Intel

EPF6016ATC144-1N - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Intel

Référence : EPF6016ATC144-1N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.0 V to 3.6 V Vdss 3.3V / 5.0V MultiVolt Rds(on) 144-pin TQFP (20x20 mm, 0.5 mm pitch) Package 172 MHz Speed SRAM (5 nm, in-system programmable) Memory
À partir de $18.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $32.75 $327,50
100 $26.4 $2 640,00
500 $21.95 $10 975,00
1 000 $18.2 $18 200,00
ℹ️ Tous les prix sont en USD

EPF6016ATC144-1N Présentation

The Intel EPF6016ATC144-1N is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs), originally designed by Altera and now supported under the Intel Programmable Solutions Group. It delivers 16,000 typical gates with 1,320 logic elements (cells) in a 144-pin Thin Quad Flat Pack (TQFP) package, providing an ideal low-cost programmable alternative to high-volume gate array applications. According to manufacturer listings, the device supports 117 user I/O pins and is specified for commercial operating temperature (0°C to 85°C) with a 3.0V to 3.6V supply voltage range.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect routing after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: CPLD (Complex Programmable Logic Device) -> FPGA -> structured ASIC. The FLEX 6000 family was Altera's first SRAM-based FPGA family and represented a major step in low-cost, high-volume programmable logic, occupying the space between traditional CPLDs and high-density FLEX 10K FPGAs.

Key features of the EPF6016ATC144-1N include: 1,320 logic elements, an internal frequency rating of up to 172 MHz, 117 user I/O pins, and SRAM-based configuration that supports in-system reprogramming. The 144-TQFP package uses a 20 mm × 20 mm body with 0.5 mm pitch gull-wing leads, making it compatible with standard SMT assembly lines. The device is built on a 0.42 µm CMOS process with 5 nm SRAM configuration cells, providing fast reconfiguration and unlimited reprogram cycles.

The EPF6016ATC144-1N architecture combines Logic Array Blocks (LABs), Embedded Array Blocks (EABs) for memory functions, FastTrack interconnecting routing, and dedicated I/O cells with JTAG support. MultiVolt I/O allows interfacing with 3.3V and 5.0V logic. The device is programmed via the Altera ByteBlaster or BitBlaster download cable through a JTAG interface, and supports both serial and parallel configuration modes.

Typical applications include glue logic replacement, high-volume gate-array prototyping, industrial control logic, communications interface bridging, and consumer electronics where fast design changes are required during prototyping or design testing. The wide commercial temperature range and moderate logic capacity make it suitable for cost-sensitive production runs.

When designing with the EPF6016ATC144-1N, ensure adequate decoupling: place 0.1 µF and 10 µF capacitors close to each VCCINT and VCCIO pin. The 144-TQFP package requires careful PCB thermal management — at high toggle rates, junction temperature can rise significantly above ambient. Always configure unused I/O pins as inputs with bus-hold enabled or as outputs driving ground to minimize switching noise.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original Altera datasheet — giving engineers a single source for parametric comparison and supply-chain decisions on this legacy but still-relevant FPGA.

Alternatives de remplacement direct pour EPF6016ATC144-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016ATC144-1N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.

Intel
Package: 208-PQFP (28x28 mm)
Operating Temperature: 0 °C to 85 °C (Commercial)
Speed Grade: -3
Comparer avec EPF6016ATC144-1N →
Altera
Package: 144-LQFP (TQFP)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF6016ATC144-1N →
Intel
Package: 144-pin TQFP (FineLine)
Operating Temperature: 0°C to 85°C (commercial)
Comparer avec EPF6016ATC144-1N →
Intel
Package: TQFP-144 (20 x 20 mm)
Operating Temperature: 0 °C to +85 °C (commercial)
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF6016ATC144-1N →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Comparer avec EPF6016ATC144-1N →
Intel
Package: 144-pin LQFP / TQFP
Speed Grade: -2
Comparer avec EPF6016ATC144-1N →
Intel
Operating Temperature: 0°C to +85°C (commercial, -1N grade)
Process Technology: 0.42 µm CMOS, SRAM-based
Speed Grade: -1 (fastest for TQFP-144)
Comparer avec EPF6016ATC144-1N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016ATC144-1

