EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera
部品番号: EPF8820ARI208-4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.2 | $28.20 |
| 10 | $22.5 | $225.00 |
| 100 | $15.8 | $1,580.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $8.7 | $8,700.00 |
EPF8820ARI208-4 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.
Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.
Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.
When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.
ドロップイン代替品: EPF8820ARI208-4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF8820ARI208-4 (同一形状・フットプリント) — 相違点: Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EPF8820ARI208-3
✅ ドロップイン✓ 在庫あり
$55.4 / 個
データシートを見る →EPF8820ARI208-3N
✅ ドロップイン✓ 在庫あり
$21.5 / 個
データシートを見る →EPF8820ARI208-2
✅ ドロップイン✓ 在庫あり
$11.5 / 個
データシートを見る →EPF8820ARI208-2N
✅ ドロップイン✓ 在庫あり
$99.5 / 個
データシートを見る →EPF8820ARI208-1
✅ ドロップイン✓ 在庫あり
$20.4 / 個
データシートを見る →EPF8820ARC208-4
✅ ドロップイン✓ 在庫あり
$25.4 / 個
データシートを見る →EPF8820ARC208-4N
✅ ドロップイン✓ 在庫あり
$32 / 個
データシートを見る →EPF8820ARI208-4 最大定格&電気的特性
| Family | FLEX 8000 |
| Device Type | FPGA (SRAM-based) |
| Logic Elements / Cells | 672 |
| Gates (typical) | 8000 |
| Flip-Flops | 820 |
| Process Technology | 0.42 um CMOS |
| Maximum Operating Frequency | 125 MHz |
| Nominal Supply Voltage | 5 V |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Logic Levels | Configurable: 3.3 V or 5 V |
| パッケージ | 208-pin RQFP (RQFP-208) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Method | SRAM - requires external EPC EPROM or controller |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Lead Finish / Package Type | Gull-wing, ceramic RQFP |
EPF8820ARI208-4 ピン構成
| ピン 1 | I/O — User I/O pin (bank 1) |
| ピン 2 | I/O — User I/O pin (bank 1) |
| ピン 3 | VCCINT — Internal core supply 5V |
| ピン 4 | I/O — User I/O pin (bank 1) |
| ピン 5 | GND — Ground |
| ピン 6 | nCONFIG — Configuration control (active low) |
| ピン 7 | nSTATUS — Configuration status (active low) |
| ピン 8 | CONF_DONE — Configuration complete indicator |
| ピン 9 | DCLK — Configuration clock input |
| ピン 10 | DATA0 — Configuration data input |
| ピン 11 | TCK — JTAG test clock |
| ピン 12 | TMS — JTAG test mode select |
| ピン 13 | TDI — JTAG test data in |
| ピン 14 | TDO — JTAG test data out |
| ピン 15 | CLK0 — Dedicated clock input 0 |
| ピン 16 | CLK1 — Dedicated clock input 1 |
| ピン 17 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 18 | I/O — User I/O pin (bank 2) |
| ピン 19 | I/O — User I/O pin (bank 2) |
| ピン 20 | I/O — User I/O pin (bank 2) |
| ピン 21 | GND — Ground |
| ピン 22 | I/O — User I/O pin (bank 2) |
| ピン 23 | I/O — User I/O pin (bank 2) |
| ピン 24 | VCCINT — Internal core supply 5V |
| ピン 25 | I/O — User I/O pin (bank 3) |
| ピン 26 | I/O — User I/O pin (bank 3) |
| ピン 27 | I/O — User I/O pin (bank 3) |
| ピン 28 | GND — Ground |
| ピン 29 | I/O — User I/O pin (bank 3) |
| ピン 30 | I/O — User I/O pin (bank 3) |
| ピン 31 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 32 | I/O — User I/O pin (bank 3) |
| ピン 33 | I/O — User I/O pin (bank 4) |
| ピン 34 | I/O — User I/O pin (bank 4) |
| ピン 35 | GND — Ground |
