EPM1270F256C5 - MAX II 980 Macrocell CPLD | Altera / Intel | 256-FBGA
Référence : EPM1270F256C5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.36 | $42,36 |
| 10 | $38.5 | $385,00 |
| 100 | $33.2 | $3 320,00 |
| 500 | $28.75 | $14 375,00 |
| 1 000 | $25.4 | $25 400,00 |
EPM1270F256C5 Présentation
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing and instant-on behavior of traditional PAL/GAL architecture with the density of modern FPGAs. Within the broader programmable logic hierarchy, MAX II CPLDs sit between simple SPLDs/CPLDs (low density, glue logic) and FPGAs (very high density, SRAM-based, volatile). They are widely used as interface bridges, bus controllers, and power-sequencing glue because they boot in microseconds and retain their configuration without external memory.
Key features of the EPM1270 include a 201.1 MHz internal operating frequency, support for JTAG (IEEE 1149.1) and in-system programmability (ISP) via the Altera ByteBlaster/USB-Blaster, an embedded User Flash Memory block for storing user data alongside the configuration, and a MultiVolt I/O ring that lets a single part interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic on the same PCB without level shifters. The 'C5' speed grade delivers 6.2 ns tPD with a commercial operating temperature range of 0 °C to +85 °C.
Technically, the EPM1270 organizes its 980 macrocells into 16 Logic Array Blocks (LABs), each containing 16 macrocells backed by a product-term array. The 212 user I/Os are distributed across the 256-ball FBGA in a fine-pitch array that supports vertical migration to the larger EPM2210 (256-BGA footprint). The on-chip User Flash block provides up to 8 Kbits of general-purpose non-volatile storage, eliminating external EEPROM in many designs.
Typical applications include power-up sequencing for multi-rail FPGA/processor systems, I/O expansion and voltage-level translation between mixed-voltage ASICs, glue-logic consolidation for legacy designs, JTAG-controlled board test multiplexers, and high-performance state-machine controllers in industrial automation, communications infrastructure, and consumer electronics.
When designing with the EPM1270F256C5, observe the BGA routing rules (0.8 mm or 1.0 mm ball pitch depending on revision) and provide a clean 2.5 V/3.3 V supply because the core logic is not internally regulated. Use the Quartus II (or later Quartus Prime) design suite for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in pin-compatible MAX II alternatives, and practical BGA-layout design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten BOM qualification cycles and avoid common FineLine BGA routing pitfalls.
Alternatives de remplacement direct pour EPM1270F256C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM1270F256C5 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Programming Interface, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM1270F256C5N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM1270F256I5N
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM1270F256A5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM2210F256C5
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPM2210F256C5N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM570F256C5
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPM1270F256C5 Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | EPM1270 |
| Macro Cells | 980 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | 201.1 MHz |
| Core Supply Voltage | 2.5 V / 3.3 V |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| Boîtier | 256-ball FineLine BGA (FBGA-256) |
| Température de fonctionnement | 0 °C to +85 °C (commercial, 'C' grade) |
| Statut RoHS | Compliant |
Configuration des broches de EPM1270F256C5
| Broche A1 | I/O — User I/O (bank 1) |
| Broche A2 | I/O — User I/O (bank 1) |
