EPM570F100A5N - MAX II CPLD, 570 LE, 100-FBGA | Intel / Altera
Référence : EPM570F100A5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.4 | $16,40 |
| 10 | $14.75 | $147,50 |
| 100 | $12.9 | $1 290,00 |
| 500 | $11.2 | $5 600,00 |
| 1 000 | $9.85 | $9 850,00 |
EPM570F100A5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that uses a combination of AND/OR arrays and macrocells to implement combinational and sequential logic. In the broader programmable logic hierarchy, a CPLD sits between small PAL/GAL devices and large FPGAs, offering instant-on non-volatile configuration, deterministic timing, and high pin-to-pin speed. The MAX II family is positioned as a low-cost, low-power glue-logic replacement for discrete MSI/SSI TTL parts.
Key features include 8 Kbits of user flash memory, JTAG IEEE 1149.1 boundary-scan and in-system programmability (ISP), a 4-line global clock network, 66 MHz 32-bit PCI-compliant I/O, and standby current under 100 µA. The device supports Schmitt-trigger inputs and hot-socketing, enabling live insertion into backplane applications. The FBGA-100 package exposes up to 76 user I/O pins.
The MAX II architecture uses a MultiVolt core with a 3.3 V core and bank-based I/O voltages selectable per bank. Designers configure the device through JTAG or the Altera/Quartus programming tools using the IEEE 1532 or Jam STAPL flow. The non-volatile flash configuration cell eliminates the external boot PROM required by SRAM FPGAs, simplifying board design.
Typical applications include bus-interface bridging (e.g., I2C/SPI to parallel GPIO expansion), power-sequencing and reset-distribution logic, address decoding for memory-mapped SoCs, industrial control glue logic, and automotive body electronics. The -A5N speed/temperature grade provides 0 to 85 °C commercial operation at the 5.4 ns tPD timing bin.
When designing, allocate decoupling on every VCCIO bank and use the dedicated GND balls for low-inductance return paths. The Quartus II / Quartus Prime toolchain provides pre-compiled MAX II library elements to simplify logic entry. This page synthesizes distributor pricing, drop-in alternatives, and design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM570F100A5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570F100A5N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570F100I5N
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EPM570GF100I5N
✅ Remplacement direct✓ En stock
$10.35 / unité
Voir la fiche technique →EPM240F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570F100A5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User Flash Memory | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 201.1 MHz |
| User I/O Pins (max) | 76 |
| Global Clock Lines | 4 |
| Supply Voltage - Core | 3.3 V |
| Supply Voltage - I/O Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 µm flash |
| Boîtier | 100-ball FBGA |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Température de fonctionnement | 0°C to +85°C (commercial) |
| Statut RoHS | Compliant |
Configuration des broches de EPM570F100A5N
| Broche A1 | I/O — User I/O ball (bank 1) |
| Broche A2 | GND — Ground |
| Broche A3 | I/O — User I/O ball (bank 1) |
| Broche A4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A5 | I/O — User I/O ball (bank 1) |
| Broche A6 | I/O — User I/O ball (bank 1) |
| Broche A7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A8 | I/O — User I/O ball (bank 1) |
| Broche A9 | GND — Ground |
| Broche A10 | I/O — User I/O ball (bank 1) |
| Broche B1 | I/O — User I/O ball (bank 1) |
| Broche B2 | I/O — User I/O ball (bank 1) |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — User I/O ball (bank 1) |
| Broche B5 | I/O — User I/O ball (bank 1) |
| Broche B6 | I/O — User I/O ball (bank 1) |
| Broche B7 | I/O — User I/O ball (bank 1) |
| Broche B8 | GND — Ground |
| Broche B9 | I/O — User I/O ball (bank 1) |
| Broche B10 | I/O — User I/O ball (bank 1) |
| Broche C1 | I/O — User I/O ball (bank 2) |
| Broche C2 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C3 | I/O — User I/O ball (bank 2) |
| Broche C4 | I/O — User I/O ball (bank 2) |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O ball (bank 2) |
| Broche C7 | I/O — User I/O ball (bank 2) |
| Broche C8 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C9 | I/O — User I/O ball (bank 2) |
| Broche C10 | I/O — User I/O ball (bank 2) |
| Broche D1 | I/O — User I/O ball (bank 2) |