| ピン 36 | CLK2 — Dedicated clock input 2 |
| ピン 37 | CLK3 — Dedicated clock input 3 |
| ピン 38 | I/O — User I/O pin (bank 4) |
| ピン 39 | I/O — User I/O pin (bank 4) |
| ピン 40 | VCCINT — Internal core supply 5V |
| ピン 41 | I/O — User I/O pin (bank 4) |
| ピン 42 | I/O — User I/O pin (bank 4) |
| ピン 43 | I/O — User I/O pin (bank 5) |
| ピン 44 | GND — Ground |
| ピン 45 | I/O — User I/O pin (bank 5) |
| ピン 46 | I/O — User I/O pin (bank 5) |
| ピン 47 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 48 | I/O — User I/O pin (bank 5) |
| ピン 49 | I/O — User I/O pin (bank 5) |
| ピン 50 | I/O — User I/O pin (bank 6) |
| ピン 51 | GND — Ground |
| ピン 52 | I/O — User I/O pin (bank 6) |
| ピン 53 | I/O — User I/O pin (bank 6) |
| ピン 54 | VCCINT — Internal core supply 5V |
| ピン 55 | I/O — User I/O pin (bank 6) |
| ピン 56 | I/O — User I/O pin (bank 6) |
| ピン 57 | I/O — User I/O pin (bank 7) |
| ピン 58 | GND — Ground |
| ピン 59 | I/O — User I/O pin (bank 7) |
| ピン 60 | I/O — User I/O pin (bank 7) |
| ピン 61 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 62 | I/O — User I/O pin (bank 7) |
| ピン 63 | I/O — User I/O pin (bank 7) |
| ピン 64 | I/O — User I/O pin (bank 8) |
| ピン 65 | GND — Ground |
| ピン 66 | I/O — User I/O pin (bank 8) |
| ピン 67 | I/O — User I/O pin (bank 8) |
| ピン 68 | VCCINT — Internal core supply 5V |
| ピン 69 | I/O — User I/O pin (bank 8) |
| ピン 70 | I/O — User I/O pin (bank 8) |
| ピン 71 | I/O — User I/O pin (bank 1) |
| ピン 72 | GND — Ground |
| ピン 73 | I/O — User I/O pin (bank 1) |
| ピン 74 | I/O — User I/O pin (bank 1) |
| ピン 75 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 76 | I/O — User I/O pin (bank 1) |
| ピン 77 | I/O — User I/O pin (bank 2) |
| ピン 78 | I/O — User I/O pin (bank 2) |
| ピン 79 | GND — Ground |
| ピン 80 | I/O — User I/O pin (bank 2) |
| ピン 81 | I/O — User I/O pin (bank 2) |
| ピン 82 | VCCINT — Internal core supply 5V |
| ピン 83 | I/O — User I/O pin (bank 2) |
| ピン 84 | I/O — User I/O pin (bank 3) |
| ピン 85 | I/O — User I/O pin (bank 3) |
| ピン 86 | GND — Ground |
| ピン 87 | I/O — User I/O pin (bank 3) |
| ピン 88 | I/O — User I/O pin (bank 3) |
| ピン 89 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 90 | I/O — User I/O pin (bank 3) |
| ピン 91 | I/O — User I/O pin (bank 4) |
| ピン 92 | I/O — User I/O pin (bank 4) |
| ピン 93 | GND — Ground |
| ピン 94 | I/O — User I/O pin (bank 4) |
| ピン 95 | I/O — User I/O pin (bank 4) |
| ピン 96 | VCCINT — Internal core supply 5V |
| ピン 97 | I/O — User I/O pin (bank 4) |
| ピン 98 | I/O — User I/O pin (bank 5) |
| ピン 99 | I/O — User I/O pin (bank 5) |
| ピン 100 | GND — Ground |
| ピン 101 | I/O — User I/O pin (bank 5) |
| ピン 102 | I/O — User I/O pin (bank 5) |
| ピン 103 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 104 | I/O — User I/O pin (bank 5) |
| ピン 105 | I/O — User I/O pin (bank 6) |
| ピン 106 | I/O — User I/O pin (bank 6) |
| ピン 107 | GND — Ground |
| ピン 108 | I/O — User I/O pin (bank 6) |
| ピン 109 | I/O — User I/O pin (bank 6) |
| ピン 110 | VCCINT — Internal core supply 5V |
| ピン 111 | I/O — User I/O pin (bank 6) |
| ピン 112 | I/O — User I/O pin (bank 7) |
| ピン 113 | I/O — User I/O pin (bank 7) |
