EPM5016DC-20 - 16-Macrocell MAX 5000 EPLD, 20ns, Ceramic DIP | Altera
Référence : EPM5016DC-20 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $21.4 | $2 140,00 |
| 500 | $18.75 | $9 375,00 |
| 1 000 | $16.5 | $16 500,00 |
EPM5016DC-20 Présentation
An EPLD (Erasable Programmable Logic Device) is a non-volatile programmable logic IC that belongs to the broader category of Programmable Logic Devices (PLDs), which also includes PALs, GALs, and complex PLDs (CPLDs). The MAX 5000 family sits in the hierarchy above simple 22V10-style PALs and below modern SRAM-based FPGAs, offering deterministic combinational plus registered logic with predictable timing suitable for glue-logic, bus decoding, and state-machine replacement.
Key features include 160 product terms for sum-of-products logic implementation, 5.25 V maximum supply voltage, in-system UV-erasable reprogrammability, and a PAL-type macrocell architecture with per-macrocell configurable D/T/J-K flip-flop or combinational output. The PIA provides a uniform interconnect that guarantees fixed and predictable pin-to-pin delays independent of logic placement.
Architecturally, the EPM5016 uses Altera's second-generation MAX architecture: each macrocell contains a programmable AND/OR array feeding a selectable flip-flop, and the PIA delivers any input or feedback signal to any macrocell with constant delay. Ceramic DIP packaging provides hermeticity for military and aerospace programs where plastic packages are not acceptable.
Typical applications include industrial control glue logic, address decoding for microprocessor systems, bus-interface adapters, state-machine controllers, and legacy TTL replacement in long-lifecycle programs. The DC ceramic-DIP package makes it specifically suited for high-reliability military, aerospace, and industrial environments where the part must withstand extended temperature ranges and harsh conditions.
When designing with the EPM5016DC-20, note that the ceramic DIP package is windowed for UV erasure; production programming must be performed before window capping, and field erasure requires approximately one hour of UV exposure. Designers must allocate board space for the quartz window and protect it from opaque labels. Logic fitting within 160 product terms should be verified with Altera's MAX+PLUS II development environment.
This page synthesizes distributor inventory, parametric comparison, and practical replacement guidance not consolidated in the original manufacturer datasheet, helping sourcing engineers evaluate authenticity and second-source options for legacy MAX 5000 designs.
Alternatives de remplacement direct pour EPM5016DC-20 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM5016DC-20 (même facteur de forme et même empreinte) — différant par Package, Supply Voltage (VCC), Device Type, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM5016DC-17
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM5016DC-15
✅ Remplacement direct✓ En stock
$10.75 / unité
Voir la fiche technique →EPM5016DC-20 Valeurs maximales et caractéristiques électriques
| Family | MAX 5000 |
| Device Type | EPLD (UV-Erasable Programmable Logic Device) |
| Macrocells | 16 |
| Product Terms | 160 |
| Dedicated Inputs | 7 |
| I/O Pins | 8 |
| Propagation Delay (tPD) | 20 ns |
| Fréquence d'horloge maximale | 62.5 MHz |
| Maximum Supply Voltage | 5.25 V |
| Nominal Supply Voltage | 5.0 V |
| Process Technology | CMOS, UV-erasable |
| Architecture | PAL-type macrocell with Programmable Interconnect Array (PIA) |
| Package Type | 20-pin Ceramic DIP (Cerdip) with UV window |
| Package Suffix Code | DC = Ceramic DIP, Commercial |
| Speed Grade | -20 = 20 ns tPD |
| Programming Method | UV erase + EPROM-style programming via Altera programming hardware |
Configuration des broches de EPM5016DC-20
| Broche 1 | I1 — Dedicated input 1 |
| Broche 2 | I2 — Dedicated input 2 |
| Broche 3 | I3 — Dedicated input 3 |
| Broche 4 | I4 — Dedicated input 4 |
| Broche 5 | I5 — Dedicated input 5 |
| Broche 6 | I6 — Dedicated input 6 |
| Broche 7 | I7 — Dedicated input 7 |
| Broche 8 | IO1 — Bidirectional I/O pin 1 |
| Broche 9 | IO2 — Bidirectional I/O pin 2 |
| Broche 10 | GND — Ground reference |
| Broche 11 | IO3 — Bidirectional I/O pin 3 |
| Broche 12 | IO4 — Bidirectional I/O pin 4 |
| Broche 13 | IO5 — Bidirectional I/O pin 5 |
| Broche 14 | IO6 — Bidirectional I/O pin 6 |
| Broche 15 | IO7 — Bidirectional I/O pin 7 |
| Broche 16 | IO8 — Bidirectional I/O pin 8 |
| Broche 17 | NC — Not connected (per datasheet) |
| Broche 18 | NC — Not connected (per datasheet) |
| Broche 19 | NC — Not connected (per datasheet) |
| Broche 20 | VCC — +5 V supply voltage |
Applications typiques
EPM5016DC-20 convient pour 6 applications: Military & Aerospace Glue Logic, Address Decoding for Microprocessor Systems, Industrial Control State Machines, Bus Interface Adapters & Glue Logic, Legacy TTL/CMOS Replacement, Test & Measurement Equipment Logic.
Military & Aerospace Glue Logic
The EPM5016DC-20's 20-pin ceramic DIP package (DC suffix) provides hermeticity and extended temperature tolerance required for MIL-STD-883 and aerospace programs. Its 16 macrocells and 160 product terms deliver sufficient density to replace 20-40 discrete 7400-series SSI/MSI packages, reducing board area, weight, and power in flight control, avionics, and weapons-system interfaces where every gram and every square millimeter matters. The deterministic 20 ns tPD and predictable PIA interconnect guarantee timing closure without place-and-route iterations required by SRAM FPGAs.
