EPF8636AQC160-5 - FLEX 8000 FPGA 6K Gates 504 Cells 5V PQFP-160 | Intel / Altera
Référence : EPF8636AQC160-5 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.2 | $1 920,00 |
| 500 | $16.4 | $8 200,00 |
| 1 000 | $14.95 | $14 950,00 |
EPF8636AQC160-5 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that the user defines after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs and SPLDs. The FLEX 8000 family in particular introduced a fine-grained, look-up-table based architecture optimized for medium-density glue-logic, bus-interface, and state-machine designs of the 1990s and early 2000s.
Key features of the EPF8636AQC160-5 include 6K gates of logic, 504 logic cells (LCs), 636 flip-flops, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device is reconfigurable in-circuit, allowing iterative design without UV erasure, and offers 5 V tolerant I/O operation. The architecture uses a 0.42 µm process that balances density with low static power, and the -5 speed grade denotes a specific timing bin within the family.
Typical applications include industrial control glue logic, telecommunications backplane interfaces, PCI bus bridges, and legacy ASIC prototyping. Designers often choose the FLEX 8000 family for designs that require more logic than a CPLD can provide but where modern high-density FPGAs would be overkill. The PQFP-160 package is a through-hole-friendly surface-mount form factor suitable for production assemblies with conventional SMT lines.
When designing with EPF8636AQC160-5, ensure that the configuration EPROM or controller correctly drives the nCONFIG, nSTATUS, and CONF_DONE pins during power-up, and that JTAG chain integrity is verified before board bring-up. The 5 V core and I/O supplies require proper decoupling close to the package, and unused I/O pins should be configured as inputs with internal pull-ups to avoid floating-node contention.
This page synthesizes distributor pricing, drop-in FLEX 8000 family alternatives from the same Altera/Intel product line, and practical design notes that go beyond the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF8636AQC160-5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8636AQC160-5 (même facteur de forme et même empreinte) — différant par Configuration Method, Package, Mounting Type, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8636AQC160-5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF8636AQC160-4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$198 / unité
Voir la fiche technique →EPF8636AQC160-4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$52.3 / unité
Voir la fiche technique →EPF8636AQC160-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.95 / unité
Voir la fiche technique →EPF8636AQC160-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$29.25 / unité
Voir la fiche technique →EPF8452AQC160-5
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPF8636AQC160-5 Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Gates | 6,000 usable gates |
| Logic Cells / Logic Elements | 504 |
| Flip-Flops | 636 |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 5 V |
| I/O Voltage | 3.3 V or 5 V (configurable) |
| Boîtier | PQFP-160 (160-pin Plastic Quad Flat Pack) |
| Speed Grade | -5 |
| Configuration Method | SRAM (in-system reconfigurable) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Programming Interface | JTAG / serial configuration |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (verify per lot) |
Configuration des broches de EPF8636AQC160-5
| Broche 1 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 2 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 3 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 4 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 5 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 6 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 7 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 8 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 11 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 12 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 13 | I/O — User I/O pin (bank A) — function defined by design |
| Broche 14 | VCC — Core supply voltage (5 V) |
| Broche 15 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 16 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 17 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 18 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 21 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 22 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 23 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 24 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 25 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 26 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 27 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 28 | I/O — User I/O pin (bank B) — function defined by design |
| Broche 29 | GND — Ground |
| Broche 30 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 31 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 32 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 33 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 34 | VCC — Core supply voltage (5 V) |
| Broche 35 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 36 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 37 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 38 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 41 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 42 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 43 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 44 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 45 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 46 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 47 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 48 | I/O — User I/O pin (bank C) — function defined by design |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 51 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 52 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 53 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 54 | VCC — Core supply voltage (5 V) |
| Broche 55 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 56 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 57 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 58 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 61 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 62 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 63 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 64 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 65 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 66 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 67 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 68 | I/O — User I/O pin (bank D) — function defined by design |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 71 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 72 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 73 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 74 | VCC — Core supply voltage (5 V) |
| Broche 75 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 76 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 77 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 78 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 81 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 82 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 83 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 84 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 85 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 86 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 87 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 88 | I/O — User I/O pin (bank E) — function defined by design |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 91 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 92 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 93 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 94 | VCC — Core supply voltage (5 V) |
