EPM570GF100I5N - 570 LEs CPLD 100-FBGA 1.8V Industrial | Intel
MPN: EPM570GF100I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.4 | $18.40 |
| 10 | $16.55 | $165.50 |
| 100 | $13.8 | $1,380.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.35 | $10,350.00 |
Drop-in alternatives for EPM570GF100I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM570GF100C5N
✅ Drop-In✓ In Stock
$11.65 / Unit
View Datasheet →EPM570F100I5N
✅ Drop-In✓ In Stock
$13.4 / Unit
View Datasheet →EPM570F100C5N
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$5.2 / Unit
View Datasheet →EPM570GF100I5
✅ Drop-In📋 Reference alternative (not in catalog)
EPM570F100A5N
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPM570GF100I5N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Family | Complex Programmable Logic Device (CPLD) |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 76 |
| User Flash Memory (UFM) | 8192 bits |
| Propagation Delay (tPD) | 5.4 ns |
| Maximum Internal Frequency | 201.1 MHz |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (typ 1.8 V) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V compatible |
| Process Technology | 0.18 µm CMOS Flash |
| Package | FBGA-100 (11 x 11 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster |
| RoHS Status | Compliant |
EPM570GF100I5N fbga-100 (11 x 11 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EPM570GF100I5N (fbga-100 (11 x 11 mm, 1.0 mm pitch) package) with 100 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GF100I5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 100 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF100I5N is suitable for 6 applications: Industrial I/O Expansion and Glue Logic, Motor Control Sequencing and PWM Fanout, Microprocessor Address Decoding and Chip-Select Generation, Multi-Rail Power Sequencing and Reset Management, Bus Interface Bridging (PCI/PCIe/Local Bus Glue), Display Backplane Timing Generation.
Industrial I/O Expansion and Glue Logic
The EPM570GF100I5N is a natural fit for industrial I/O expansion boards because its 570 logic elements, 440 macrocells, and 76 user I/Os handle complex address decoding, interrupt steering, and bus interface bridging in a single flash-based device. The 5.4 ns pin-to-pin propagation delay ensures deterministic timing for handshake signals between microcontrollers and peripheral chips. Its industrial -40 °C to +100 °C operating range and MultiVolt I/O banks (1.5/1.8/2.5/3.3 V) allow direct connection to legacy 5 V-tolerant logic via bus-hold resistors. The 8 Kbit user flash memory can store board IDs and calibration data, reducing BOM cost by eliminating an external EEPROM. Quartus Prime supports fast design iteration for industrial control firmware engineers.
Recommended
Motor Control Sequencing and PWM Fanout
Motor-control inverter boards use the EPM570GF100I5N to generate dead-time insertion, gate-driver sequencing, and fault-interrupt aggregation across multiple PWM channels. The CPLD's deterministic timing (5.4 ns tPD) is critical for safety-rated PWM timing margins, while the 76 user I/Os can fan out to 6 to 8 three-phase motor channels simultaneously. Its 1.8 V core and 3.3 V I/O banks interface directly to modern MCU peripherals and gate drivers without level shifters, simplifying PCB layout. The 8 Kbit UFM holds motor calibration tables for field servicing. JTAG boundary scan supports board-level fault coverage during manufacturing test of industrial drives.
Recommended
Microprocessor Address Decoding and Chip-Select Generation
Embedded SBCs and SBC-on-module designs use the EPM570GF100I5N to generate chip-select, wait-state, and bus-arbiter signals for memory and peripheral banks from a 570-LE logic pool. The MAX II family's deterministic interconnect guarantees worst-case timing independent of design utilization, which is essential for address-decoding paths that must complete within one clock cycle. 76 user I/Os are sufficient to decode 8 to 12 peripheral banks plus interrupt routing, and the 8 Kbit UFM can store non-volatile boot configuration. The 1.8 V core and JTAG-based in-system programming simplify bring-up of prototype boards.
Recommended
Multi-Rail Power Sequencing and Reset Management
The EPM570GF100I5N orchestrates power-up and power-down sequencing for systems with multiple voltage rails, where MCU rails must come up before peripheral rails to prevent latch-up. Its instant-on flash-based architecture means outputs are valid within microseconds of VCCINT reaching regulation, and the 76 user I/Os can sequence 8 to 10 power rails with independent delay settings implemented in the UFM. Industrial -40 °C to +100 °C operation and MultiVolt I/O tolerance allow direct interface to 1.5 V, 1.8 V, 2.5 V, and 3.3 V regulators and supervisor ICs. JTAG-based in-system programming lets engineers update sequencing without recalling hardware.