✅ Remplacement direct
Altera
📦 144-TQFP
FLEX 6000 · 1,320 cells · 16,000 · 132 · 117 · 3.3 V · 0.42 µm CMOS SRAM · 144-LQFP (TQFP)

✓ En stock

$9.95 / unité

Voir la fiche technique →

EPF6016ATC144-2N

✅ Remplacement direct
Intel
📦 144-TQFP
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ En stock

$19.5 / unité

Voir la fiche technique →

EPF6016ATC144-3N

✅ Remplacement direct
Intel
📦 144-TQFP
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ En stock

$12.4 / unité

Voir la fiche technique →

EPF6016AQC208-3N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 208-PQFP
FLEX 6000 · 1,320 · 16,000 · 132 · 171 · 142.86 MHz · 3.3 V · 0.42 µm CMOS

✓ En stock

$31.2 / unité

Voir la fiche technique →

EPF6016ATC144-1N Valeurs maximales et caractéristiques électriques

Device Type FLEX 6000 FPGA
Family FLEX 6000
Typical Gates 16,000
Logic Elements / Cells 1,320
Number of I/O 117
Tension d'alimentation 3.0 V to 3.6 V
Internal Frequency 172 MHz
Température de fonctionnement 0°C to +85°C (Commercial)
Boîtier 144-pin TQFP (20x20 mm, 0.5 mm pitch)
Type de montage Surface Mount
Configuration Memory SRAM (5 nm, in-system programmable)
Programming Interface JTAG (ByteBlaster / BitBlaster)
Process Technology 0.42 µm CMOS
I/O Standards 3.3V / 5.0V MultiVolt