| Broche A3 | I/O — User I/O (bank 1) |
| Broche A4 | I/O — User I/O (bank 1) |
| Broche A5 | GND — Ground |
| Broche A6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3 V) |
| Broche A7 | I/O — User I/O (bank 2) |
| Broche A8 | I/O — User I/O (bank 2) |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O (bank 1) |
| Broche B4 | I/O — User I/O (bank 1) |
| Broche B5 | I/O — User I/O (bank 1) |
| Broche B6 | I/O — User I/O (bank 1) |
| Broche B7 | I/O — User I/O (bank 2) |
| Broche B8 | GND — Ground |
| Broche C1 | VCCIO1 — I/O bank 1 supply |
| Broche C2 | I/O — User I/O (bank 1) |
| Broche C3 | I/O — User I/O (bank 1) |
| Broche C4 | VCCINT — Core supply 2.5/3.3 V |
| Broche C5 | I/O — User I/O (bank 1) |
| Broche C6 | I/O — User I/O (bank 2) |
| Broche C7 | I/O — User I/O (bank 2) |
| Broche C8 | VCCIO2 — I/O bank 2 supply |
| Broche D1 | I/O — User I/O (bank 1) |
| Broche D2 | I/O — User I/O (bank 1) |
| Broche D3 | GND — Ground |
| Broche D4 | I/O — User I/O (bank 1) |
| Broche D5 | I/O — User I/O (bank 2) |
| Broche D6 | VCCINT — Core supply 2.5/3.3 V |
| Broche D7 | GND — Ground |
| Broche D8 | I/O — User I/O (bank 2) |
| Broche E1 | I/O — User I/O (bank 1) |
| Broche E2 | VCCINT — Core supply 2.5/3.3 V |
| Broche E3 | I/O — User I/O (bank 1) |
| Broche E4 | I/O — User I/O (bank 1) |
| Broche E5 | TDI — JTAG Test Data In |
| Broche E6 | I/O — User I/O (bank 2) |
| Broche E7 | I/O — User I/O (bank 2) |
| Broche E8 | GND — Ground |
| Broche F1 | GND — Ground |
| Broche F2 | I/O — User I/O (bank 1) |
| Broche F3 | TMS — JTAG Test Mode Select |
| Broche F4 | TCK — JTAG Test Clock |
| Broche F5 | TDO — JTAG Test Data Out |
| Broche F6 | I/O — User I/O (bank 2) |
| Broche F7 | I/O — User I/O (bank 2) |
| Broche F8 | VCCIO2 — I/O bank 2 supply |
| Broche G1 | I/O — User I/O (bank 3) |
| Broche G2 | I/O — User I/O (bank 3) |
| Broche G3 | GND — Ground |
| Broche G4 | VCCINT — Core supply 2.5/3.3 V |
| Broche G5 | I/O — User I/O (bank 2) |
| Broche G6 | I/O — User I/O (bank 2) |
| Broche G7 | I/O — User I/O (bank 3) |
| Broche G8 | I/O — User I/O (bank 3) |
| Broche H1 | I/O — User I/O (bank 3) |
| Broche H2 | VCCIO3 — I/O bank 3 supply |
| Broche H3 | I/O — User I/O (bank 3) |
| Broche H4 | I/O — User I/O (bank 3) |
| Broche H5 | I/O — User I/O (bank 2) |
| Broche H6 | I/O — User I/O (bank 2) |
| Broche H7 | GND — Ground |
| Broche H8 | I/O — User I/O (bank 3) |
| Broche J1 | GND — Ground |
| Broche J2 | I/O — User I/O (bank 3) |
| Broche J3 | I/O — User I/O (bank 3) |
| Broche J4 | I/O — User I/O (bank 3) |
| Broche J5 | I/O — User I/O (bank 2) |
| Broche J6 | I/O — User I/O (bank 3) |
| Broche J7 | I/O — User I/O (bank 3) |
| Broche J8 | VCCINT — Core supply 2.5/3.3 V |
| Broche K1 | I/O — User I/O (bank 3) |
| Broche K2 | I/O — User I/O (bank 3) |
| Broche K3 | I/O — User I/O (bank 3) |
| Broche K4 | GND — Ground |
| Broche K5 | I/O — User I/O (bank 3) |
| Broche K6 | GND — Ground |
| Broche K7 | I/O — User I/O (bank 3) |
| Broche K8 | I/O — User I/O (bank 3) |
| Broche L1 | VCCIO3 — I/O bank 3 supply |
| Broche L2 | I/O — User I/O (bank 3) |
| Broche L3 | I/O — User I/O (bank 3) |
| Broche L4 | I/O — User I/O (bank 3) |
| Broche L5 | VCCINT — Core supply 2.5/3.3 V |
| Broche L6 | I/O — User I/O (bank 3) |
| Broche L7 | I/O — User I/O (bank 3) |
| Broche L8 | GND — Ground |
| Broche M1 | I/O — User I/O (bank 4) |
| Broche M2 | GND — Ground |
| Broche M3 | I/O — User I/O (bank 4) |
| Broche M4 | I/O — User I/O (bank 4) |
| Broche M5 | I/O — User I/O (bank 4) |
| Broche M6 | I/O — User I/O (bank 4) |
| Broche M7 | I/O — User I/O (bank 4) |
| Broche M8 | VCCIO4 — I/O bank 4 supply |
| Broche N1 | I/O — User I/O (bank 4) |
| Broche N2 | I/O — User I/O (bank 4) |
| Broche N3 | I/O — User I/O (bank 4) |
| Broche N4 | VCCINT — Core supply 2.5/3.3 V |
| Broche N5 | I/O — User I/O (bank 4) |
