EPF8820ARC208-4N - FLEX 8000 FPGA 8K Gates 672 Cells | Altera
MPN: EPF8820ARC208-4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.65 | $436.50 |
| 100 | $38.8 | $3,880.00 |
| 250 | $35.2 | $8,800.00 |
| 500 | $32 | $16,000.00 |
Drop-in alternatives for EPF8820ARC208-4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
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View Datasheet βEPF8820ARC208-4N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 8,000 |
| Logic Elements (Cells) | 672 |
| Maximum Operating Frequency | 125 MHz |
| Propagation Delay | 5.5 ns |
| Number of User I/O | 152 |
| Dedicated Inputs | 4 |
| Core Voltage | 5 V (4.75 V to 5.25 V) |
| I/O Voltage | 3.3 V or 5 V (configurable) |
| Process Technology | 0.42 Β΅m CMOS |
| Package | 208-RQFP / BFQFP with exposed pad |
| Configuration Memory | SRAM (volatile) |
| Operating Temperature (Commercial) | 0 Β°C to +70 Β°C |
| Operating Temperature (Industrial) | -40 Β°C to +85 Β°C |
| In-Circuit Reconfigurability | Yes (via external configuration device or intelligent controller) |
| Boundary-Scan (JTAG) | Yes (IEEE 1149.1 compliant) |
| Mounting Type | Surface Mount |
EPF8820ARC208-4N Pin Configuration
| Pin 1 | I/O β User I/O pin |
| Pin 2 | I/O β User I/O pin |
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| Pin 11 | GND β Ground |
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| Pin 20 | I/O β User I/O pin |
| Pin 21 | VCC β +5 V core supply |
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| Pin 32 | GND β Ground |
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| Pin 43 | VCC β +5 V core supply |
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| Pin 54 | GND β Ground |
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| Pin 65 | VCC β +5 V core supply |
| Pin 66 | I/O β User I/O pin |
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| Pin 76 | GND β Ground |
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| Pin 87 | VCC β +5 V core supply |
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| Pin 98 | GND β Ground |
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| Pin 109 | VCC β +5 V core supply |
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| Pin 120 | GND β Ground |
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| Pin 131 | VCCINT β Internal core voltage (after on-chip regulator) |
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| Pin 142 | GND β Ground |
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| Pin 153 | VCC β +5 V I/O supply |
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| Pin 164 | GND β Ground |
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| Pin 174 | I/O β User I/O pin |
| Pin 175 | VCC β +5 V I/O supply |
| Pin 176 | I/O β User I/O pin |
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| Pin 186 | GND β Ground |
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| Pin 196 | I/O β User I/O pin |
| Pin 197 | VCC β +5 V I/O supply |
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| Pin 207 | I/O β User I/O pin |
| Pin 208 | EXPOSED PAD β Thermal pad (must be soldered to copper pour) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ARC208-4N is suitable for 6 applications: Industrial Control Glue Logic, Peripheral Bus Bridge (PCI / ISA / VME), Telecommunications Line-Card Interface, Custom Register and FIFO Interface, Legacy System Upgrade (TTL Replacement), Test and Measurement Instrument Front-End.
Industrial Control Glue Logic
The EPF8820ARC208-4N fits industrial control glue logic because its 8,000 usable gates and 152 user I/O consolidate dozens of 74-series TTL packages into a single reconfigurable device. The 5 V tolerant I/O (3.3 V or 5 V configurable) directly interfaces with legacy 5 V peripherals, optocouplers, and 24 V industrial sensor interfaces through external level shifters. With a 5.5 ns propagation delay and 125 MHz internal performance, the device can implement deterministic state machines for motor-control sequencing, conveyor logic, and PLC I/O expansion. The exposed thermal pad and industrial temperature grade (-40 Β°C to +85 Β°C) ensure reliable operation in factory-floor enclosures. Recommended companion parts: EPF8452ATC100-4N for distributed I/O nodes; the EPF8820ARC208-2N for higher-speed variants.
Recommended
Peripheral Bus Bridge (PCI / ISA / VME)
The EPF8820ARC208-4N is well suited for legacy peripheral bus bridging between PCI, ISA, and VME buses because its 152 user I/O and 5.5 ns propagation delay meet the 33 MHz PCI timing budget for state machines and address decoding. The device's high register count enables parallel FIFO implementations for DMA handshaking, while the 8,000-gate capacity is sufficient for full bus-master controllers. The 5 V I/O compatibility allows direct interface to legacy ISA and VME buses without external transceivers. The exposed thermal pad supports continuous operation in densely populated backplane designs. Recommended companions: EPF81188ARC240-4 for higher-density VME controllers; EPF81500ARC304-4 for multi-bus gateway designs.
Recommended
Telecommunications Line-Card Interface
The EPF8820ARC208-4N serves telecom line-card interface designs because its 152 user I/O supports HDLC controllers, T1/E1 framers, and serial backplane interfaces in a single device. The 5.5 ns propagation delay and 125 MHz internal frequency enable 8.192 MHz E1 and 1.544 MHz T1 data stream processing with comfortable timing margins. JTAG boundary-scan (IEEE 1149.1) compliance provides board-level test access for telecom manufacturing tests. In-circuit reconfigurability via external configuration devices supports field upgrades and fault recovery without powering down the line card. Recommended companions: EPF8820ARC208-3N for cost-optimized variants; EPF8636ARC208-4 for simpler line interfaces.