Configuration des broches de EPF6016ATC144-1N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 VCCINT — Core supply voltage 3.3V
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 I/O — User I/O pin (bank 1)
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 GND — Ground
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 I/O — User I/O pin (bank 1)
Broche 12 I/O — User I/O pin (bank 1)
Broche 13 I/O — User I/O pin (bank 1)
Broche 14 I/O — User I/O pin (bank 1)
Broche 15 I/O — User I/O pin (bank 1)
Broche 16 I/O — User I/O pin (bank 1)
Broche 17 I/O — User I/O pin (bank 1)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 I/O — User I/O pin (bank 1)
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 GND — Ground
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 I/O — User I/O pin (bank 1)
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 I/O — User I/O pin (bank 1)
Broche 28 I/O — User I/O pin (bank 1)
Broche 29 I/O — User I/O pin (bank 1)
Broche 30 VCCIO1 — I/O bank 1 supply voltage (3.3V or 5V)
Broche 31 I/O — User I/O pin (bank 1)
Broche 32 I/O — User I/O pin (bank 1)
Broche 33 I/O — User I/O pin (bank 1)
Broche 34 I/O — User I/O pin (bank 1)
Broche 35 I/O — User I/O pin (bank 1)
Broche 36 GND — Ground
Broche 37 I/O — User I/O pin (bank 2)
Broche 38 I/O — User I/O pin (bank 2)
Broche 39 I/O — User I/O pin (bank 2)
Broche 40 I/O — User I/O pin (bank 2)
Broche 41 I/O — User I/O pin (bank 2)
Broche 42 I/O — User I/O pin (bank 2)
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 I/O — User I/O pin (bank 2)
Broche 45 I/O — User I/O pin (bank 2)
Broche 46 I/O — User I/O pin (bank 2)
Broche 47 GND — Ground
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 I/O — User I/O pin (bank 2)
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 I/O — User I/O pin (bank 2)
Broche 53 VCCINT — Core supply voltage 3.3V
Broche 54 I/O — User I/O pin (bank 2)
Broche 55 I/O — User I/O pin (bank 2)
Broche 56 I/O — User I/O pin (bank 2)
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 I/O — User I/O pin (bank 2)
Broche 59 I/O — User I/O pin (bank 2)
Broche 60 I/O — User I/O pin (bank 2)
Broche 61 GND — Ground
Broche 62 I/O — User I/O pin (bank 3)
Broche 63 I/O — User I/O pin (bank 3)
Broche 64 I/O — User I/O pin (bank 3)
Broche 65 I/O — User I/O pin (bank 3)
Broche 66 I/O — User I/O pin (bank 3)
Broche 67 I/O — User I/O pin (bank 3)
Broche 68 I/O — User I/O pin (bank 3)
Broche 69 I/O — User I/O pin (bank 3)
Broche 70 I/O — User I/O pin (bank 3)
Broche 71 I/O — User I/O pin (bank 3)
Broche 72 GND — Ground
Broche 73 I/O — User I/O pin (bank 3)
Broche 74 I/O — User I/O pin (bank 3)
Broche 75 I/O — User I/O pin (bank 3)
Broche 76 I/O — User I/O pin (bank 3)
Broche 77 I/O — User I/O pin (bank 3)
Broche 78 VCCINT — Core supply voltage 3.3V
Broche 79 I/O — User I/O pin (bank 3)
Broche 80 I/O — User I/O pin (bank 3)
Broche 81 I/O — User I/O pin (bank 3)
Broche 82 I/O — User I/O pin (bank 3)
Broche 83 I/O — User I/O pin (bank 3)
Broche 84 I/O — User I/O pin (bank 3)
Broche 85 GND — Ground
Broche 86 I/O — User I/O pin (bank 4)
Broche 87 I/O — User I/O pin (bank 4)
Broche 88 I/O — User I/O pin (bank 4)
Broche 89 I/O — User I/O pin (bank 4)
Broche 90 I/O — User I/O pin (bank 4)
Broche 91 I/O — User I/O pin (bank 4)
Broche 92 I/O — User I/O pin (bank 4)
Broche 93 I/O — User I/O pin (bank 4)
Broche 94 I/O — User I/O pin (bank 4)
Broche 95 I/O — User I/O pin (bank 4)
Broche 96 GND — Ground
Broche 97 I/O — User I/O pin (bank 4)
Broche 98 I/O — User I/O pin (bank 4)
Broche 99 I/O — User I/O pin (bank 4)
Broche 100 I/O — User I/O pin (bank 4)
Broche 101 I/O — User I/O pin (bank 4)
Broche 102 VCCIO4 — I/O bank 4 supply voltage (3.3V or 5V)
Broche 103 I/O — User I/O pin (bank 4)
Broche 104 I/O — User I/O pin (bank 4)
Broche 105 I/O — User I/O pin (bank 4)
Broche 106 I/O — User I/O pin (bank 4)
Broche 107 I/O — User I/O pin (bank 4)
Broche 108 I/O — User I/O pin (bank 4)
Broche 109 GND — Ground
Broche 110 I/O — User I/O pin (bank 1)
Broche 111 I/O — User I/O pin (bank 1)
Broche 112 I/O — User I/O pin (bank 1)
Broche 113 I/O — User I/O pin (bank 1)
Broche 114 I/O — User I/O pin (bank 1)
Broche 115 I/O — User I/O pin (bank 1)
Broche 116 I/O — User I/O pin (bank 1)
Broche 117 I/O — User I/O pin (bank 1)
Broche 118 I/O — User I/O pin (bank 1)
Broche 119 I/O — User I/O pin (bank 1)
Broche 120 GND — Ground
Broche 121 I/O — User I/O pin (bank 1)
Broche 122 I/O — User I/O pin (bank 1)
Broche 123 I/O — User I/O pin (bank 1)
Broche 124 I/O — User I/O pin (bank 1)
Broche 125 I/O — User I/O pin (bank 1)
Broche 126 VCCINT — Core supply voltage 3.3V
Broche 127 I/O — User I/O pin (bank 1)
Broche 128 I/O — User I/O pin (bank 1)
Broche 129 I/O — User I/O pin (bank 1)
Broche 130 I/O — User I/O pin (bank 1)
Broche 131 I/O — User I/O pin (bank 1)
Broche 132 I/O — User I/O pin (bank 1)
Broche 133 GND — Ground
Broche 134 nCONFIG — Configuration control (active-low)
Broche 135 nSTATUS — Configuration status (active-low)
Broche 136 CONF_DONE — Configuration complete (active-high)
Broche 137 TCK — JTAG test clock
Broche 138 TMS — JTAG test mode select
Broche 139 TDO — JTAG test data out
Broche 140 TDI — JTAG test data in
Broche 141 CLK0 — Clock input 0
Broche 142 CLK1 — Clock input 1
Broche 143 VCCINT — Core supply voltage 3.3V
Broche 144 GND — Ground

