EPF6016ATC144-1N - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Intel
Référence : EPF6016ATC144-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $26.4 | $2 640,00 |
| 500 | $21.95 | $10 975,00 |
| 1 000 | $18.2 | $18 200,00 |
EPF6016ATC144-1N Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnect routing after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: CPLD (Complex Programmable Logic Device) -> FPGA -> structured ASIC. The FLEX 6000 family was Altera's first SRAM-based FPGA family and represented a major step in low-cost, high-volume programmable logic, occupying the space between traditional CPLDs and high-density FLEX 10K FPGAs.
Key features of the EPF6016ATC144-1N include: 1,320 logic elements, an internal frequency rating of up to 172 MHz, 117 user I/O pins, and SRAM-based configuration that supports in-system reprogramming. The 144-TQFP package uses a 20 mm × 20 mm body with 0.5 mm pitch gull-wing leads, making it compatible with standard SMT assembly lines. The device is built on a 0.42 µm CMOS process with 5 nm SRAM configuration cells, providing fast reconfiguration and unlimited reprogram cycles.
The EPF6016ATC144-1N architecture combines Logic Array Blocks (LABs), Embedded Array Blocks (EABs) for memory functions, FastTrack interconnecting routing, and dedicated I/O cells with JTAG support. MultiVolt I/O allows interfacing with 3.3V and 5.0V logic. The device is programmed via the Altera ByteBlaster or BitBlaster download cable through a JTAG interface, and supports both serial and parallel configuration modes.
Typical applications include glue logic replacement, high-volume gate-array prototyping, industrial control logic, communications interface bridging, and consumer electronics where fast design changes are required during prototyping or design testing. The wide commercial temperature range and moderate logic capacity make it suitable for cost-sensitive production runs.
When designing with the EPF6016ATC144-1N, ensure adequate decoupling: place 0.1 µF and 10 µF capacitors close to each VCCINT and VCCIO pin. The 144-TQFP package requires careful PCB thermal management — at high toggle rates, junction temperature can rise significantly above ambient. Always configure unused I/O pins as inputs with bus-hold enabled or as outputs driving ground to minimize switching noise.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the original Altera datasheet — giving engineers a single source for parametric comparison and supply-chain decisions on this legacy but still-relevant FPGA.
Alternatives de remplacement direct pour EPF6016ATC144-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016ATC144-1N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016ATC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPF6016ATC144-2N
✅ Remplacement direct✓ En stock
$19.5 / unité
Voir la fiche technique →EPF6016ATC144-3N
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →EPF6016AQC208-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$31.2 / unité
Voir la fiche technique →EPF6016ATC144-1N Valeurs maximales et caractéristiques électriques
| Device Type | FLEX 6000 FPGA |
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements / Cells | 1,320 |
| Number of I/O | 117 |
| Tension d'alimentation | 3.0 V to 3.6 V |
| Internal Frequency | 172 MHz |
| Température de fonctionnement | 0°C to +85°C (Commercial) |
| Boîtier | 144-pin TQFP (20x20 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Configuration Memory | SRAM (5 nm, in-system programmable) |
| Programming Interface | JTAG (ByteBlaster / BitBlaster) |
| Process Technology | 0.42 µm CMOS |
| I/O Standards | 3.3V / 5.0V MultiVolt |
Configuration des broches de EPF6016ATC144-1N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCINT — Core supply voltage 3.3V |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | VCCIO1 — I/O bank 1 supply voltage (3.3V or 5V) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 1) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | VCCINT — Core supply voltage 3.3V |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | VCCINT — Core supply voltage 3.3V |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | I/O — User I/O pin (bank 3) |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | I/O — User I/O pin (bank 4) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | VCCIO4 — I/O bank 4 supply voltage (3.3V or 5V) |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | I/O — User I/O pin (bank 4) |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O pin (bank 1) |