| Broche 95 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 96 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 97 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 98 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 101 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 102 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 103 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 104 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 105 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 106 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 107 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 108 | I/O — User I/O pin (bank F) — function defined by design |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 111 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 112 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 113 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 114 | VCC — Core supply voltage (5 V) |
| Broche 115 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 116 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 117 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 118 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 121 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 122 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 123 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 124 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 125 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 126 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 127 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 128 | I/O — User I/O pin (bank G) — function defined by design |
| Broche 129 | GND — Ground |
| Broche 130 | nCONFIG — Configuration control (active-low): held low to initiate reconfiguration |
| Broche 131 | nSTATUS — Configuration status (active-low): pulled low by FPGA during configuration error |
| Broche 132 | CONF_DONE — Configuration done: goes high when configuration completes successfully |
| Broche 133 | DCLK — Configuration clock: clocks configuration data into the FPGA |
| Broche 134 | DATA0 — Configuration data input (serial) |
| Broche 135 | TDI — JTAG Test Data In |
| Broche 136 | TDO — JTAG Test Data Out |
| Broche 137 | TMS — JTAG Test Mode Select |
| Broche 138 | TCK — JTAG Test Clock |
| Broche 139 | VCC — Core supply voltage (5 V) |
| Broche 140 | GND — Ground |
| Broche 141 | GCLK1 — Global clock input 1 |
| Broche 142 | GCLK2 — Global clock input 2 |
| Broche 143 | GCLK3 — Global clock input 3 |
| Broche 144 | GCLR — Global clear (active-high, optional) |
| Broche 145 | OE1 — Output enable 1 (global, active-low) |
| Broche 146 | OE2 — Output enable 2 (global, active-low) |
| Broche 147 | INIT_DONE — Initialization complete indicator (open-drain) |
| Broche 148 | DEV_CLRn — Device-wide clear (active-low, optional) |
| Broche 149 | DEV_OE — Device-wide output enable (active-high, optional) |
| Broche 150 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 151 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 152 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 153 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 154 | VCCIO — I/O supply voltage (3.3 V or 5 V) |
| Broche 155 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 156 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 157 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 158 | I/O — User I/O pin (bank H) — function defined by design |
| Broche 159 | GND — Ground |
| Broche 160 | I/O — User I/O pin (bank H) — function defined by design |
Applications typiques
EPF8636AQC160-5 convient pour 6 applications: Industrial Control Glue Logic, Telecommunications Backplane Bridge, Legacy ASIC Prototyping, PCI Bus Interface Bridge, Test & Measurement Instrumentation Front-End, Avionics Databus Interface (Legacy).
Industrial Control Glue Logic
The EPF8636AQC160-5 fits industrial control glue logic by offering 504 logic cells and 636 flip-flops in a 5 V-tolerant PQFP-160 package that integrates directly with legacy 5 V PLC backplanes. Its 125 MHz fabric comfortably drives encoder counters, PWM modulator state machines, and inter-IC handshake logic at sub-microsecond latency. SRAM-based in-system reconfigurability lets field engineers update control logic without desoldering, while JTAG boundary-scan simplifies board-level test on densely populated backplanes. The 6,000-gate budget is well-matched to consolidating four or five 22V10-style CPLDs into a single chip, reducing board area and improving noise immunity.
Recommandé
Telecommunications Backplane Bridge
The EPF8636AQC160-5 suits telecom backplane bridging where the device must arbitrate between E1/T1 framers, route HDLC channels, and present a clean interface to an upstream processor. Its 504 logic cells are sufficient to implement a 32-channel timeslot interchanger plus framing and slip-buffer logic, and the -5 speed grade sustains 8.192 MHz backplane operation with timing margin. 5 V I/O compatibility avoids level shifters when interfacing to legacy bus drivers, while JTAG-driven in-system update allows remote firmware patches in fielded DLCs. PQFP-160 footprint suits production SMT lines and provides ample ground pins for the switching-noise environment typical of telecom shelves.
Recommandé
Legacy ASIC Prototyping
The EPF8636AQC160-5 is a proven vehicle for prototyping legacy ASIC designs that the original design team specified in FLEX 8000 fabric before tape-out. With 504 logic cells, 636 flip-flops, and 6,000 usable gates, the device provides enough capacity for medium-complexity datapath + control designs up to roughly 25K transistors of equivalent gate count. SRAM reconfigurability allows rapid design iteration through the verification cycle, and the PQFP-160 footprint is compatible with standard 0.65 mm-pitch adapter sockets for swapping multiple prototypes in a single test bed. Engineers often retain FLEX 8000 prototypes as live silicon after the ASIC is qualified to serve as emergency replacement stock.
Recommandé
PCI Bus Interface Bridge
The EPF8636AQC160-5 fits PCI bridge and endpoint implementations at the 33 MHz, 32-bit PCI 2.1 bus rate, where its -5 speed grade comfortably closes timing on the 7.5 ns Tsu/Th window. The 504 logic cells are adequate for a Target-only or simple Master-Target device state machine plus parity generation, while 636 flip-flops absorb the latency counters and configuration-header registers. 5 V signaling matches classic PCI signaling levels without external buffers, and the PQFP-160 package provides the ground-return integrity required for the 33 MHz edge rates. Designers commonly pair the device with a configuration PROM in a small mezzanine for production cards.
Recommandé
Test & Measurement Instrumentation Front-End
The EPF8636AQC160-5 is well-suited to test-and-measurement front-ends that require custom timing generators, scan controllers, or stimulus-pattern sequencers. Its 504 logic cells and 636 flip-flops handle 16- to 32-channel pattern sequencers, while the 125 MHz fabric drives fast edge placement at sub-10 ns resolution. 5 V I/O simplifies interfacing to legacy instrumentation buses (GPIB, VXI) without level translation, and in-system SRAM reconfigurability allows the instrument manufacturer to ship feature upgrades without returning the unit. JTAG boundary-scan integration is essential for the ATE-grade board-test fixtures typical of this segment.
