EPM2210F256I5 - MAX II CPLD, 1700 Macrocells, 201MHz | Altera
Référence : EPM2210F256I5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.8 | $298,00 |
| 100 | $26.5 | $2 650,00 |
| 500 | $23.2 | $11 600,00 |
| 1 000 | $20.8 | $20 800,00 |
EPM2210F256I5 Présentation
What is a CPLD? A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PAL/GAL devices and high-density FPGAs. CPLDs use flash-based or EPROM configuration memory, providing instant-on operation, deterministic timing, and excellent pin-to-pin consistency. The MAX II family hierarchy is: CPLD -> Programmable Logic -> Logic IC -> Integrated Circuit, and EPM2210F256I5 is the largest density member of the MAX II generation.
Key features of the EPM2210F256I5 include 1700 macrocells distributed across 16 logic array blocks, an 8 Kbit user flash memory block, JTAG and in-system programmability via Altera's ByteBlaster or USB-Blaster, multi-volt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interfaces, and 4 JTAG-compliant pins (TCK, TMS, TDI, TDO). The device supports the IEEE 1149.1 boundary-scan standard for board-level testability.
Technically, the EPM2210F256I5 implements a Logic Array Block (LAB) architecture where each LAB contains 16 macrocells with interconnect via the MultiTrack interconnect. The multi-volt core allows the device to interface with legacy 5V-tolerant systems while drawing low standby current, which is critical for power-sensitive glue-logic applications. The MAX II architecture also provides an instant-on capability with no external boot memory required.
Typical applications include I/O expansion and bridging in industrial controllers, register and state-machine implementation in FPGA co-processing, configuration logic for memory and peripherals, glue-logic replacement for discrete 74-series TTL, and bus interface translation in legacy system upgrades. The wide temperature range makes it suitable for industrial automation, telecommunications line cards, and white-goods control boards.
When designing with this part, note that MAX II devices support vertical migration within the same package: EPM570, EPM1270, and EPM2210 share the 256-pin FineLine BGA footprint, allowing PCB reuse across density options. Designers should also ensure the Quartus II or Intel Quartus Prime software is configured for MAX II support before compilation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers an at-a-glance comparison between EPM2210F256I5 and its vertical-migration siblings.
Alternatives de remplacement direct pour EPM2210F256I5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM2210F256I5 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Programming Interface, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM2210F256I5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM2210F256C5N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM2210F256C5
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPM2210F256A5NGA
✅ Remplacement direct✓ En stock
$48.75 / unité
Voir la fiche technique →EPM1270F256I5N
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM1270F256C5N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM2210F256I5 Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Series | MAX II CPLD |
| Number of Macrocells | 1700 |
| Number of Logic Elements | 2210 |
| Maximum Internal Frequency | 201.1 MHz |
| Maximum Propagation Delay (tpd) | 7.0 ns |
| Supply Voltage - Internal | 2.5 V, 3.3 V |
| Operating Temperature (TJ) | -40 C to +100 C |
| Boîtier / Format | 256-FBGA (17x17) |
| Type de montage | Surface Mount |
| User Flash Memory | 8 Kbit |
| Number of Logic Array Blocks | 16 |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| JTAG Compliant | Yes (IEEE 1149.1) |
| In-System Programmable | Yes (via ByteBlaster/USB-Blaster) |
| Statut RoHS | Non-compliant (contains lead, per IC Components datasheet) |
| Delivery Type | Tray |
Guide de configuration des broches du EPM2210F256I5 256-fbga (17x17)
Configuration des broches du EPM2210F256I5 (boîtier 256-fbga (17x17)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM2210F256I5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM2210F256I5 convient pour 6 applications: Industrial I/O Expansion and Bridging, FPGA Co-Processing and Glueless Interfaces, Legacy Bus Interface Translation, Register and State-Machine Implementation, Telecommunications Line-Card Glue Logic, White-Goods and Appliance Control Boards.
Industrial I/O Expansion and Bridging
The EPM2210F256I5 is well suited for industrial I/O expansion where 1700 macrocells provide ample capacity for complex register banks, multiplexers, and bus-bridging logic between legacy peripherals and modern processors. Its 7.0 ns tpd and 201.1 MHz internal frequency enable deterministic glue-logic that fits inside one clock cycle of most industrial MCUs. Placed between the MCU and parallel I/O expanders, the CPLD absorbs timing-skew issues and converts between 3.3V and 1.8V standards using its multi-volt I/O. Compared to small FPGAs, the instant-on, non-volatile MAX II architecture removes external boot memory and simplifies board layout. Use this part when deterministic timing, low unit cost, and instant-on behavior matter more than DSP or memory resources.
Recommandé
FPGA Co-Processing and Glueless Interfaces
In FPGA co-processing designs the EPM2210F256I5 acts as a deterministic pre- or post-processor, handling reset sequencing, configuration memory control, and high-speed parallel interfaces that would otherwise consume FPGA fabric. Its 1700 macrocells comfortably fit wide register banks and custom state machines, while the 256-ball FBGA footprint matches common FPGA BGA patterns for compact board placement. The 8 Kbit user flash holds non-volatile parameter storage that the FPGA reads at boot. Designers often place the CPLD between an FPGA and external DDR memory to generate chip-select and timing-control signals. The non-volatile, instant-on behavior also makes it ideal for system controllers that must respond before the FPGA finishes loading.
Recommandé
Legacy Bus Interface Translation
The EPM2210F256I5 excels at translating between legacy bus standards such as ISA, PCI, and VME and modern parallel or serial interfaces, leveraging its 1700 macrocells to host full bus controllers with timing margins well inside 7.0 ns. Multi-volt I/O (1.5V / 1.8V / 2.5V / 3.3V) lets one CPLD bridge 5V-tolerant legacy parts and 1.8V modern ASICs without external level shifters. Industrial telecom and factory-automation boards use this part to glue 8-bit or 16-bit legacy peripherals to 32-bit processors while keeping BOM small. The JTAG (IEEE 1149.1) interface allows boundary-scan test coverage on every translated signal, simplifying board-level test. Choose EPM2210F256I5 over an FPGA when deterministic timing and instant-on are required.
