EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
Référence : EPF8820ARI208-4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.2 | $28,20 |
| 10 | $22.5 | $225,00 |
| 100 | $15.8 | $1 580,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $8.7 | $8 700,00 |
EPF8820ARI208-4 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
Alternatives de remplacement direct pour EPF8820ARI208-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ARI208-4 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ARI208-3
✅ Remplacement direct✓ En stock
$55.4 / unité
Voir la fiche technique →EPF8820ARI208-3N
✅ Remplacement direct✓ En stock
$21.5 / unité
Voir la fiche technique →EPF8820ARI208-2
✅ Remplacement direct✓ En stock
$11.5 / unité
Voir la fiche technique →EPF8820ARI208-2N
✅ Remplacement direct✓ En stock
$99.5 / unité
Voir la fiche technique →EPF8820ARI208-1
✅ Remplacement direct✓ En stock
$20.4 / unité
Voir la fiche technique →EPF8820ARC208-4
✅ Remplacement direct✓ En stock
$25.4 / unité
Voir la fiche technique →EPF8820ARC208-4N
✅ Remplacement direct✓ En stock
$32 / unité
Voir la fiche technique →EPF8820ARI208-4 Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| Boîtier | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
Configuration des broches de EPF8820ARI208-4
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | VCCINT — Internal core supply 5V |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | GND — Ground |
| Broche 6 | nCONFIG — Configuration control (active low) |
| Broche 7 | nSTATUS — Configuration status (active low) |
| Broche 8 | CONF_DONE — Configuration complete indicator |
| Broche 9 | DCLK — Configuration clock input |
| Broche 10 | DATA0 — Configuration data input |
| Broche 11 | TCK — JTAG test clock |
| Broche 12 | TMS — JTAG test mode select |
| Broche 13 | TDI — JTAG test data in |
| Broche 14 | TDO — JTAG test data out |
| Broche 15 | CLK0 — Dedicated clock input 0 |
| Broche 16 | CLK1 — Dedicated clock input 1 |
| Broche 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | VCCINT — Internal core supply 5V |
| Broche 25 | I/O — User I/O pin (bank 3) |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | I/O — User I/O pin (bank 3) |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 4) |
| Broche 34 | I/O — User I/O pin (bank 4) |
| Broche 35 | GND — Ground |
| Broche 36 | CLK2 — Dedicated clock input 2 |
| Broche 37 | CLK3 — Dedicated clock input 3 |
| Broche 38 | I/O — User I/O pin (bank 4) |
| Broche 39 | I/O — User I/O pin (bank 4) |
| Broche 40 | VCCINT — Internal core supply 5V |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | I/O — User I/O pin (bank 4) |
| Broche 43 | I/O — User I/O pin (bank 5) |
| Broche 44 | GND — Ground |
| Broche 45 | I/O — User I/O pin (bank 5) |
| Broche 46 | I/O — User I/O pin (bank 5) |
| Broche 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 48 | I/O — User I/O pin (bank 5) |
| Broche 49 | I/O — User I/O pin (bank 5) |
| Broche 50 | I/O — User I/O pin (bank 6) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin (bank 6) |
| Broche 53 | I/O — User I/O pin (bank 6) |
| Broche 54 | VCCINT — Internal core supply 5V |
| Broche 55 | I/O — User I/O pin (bank 6) |
| Broche 56 | I/O — User I/O pin (bank 6) |
| Broche 57 | I/O — User I/O pin (bank 7) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O pin (bank 7) |
| Broche 60 | I/O — User I/O pin (bank 7) |
| Broche 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 62 | I/O — User I/O pin (bank 7) |
| Broche 63 | I/O — User I/O pin (bank 7) |
| Broche 64 | I/O — User I/O pin (bank 8) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O pin (bank 8) |
| Broche 67 | I/O — User I/O pin (bank 8) |
| Broche 68 | VCCINT — Internal core supply 5V |
| Broche 69 | I/O — User I/O pin (bank 8) |
| Broche 70 | I/O — User I/O pin (bank 8) |
| Broche 71 | I/O — User I/O pin (bank 1) |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin (bank 1) |
| Broche 74 | I/O — User I/O pin (bank 1) |
| Broche 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 76 | I/O — User I/O pin (bank 1) |
| Broche 77 | I/O — User I/O pin (bank 2) |
| Broche 78 | I/O — User I/O pin (bank 2) |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin (bank 2) |
| Broche 81 | I/O — User I/O pin (bank 2) |
| Broche 82 | VCCINT — Internal core supply 5V |
| Broche 83 | I/O — User I/O pin (bank 2) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | VCCINT — Internal core supply 5V |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 5) |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O pin (bank 5) |
| Broche 102 | I/O — User I/O pin (bank 5) |
| Broche 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 104 | I/O — User I/O pin (bank 5) |
| Broche 105 | I/O — User I/O pin (bank 6) |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | VCCINT — Internal core supply 5V |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 7) |