| Broche 111 | I/O — User I/O pin (bank 1) |
| Broche 112 | I/O — User I/O pin (bank 1) |
| Broche 113 | I/O — User I/O pin (bank 1) |
| Broche 114 | I/O — User I/O pin (bank 1) |
| Broche 115 | I/O — User I/O pin (bank 1) |
| Broche 116 | I/O — User I/O pin (bank 1) |
| Broche 117 | I/O — User I/O pin (bank 1) |
| Broche 118 | I/O — User I/O pin (bank 1) |
| Broche 119 | I/O — User I/O pin (bank 1) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | I/O — User I/O pin (bank 1) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | VCCINT — Core supply voltage 3.3V |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | I/O — User I/O pin (bank 1) |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | GND — Ground |
| Broche 134 | nCONFIG — Configuration control (active-low) |
| Broche 135 | nSTATUS — Configuration status (active-low) |
| Broche 136 | CONF_DONE — Configuration complete (active-high) |
| Broche 137 | TCK — JTAG test clock |
| Broche 138 | TMS — JTAG test mode select |
| Broche 139 | TDO — JTAG test data out |
| Broche 140 | TDI — JTAG test data in |
| Broche 141 | CLK0 — Clock input 0 |
| Broche 142 | CLK1 — Clock input 1 |
| Broche 143 | VCCINT — Core supply voltage 3.3V |
| Broche 144 | GND — Ground |
Applications typiques
EPF6016ATC144-1N convient pour 6 applications: Glue Logic Replacement, High-Volume Gate Array Prototyping, Industrial Control Logic, Communications Interface Bridging, Consumer Electronics Logic Consolidation, Legacy Test Equipment & Maintenance.
Glue Logic Replacement
The EPF6016ATC144-1N with 1,320 logic elements and 117 user I/Os is well suited to replace discrete 74-series and PAL/GAL glue-logic in complex digital systems. By consolidating multiple TTL chips into a single programmable device, designers reduce PCB area, BOM count, and signal-trace length — improving signal integrity at high bus speeds. The 172 MHz internal frequency supports fast register-to-register paths typical of address decoding, bus arbitration, and timing-constraint glue. Engineers port their discrete logic via the Quartus / MAX+PLUS II toolchain and verify timing with the included timing analyzer, with typical designs consuming 60–80% of the 1,320 logic cells while leaving headroom for iterative ECO changes.
Recommandé
High-Volume Gate Array Prototyping
The EPF6016ATC144-1N provides an ideal low-cost, programmable alternative to high-volume gate-array ASICs and allows fast design changes during prototyping or design testing. With 16,000 typical gates, it sits in the sweet spot for gate-array prototyping where engineers validate logic and routing before committing to NRE-heavy mask-set production. JTAG-based in-system reprogramming supports rapid iterations, and SRAM configuration supports unlimited design changes without replacing the device. Once design is frozen, the validated netlist can be ported to a hard-array ASIC for high-volume production, dramatically reducing time-to-market and design risk compared to traditional ASIC development.
Recommandé
Industrial Control Logic
The EPF6016ATC144-1N's 117 I/O pins support direct connection to industrial sensors, actuators, and bus peripherals typically found in factory automation controllers. Its 3.0–3.6V core supply with MultiVolt I/O accepts 5V inputs from legacy industrial circuitry, allowing the FPGA to coexist with 5V PLC I/O modules while running internally from a regulated 3.3V rail. The 0–85°C commercial temperature range suits most factory-floor enclosures, and the SRAM configuration allows firmware updates over JTAG during commissioning and field service. Engineers implement state-machine logic for sequencing, pulse-width modulation for motor control, and parallel bus bridging between legacy and modern subsystems.
Recommandé
Communications Interface Bridging
The EPF6016ATC144-1N serves as a flexible protocol-bridging device in communications equipment, supporting conversion between UART, SPI, I²C, parallel buses, and custom proprietary interfaces. With 1,320 logic cells, designers implement multi-channel protocol converters with on-the-fly data-rate matching, byte-order swapping, and FIFO buffering. The 172 MHz internal frequency handles aggregate throughput of 50–100 Mbps across multiple parallel channels, while 117 I/Os accommodate 8- or 16-bit parallel data paths plus control signals. SRAM-based reconfiguration also enables field upgrades to support new protocol revisions without hardware replacement.