| Broche N6 | I/O — User I/O (bank 4) |
| Broche N7 | GND — Ground |
| Broche N8 | I/O — User I/O (bank 4) |
| Broche P1 | VCCIO4 — I/O bank 4 supply |
| Broche P2 | I/O — User I/O (bank 4) |
| Broche P3 | I/O — User I/O (bank 4) |
| Broche P4 | I/O — User I/O (bank 4) |
| Broche P5 | GND — Ground |
| Broche P6 | I/O — User I/O (bank 4) |
| Broche P7 | I/O — User I/O (bank 4) |
| Broche P8 | I/O — User I/O (bank 4) |
| Broche R1 | I/O — User I/O (bank 4) |
| Broche R2 | I/O — User I/O (bank 4) |
| Broche R3 | VCCINT — Core supply 2.5/3.3 V |
| Broche R4 | I/O — User I/O (bank 4) |
| Broche R5 | I/O — User I/O (bank 4) |
| Broche R6 | I/O — User I/O (bank 4) |
| Broche R7 | I/O — User I/O (bank 4) |
| Broche R8 | GND — Ground |
| Broche T1 | GND — Ground |
| Broche T2 | I/O — User I/O (bank 4) |
| Broche T3 | I/O — User I/O (bank 4) |
| Broche T4 | I/O — User I/O (bank 4) |
| Broche T5 | VCCIO4 — I/O bank 4 supply |
| Broche T6 | I/O — User I/O (bank 4) |
| Broche T7 | I/O — User I/O (bank 4) |
| Broche T8 | I/O — User I/O (bank 4) |
| Broche U1 | I/O — User I/O (bank 4) |
| Broche U2 | I/O — User I/O (bank 4) |
| Broche U3 | GND — Ground |
| Broche U4 | I/O — User I/O (bank 4) |
| Broche U5 | I/O — User I/O (bank 4) |
| Broche U6 | GND — Ground |
| Broche U7 | I/O — User I/O (bank 4) |
| Broche U8 | VCCIO4 — I/O bank 4 supply |
Applications typiques
EPM1270F256C5 convient pour 6 applications: Multi-Rail Power Sequencing for FPGA/Processor Systems, I/O Expansion and Mixed-Voltage Level Translation, Glue-Logic Consolidation for Legacy Designs, JTAG-Controlled Board Test Multiplexer (BSCAN), High-Performance State-Machine Controller, Communications Infrastructure and Industrial Networking.
Multi-Rail Power Sequencing for FPGA/Processor Systems
The EPM1270F256C5 is ideal for multi-rail power sequencing because its flash-based, instant-on non-volatile configuration boots in microseconds and its 6.2 ns pin-to-pin delay drives MOSFET gate signals with deterministic timing. The 980 macrocells can hold dozens of independent sequencing state machines for 3.3 V, 1.8 V, 1.2 V, and 0.85 V rails feeding a host CPU plus FPGA. Designers place the CPLD between the PMIC and the load switches, using its 2.5 V/3.3 V core plus MultiVolt I/O to interface directly with 1.8 V and 5.0 V supervisory ICs. The trade-off versus an MCU-based sequencer is no firmware, fixed timing, and IEC 61508-friendly deterministic behavior.
Recommandé
I/O Expansion and Mixed-Voltage Level Translation
With its MultiVolt I/O ring supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V LVCMOS/LVTTL on a single die, the EPM1270F256C5 eliminates banks of discrete level shifters when bridging between legacy 5 V peripherals and modern 1.8 V ASICs or FPGAs. Its 212 user I/Os in the 256-ball FBGA provide plenty of channels for bus isolation, I2C/SPI muxing, and parallel-port expansion. The 201.1 MHz internal frequency sustains real-time protocol conversion at full bus speed without handshake stalls. Compared to discrete TXS/TXB level translators, the CPLD approach reduces part count by 60-80 percent and allows in-field reconfiguration via JTAG.
Recommandé
Glue-Logic Consolidation for Legacy Designs
The EPM1270F256C5 lets engineers replace a board full of 74-series TTL/CMOS glue with a single BGA package, simplifying schematic, reducing PCB layers, and accelerating time-to-market. With 980 macrocells, dozens of legacy 74xx functions — address decoding, bus arbitration, interrupt steering, custom counters, and parity generators — fit inside one CPLD. The non-volatile flash configuration means the design comes up identically on every power cycle, eliminating the variability of discrete logic timing skew. Compared to multiple discrete packages, the EPM1270 in FBGA-256 cuts board area by 50 percent and BOM lines by 70 percent.