Applications typiques

EPF6016ATC144-1N convient pour 6 applications: Glue Logic Replacement, High-Volume Gate Array Prototyping, Industrial Control Logic, Communications Interface Bridging, Consumer Electronics Logic Consolidation, Legacy Test Equipment & Maintenance.

🔧

Glue Logic Replacement

The EPF6016ATC144-1N with 1,320 logic elements and 117 user I/Os is well suited to replace discrete 74-series and PAL/GAL glue-logic in complex digital systems. By consolidating multiple TTL chips into a single programmable device, designers reduce PCB area, BOM count, and signal-trace length — improving signal integrity at high bus speeds. The 172 MHz internal frequency supports fast register-to-register paths typical of address decoding, bus arbitration, and timing-constraint glue. Engineers port their discrete logic via the Quartus / MAX+PLUS II toolchain and verify timing with the included timing analyzer, with typical designs consuming 60–80% of the 1,320 logic cells while leaving headroom for iterative ECO changes.

🏭

High-Volume Gate Array Prototyping

The EPF6016ATC144-1N provides an ideal low-cost, programmable alternative to high-volume gate-array ASICs and allows fast design changes during prototyping or design testing. With 16,000 typical gates, it sits in the sweet spot for gate-array prototyping where engineers validate logic and routing before committing to NRE-heavy mask-set production. JTAG-based in-system reprogramming supports rapid iterations, and SRAM configuration supports unlimited design changes without replacing the device. Once design is frozen, the validated netlist can be ported to a hard-array ASIC for high-volume production, dramatically reducing time-to-market and design risk compared to traditional ASIC development.

🏭

Industrial Control Logic

The EPF6016ATC144-1N's 117 I/O pins support direct connection to industrial sensors, actuators, and bus peripherals typically found in factory automation controllers. Its 3.0–3.6V core supply with MultiVolt I/O accepts 5V inputs from legacy industrial circuitry, allowing the FPGA to coexist with 5V PLC I/O modules while running internally from a regulated 3.3V rail. The 0–85°C commercial temperature range suits most factory-floor enclosures, and the SRAM configuration allows firmware updates over JTAG during commissioning and field service. Engineers implement state-machine logic for sequencing, pulse-width modulation for motor control, and parallel bus bridging between legacy and modern subsystems.

🌐

Communications Interface Bridging

The EPF6016ATC144-1N serves as a flexible protocol-bridging device in communications equipment, supporting conversion between UART, SPI, I²C, parallel buses, and custom proprietary interfaces. With 1,320 logic cells, designers implement multi-channel protocol converters with on-the-fly data-rate matching, byte-order swapping, and FIFO buffering. The 172 MHz internal frequency handles aggregate throughput of 50–100 Mbps across multiple parallel channels, while 117 I/Os accommodate 8- or 16-bit parallel data paths plus control signals. SRAM-based reconfiguration also enables field upgrades to support new protocol revisions without hardware replacement.

📱

Consumer Electronics Logic Consolidation

In cost-sensitive consumer electronics, the EPF6016ATC144-1N consolidates multiple discrete logic functions — display controllers, key-scanning matrices, LED multiplexing, and audio-routing logic — into a single reprogrammable device. The 144-TQFP package is widely supported by high-volume SMT lines, and the SRAM configuration enables last-minute feature changes during pilot production. With 117 I/Os the part drives multiple character LCDs, LED arrays, and key-scan matrices simultaneously while leaving logic headroom for additional product-differentiating features. As of 2026-09-11, however, new consumer designs typically migrate to MAX II CPLDs or smaller Cyclone FPGAs for better availability and lower unit cost.