Recommended
Custom Register and FIFO Interface
The EPF8820ARC208-4N is ideal for custom register and FIFO interface designs because its register-rich architecture (672 cells, predominantly flip-flop based) supports large register banks and parallel FIFOs with minimal logic overhead. The continuous FastTrack interconnect provides predictable routing delays essential for synchronous FIFO flag generation and credit-based flow control. With 8,000 usable gates, designers can implement 32-bit x 1k FIFO plus DMA handshake logic in a single device. The 5 V I/O allows direct connection to legacy bus transceivers without external level translation. Recommended companions: EPF8820ARC208-2N for higher-speed FIFO flag generation; EPF8452AQC160-4 for distributed register sub-nodes.
Recommended
Legacy System Upgrade (TTL Replacement)
The EPF8820ARC208-4N is a strong fit for legacy system upgrades replacing dozens of 74F/74AS/74LS TTL packages because its 152 user I/O and 5 V I/O tolerance allow direct replacement of wide datapath logic without PCB changes. Designers can implement address latches, bus transceivers, parity generators, interrupt controllers, and custom state machines in a single FPGA, dramatically reducing board area and power consumption. The exposed thermal pad and industrial temperature grade support operation in legacy telecom and industrial chassis. SRAM-based configuration memory requires a serial configuration PROM (EPC1 or EPC2) on the board. Recommended companions: EPC1PC8 configuration PROM; EPF8820ARC208-4 for non-RoHS designs.
Recommended
Test and Measurement Instrument Front-End
The EPF8820ARC208-4N fits test and measurement instrument front-ends because its 152 user I/O and 5.5 ns propagation delay enable custom timing generators, pattern sequencers, and channel-multiplexer control logic. The device can coordinate analog multiplexer switching, ADC/DAC trigger signals, and front-panel display scanning with deterministic timing. JTAG boundary-scan integration simplifies board-level test fixtures and manufacturing tests. The exposed thermal pad supports continuous operation in instrument chassis with limited airflow. The 5 V I/O is compatible with legacy analog front-end ICs from Analog Devices and Texas Instruments. Recommended companions: EPF81188ARC240-4 for higher-channel-count instruments; EPF8636ARC208-3 for portable instruments.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ARC208-4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ARC208-4 | EPF8820ARC208-3N | EPF8820ARC208-2N | EPF8820AQC208-4 | EPF8636ARC208-4 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 208-RQFP (28x28) with exposed pad | 208-RQFP (28x28) with exposed pad | 208-RQFP (28x28) with exposed pad | 208-RQFP (28x28) with exposed pad | 208-PQFP (28x28) | 208-RQFP (28x28) with exposed pad |
| Usable Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 6,000 |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 504 |
| Speed Grade | -4 (5.5 ns) | -4 (5.5 ns) | -3 (~6 ns) | -2 (faster) | -4 (5.5 ns) | -4 (5.5 ns) |
| RoHS Compliance | Yes (Pb-free, -N suffix) | No (leaded) | Yes (Pb-free) | Yes (Pb-free) | No (leaded) | No (leaded) |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lead-free / RoHS-compliant variant in same footprint (vs EPF8820ARC208-4)
- Highest speed grade in the EPF8820ARC208 family (vs EPF8820ARC208-3N)
- Maximum logic capacity in the 208-pin FLEX 8000 family (vs EPF8636ARC208-4)
Design Notes
The EPF8820ARC208-4N requires five VCC pins (4.75 V to 5.25 V) plus an internal core voltage pin. Per the FLEX 8000 datasheet, decouple each VCC pin with a 0.1 Β΅F X7R ceramic capacitor placed within 5 mm of the pin, plus a single 10 Β΅F tantalum bulk capacitor near the package. Configuration PROMs (EPC1, EPC2) must share this decoupling network to avoid in-rush current glitches that can corrupt configuration.
The exposed thermal pad on the 208-RQFP package MUST be soldered to a copper pour of at least 1 square inch (645 mmΒ²) for industrial-temperature (-40 Β°C to +85 Β°C) operation. Estimated: with the -4 speed grade at 125 MHz and full I/O toggling, dynamic current consumption reaches approximately 200 mA, dissipating 1 W. Without proper thermal pad soldering, junction temperature can exceed 100 Β°C and trigger thermal-induced timing failure. Reference the FLEX 8000 packaging thermal characteristics section for theta-JA values.
Place the EPC1 or EPC2 configuration PROM within 50 mm of the FPGA to keep configuration traces short and avoid reflection-induced configuration failures. Use 4-layer PCB with dedicated ground and power planes; route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) as 50 Ξ© microstrip on the top layer over a continuous ground plane. The 208-RQFP pin pitch is 0.5 mm, so use 0.2 mm/8 mil trace/space design rules.
Do not assume the SRAM configuration memory retains bitstream after power-off - it does not. The EPF8820ARC208-4N requires reconfiguration on every power-up via an external EPC1/EPC2 PROM or intelligent controller. For designs requiring non-volatile bitstream retention, consider migrating to a MAX series CPLD or a flash-based FPGA. Also note that the 5 V I/O banks are NOT 5 V tolerant when VCCIO is set to 3.3 V; exceeding VCCIO + 0.5 V damages the I/O cells.
The FLEX 8000 FastTrack interconnect uses continuous routing rows and columns; place high-fanout signals (clock, global enable) on dedicated global routing lines (CLK1, CLK2, OE, CLR) to avoid contention with general routing. Keep high-speed I/O (e.g., 50 MHz clock outputs) on the dedicated clock output pins to leverage the FastTrack low-skew network. Reference the FLEX 8000 handbook chapter on FastTrack routing for detailed placement guidelines.
Compliance Information
Pb-free / RoHS-compliant per the -N suffix part-number convention. Not AEC-Q100 qualified (commercial/industrial temperature grades only). Halogen-free and conflict-minerals status not stated in the available data.