Recommandé
Consumer Electronics Logic Consolidation
In cost-sensitive consumer electronics, the EPF6016ATC144-1N consolidates multiple discrete logic functions — display controllers, key-scanning matrices, LED multiplexing, and audio-routing logic — into a single reprogrammable device. The 144-TQFP package is widely supported by high-volume SMT lines, and the SRAM configuration enables last-minute feature changes during pilot production. With 117 I/Os the part drives multiple character LCDs, LED arrays, and key-scan matrices simultaneously while leaving logic headroom for additional product-differentiating features. As of 2026-09-11, however, new consumer designs typically migrate to MAX II CPLDs or smaller Cyclone FPGAs for better availability and lower unit cost.
Recommandé
Legacy Test Equipment & Maintenance
The EPF6016ATC144-1N continues to see service in legacy test-and-measurement equipment where its original design was based on the FLEX 6000 family and where OEM support has ended. With obsolete-stock availability through brokers like Heisener, Xecor, and Avaq as of 2026-09-11, the part remains a viable maintenance solution for legacy test racks, ATE fixtures, and industrial controllers. Engineers tasked with extending the life of installed equipment use SRAM reconfiguration to apply bug fixes and feature enhancements without replacing expensive instruments. For new test equipment, however, modern Cyclone IV/V or MAX V CPLDs offer active manufacturer support and significantly lower cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016ATC144-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016ATC144-1 | EPF6016ATC144-2N | EPF6016ATC144-3N | EPF6016AQC208-3N |
|---|---|---|---|---|---|
| Package | 144-TQFP (20x20 mm) | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 208-PQFP - DIFFERENT |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Logic Elements / Cells | 1,320 cells | 1,320 cells | 1,320 cells | 1,320 cells | 1,320 cells |
| Speed Grade | -1 (fastest) | -1 | -2 (slower) | -3 (slowest) | -3 (slowest) |
| User I/O Count | 117 | 117 | 117 | 117 | 171 (in 208-PQFP) |
| RoHS Compliant | Yes (Pb-free, 'N' suffix) | No (non-RoHS) | Yes | Yes | Yes |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Lifecycle Status (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- RoHS-compliant (Pb-free) termination (vs EPF6016ATC144-1)
- Fastest speed grade (-1) of the FLEX 6000 family (vs EPF6016ATC144-2N / EPF6016ATC144-3N)
- Higher I/O density in same 144-TQFP footprint vs older FLEX 6000 variants (vs EPF6010ATC144-1 (FLEX 6010 family))
Notes de conception
The EPF6016ATC144-1N requires separate VCCINT (3.0–3.6V core) and VCCIO (3.3V or 5V I/O bank) supplies. Place a 0.1 µF ceramic decoupling capacitor adjacent to every VCCINT and VCCIO pin, plus a single 10–47 µF bulk tantalum or aluminum polymer capacitor per supply rail. Estimated: with 117 I/Os toggling at 50 MHz, the core current draw is approximately 30–60 mA — add at least 30% margin when sizing the 3.3V regulator. Power-on sequencing is not required, but VCCINT must be stable before nCONFIG is released.
The 144-TQFP package (20x20 mm, 0.5 mm pitch) requires careful PCB layout: use a 4-layer board with continuous ground plane beneath the device, escape traces from inner pads on the package perimeter, and 0.1 µF / 10 µF decoupling within 5 mm of every VCC pin. Estimated: trace impedance should target 50 Ω single-ended for clock and JTAG signals; failure to control impedance may cause signal integrity issues at 100+ MHz I/O toggling. Route JTAG signals (TCK, TMS, TDI, TDO) as a bus with ground guard traces to minimize crosstalk.
Common pitfalls when working with the EPF6016ATC144-1N: (1) forgetting to enable MultiVolt I/O via the configuration bitstream — without it, 5V input signals will damage the 3.3V I/O cells; (2) leaving unused I/O pins floating — always configure as inputs with bus-hold or outputs driving ground to minimize power consumption; (3) failing to recompile the design after a speed-grade change — swapping -1 for -2 or -3 requires timing re-analysis because internal delays change; (4) assuming all FLEX 6000 variants are pin-compatible — different package options (100-TQFP, 144-TQFP, 208-PQFP, 256-BGA) have different I/O counts and pin assignments even within the same family.
Informations de conformité
RoHS compliance indicated by 'N' suffix in MPN. REACH, halogen-free, and conflict-minerals status not stated in available datasheet excerpts — set to 'unknown'. Not AEC-Q100 qualified (commercial 0–85°C grade only).