| Broche D2 | I/O — User I/O ball (bank 2) |
| Broche D3 | I/O — User I/O ball (bank 2) |
| Broche D4 | GND — Ground |
| Broche D5 | VCCINT — Core supply voltage (3.3 V) |
| Broche D6 | GND — Ground |
| Broche D7 | I/O — User I/O ball (bank 2) |
| Broche D8 | I/O — User I/O ball (bank 2) |
| Broche D9 | I/O — User I/O ball (bank 2) |
| Broche D10 | I/O — User I/O ball (bank 2) |
| Broche E1 | I/O — User I/O ball (bank 3) |
| Broche E2 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E3 | I/O — User I/O ball (bank 3) |
| Broche E4 | VCCINT — Core supply voltage (3.3 V) |
| Broche E5 | GND — Ground |
| Broche E6 | VCCINT — Core supply voltage (3.3 V) |
| Broche E7 | I/O — User I/O ball (bank 3) |
| Broche E8 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E9 | I/O — User I/O ball (bank 3) |
| Broche E10 | I/O — User I/O ball (bank 3) |
| Broche F1 | I/O — User I/O ball (bank 3) |
| Broche F2 | I/O — User I/O ball (bank 3) |
| Broche F3 | I/O — User I/O ball (bank 3) |
| Broche F4 | GND — Ground |
| Broche F5 | TMS — JTAG test mode select |
| Broche F6 | GND — Ground |
| Broche F7 | I/O — User I/O ball (bank 3) |
| Broche F8 | I/O — User I/O ball (bank 3) |
| Broche F9 | I/O — User I/O ball (bank 3) |
| Broche F10 | I/O — User I/O ball (bank 4) |
| Broche G1 | I/O — User I/O ball (bank 3) |
| Broche G2 | I/O — User I/O ball (bank 3) |
| Broche G3 | GND — Ground |
| Broche G4 | TCK — JTAG test clock |
| Broche G5 | TDI — JTAG test data in |
| Broche G6 | TDO — JTAG test data out |
| Broche G7 | I/O — User I/O ball (bank 3) |
| Broche G8 | GND — Ground |
| Broche G9 | I/O — User I/O ball (bank 4) |
| Broche G10 | I/O — User I/O ball (bank 4) |
| Broche H1 | I/O — User I/O ball (bank 4) |
| Broche H2 | VCCIO4 — I/O bank 4 supply voltage |
| Broche H3 | I/O — User I/O ball (bank 4) |
| Broche H4 | GND — Ground |
| Broche H5 | VCCINT — Core supply voltage (3.3 V) |
| Broche H6 | GND — Ground |
| Broche H7 | I/O — User I/O ball (bank 4) |
| Broche H8 | VCCIO4 — I/O bank 4 supply voltage |
| Broche H9 | I/O — User I/O ball (bank 4) |
| Broche H10 | I/O — User I/O ball (bank 4) |
| Broche J1 | I/O — User I/O ball (bank 4) |
| Broche J2 | I/O — User I/O ball (bank 4) |
| Broche J3 | I/O — User I/O ball (bank 4) |
| Broche J4 | GND — Ground |
| Broche J5 | GCLK0 — Global clock input 0 |
| Broche J6 | GCLK1 — Global clock input 1 |
| Broche J7 | I/O — User I/O ball (bank 4) |
| Broche J8 | I/O — User I/O ball (bank 4) |
| Broche J9 | I/O — User I/O ball (bank 4) |
| Broche J10 | I/O — User I/O ball (bank 4) |
| Broche K1 | I/O — User I/O ball (bank 4) |
| Broche K2 | VCCIO4 — I/O bank 4 supply voltage |
| Broche K3 | I/O — User I/O ball (bank 4) |
| Broche K4 | I/O — User I/O ball (bank 4) |
| Broche K5 | GCLK2 — Global clock input 2 |
| Broche K6 | GCLK3 — Global clock input 3 |
| Broche K7 | I/O — User I/O ball (bank 4) |
| Broche K8 | I/O — User I/O ball (bank 4) |
| Broche K9 | VCCIO4 — I/O bank 4 supply voltage |
| Broche K10 | I/O — User I/O ball (bank 4) |
Applications typiques
EPM570F100A5N convient pour 7 applications: I/O Expansion and Bus Bridging, Power-Sequencing and Reset-Distribution, Address Decoding for Memory-Mapped SoCs, Industrial Control Glue Logic, Automotive Body Electronics, Display Interface Bridging, Communications Backplane Glue Logic.
I/O Expansion and Bus Bridging
The EPM570F100A5N's 570 Logic Elements and 440 macrocells give designers generous headroom to implement I2C/SPI-to-GPIO expanders, UART bridges, and custom parallel-bus mux/demux logic on a single non-volatile device. Its 5.4 ns tPD makes it well suited as a 25 MHz+ glue-logic bridge between a host SoC and slower peripheral buses, and the 76 user I/O pins easily satisfy 16-bit address plus 16-bit data plus control-signal fan-out. Instant-on flash configuration eliminates the boot PROM required by SRAM FPGAs, simplifying board bring-up.
Recommandé
Power-Sequencing and Reset-Distribution
Power-rail sequencing for multi-rail SoCs requires deterministic, glitch-free control signals that fire only after the upstream rail settles. The EPM570F100A5N provides deterministic 5.4 ns propagation delay across its 440 macrocells, ideal for cascading power-good inputs into ordered enable outputs for downstream regulators. With 1.5 V/1.8 V/2.5 V/3.3 V multi-voltage I/O banks, it can directly interface both low-voltage SoC rails and legacy 3.3 V/5 V system logic without level shifters. JTAG ISP allows in-field sequencing-logic updates.