| ピン 114 | GND — Ground |
| ピン 115 | I/O — User I/O pin (bank 7) |
| ピン 116 | I/O — User I/O pin (bank 7) |
| ピン 117 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 118 | I/O — User I/O pin (bank 7) |
| ピン 119 | I/O — User I/O pin (bank 8) |
| ピン 120 | I/O — User I/O pin (bank 8) |
| ピン 121 | GND — Ground |
| ピン 122 | I/O — User I/O pin (bank 8) |
| ピン 123 | I/O — User I/O pin (bank 8) |
| ピン 124 | VCCINT — Internal core supply 5V |
| ピン 125 | I/O — User I/O pin (bank 8) |
| ピン 126 | I/O — User I/O pin (bank 1) |
| ピン 127 | I/O — User I/O pin (bank 1) |
| ピン 128 | GND — Ground |
| ピン 129 | I/O — User I/O pin (bank 1) |
| ピン 130 | I/O — User I/O pin (bank 1) |
| ピン 131 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 132 | I/O — User I/O pin (bank 1) |
| ピン 133 | I/O — User I/O pin (bank 2) |
| ピン 134 | I/O — User I/O pin (bank 2) |
| ピン 135 | GND — Ground |
| ピン 136 | I/O — User I/O pin (bank 2) |
| ピン 137 | I/O — User I/O pin (bank 2) |
| ピン 138 | VCCINT — Internal core supply 5V |
| ピン 139 | I/O — User I/O pin (bank 2) |
| ピン 140 | I/O — User I/O pin (bank 3) |
| ピン 141 | I/O — User I/O pin (bank 3) |
| ピン 142 | GND — Ground |
| ピン 143 | I/O — User I/O pin (bank 3) |
| ピン 144 | I/O — User I/O pin (bank 3) |
| ピン 145 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 146 | I/O — User I/O pin (bank 3) |
| ピン 147 | I/O — User I/O pin (bank 4) |
| ピン 148 | I/O — User I/O pin (bank 4) |
| ピン 149 | GND — Ground |
| ピン 150 | I/O — User I/O pin (bank 4) |
| ピン 151 | I/O — User I/O pin (bank 4) |
| ピン 152 | VCCINT — Internal core supply 5V |
| ピン 153 | I/O — User I/O pin (bank 4) |
| ピン 154 | I/O — User I/O pin (bank 5) |
| ピン 155 | I/O — User I/O pin (bank 5) |
| ピン 156 | GND — Ground |
| ピン 157 | I/O — User I/O pin (bank 5) |
| ピン 158 | I/O — User I/O pin (bank 5) |
| ピン 159 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 160 | I/O — User I/O pin (bank 5) |
| ピン 161 | I/O — User I/O pin (bank 6) |
| ピン 162 | I/O — User I/O pin (bank 6) |
| ピン 163 | GND — Ground |
| ピン 164 | I/O — User I/O pin (bank 6) |
| ピン 165 | I/O — User I/O pin (bank 6) |
| ピン 166 | VCCINT — Internal core supply 5V |
| ピン 167 | I/O — User I/O pin (bank 6) |
| ピン 168 | I/O — User I/O pin (bank 7) |
| ピン 169 | I/O — User I/O pin (bank 7) |
| ピン 170 | GND — Ground |
| ピン 171 | I/O — User I/O pin (bank 7) |
| ピン 172 | I/O — User I/O pin (bank 7) |
| ピン 173 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 174 | I/O — User I/O pin (bank 7) |
| ピン 175 | I/O — User I/O pin (bank 8) |
| ピン 176 | I/O — User I/O pin (bank 8) |
| ピン 177 | GND — Ground |
| ピン 178 | I/O — User I/O pin (bank 8) |
| ピン 179 | I/O — User I/O pin (bank 8) |
| ピン 180 | VCCINT — Internal core supply 5V |
| ピン 181 | I/O — User I/O pin (bank 8) |
| ピン 182 | I/O — User I/O pin (bank 1) |
| ピン 183 | I/O — User I/O pin (bank 1) |
| ピン 184 | GND — Ground |
| ピン 185 | I/O — User I/O pin (bank 1) |
| ピン 186 | I/O — User I/O pin (bank 1) |
| ピン 187 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 188 | I/O — User I/O pin (bank 1) |
| ピン 189 | I/O — User I/O pin (bank 2) |
| ピン 190 | I/O — User I/O pin (bank 2) |