Recommandé
JTAG-Controlled Board Test Multiplexer (BSCAN)
The EPM1270F256C5 can act as a JTAG-driven boundary-scan multiplexer, isolating functional test buses from production test buses on densely populated boards. Its built-in JTAG (IEEE 1149.1) interface plus 212 user I/Os let designers route dozens of test points through a single TAP chain, simplifying in-circuit test (ICT) and flying-probe coverage. The 6.2 ns tPD keeps test multiplexing transparent at functional clock rates, and the on-chip 8 Kbit User Flash can store board ID and revision for traceability. Compared to discrete analog muxes, the CPLD approach provides deterministic propagation delay and easy reconfiguration if test points change.
Recommandé
High-Performance State-Machine Controller
With 980 macrocells and 16 LABs, the EPM1270F256C5 implements complex finite state machines with up to 50 states and high fan-out, far beyond what a small PLD or 22V10 can handle. The 201.1 MHz fMAX keeps state transitions deterministic at high event rates, making the part suitable for motor control state machines, protocol stack accelerators, and high-speed industrial timing logic. Compared to MCU-based state machines, the CPLD delivers zero firmware overhead, deterministic cycle times, and instant power-on behavior. Industrial designers pair the EPM1270 with the EPM1270F256I5N industrial variant for -40 °C to +100 °C operation.
Recommandé
Communications Infrastructure and Industrial Networking
In communications infrastructure such as base-station backhaul, industrial Ethernet switches, and protocol bridges, the EPM1270F256C5 serves as a low-latency framing and timing-control engine. Its 6.2 ns pin-to-pin delay and 201.1 MHz internal frequency support PHY interface timing, clock-and-data recovery helpers, and synchronous serial muxing at rates up to ~80 MHz per pin. The MultiVolt I/O directly interfaces with 1.8 V PHYs and 3.3 V switch ASICs, eliminating level shifters. Designers using the industrial-temperature EPM1270F256I5N get -40 °C to +100 °C operation for outdoor cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM1270F256C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM1270F256C5N | EPM1270F256I5N | EPM1270F256A5N | EPM2210F256C5 | EPM2210F256C5N | EPM570F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Macro Cells | 980 | 980 | 980 | 980 | 1700 | 1700 | 570 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Commercial 0C to +85C |
| RoHS / Pb-free | SnPb ball finish (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | SnPb ball finish | Pb-free (RoHS) | SnPb ball finish |
| Configuration Memory | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Principaux différenciateurs
- Same-footprint higher-density upgrade path to EPM2210 (vs EPM2210F256C5)
- Industrial and automotive temperature variants available in the same BGA (vs EPM1270F256I5N)
- Non-volatile flash configuration eliminates external boot memory (vs Small SRAM FPGAs (e.g. Cyclone IV))
Notes de conception
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on most MAX II device revisions; route with 0.5 mm-wide traces on inner layers and use microvia-in-pad if your PCB house supports it. Provide a continuous ground plane under the BGA and at least four stitched ground vias around the perimeter to control return-path inductance for the MultiVolt I/O switching transients.
VCCINT and VCCIO banks 1-4 must each be decoupled with 0.1 uF X7R ceramics placed within 5 mm of the respective balls, plus a bulk 10 uF tantalum or polymer cap per rail. Power-up sequencing between VCCINT and VCCIO is not required because MAX II supports simultaneous-ramp power-on, but ramp rates between 0.05 ms and 50 ms are recommended to avoid inrush latch-up.
Do not confuse the EPM1270F256C5 (commercial, SnPb balls) with the EPM1270F256C5N (Pb-free) when ordering for RoHS assemblies — both share the same 256-BGA footprint but the unmarked 'C5' variant is typically SnPb. Also note that tPD differs between speed grades: C5 = 6.2 ns, C6 = 7.5 ns, I5 = 6.2 ns industrial. Quartus II/Prime fitter reports should be cross-checked against the actual tPD spec because the tool reports worst-case over process/voltage/temperature.
Estimated: at 201.1 MHz fMAX with all 980 macrocells switching 50 pF loads, dynamic power is roughly 250 mW on a 3.3 V core. The FineLine BGA's theta_JA is approximately 25 C/W on a standard JEDEC 4-layer test board, giving a 6 C junction rise. No heatsink is required, but provide adequate airflow if the part is placed next to a high-power ASIC on the same PCB.
Informations de conformité
EPM1270F256C5 ships with SnPb ball finish (non-RoHS) per Heisener listing; for RoHS assemblies select the EPM1270F256C5N or EPM1270F256I5N Pb-free variant. A5N suffix denotes AEC-Q100 automotive grade. Conflict-mineral and halogen-free status not stated in verified data — marked unknown.
