EPM1270F256I5N - 980-Macrocell MAX II CPLD, 256-FBGA | Intel / Altera
Référence : EPM1270F256I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $20.75 | $20,75 |
| 10 | $19.2 | $192,00 |
| 100 | $17.45 | $1 745,00 |
| 250 | $16.1 | $4 025,00 |
| 500 | $14.85 | $7 425,00 |
EPM1270F256I5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple glue-logic PAL/GAL devices and larger FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> logic IC -> semiconductor. MAX II CPLDs use a unique MultiCore architecture pairing a LUT-based logic array with Flash configuration memory, providing instant-on behavior at power-up without external boot ROM - a key advantage over SRAM-based FPGAs in cost-sensitive and power-constrained designs.
Key features include 980 macrocells (1270 logic elements), 8 Kbits user Flash memory, JTAG IEEE 1149.1 boundary-scan and in-system programmability via JTAG, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and a dedicated 3.3 V PCI-compliant I/O bank. The on-chip voltage regulator accepts a single 3.3 V supply and generates the internal core voltage, simplifying power tree design compared to legacy 5 V CPLDs.
Typical applications include bus-interface bridging, I/O expansion and voltage-level translation, power-up sequencing logic, and glue-logic consolidation replacing multiple discrete PAL/GAL devices. The instant-on Flash architecture and industrial temperature range make EPM1270F256I5N especially common in telecom line cards, industrial controllers, and automotive infotainment subsystems where deterministic boot behavior is mandatory.
When designing with this part, provide a minimum of four PCB layers with continuous ground and power planes for the FBGA-256 ball field, and use the Quartus II (or Quartus Prime Lite) design suite with a USB-Blaster or ByteBlaster for JTAG programming. Decoupling: place 0.1 uF ceramic capacitors within 50 mil of every VCCIO/VCCINT ball group, plus a 10 uF bulk cap near the supply pins.
This page synthesizes distributor pricing, drop-in same-family MAX II alternatives, and practical FBGA-256 PCB design notes not collected in a single place in the original Altera datasheet.
Alternatives de remplacement direct pour EPM1270F256I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM1270F256I5N (même facteur de forme et même empreinte) — différant par Programming Interface, Operating Temperature, Package, Family, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM1270F256I5
✅ Remplacement direct✓ En stock
$16.9 / unité
Voir la fiche technique →EPM1270F256I5RR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM1270F256I5ES
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM1270F256I3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM1270F256C5N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM1270GF256I5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM1270F256I5N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | MAX II (EPM1270) |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macro Cells | 980 |
| Logic Elements | 1270 |
| User I/O Pins | 212 |
| User Flash Memory | 8 Kbits |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Logic Delay | 6.2 ns (I5 speed grade) |
| External Supply Voltage | 2.5 V / 3.3 V |
| Internal Core Voltage | 1.8 V (on-chip regulator) |
| I/O Bank Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank |
| Process Technology | 0.18-micron Flash-based CMOS |
| Configuration Memory | Non-volatile Flash (instant-on) |
| Programming Interface | JTAG IEEE 1149.1 (boundary-scan + ISP) |
| Boîtier | 256-ball FBGA (FineLine BGA), 17 x 17 mm |
| Température de fonctionnement | -40C to +100C (TJ), industrial |
| Speed Grade | I5 (industrial, 6.2 ns tPD) |
| Type de montage | Surface Mount (SMT, BGA) |
| Statut RoHS | Compliant |
| Sans halogène | Compliant (per GlobalSpec) |
| Country of Origin | Malaysia / Republic of Korea |
Guide de configuration des broches du EPM1270F256I5N 256-ball fbga (fineline bga), 17 x 17 mm
Configuration des broches du EPM1270F256I5N (boîtier 256-ball fbga (fineline bga), 17 x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM1270F256I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM1270F256I5N convient pour 6 applications: Power-Up Sequencing Logic, Bus-Interface Bridging and Level Translation, Glue-Logic Consolidation, I/O Expansion and Buffering, Automotive Infotainment Subsystems, Industrial Motor-Control Logic.