| Broche 113 | I/O — User I/O pin (bank 7) |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O pin (bank 7) |
| Broche 116 | I/O — User I/O pin (bank 7) |
| Broche 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | I/O — User I/O pin (bank 8) |
| Broche 120 | I/O — User I/O pin (bank 8) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin (bank 8) |
| Broche 123 | I/O — User I/O pin (bank 8) |
| Broche 124 | VCCINT — Internal core supply 5V |
| Broche 125 | I/O — User I/O pin (bank 8) |
| Broche 126 | I/O — User I/O pin (bank 1) |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | GND — Ground |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 2) |
| Broche 134 | I/O — User I/O pin (bank 2) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O pin (bank 2) |
| Broche 137 | I/O — User I/O pin (bank 2) |
| Broche 138 | VCCINT — Internal core supply 5V |
| Broche 139 | I/O — User I/O pin (bank 2) |
| Broche 140 | I/O — User I/O pin (bank 3) |
| Broche 141 | I/O — User I/O pin (bank 3) |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O pin (bank 3) |
| Broche 144 | I/O — User I/O pin (bank 3) |
| Broche 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 146 | I/O — User I/O pin (bank 3) |
| Broche 147 | I/O — User I/O pin (bank 4) |
| Broche 148 | I/O — User I/O pin (bank 4) |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — User I/O pin (bank 4) |
| Broche 151 | I/O — User I/O pin (bank 4) |
| Broche 152 | VCCINT — Internal core supply 5V |
| Broche 153 | I/O — User I/O pin (bank 4) |
| Broche 154 | I/O — User I/O pin (bank 5) |
| Broche 155 | I/O — User I/O pin (bank 5) |
| Broche 156 | GND — Ground |
| Broche 157 | I/O — User I/O pin (bank 5) |
| Broche 158 | I/O — User I/O pin (bank 5) |
| Broche 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 160 | I/O — User I/O pin (bank 5) |
| Broche 161 | I/O — User I/O pin (bank 6) |
| Broche 162 | I/O — User I/O pin (bank 6) |
| Broche 163 | GND — Ground |
| Broche 164 | I/O — User I/O pin (bank 6) |
| Broche 165 | I/O — User I/O pin (bank 6) |
| Broche 166 | VCCINT — Internal core supply 5V |
| Broche 167 | I/O — User I/O pin (bank 6) |
| Broche 168 | I/O — User I/O pin (bank 7) |
| Broche 169 | I/O — User I/O pin (bank 7) |
| Broche 170 | GND — Ground |
| Broche 171 | I/O — User I/O pin (bank 7) |
| Broche 172 | I/O — User I/O pin (bank 7) |
| Broche 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 174 | I/O — User I/O pin (bank 7) |
| Broche 175 | I/O — User I/O pin (bank 8) |
| Broche 176 | I/O — User I/O pin (bank 8) |
| Broche 177 | GND — Ground |
| Broche 178 | I/O — User I/O pin (bank 8) |
| Broche 179 | I/O — User I/O pin (bank 8) |
| Broche 180 | VCCINT — Internal core supply 5V |
| Broche 181 | I/O — User I/O pin (bank 8) |
| Broche 182 | I/O — User I/O pin (bank 1) |
| Broche 183 | I/O — User I/O pin (bank 1) |
| Broche 184 | GND — Ground |
| Broche 185 | I/O — User I/O pin (bank 1) |
| Broche 186 | I/O — User I/O pin (bank 1) |
| Broche 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 188 | I/O — User I/O pin (bank 1) |
| Broche 189 | I/O — User I/O pin (bank 2) |
| Broche 190 | I/O — User I/O pin (bank 2) |
| Broche 191 | GND — Ground |
| Broche 192 | I/O — User I/O pin (bank 2) |
| Broche 193 | I/O — User I/O pin (bank 2) |
| Broche 194 | VCCINT — Internal core supply 5V |
| Broche 195 | I/O — User I/O pin (bank 2) |
| Broche 196 | I/O — User I/O pin (bank 3) |
| Broche 197 | I/O — User I/O pin (bank 3) |
| Broche 198 | GND — Ground |
| Broche 199 | I/O — User I/O pin (bank 3) |
| Broche 200 | I/O — User I/O pin (bank 3) |
| Broche 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| Broche 202 | I/O — User I/O pin (bank 3) |
| Broche 203 | I/O — User I/O pin (bank 4) |
| Broche 204 | I/O — User I/O pin (bank 4) |
| Broche 205 | GND — Ground |
| Broche 206 | I/O — User I/O pin (bank 4) |
| Broche 207 | I/O — User I/O pin (bank 4) |
| Broche 208 | VCCINT — Internal core supply 5V |
Applications typiques
EPF8820ARI208-4 convient pour 6 applications: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
Recommandé
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
Recommandé
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
Recommandé
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
Recommandé
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
Recommandé
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ARI208-4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
Principaux différenciateurs
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (vs EPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (vs EPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (vs Discrete 74LS/74HC logic equivalent)
Notes de conception
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
Informations de conformité
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).