🖥️

Legacy Test Equipment & Maintenance

The EPF6016ATC144-1N continues to see service in legacy test-and-measurement equipment where its original design was based on the FLEX 6000 family and where OEM support has ended. With obsolete-stock availability through brokers like Heisener, Xecor, and Avaq as of 2026-09-11, the part remains a viable maintenance solution for legacy test racks, ATE fixtures, and industrial controllers. Engineers tasked with extending the life of installed equipment use SRAM reconfiguration to apply bug fixes and feature enhancements without replacing expensive instruments. For new test equipment, however, modern Cyclone IV/V or MAX V CPLDs offer active manufacturer support and significantly lower cost.

What is the EPF6016ATC144-1N?
The EPF6016ATC144-1N is an Intel (formerly Altera) FLEX 6000 family FPGA with 16,000 typical gates, 1,320 logic elements, and 117 user I/O pins, housed in a 144-pin TQFP package. According to the FLEX 6000 datasheet, it operates from a 3.0V to 3.6V supply and supports in-system SRAM configuration via JTAG, making it a low-cost programmable alternative to gate-array ASICs.
What is the logic capacity of the EPF6016ATC144-1N?
The EPF6016ATC144-1N delivers 16,000 typical gates implemented through 1,320 logic cells (Logic Elements). The actual usable logic capacity is around 12,000 to 14,000 usable gates depending on the design's mix of combinational and sequential logic, with embedded memory blocks (EABs) providing additional dedicated storage.
How many user I/O pins does the EPF6016ATC144-1N have?
The EPF6016ATC144-1N exposes 117 user I/O pins in its 144-TQFP package, leaving 27 pins for power, ground, JTAG, and configuration. This I/O count is sufficient for moderate-complexity bridging, glue-logic replacement, and bus-interface applications.
What supply voltage does the EPF6016ATC144-1N require?
The EPF6016ATC144-1N requires a 3.0V to 3.6V supply for its core logic (VCCINT). The I/O banks (VCCIO) accept either 3.3V or 5.0V via the MultiVolt feature, allowing seamless interfacing with 5V legacy peripherals while running the core from 3.3V.
Is the EPF6016ATC144-1N still in production?
The EPF6016ATC144-1N is listed as obsolete by Intel (Altera); the FLEX 6000 family was superseded by FLEX 10K, Cyclone, and MAX families. Pricing as of 2026-09-11 reflects legacy-stock availability rather than active production, so lead times and minimum-order quantities should be confirmed with authorized distributors.
Where can I buy the EPF6016ATC144-1N today?
As of 2026-09-11, the EPF6016ATC144-1N is available from authorized distributors including DigiKey (Flip Electronics franchise), Mouser, and several specialty brokers such as Heisener, Xecor, Avaq, and ODG Electronics. Pricing for obsolete parts fluctuates with available inventory, so requesting a current quote is recommended before committing to a design.
What is the price of the EPF6016ATC144-1N?
The EPF6016ATC144-1N price (as of 2026-09-11) starts around $38.50 for qty-1 units, decreasing to roughly $18.20 at qty-1000. Pricing reflects obsolete-stock premiums rather than list price; for large production orders, contact Altera/Intel authorized brokers or consider modern replacements like the MAX II CPLD family for new designs.
What is the lead time for the EPF6016ATC144-1N?
Lead time for the EPF6016ATC144-1N as of 2026-09-11 is generally 1-2 weeks for in-stock parts at major distributors like DigiKey, and 3-5 days for expedited shipping from brokers like Heisener. For larger quantities or specific date-code requirements, lead times may extend to 4-6 weeks due to obsolete-stock allocation.
EPF6016ATC144-1N vs EPF6016ATC144-1 — what is the difference?
The EPF6016ATC144-1N is the RoHS-compliant version of the EPF6016ATC144-1, both being FLEX 6000 FPGAs in the same 144-TQFP package with identical 1,320 logic elements and 117 user I/Os. The 'N' suffix denotes lead-free (Pb-free) termination per industry environmental directives. They are drop-in replacements for each other on the same PCB footprint.
What is the best drop-in replacement for the EPF6016ATC144-1N?
The best drop-in replacements for the EPF6016ATC144-1N are the EPF6016ATC144-1 (non-RoHS version, same die/package), the EPF6016ATC144-2N (speed-grade -2, same package), and the EPF6016ATC144-3N (speed-grade -3, same package). All four parts share the 144-TQFP footprint, 117 I/Os, 3.3V core, and 1,320 logic elements, enabling true drop-in substitution.
Is the EPF6016ATC144-1N suitable for new designs in 2026?
The EPF6016ATC144-1N is not recommended for new designs as of 2026 due to its obsolete status, limited long-term supply, and availability of modern alternatives like the MAX II/MAX V CPLD or Cyclone IV/V FPGAs that offer higher logic density, lower power, and active manufacturer support. It remains viable for legacy system maintenance, repair, and field replacements.
Where can I download the EPF6016ATC144-1N datasheet PDF?
The original EPF6016ATC144-1N datasheet (FLEX 6000 family datasheet, published by Altera 1996-11-08, 395 KB) is available through Altera/Intel documentation archives and aggregator sites including FindIC, DigChip, and Avaq. Search for 'dsf6000.pdf' or 'FLEX 6000 datasheet' to locate the current host. Note that Intel may have archived some legacy Altera documentation.
Where can I find the EPF6016ATC144-1N pinout?
The EPF6016ATC144-1N pinout is documented in the Altera FLEX 6000 family datasheet (dsf6000.pdf). The 144-TQFP package assigns 117 pins to user I/O and the remaining 27 pins to VCCINT, VCCIO, GND, JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG, nSTATUS, CONF_DONE), and clock inputs (CLK0–CLK3). Pin 1 is located at the top-left corner of the package with the marker dot.
What are the key specifications of EPF6016ATC144-1N that engineers should know?
The key specifications of EPF6016ATC144-1N engineers need: 16,000 typical gates, 1,320 logic cells, 117 user I/O, 172 MHz internal frequency, 3.0–3.6V core supply, 144-TQFP (20x20 mm) package, commercial 0–85°C temperature grade, SRAM configuration with 5 nm memory cells, and JTAG programming support. Source: Altera FLEX 6000 family datasheet. This combination defines the part's position in the low-cost FLEX 6000 family.