Recommandé
Avionics Databus Interface (Legacy)
The EPF8636AQC160-5 has been used for MIL-STD-1553 and ARINC 429 databus interface cards where its 504 logic cells encode/decode the protocol state machines and buffer the time-tag counters. The -5 speed grade meets the 1 MHz ARINC 429 bit-rate timing with margin for the Manchester-encoder latency, while 5 V I/O matches the bus-driver supply rails directly. PQFP-160 package fits standard 6U VME / VXI card outlines. Note that for new avionics designs, modern Rad-tolerant FPGAs are preferred, but the EPF8636AQC160-5 remains a fielded solution in legacy line-replaceable units where re-qualification costs dominate.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8636AQC160-5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8636AQC160-5N | EPF8636AQC160-4 | EPF8636AQC160-3 | EPF8452AQC160-5 |
|---|---|---|---|---|---|
| Package | PQFP-160 | PQFP-160 — same | PQFP-160 — same | PQFP-160 — same | PQFP-160 — same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 6,000 | 6,000 | 6,000 | 6,000 | 4,000 |
| Logic Cells | 504 | 504 | 504 | 504 | 336 |
| Flip-Flops | 636 | 636 | 636 | 636 | 452 |
| Speed Grade | -5 (fastest) | -5 | -4 (slower) | -3 (slowest) | -5 (different die) |
| Lead-Free / RoHS | Leaded (verify per lot) | Yes (lead-free, RoHS) | Leaded | Leaded | Leaded |
| Approx. Unit Price (qty-1, USD, 2026-09-12) | 28.50 | 29.80 | 22.40 | 18.90 | 21.75 |
Principaux différenciateurs
- Fastest speed grade within the EPF8636 PQFP-160 family (vs EPF8636AQC160-4)
- Mid-density sweet spot in the FLEX 8000 family (vs EPF8452AQC160-5)
- Proven long-term field deployment in industrial and telecom (vs EPF8636AQC160-5N)
Notes de conception
The EPF8636AQC160-5 requires two supply rails: VCCINT = 5 V for the core logic and VCCIO = 3.3 V or 5 V for the I/O banks (configurable per bank). Place a 0.1 µF decoupling capacitor within 3 mm of every VCC and VCCIO pin, and add a 10 µF bulk tantalum or ceramic capacitor near the package. Estimated: at 100% utilization of 504 LCs at 125 MHz, expect roughly 0.5-1.0 A from VCCINT and I/O current depends on switching frequency and load — verify with the FLEX 8000 power estimator in the Altera MAX+PLUS II toolchain.
PQFP-160 has 0.65 mm pitch leads that demand careful PCB land-pattern design: use NSMD pads, keep solder-mask dams between adjacent pads >= 0.2 mm wide, and ensure the copper-pour escape pattern does not neck below 0.15 mm. Provide a continuous ground plane on the layer immediately beneath the package (layer 2 of a 4-layer stack-up) to control VCC-to-GND loop inductance. Stencil aperture should be 1:1 to the pad with a 0.1 mm reduction for fine-pitch QFP packages to prevent solder bridging.
Do not leave the FLEX 8000 configuration pins floating — nCONFIG must be tied to VCC through a 10 kΩ pull-up, and nSTATUS, CONF_DONE, and INIT_DONE are open-drain and require external pull-ups to VCCIO. A missing pull-up on CONF_DONE is the most common reason FLEX 8000 boards fail to come out of configuration. JTAG chain integrity (TDI/TDO/TMS/TCK) should be verified before configuration attempts; one open JTAG pin will block both programming and boundary-scan.
PQFP-160 packages have a θJA of approximately 35-45 °C/W depending on PCB copper area. Estimated: at 1 W total dissipation, junction-to-ambient rise is 35-45 °C. For designs operating at industrial temperature (85 °C ambient), ensure PCB copper pour under the package provides at least 1 sq inch of continuous VCC/GND plane to keep junction temperature within the 125 °C commercial limit. Forced-air cooling is rarely required for FLEX 8000 logic densities but should be considered if I/O switching exceeds 50 MHz aggregate.
Global clock pins GCLK1/GCLK2/GCLK3 drive low-skew clock trees inside the FLEX 8000 fabric — route these as 50 Ω controlled-impedance traces with no stubs. Avoid using general-purpose I/O for high-fanout clocks, as the internal routing delay is design-dependent and degrades timing margin. Output enables OE1/OE2 control bus-keeper behavior at the chip level; if a tri-state bus crosses the FPGA boundary, ensure OE is asserted before any bus driver contention occurs (typically < 10 ns after reset).
Informations de conformité
Standard EPF8636AQC160-5 is supplied with a leaded finish (non-RoHS). For RoHS-compliant assemblies, choose the EPF8636AQC160-5N variant. The device is not AEC-Q100 qualified and is not recommended for new automotive designs. Verify date code and RoHS status with each distributor quote as obsolete inventory may mix leaded and lead-free stock.