Power-Up Sequencing Logic
The EPM1270F256I5N is the de-facto standard for multi-rail power sequencing in telecom and server hardware. Its 212 user I/Os with 8 independently programmable MultiVolt banks (1.5 V / 1.8 V / 2.5 V / 3.3 V) can drive PG (power-good) signals and EN (enable) lines for 8-16 voltage rails simultaneously. The Flash-based configuration boots in microseconds at power-up, ensuring deterministic rail-on order before downstream regulators latch - critical for ASICs and processors that require specific rail sequences. With 6.2 ns pin-to-pin delay, the CPLD can monitor fault conditions and assert RESET within one clock cycle, outperforming MCU-based sequencers on response time.
Recommandé
Bus-Interface Bridging and Level Translation
MultiVolt I/O makes the EPM1270F256I5N ideal for bridging legacy 5 V / 3.3 V parallel buses to modern 1.8 V processors without external translator ICs. Each of the 8 I/O banks can be independently configured to 1.5 V, 1.8 V, 2.5 V, or 3.3 V, so a single CPLD can interface a 3.3 V PCI bus on Bank 1, a 2.5 V legacy peripheral on Bank 2, and a 1.8 V processor bus on Bank 3 simultaneously. With 980 macrocells, the part can implement wide mux/demux logic, address-latch-and-decode, and chip-select generation for 8-16 peripheral devices. Industrial temperature grade ensures operation in -40C to +100C telecom line-card bays.
Recommandé
Glue-Logic Consolidation
The EPM1270F256I5N replaces 10-20 discrete 74-series PAL/GAL chips with a single programmable device, reducing PCB area by 60-80% on legacy industrial controllers. Each macrocell implements a sum-of-products equation with up to 36 inputs, so 980 macrocells can consolidate dozens of address decoders, chip-select generators, and interrupt arbiters. The Flash-based instant-on behavior guarantees deterministic logic states at power-up - critical for industrial PLCs and machine controllers where boot-time I/O glitches cause machine damage. Quartus II design entry uses the same schematic capture as 74-series logic, easing migration.
Recommandé
I/O Expansion and Buffering
With 212 user I/Os, the EPM1270F256I5N expands a microcontroller's GPIO count by an order of magnitude. Each pin is 5 V tolerant on 3.3 V banks and supports 24 mA drive strength, allowing direct LED, relay, and optocoupler drive without external buffers. Industrial PLCs commonly use this CPLD to add 100-200 opto-isolated digital I/O channels to an ARM Cortex-M host processor over a single SPI or parallel interface. The -40C to +100C industrial temperature range covers outdoor cabinet installations.
Recommandé
Automotive Infotainment Subsystems
Automotive head units use the EPM1270F256I5N for deterministic I/O handling: button-matrix scanning, backlight PWM generation, CAN/LIN bus bridging, and audio-mux control. The instant-on Flash configuration boots in microseconds at cold-crank (6 V battery drop) without the bitstream-corruption risk that SRAM FPGAs face. Industrial temperature grade covers -40C cabin temperatures, and MultiVolt I/O interfaces both 3.3 V automotive MCUs and 1.8 V application processors in the same design. Note: the standard EPM1270F256I5N is NOT AEC-Q100 qualified - for AEC-Q100 automotive applications, choose the automotive-graded MAX II variant or add external qualification testing.