Recommended
Bus Interface Bridging (PCI/PCIe/Local Bus Glue)
The EPM570GF100I5N bridges between microprocessors, FPGAs, and legacy peripherals that use differing bus standards, such as a local 32-bit bus to a 16-bit SRAM, or a parallel expansion bus to serial-controlled peripherals. The 5.4 ns tPD comfortably meets PCI 33 MHz timing budgets, and the 76 user I/Os accommodate 32-bit data plus control signals with headroom. Its 8 Kbit UFM can store bus-protocol configuration tables, reducing firmware burden. MultiVolt I/O banks interface directly to 3.3 V PCI and 1.8 V SoC peripherals without external level translation.
Recommended
Display Backplane Timing Generation
Display controller boards use the EPM570GF100I5N to generate TCON (timing controller) signals, backlight PWM dimming, and source-driver gate timing for industrial LCD panels. The deterministic 5.4 ns propagation delay synchronizes critical blanking and gate-clock phases to within one clock period, and the 76 user I/Os support up to 8 source-driver lanes with auxiliary control. Industrial temperature grade and MultiVolt I/O tolerance allow direct drive of 3.3 V TCON ICs and 1.8 V SoC outputs. The 8 Kbit UFM can hold panel EDID or lookup tables for gamma correction.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF100I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GF100C5N | EPM570F100I5N | EPM570F100C5N | EPM570GF100I5 | EPM570F100A5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-100 (11x11 mm, 1.0 mm pitch) | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial/Automotive |
| RoHS / Finish | RoHS (G suffix, N finish) | RoHS (G/N) | Non-G (standard finish) | Non-G (standard finish) | G but non-N (leaded) | RoHS N |
| Propagation Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Core Voltage | 1.71 V to 1.89 V (1.8 V typ) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
Key Differentiators
- Industrial temperature grade (vs EPM570GF100C5N)
- RoHS-compliant green finish (vs EPM570F100I5N)
- Lead-free finish indicator (N) (vs EPM570GF100I5)
- Instant-on flash-based architecture (vs EPM570F100A5N)
Design Notes
Decouple VCCINT and VCCIO separately with 0.1 µF and 10 µF capacitors placed within 5 mm of each supply ball. The MAX II family datasheet recommends one bulk 10 µF per power pin pair; shared decoupling causes ground bounce that the deterministic interconnect timing cannot mask. Power sequencing is not strictly required, but holding JTAG signals low before rails are valid avoids accidental JTAG state-machine transitions during power-up.
The FBGA-100 package has 1.0 mm ball pitch and requires laser-cut solder paste stencils with 0.4 mm apertures for reliable reflow. Vias-in-pad (VIPPO) are recommended on inner balls to route signals out of the BGA escape region. Use a 4-layer PCB with continuous ground plane directly under the FBGA to provide both thermal dissipation and controlled-impedance reference for high-speed signals; the 0.18 µm process I/O buffers can drive 100 MHz LVCMOS at moderate loads.
Do not confuse the MAX II family (flash-based, instant-on) with the older MAX 7000 (EEPROM-based) or MAX 10 (FPGA with analog) families when sourcing; bitstream and JTAG instructions are not interchangeable. Ensure Quartus Prime device selection matches the exact 'GF100' package code; selecting the TQFP-100 variant of the same die produces a different pinout file. The 'G' and 'N' suffixes (RoHS-green finish, lead-free) are independent of temperature grade ('C5' vs 'I5').
For multi-MHz outputs, place a 33 Ω damping resistor in series with each CPLD output driving a long PCB trace to suppress ringing on 3.3 V LVCMOS signals. The MultiVolt I/O bank tolerates 1.5/1.8/2.5/3.3 V inputs, but cannot drive 5 V TTL reliably without external level shifting; do not assume 5 V tolerance. Use IBIS models from the Altera website for signal-integrity simulation before final PCB layout.
Estimated: at full 76-I/O utilization switching at 50 MHz with 10 pF loads, dynamic current per I/O is approximately 2.5 mA, so total I/O current is roughly 190 mA; combined with core current around 50 mA, total power is approximately 0.43 W at VCCINT = 1.8 V and VCCIO = 3.3 V. With a 4-layer PCB ground plane, theta_JA is around 35 °C/W, producing a junction temperature rise of about 15 °C above ambient, well within the 100 °C industrial limit.
Compliance Information
RoHS-compliant per 'G' suffix and lead-free per 'N' suffix. Not AEC-Q100 qualified; for automotive screening choose EPM570F100A5N. Halogen-free status not confirmed in the verified web data.