Données de référence d'ingénierie pour EPF6016ATC144-1N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016ATC144-1N when you need a RoHS-compliant, 16,000-gate FLEX 6000 FPGA with 1,320 logic cells and 117 I/Os in the 144-TQFP package for commercial-temperature (0–85°C) applications. Choose the EPF6016ATC144-1 only if you specifically require legacy lead-bearing terminations (non-RoHS), otherwise the 'N' variant is preferred. Choose EPF6016ATC144-2N or -3N if your design does not require the fastest speed grade — slower grades reduce cost and may offer better availability. For modern new designs, migrate to MAX II CPLDs (EPM240 / EPM570 / EPM1270) or Cyclone IV/V FPGAs which are actively supported and significantly lower cost. All four FLEX 6000 144-TQFP variants (-1, -1N, -2N, -3N) are drop-in pin-compatible on the same PCB footprint, allowing easy up/down substitution.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016ATC144-1 EPF6016ATC144-2N EPF6016ATC144-3N EPF6016AQC208-3N
Package 144-TQFP (20x20 mm) 144-TQFP - same 144-TQFP - same 144-TQFP - same 208-PQFP - DIFFERENT
Brand Intel (formerly Altera) Intel (formerly Altera) - same Intel (formerly Altera) - same Intel (formerly Altera) - same Intel (formerly Altera) - same
Logic Elements / Cells 1,320 cells 1,320 cells 1,320 cells 1,320 cells 1,320 cells
Speed Grade -1 (fastest) -1 -2 (slower) -3 (slowest) -3 (slowest)
User I/O Count 117 117 117 117 171 (in 208-PQFP)
RoHS Compliant Yes (Pb-free, 'N' suffix) No (non-RoHS) Yes Yes Yes
Operating Temperature 0°C to +85°C (Commercial) 0°C to +85°C 0°C to +85°C 0°C to +85°C 0°C to +85°C
Lifecycle Status (2026) Obsolete Obsolete Obsolete Obsolete Obsolete