Recommandé
Industrial Motor-Control Logic
The EPM1270F256I5N generates PWM timing, fault-interrupt logic, and Hall-sensor decoding for BLDC and stepper motor controllers. With 6.2 ns pin-to-pin logic delay, the CPLD can latch over-current faults and shut down gate drivers within 50 ns - faster than MCU interrupt service routines and critical for IGBT protection. The 980 macrocells handle 6-step or FOC commutation tables, while MultiVolt I/O interfaces 3.3 V MCUs, 5 V gate drivers, and 1.8 V position sensors in the same design. The -40C to +100C industrial temperature range covers outdoor motor cabinets and factory-floor drives.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM1270F256I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM1270F256I5 | EPM1270F256I5RR | EPM1270F256I5ES | EPM1270F256I3N | EPM1270F256C5N | EPM1270GF256I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Macro Cells | 980 | 980 | 980 | 980 | 980 | 980 | 980 |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Speed Grade (tPD) | I5 (~6.2 ns) | I5 (~6.2 ns) | I5 (~6.2 ns) | I5 (~6.2 ns) | I3 (slower ~7.5 ns) | C5 (faster ~5.5 ns) | I5 (~6.2 ns) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | -40C to +100C |
| Family / Generation | MAX II (standard Flash) | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II G (larger user Flash) |
| Packing Code / Variant | N (standard, tray) | no N suffix (tray variant) | RR (tape-and-reel, 7-inch) | ES (engineering sample) | N (tray) | N (tray) | N (tray, G die) |
| External Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
Principaux différenciateurs
- Same die as EPM1270F256I5 (tray variant), 100% pin-for-pin compatible (vs EPM1270F256I5)
- Same die as C5 (commercial) variant with same FBGA-256 footprint (vs EPM1270F256C5N)
- MAX II G variant offers larger user Flash for on-chip NVM storage (vs EPM1270GF256I5N)
Notes de conception
The 256-ball FBGA package (17x17 mm, 1.0 mm ball pitch) requires a 4-layer stack minimum, with continuous GND and VCC planes on inner layers for the BGA ball field. Microvia (HDI) fabrication is recommended for breakout routing - use 0.1 mm laser-drilled microvias on the top layer with via-in-pad for inner balls, then dog-bone fanout for the perimeter. Per Altera's AN-410 application note, the maximum recommended PCB thickness is 1.6 mm to ensure reliable BGA solder fillet formation. Place 0.1 uF X7R ceramic decoupling capacitors within 50 mil (1.27 mm) of every VCCIO and VCCINT ball group, plus a single 10 uF bulk ceramic cap per supply rail near the BGA edge.
The MAX II EPM1270 family uses an on-chip 1.8 V regulator that dissipates (VIN - 1.8) x I_CORE watts; for a typical 3.3 V supply and 50 mA core current, this is ~75 mW of internal regulator dissipation. Per the Altera MAX II datasheet thermal characteristics, the FBGA-256 package has theta_JA of approximately 18 C/W with 4-layer PCB and adequate thermal vias. The internal regulator may shut down at junction temperatures above 150 C, so for industrial +100C ambient operation, ensure the PCB has a 6x6 thermal-via array (0.3 mm pitch, 0.5 mm plated diameter) under the central VCCINT balls to spread heat to the inner GND plane.
Estimated power analysis for the EPM1270F256I5N at 50 MHz toggle on 64 I/O pins, 3.3 V VCCIO, 25 pF load: P_dynamic = C x V^2 x f x N x switching_activity = 25e-12 x 3.3^2 x 50e6 x 64 x 0.5 = ~175 mW. Combined with 75 mW core regulator dissipation, total estimated power is ~300 mW - well within the 1 W FBGA-256 thermal envelope. Note: this is an estimate based on typical toggle activity; actual power depends on design-specific switching rate. Always validate with Quartus Prime PowerPlay analysis before final layout. The single most common design error is omitting the JTAG pull-up resistors on TCK/TMS - the MAX II requires 10 kohm pull-ups to VCCIO for in-system programming reliability.
Informations de conformité
RoHS compliant per Altera product page. Halogen-free per GlobalSpec datasheet record. NOT AEC-Q100 qualified - the MAX II family is industrial-grade but does not carry automotive certification; for AEC-Q100 applications use automotive-specific MAX II variants or add external qualification testing.
