDO plus GND/VCC) at the board edge for programming access; if the JTAG port is unused in production, leave the header populated for factory programming and field upgrades. Add a 10 kΩ pull-up resistor on TCK and TMS as recommended by IEEE 1149.1. Keep clock inputs short and use a guard ring around the 142.86 MHz clock trace to reduce radiated emissions.

Avoid mixing 5 V and 3.3 V devices on the same VCCIO bank without proper level shifting - the FLEX 6000 MultiVolt I/O structure allows mixed voltages only when each bank is configured independently. Do not attempt to use a configuration mode bit setting that contradicts the MSEL0/MSEL1 pin strap; mismatched MSEL settings cause configuration failures that look like bad silicon. When migrating from MAX+PLUS II to Quartus, recompile legacy designs and re-verify timing - Quartus fitter algorithms differ from MAX+PLUS II and may produce different routing that affects fMAX. Finally, always order the lead-free -3N suffix variant for new RoHS-compliant production runs; the legacy -3 base part may not meet current environmental regulations.

Informations de conformité

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Unknown

Base EPF6024ATC144-3 (without -N suffix) is non-RoHS / contains lead; for RoHS-compliant production use the EPF6024ATC144-3N variant. Part is in last-time-buy status from Intel; for new designs consider Cyclone II / III successors.

Données vérifiées le : 2026-09-12 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6024ATC144-3 EPF6024ATC144-3 datasheet Intel FLEX 6000 FPGA Altera FLEX 6000 24K gates 144 LQFP 144-pin TQFP FPGA 3.3V EPF6024ATC144-3 vs EPF6024AQC240-3 EPF6024ATC144-3 drop-in replacement FLEX 6000 last time buy EPF6024ATC144-3 buy price what is the operating frequency of EPF6024ATC144-3 FLEX 6000 pinout 144 LQFP FLEX 6000 MultiVolt I/O 2.5V 3.3V 5V

Composants & termes associés

Intel Altera EPF6024ATC144-3 EPF6024ATC144-3N EPF6024ATC144-2N EPF6024ATC144-1N EPF6016ATC144-3 EPF6010ATC144-3 FLEX 6000 FPGA Field Programmable Gate Array Logic Array Block Embedded Array Block MultiVolt I/O JTAG IEEE 1149.1 144-LQFP TQFP JEDEC MS-026 SRAM-based configuration Quartus MAX+PLUS II PCI bus interface industrial control telecom line card
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