EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
N.º da peça: EPF8820ARI208-4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.2 | $28,20 |
| 10 | $22.5 | $225,00 |
| 100 | $15.8 | $1.580,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $8.7 | $8.700,00 |
EPF8820ARI208-4 Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
Alternativas drop-in para EPF8820ARI208-4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF8820ARI208-4 (mesmo formato e footprint) — diferindo em Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF8820ARI208-3
✅ Drop-In✓ Em estoque
$55.4 / unidade
Ver ficha técnica →EPF8820ARI208-3N
✅ Drop-In✓ Em estoque
$21.5 / unidade
Ver ficha técnica →EPF8820ARI208-2
✅ Drop-In✓ Em estoque
$11.5 / unidade
Ver ficha técnica →EPF8820ARI208-2N
✅ Drop-In✓ Em estoque
$99.5 / unidade
Ver ficha técnica →EPF8820ARI208-1
✅ Drop-In✓ Em estoque
$20.4 / unidade
Ver ficha técnica →EPF8820ARC208-4
✅ Drop-In✓ Em estoque
$25.4 / unidade
Ver ficha técnica →EPF8820ARC208-4N
✅ Drop-In✓ Em estoque
$32 / unidade
Ver ficha técnica →EPF8820ARI208-4 Classificações máximas e características elétricas
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| Encapsulamento | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
Configuração de pinos do EPF8820ARI208-4
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | VCCINT — Internal core supply 5V |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | GND — Ground |
| Pino 6 | nCONFIG — Configuration control (active low) |
| Pino 7 | nSTATUS — Configuration status (active low) |
| Pino 8 | CONF_DONE — Configuration complete indicator |
| Pino 9 | DCLK — Configuration clock input |
| Pino 10 | DATA0 — Configuration data input |
| Pino 11 | TCK — JTAG test clock |
| Pino 12 | TMS — JTAG test mode select |
| Pino 13 | TDI — JTAG test data in |
| Pino 14 | TDO — JTAG test data out |
| Pino 15 | CLK0 — Dedicated clock input 0 |
| Pino 16 | CLK1 — Dedicated clock input 1 |
| Pino 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | VCCINT — Internal core supply 5V |
| Pino 25 | I/O — User I/O pin (bank 3) |
| Pino 26 | I/O — User I/O pin (bank 3) |
| Pino 27 | I/O — User I/O pin (bank 3) |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O pin (bank 3) |
| Pino 30 | I/O — User I/O pin (bank 3) |
| Pino 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 32 | I/O — User I/O pin (bank 3) |
| Pino 33 | I/O — User I/O pin (bank 4) |
| Pino 34 | I/O — User I/O pin (bank 4) |
| Pino 35 | GND — Ground |
| Pino 36 | CLK2 — Dedicated clock input 2 |
| Pino 37 | CLK3 — Dedicated clock input 3 |
| Pino 38 | I/O — User I/O pin (bank 4) |
| Pino 39 | I/O — User I/O pin (bank 4) |
| Pino 40 | VCCINT — Internal core supply 5V |
| Pino 41 | I/O — User I/O pin (bank 4) |
| Pino 42 | I/O — User I/O pin (bank 4) |
| Pino 43 | I/O — User I/O pin (bank 5) |
| Pino 44 | GND — Ground |
| Pino 45 | I/O — User I/O pin (bank 5) |
| Pino 46 | I/O — User I/O pin (bank 5) |
| Pino 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 48 | I/O — User I/O pin (bank 5) |
| Pino 49 | I/O — User I/O pin (bank 5) |
| Pino 50 | I/O — User I/O pin (bank 6) |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O pin (bank 6) |
| Pino 53 | I/O — User I/O pin (bank 6) |
| Pino 54 | VCCINT — Internal core supply 5V |
| Pino 55 | I/O — User I/O pin (bank 6) |
| Pino 56 | I/O — User I/O pin (bank 6) |
| Pino 57 | I/O — User I/O pin (bank 7) |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O pin (bank 7) |