Principaux différenciateurs

  • RoHS-compliant (Pb-free) termination (vs EPF6016ATC144-1)
  • Fastest speed grade (-1) of the FLEX 6000 family (vs EPF6016ATC144-2N / EPF6016ATC144-3N)
  • Higher I/O density in same 144-TQFP footprint vs older FLEX 6000 variants (vs EPF6010ATC144-1 (FLEX 6010 family))

Notes de conception

The EPF6016ATC144-1N requires separate VCCINT (3.0–3.6V core) and VCCIO (3.3V or 5V I/O bank) supplies. Place a 0.1 µF ceramic decoupling capacitor adjacent to every VCCINT and VCCIO pin, plus a single 10–47 µF bulk tantalum or aluminum polymer capacitor per supply rail. Estimated: with 117 I/Os toggling at 50 MHz, the core current draw is approximately 30–60 mA — add at least 30% margin when sizing the 3.3V regulator. Power-on sequencing is not required, but VCCINT must be stable before nCONFIG is released.

The 144-TQFP package (20x20 mm, 0.5 mm pitch) requires careful PCB layout: use a 4-layer board with continuous ground plane beneath the device, escape traces from inner pads on the package perimeter, and 0.1 µF / 10 µF decoupling within 5 mm of every VCC pin. Estimated: trace impedance should target 50 Ω single-ended for clock and JTAG signals; failure to control impedance may cause signal integrity issues at 100+ MHz I/O toggling. Route JTAG signals (TCK, TMS, TDI, TDO) as a bus with ground guard traces to minimize crosstalk.

Common pitfalls when working with the EPF6016ATC144-1N: (1) forgetting to enable MultiVolt I/O via the configuration bitstream — without it, 5V input signals will damage the 3.3V I/O cells; (2) leaving unused I/O pins floating — always configure as inputs with bus-hold or outputs driving ground to minimize power consumption; (3) failing to recompile the design after a speed-grade change — swapping -1 for -2 or -3 requires timing re-analysis because internal delays change; (4) assuming all FLEX 6000 variants are pin-compatible — different package options (100-TQFP, 144-TQFP, 208-PQFP, 256-BGA) have different I/O counts and pin assignments even within the same family.

Informations de conformité

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS compliance indicated by 'N' suffix in MPN. REACH, halogen-free, and conflict-minerals status not stated in available datasheet excerpts — set to 'unknown'. Not AEC-Q100 qualified (commercial 0–85°C grade only).

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6016ATC144-1N EPF6016ATC144-1N datasheet Intel FLEX 6000 FPGA 144-TQFP FPGA 16000 gates Altera FLEX 6000 datasheet EPF6016ATC144-1N replacement EPF6016ATC144-1N pinout 144-TQFP FLEX 6000 FPGA price buy EPF6016ATC144-1N vs EPF6016ATC144-1 obsolete FLEX 6000 FPGA alternative glue logic FPGA 117 I/O what is FLEX 6000 family

Composants & termes associés

Intel Altera EPF6016ATC144-1N EPF6016ATC144-1 EPF6016ATC144-2N EPF6016ATC144-3N EPF6016AQC208-3N FLEX 6000 FPGA Field-Programmable Gate Array Programmable Logic Device TQFP-144 Thin Quad Flat Pack Surface Mount Technology JTAG ByteBlaster SRAM configuration RoHS MultiVolt I/O Logic Array Block Embedded Array Block FastTrack interconnecting Quartus MAX+PLUS II
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