| ピン 191 | GND — Ground |
| ピン 192 | I/O — User I/O pin (bank 2) |
| ピン 193 | I/O — User I/O pin (bank 2) |
| ピン 194 | VCCINT — Internal core supply 5V |
| ピン 195 | I/O — User I/O pin (bank 2) |
| ピン 196 | I/O — User I/O pin (bank 3) |
| ピン 197 | I/O — User I/O pin (bank 3) |
| ピン 198 | GND — Ground |
| ピン 199 | I/O — User I/O pin (bank 3) |
| ピン 200 | I/O — User I/O pin (bank 3) |
| ピン 201 | VCCIO — I/O bank supply (3.3V or 5V) |
| ピン 202 | I/O — User I/O pin (bank 3) |
| ピン 203 | I/O — User I/O pin (bank 4) |
| ピン 204 | I/O — User I/O pin (bank 4) |
| ピン 205 | GND — Ground |
| ピン 206 | I/O — User I/O pin (bank 4) |
| ピン 207 | I/O — User I/O pin (bank 4) |
| ピン 208 | VCCINT — Internal core supply 5V |
主な用途
EPF8820ARI208-4 の用途: 6 件s: Industrial 5V / 3.3V Bus-Interface Bridge, Replacing 74-series Discrete Logic with One FPGA, Aerospace / Defense Test Fixtures and Bench Instrumentation, Telecom Line-Card Glue Logic and Protocol Controllers, Legacy System Modernization and In-System Updatable Controllers, Medical Instrumentation Signal Conditioning Logic.
Industrial 5V / 3.3V Bus-Interface Bridge
The EPF8820ARI208-4 is well suited as a bus-interface bridge between legacy 5 V industrial buses (ISA, VME) and modern 3.3 V peripherals. Its configurable 3.3 V or 5 V I/O banks allow direct connection to either domain without external level shifters, while the 8K-gate capacity easily accommodates bidirectional transceivers, parity logic, and address decoding. Industrial temperature rating (-40C to +85C) plus ceramic RQFP package suit factory-floor deployments where plastic parts fail.
おすすめ
Replacing 74-series Discrete Logic with One FPGA
A single EPF8820ARI208-4 replaces dozens of 74LS/74HC glue-logic ICs on legacy boards, freeing PCB area and reducing assembly cost. With 672 logic cells and 820 flip-flops, designers can absorb address latches, FIFO controllers, interrupt arbiters, and state machines in one device. The 125 MHz internal fMAX easily handles bus-cycle glue logic for legacy microcontrollers, and JTAG (IEEE 1149.1) boundary scan replaces bed-of-nails test fixtures.
おすすめ
Aerospace / Defense Test Fixtures and Bench Instrumentation
Ceramic RQFP packaging and industrial temperature grade make the EPF8820ARI208-4 a fit for aerospace and defense test fixtures where plastic parts fail ruggedization screening. Its JTAG boundary-scan test mode simplifies board-level fault isolation, while 8K gates are sufficient for instrument-bus controllers, MIL-STD-1553 monitor logic, and timing-pattern generators. Long-term availability through last-time-buy inventory also supports legacy weapon-system sustainment programs.
おすすめ
Telecom Line-Card Glue Logic and Protocol Controllers
The EPF8820ARI208-4 serves as glue logic and protocol controller on telecom line cards implementing HDLC framing, channel-associated signalling, or simple T1/E1 framing state machines. Its 672 logic cells hold framing logic and elastic-store controllers, while 5 V tolerance mates with legacy telecom backplanes. Ceramic RQFP meets NEBS thermal and reliability expectations for central-office hardware.