| Pino 60 | I/O — User I/O pin (bank 7) |
| Pino 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 62 | I/O — User I/O pin (bank 7) |
| Pino 63 | I/O — User I/O pin (bank 7) |
| Pino 64 | I/O — User I/O pin (bank 8) |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O pin (bank 8) |
| Pino 67 | I/O — User I/O pin (bank 8) |
| Pino 68 | VCCINT — Internal core supply 5V |
| Pino 69 | I/O — User I/O pin (bank 8) |
| Pino 70 | I/O — User I/O pin (bank 8) |
| Pino 71 | I/O — User I/O pin (bank 1) |
| Pino 72 | GND — Ground |
| Pino 73 | I/O — User I/O pin (bank 1) |
| Pino 74 | I/O — User I/O pin (bank 1) |
| Pino 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 76 | I/O — User I/O pin (bank 1) |
| Pino 77 | I/O — User I/O pin (bank 2) |
| Pino 78 | I/O — User I/O pin (bank 2) |
| Pino 79 | GND — Ground |
| Pino 80 | I/O — User I/O pin (bank 2) |
| Pino 81 | I/O — User I/O pin (bank 2) |
| Pino 82 | VCCINT — Internal core supply 5V |
| Pino 83 | I/O — User I/O pin (bank 2) |
| Pino 84 | I/O — User I/O pin (bank 3) |
| Pino 85 | I/O — User I/O pin (bank 3) |
| Pino 86 | GND — Ground |
| Pino 87 | I/O — User I/O pin (bank 3) |
| Pino 88 | I/O — User I/O pin (bank 3) |
| Pino 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 90 | I/O — User I/O pin (bank 3) |
| Pino 91 | I/O — User I/O pin (bank 4) |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | GND — Ground |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | I/O — User I/O pin (bank 4) |
| Pino 96 | VCCINT — Internal core supply 5V |
| Pino 97 | I/O — User I/O pin (bank 4) |
| Pino 98 | I/O — User I/O pin (bank 5) |
| Pino 99 | I/O — User I/O pin (bank 5) |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O pin (bank 5) |
| Pino 102 | I/O — User I/O pin (bank 5) |
| Pino 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 104 | I/O — User I/O pin (bank 5) |
| Pino 105 | I/O — User I/O pin (bank 6) |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | VCCINT — Internal core supply 5V |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 7) |
| Pino 113 | I/O — User I/O pin (bank 7) |
| Pino 114 | GND — Ground |
| Pino 115 | I/O — User I/O pin (bank 7) |
| Pino 116 | I/O — User I/O pin (bank 7) |
| Pino 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 118 | I/O — User I/O pin (bank 7) |
| Pino 119 | I/O — User I/O pin (bank 8) |
| Pino 120 | I/O — User I/O pin (bank 8) |
| Pino 121 | GND — Ground |
| Pino 122 | I/O — User I/O pin (bank 8) |
| Pino 123 | I/O — User I/O pin (bank 8) |
| Pino 124 | VCCINT — Internal core supply 5V |
| Pino 125 | I/O — User I/O pin (bank 8) |
| Pino 126 | I/O — User I/O pin (bank 1) |
| Pino 127 | I/O — User I/O pin (bank 1) |
| Pino 128 | GND — Ground |
| Pino 129 | I/O — User I/O pin (bank 1) |
| Pino 130 | I/O — User I/O pin (bank 1) |
| Pino 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 132 | I/O — User I/O pin (bank 1) |
| Pino 133 | I/O — User I/O pin (bank 2) |
| Pino 134 | I/O — User I/O pin (bank 2) |
| Pino 135 | GND — Ground |
| Pino 136 | I/O — User I/O pin (bank 2) |
| Pino 137 | I/O — User I/O pin (bank 2) |
| Pino 138 | VCCINT — Internal core supply 5V |
| Pino 139 | I/O — User I/O pin (bank 2) |
| Pino 140 | I/O — User I/O pin (bank 3) |
| Pino 141 | I/O — User I/O pin (bank 3) |
| Pino 142 | GND — Ground |
| Pino 143 | I/O — User I/O pin (bank 3) |
| Pino 144 | I/O — User I/O pin (bank 3) |
| Pino 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 146 | I/O — User I/O pin (bank 3) |