Recommandé
Address Decoding for Microprocessor Systems
The EPM5016DC-20's 7 dedicated inputs and 8 I/O pins are well-matched to 16-bit and 20-bit address-bus decoding for 8086, 68000, and similar legacy microprocessors used in industrial controllers and long-lifecycle military platforms. With 160 product terms, the device can implement multi-level decode maps including memory-mapped I/O selects, chip-enable generation, and wait-state logic in a single chip. The 20 ns propagation delay comfortably meets typical 8 MHz to 25 MHz microprocessor bus cycles without inserting wait states, simplifying system timing analysis.
Recommandé
Industrial Control State Machines
In PLC, motor-control, and process-automation equipment, the EPM5016DC-20 implements multi-state control sequencers, fault-handling logic, and safety interlocks that previously required dozens of 74LS/74HC discrete gates. Each of the 16 macrocells contains a configurable D/T/J-K flip-flop with separate sum-of-products logic, allowing efficient Moore and Mealy state machine implementation. The ceramic DIP package withstands the vibration, thermal cycling, and chemical exposure typical of factory-floor environments where plastic packages can degrade over decades of continuous service.
Recommandé
Bus Interface Adapters & Glue Logic
The EPM5016DC-20 is widely used to bridge mismatched bus standards such as VME, ISA, and proprietary backplanes in legacy industrial, medical, and military systems. Its 8 bidirectional I/O pins implement bus transceivers, parity generators, and protocol-conversion state machines in a single chip, replacing multiple 74LS245, 74LS244, and 74LS373 buffers with deterministic 20 ns timing. The PIA architecture guarantees fixed interconnect delay regardless of pin assignment, simplifying timing closure across complex multi-master bus architectures.
Recommandé
Legacy TTL/CMOS Replacement
The EPM5016DC-20 consolidates entire boards of 7400-series SSI and MSI TTL/CMOS logic into a single ceramic-DIP device, reducing PCB layer count, connector pin usage, and solder-joint count in long-lifecycle programs. Field-reprogrammability via UV erasure allows late-stage design changes and ECOs without board rework, and a single ceramic DIP occupies less board space than the equivalent 20-40 discrete packages. This application is most common in legacy aerospace, defense, and industrial-control programs where re-spinning a board for a modern CPLD would require costly re-certification.
Recommandé
Test & Measurement Equipment Logic
Bench-top and ATE (automatic test equipment) designers use the EPM5016DC-20 to implement timing generators, pulse-shaping networks, handshake logic, and instrument-trigger sequencers. The 20 ns resolution and predictable PIA delay allow the part to serve as a coarser-resolution alternative to delay lines, while the macrocell flip-flops create precise divide-by-N counters for synthesizers and frequency references. The ceramic DIP package is preferred in high-vibration test-rack environments and in calibration laboratories where long-term thermal stability of timing parameters is critical.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM5016DC-20 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM5016DC-17 | EPM5016DC-15 |
|---|---|---|---|
| Package | 20-pin Ceramic DIP (DC) | 20-pin Ceramic DIP (DC) - same | 20-pin Ceramic DIP (DC) - same |
| Brand | Altera | Altera - same | Altera - same |
| Macrocells | 16 | 16 | 16 |
| Product Terms | 160 | 160 | 160 |
| Propagation Delay (tPD) | 20 ns | 17 ns | 15 ns |
| I/O Pins | 8 | 8 | 8 |
| Supply Voltage (max) | 5.25 V | 5.25 V | 5.25 V |
Principaux différenciateurs
- Fastest speed grade available in MAX 5000 EPLD family (vs EPM5016DC-17)
- Hermetic ceramic DIP package with UV window (vs Modern MAX II/MAX V CPLDs)
- PAL-type macrocell architecture with deterministic PIA timing (vs SRAM-based FPGAs)
Notes de conception
The EPM5016DC-20 ceramic DIP package includes a quartz UV window for erasure; the window must remain uncovered for field re-erasure. Apply opaque labels or tape over the window only AFTER final programming if no further changes are anticipated. Window contamination or accidental UV exposure (including direct sunlight for several days) will erase the programmed logic and cause field failures.
Estimated: at 62.5 MHz toggle rate on all 16 macrocells driving 50 pF loads, ICC may approach 150-200 mA from the 5 V supply, producing 0.75-1.0 W dissipation. The ceramic DIP package has a thermal resistance (theta_JA) of approximately 50-60 C/W in still air, so adequate board copper area or a small clip-on heatsink is recommended for continuous high-frequency operation. Decouple VCC (pin 20) with a 0.1 uF ceramic capacitor placed within 5 mm of the package.
Route all 8 I/O pins and 7 dedicated inputs on a single signal layer with a continuous ground plane on the adjacent layer to minimize crosstalk on the PIA. The ceramic DIP's lead inductance (~10 nH per pin) becomes significant above 50 MHz, so add 33 ohm series damping resistors on outputs driving long traces or backplane connectors. Avoid running clock or high-speed switching signals adjacent to dedicated inputs to prevent setup/hold violations from ground-bounce coupling.
Informations de conformité
Ceramic DIP package likely contains lead-bearing glass seal; RoHS exemption under Annex III 7(c)-I typically required for military/aerospace use. Compliance status not present in verified distributor data.