Recommandé
Address Decoding for Memory-Mapped SoCs
Address-decoding logic for memory-mapped peripherals benefits from the EPM570F100A5N's fast 5.4 ns tPD, which keeps chip-select propagation well under one memory cycle at typical SoC clock rates. The device supports PCI-compliant 66 MHz 32-bit I/O when configured as a bus interface, and its 570 LE accommodate wide OR-decode trees for several banks of memory or peripherals. The non-volatile configuration makes the decoder logic survive power cycles without reloading, improving boot reliability in industrial control and embedded computing.
Recommandé
Industrial Control Glue Logic
Programmable glue logic for PLCs, motor drives, and factory-automation backplanes requires deterministic timing, multi-voltage I/O, and industrial-temperature operation. The EPM570F100A5N's MAX II architecture offers Schmitt-trigger inputs that tolerate noisy industrial environments, plus 76 user I/O pins for connecting to sensor inputs, relay drivers, and HMI displays. With the I5N industrial -40 to 100 °C variant sharing the FBGA-100 footprint, designs can prototype with the A5N commercial grade and migrate to I5N for production deployment without PCB rework.
Recommandé
Automotive Body Electronics
Body-control modules for lighting, mirror, and seat-positioning subsystems use the EPM570F100A5N as the central programmable logic hub to consolidate discrete 74-series logic into one AEC-Q100-qualified device. The 570 LE easily absorb typical body-module glue functions, and the four global clock lines support PWM generation for LED drivers. According to the Arrow distributor listing, the device is qualified under the Altera/Intel automotive part program for body-electronics duty cycles at 0 to 85 °C commercial temperature range.
Recommandé
Display Interface Bridging
Bridging legacy parallel LCD/LED interfaces to modern SoC MIPI-DSI or LVDS outputs requires wide parallel-bus mux logic with strict timing margins. The EPM570F100A5N provides 76 user I/O pins and 5.4 ns tPD, sufficient for byte-to-pixel remapping and clock-domain crossing at typical TFT clock rates under 50 MHz. Multi-voltage I/O banks allow direct connection to 1.8 V SoC RGB interfaces and 3.3 V legacy LCD panels without external level shifters, simplifying display daughter-card designs.
Recommandé
Communications Backplane Glue Logic
Communications backplanes route dozens of low-speed control signals alongside high-speed SERDES links and benefit from a programmable monitor/arbitration device. The EPM570F100A5N can implement custom bus-arbitration, hot-swap control, and JTAG scan-chain management across multiple line cards. The device's hot-socketing capability supports live insertion into powered backplanes, and the FBGA-100 package provides the mechanical density required for compact AdvancedTCA or microTCA-style boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570F100A5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570F100C5N | EPM570F100I5N | EPM570GF100I5N | EPM240F100C5N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-100 | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 240 (-58%) |
| Macrocells | 440 | 440 | 440 | 440 | 192 (-56%) |
| Operating Temperature | 0 to 85 °C | 0 to 85 °C | -40 to 100 °C | -40 to 100 °C | 0 to 85 °C |
| Family | MAX II | MAX II | MAX II | MAX II G-series | MAX II |
Principaux différenciateurs
- Instant-on non-volatile flash configuration simplifies board design (vs SRAM-based FPGAs)
- Higher logic density in the same FBGA-100 footprint (vs EPM240F100C5N)
- True pin-to-pin compatible temperature-grade migration (vs EPM570F100I5N)
Notes de conception
Estimated: The EPM570F100A5N draws under 100 µA standby current and typically 30 to 50 mA active at 100 MHz with 50 % LE utilization from a 3.3 V VCCINT supply. Place one 0.1 µF X7R decoupling capacitor adjacent to every VCCINT ball and one per VCCIO bank, plus a single 10 µF bulk tantalum or ceramic capacitor near the package to suppress switching transients during simultaneous-output switching (SSO).
The FBGA-100 package uses a 1.0 mm ball pitch and requires 4-layer PCB stack-up with continuous ground plane beneath the device for signal-integrity and thermal dissipation. Fan-out escape routing must avoid vias-in-pad unless the assembly house supports microvia processes; standard through-hole vias on a 0.5 mm pad drill are recommended for cost-sensitive prototypes.
Do not leave JTAG pins (TCK/TMS/TDI/TDO) floating - tie TMS and TDI high through 10 kΩ pull-ups to VCCIO3, and TCK low through 10 kΩ to ensure the TAP controller stays in a known state at power-up. Failure to do so can cause unintended JTAG state transitions and unpredictable I/O behavior during board reset.
Route the four global clock lines (GCLK0-GCLK3) with controlled 50 Ω impedance and matched lengths within ±50 mils to minimize clock skew across the device. Assign high-fanout clock nets to dedicated GCLK inputs rather than regular I/O to leverage the low-skew global clock network documented in the MAX II handbook.
Informations de conformité
RoHS compliant and AEC-Q100 qualified under the Altera/Intel automotive part program per the Arrow distributor listing. Halogen-free per the MAX II handbook ordering information section.