| Pino 147 | I/O — User I/O pin (bank 4) |
| Pino 148 | I/O — User I/O pin (bank 4) |
| Pino 149 | GND — Ground |
| Pino 150 | I/O — User I/O pin (bank 4) |
| Pino 151 | I/O — User I/O pin (bank 4) |
| Pino 152 | VCCINT — Internal core supply 5V |
| Pino 153 | I/O — User I/O pin (bank 4) |
| Pino 154 | I/O — User I/O pin (bank 5) |
| Pino 155 | I/O — User I/O pin (bank 5) |
| Pino 156 | GND — Ground |
| Pino 157 | I/O — User I/O pin (bank 5) |
| Pino 158 | I/O — User I/O pin (bank 5) |
| Pino 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 160 | I/O — User I/O pin (bank 5) |
| Pino 161 | I/O — User I/O pin (bank 6) |
| Pino 162 | I/O — User I/O pin (bank 6) |
| Pino 163 | GND — Ground |
| Pino 164 | I/O — User I/O pin (bank 6) |
| Pino 165 | I/O — User I/O pin (bank 6) |
| Pino 166 | VCCINT — Internal core supply 5V |
| Pino 167 | I/O — User I/O pin (bank 6) |
| Pino 168 | I/O — User I/O pin (bank 7) |
| Pino 169 | I/O — User I/O pin (bank 7) |
| Pino 170 | GND — Ground |
| Pino 171 | I/O — User I/O pin (bank 7) |
| Pino 172 | I/O — User I/O pin (bank 7) |
| Pino 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 174 | I/O — User I/O pin (bank 7) |
| Pino 175 | I/O — User I/O pin (bank 8) |
| Pino 176 | I/O — User I/O pin (bank 8) |
| Pino 177 | GND — Ground |
| Pino 178 | I/O — User I/O pin (bank 8) |
| Pino 179 | I/O — User I/O pin (bank 8) |
| Pino 180 | VCCINT — Internal core supply 5V |
| Pino 181 | I/O — User I/O pin (bank 8) |
| Pino 182 | I/O — User I/O pin (bank 1) |
| Pino 183 | I/O — User I/O pin (bank 1) |
| Pino 184 | GND — Ground |
| Pino 185 | I/O — User I/O pin (bank 1) |
| Pino 186 | I/O — User I/O pin (bank 1) |
| Pino 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 188 | I/O — User I/O pin (bank 1) |
| Pino 189 | I/O — User I/O pin (bank 2) |
| Pino 190 | I/O — User I/O pin (bank 2) |
| Pino 191 | GND — Ground |
| Pino 192 | I/O — User I/O pin (bank 2) |
| Pino 193 | I/O — User I/O pin (bank 2) |
| Pino 194 | VCCINT — Internal core supply 5V |
| Pino 195 | I/O — User I/O pin (bank 2) |
| Pino 196 | I/O — User I/O pin (bank 3) |
| Pino 197 | I/O — User I/O pin (bank 3) |
| Pino 198 | GND — Ground |
| Pino 199 | I/O — User I/O pin (bank 3) |
| Pino 200 | I/O — User I/O pin (bank 3) |
| Pino 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| Pino 202 | I/O — User I/O pin (bank 3) |
| Pino 203 | I/O — User I/O pin (bank 4) |
| Pino 204 | I/O — User I/O pin (bank 4) |
| Pino 205 | GND — Ground |
| Pino 206 | I/O — User I/O pin (bank 4) |
| Pino 207 | I/O — User I/O pin (bank 4) |
| Pino 208 | VCCINT — Internal core supply 5V |
Aplicações típicas
EPF8820ARI208-4 é adequado para 6 aplicaçãos: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
Recomendado
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
Recomendado
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
Recomendado
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
Recomendado
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
Recomendado
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF8820ARI208-4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
Principais diferenciais
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (vs EPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (vs EPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (vs Discrete 74LS/74HC logic equivalent)
Notas de projeto
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
Informações de conformidade
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).