Recommandé
Register and State-Machine Implementation
The EPM2210F256I5 is a natural fit for dense register files and complex state machines in FPGA-front-end controllers, motor drives, and protocol converters. Its 2210 logic elements arranged in 16 LABs hold multi-state sequencers with deep encoding without resorting to a soft-core processor. The 7.0 ns propagation delay keeps state transitions inside a single 50 MHz clock period, while 201.1 MHz internal frequency supports faster interfaces when needed. Designers can implement hundreds of 8-bit or 16-bit registers and dozens of state variables in a single chip, replacing multiple discrete 74-series TTL packages. The non-volatile configuration means the design starts instantly at every power-up without external boot ROM.
Recommandé
Telecommunications Line-Card Glue Logic
In telecom line-card designs, the EPM2210F256I5 provides 1700 macrocells of deterministic glue logic for clock distribution, framing, alarm generation, and switch-fabric handshaking. The -40 C to +100 C junction-temperature range supports outdoor and central-office deployments without thermal derating beyond the package rating. Multi-volt I/O interfaces directly to 1.8V framers and 3.3V switch fabrics, removing external level shifters. JTAG boundary-scan simplifies line-card bring-up and field diagnostics. Compared to FPGA alternatives, the CPLD's instant-on ensures alarms and supervisory logic are active the moment power is applied, even before the main processor boots.
Recommandé
White-Goods and Appliance Control Boards
The EPM2210F256I5 is commonly used in washing-machine, dishwasher, and oven control boards where 1700 macrocells implement user-interface scanning, motor-control sequencing, sensor multiplexing, and safety interlocks. Its instant-on non-volatile start means the appliance is ready as soon as power is applied, with no boot delay visible to the user. Multi-volt I/O connects directly to 3.3V MCUs and 5V sensor arrays, reducing BOM cost. The 256-ball FBGA package supports compact board layouts typical of appliance enclosures. Designers can field-update the design via JTAG, simplifying firmware revisions across product variants.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM2210F256I5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM2210F256I5N | EPM2210F256C5N | EPM2210F256C5 | EPM2210F256A5NGA | EPM1270F256I5N | EPM1270F256C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-FBGA (17x17) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same |
| Number of Macrocells | 1700 | 1700 | 1700 | 1700 | 1700 | 980 | 980 |
| Number of Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 | 1270 | 1270 |
| Operating Temperature (TJ) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | automotive grade | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| Maximum Internal Frequency | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz |
| Maximum tpd | 7.0 ns | 7.0 ns | 7.0 ns | 7.0 ns | 7.0 ns | 6.2 ns | 6.2 ns |
| Internal Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| RoHS Compliance | Non-compliant (contains lead) | Compliant (N suffix) | Compliant (N suffix) | Non-compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Highest-density MAX II CPLD available (vs EPM1270F256I5N)
- Industrial temperature grade with extended junction range (vs EPM2210F256C5N)
- RoHS lead-free drop-in available on identical footprint (vs EPM2210F256I5N)
- Deterministic 7.0 ns tpd for glue-logic timing (vs EPM1270F256I5N)
Notes de conception
Vertical migration within the 256-ball FBGA footprint allows EPM570, EPM1270, and EPM2210 to share the same PCB layout, but pinout compatibility is package-specific, not family-wide. Verify with the Quartus II pin-out file before laying out the board, and double-check that the JTAG pins (TCK/TMS/TDI/TDO) and dual-purpose configuration pins are not inadvertently repurposed by user logic. Estimated: based on datasheet cross-reference, exact pinout files must be verified per design.
At 201.1 MHz internal frequency with all 1700 macrocells active, the EPM2210F256I5 may dissipate between 0.5 W and 1.0 W depending on toggle rate. The 256-FBGA package has limited thermal headroom without a thermal via array to inner copper planes. Place a 4x4 thermal via grid under the exposed die pad and connect it to an inner ground plane to keep junction temperature rise below 25 C at 1 W dissipation. Estimated thermal dissipation based on typical MAX II power characteristics; verify with the Quartus II PowerPlay analyzer for your design.
The multi-volt I/O supports 1.5V / 1.8V / 2.5V / 3.3V interfaces, but mixing voltage domains on the same bank requires careful VCCIO planning. Each I/O bank has an independent VCCIO rail; assign banks so that all inputs and outputs in one bank share a common voltage reference. For high-speed interfaces above 100 MHz, use controlled-impedance traces and series-termination resistors near the driver to prevent reflections. The MAX II architecture does not include internal termination, so all termination must be external.
Place decoupling capacitors as close as possible to every VCCINT and VCCIO pin. Use one 0.1 uF ceramic capacitor per power pin plus a single 10 uF bulk capacitor per voltage rail. For 256-ball FBGA breakout, fan-out the inner rows using micro-via-in-pad or dog-bone fan-out with vias on a 1.0 mm pitch. Route JTAG signals TCK, TMS, TDI, and TDO away from high-speed switching nets to avoid noise coupling into boundary-scan tests.
Informations de conformité
Per IC Components datasheet extract, EPM2210F256I5 contains lead and is RoHS non-compliant. Choose EPM2210F256I5N or EPM2210F256C5N for lead-free drop-in alternatives. AEC-Q100 is not_applicable for the industrial-grade I5 variant; the A5NGA automotive variant may carry AEC-Q100 qualification - verify with Intel/Altera documentation.
