Altera

EPF8282ATI100-3 - 2.5K Gates, 208 Cells, 125MHz FLEX 8000 FPGA | Altera

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5 V Vdss 100-pin TQFP Package 125 MHz Speed CMOS SRAM Memory

À partir de $15.6 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$28.5	$28,50
10	$25.2	$252,00
100	$21.8	$2 180,00
500	$18.4	$9 200,00
1 000	$15.6	$15 600,00

ℹ️ Tous les prix sont en USD

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EPF8282ATI100-3 Présentation

The Altera EPF8282ATI100-3 is a FLEX 8000 family Field Programmable Gate Array (FPGA) with 2,500 usable gates, 208 logic cells, 26 Logic Array Blocks (LABs), and 78 user I/Os, housed in a 100-pin TQFP package. It is fabricated on a 0.42 µm CMOS process, supports a 5V supply, and operates at up to 125 MHz system clock frequency with the -3 speed grade indicating its mid-tier performance position within the family.

A FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic and interconnections are configured by the end user via SRAM configuration memory, allowing in-circuit reconfigurability without mask changes. Within the broader programmable logic hierarchy, FPGAs sit above CPLDs (Complex Programmable Logic Devices) in logic density, and the FLEX 8000 family occupies Altera's classic high-density SRAM-based FPGA tier from the late 1990s, positioned as a high-volume alternative to gate-array ASICs.

Key features include 78 user I/O pins supporting common single-ended standards of its era, 208 logic cells distributed across 26 LABs each containing 8 logic elements, 5V core and I/O supply, in-circuit reconfigurability via SRAM configuration bits, and compatibility with Altera EPC1, EPC1064, EPC1213, and EPC1441 serial configuration devices as well as industry-standard parallel EPROMs. The 100-pin TQFP package enables standard surface-mount PCB assembly on 0.5 mm pitch land patterns.

The FLEX 8000 architecture uses CMOS SRAM configuration elements that load at system power-up from an external non-volatile memory. Its hierarchical routing includes FastTrack interconnect for predictable timing across die regions, and each Logic Element contains a 4-input look-up table, a programmable flipflop, and a dedicated carry chain for arithmetic.

Typical applications include glue-logic consolidation in legacy industrial systems, protocol bridging interfaces, motor-control co-processors, and replacement of discrete TTL/CMOS logic on 5V backplanes. The 5V tolerant I/Os make it particularly suitable for retrofit designs originally built around 74-series logic.

When designing with this device, ensure the configuration memory source (EPC1, EPC1064, parallel EPROM, or micro-controller) matches the chosen configuration scheme. The 100-pin TQFP requires 0.5 mm pitch PCB footprint and adequate ground-plane thermal management at sustained high toggle rates.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including same-family variants and pin-compatible replacements useful for legacy system refresh.

Alternatives de remplacement direct pour EPF8282ATI100-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF8282ATI100-3 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Configuration Memory, Package, Speed Grade.

EPF8282ATC100-2

Intel

Operating Temperature: 0 °C to 70 °C (Commercial)

Configuration Memory: SRAM (volatile, requires external boot)

Speed Grade: -2