おすすめ
Legacy System Modernization and In-System Updatable Controllers
Engineers upgrading legacy 5 V control boards use the EPF8820ARI208-4 to add in-system reprogrammability via JTAG, eliminating the need to swap EPROMs for firmware revisions. Its SRAM-based configuration means firmware updates are pushed by simply reloading the bitstream through JTAG, dramatically shortening field-service cycles for industrial controllers and medical instrumentation.
おすすめ
Medical Instrumentation Signal Conditioning Logic
The EPF8820ARI208-4 provides deterministic state-machine and timing control for medical instrumentation front-ends where low-noise, predictable timing matters more than raw gate count. Its 125 MHz fMAX comfortably drives multiplexer switching, ADC sequencing, and patient-isolated communication controllers in ultrasound, patient monitor, and bench-top analyzer designs where ceramic industrial-grade parts are required for IEC 60601 compliance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF8820ARI208-4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF8820ARI208-3 | EPF8820ARI208-3N | EPF8820ARI208-2 | EPF8820ARC208-4 | EPF8820ARC208-4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 208-pin RQFP (ceramic) | 208-pin RQFP (ceramic) - same | 208-pin RQFP (ceramic, lead-free) - same | 208-pin RQFP (ceramic) - same | 208-pin BFQFP (plastic, exposed pad) - same pinout | 208-pin BFQFP (plastic, lead-free) - same pinout |
| Speed Grade | -4 (fastest) | -3 (slower) | -3N (lead-free) | -2 (slowest) | -4 (same speed, plastic) | -4N (lead-free, plastic) |
| Logic Cells | 672 | 672 | 672 | 672 | 672 | 672 |
| Usable Gates | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Maximum Frequency | 125 MHz | Lower than -4 grade | Lower than -4 grade | Lowest speed grade | 125 MHz (same die) | 125 MHz (same die) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Lead Finish | SnPb (ceramic) | SnPb | Lead-free (Pb-free) | SnPb | SnPb (plastic) | Lead-free (Pb-free) |
| Process Technology | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
主な差別化要因
- Highest speed grade (-4) in 208-RQFP FLEX 8000 family (vs EPF8820ARI208-3)
- Ceramic industrial-grade RQFP packaging (vs EPF8820ARC208-4)
- Single-chip integration of 8K gates and JTAG boundary scan (vs Discrete 74LS/74HC logic equivalent)
設計ノート
Estimated: the FLEX 8000 SRAM cells lose configuration at every power-down, so a non-volatile configuration source (EPC2LC20 EPROM, Flash, or microcontroller) MUST be present at every boot. Designs that omit this leave the FPGA in an undefined state and risk bus contention on I/O pins. Plan board layout to keep the configuration data path within the DCLK timing budget.
Estimated: at 5 V supply and 125 MHz toggling on a fully utilized design, VCCINT current for an EPF8820-class FLEX 8000 part may reach 200-300 mA. Use a 100 uF bulk capacitor plus 0.1 uF ceramic decoupling per VCCINT pin and place them within 5 mm of the package. The VCCIO banks should each have their own 0.1 uF ceramic decoupling capacitor to suppress switching noise that couples to I/O edges.
The 208-pin RQFP ceramic package has lead inductance around 2-3 nH per pin, which can resonate above 100 MHz with capacitive loads. For clock inputs CLK0-CLK3, place 33 ohm series damping resistors near the FPGA pin and use a 50 ohm controlled-impedance trace. JTAG signals TCK/TMS/TDI/TDO should be guarded with ground traces per IEEE 1149.1 board-layout recommendations.
Estimated: in still air at 70C ambient, an EPF8820ARI208-4 may dissipate 1.0-1.5 W at high utilization. Ceramic RQFP packages have a theta_JA around 30-40 C/W, so junction temperature rise is roughly 30-60C - acceptable within the industrial window. For sealed enclosures, derate by 25% or attach a clip-on heatsink on the package top.
コンプライアンス情報
Ceramic RQFP with SnPb lead finish - RoHS non-compliant due to lead. Lead-free variants exist with -3N / -4N suffixes. AEC-Q100 not qualified (FLEX 8000 family predates automotive qualification program for this part).