EPM570F100C5N - 570 LE MAX II CPLD 100-FBGA | Intel / Altera
Référence : EPM570F100C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $7.95 | $79,50 |
| 100 | $6.8 | $680,00 |
| 500 | $5.95 | $2 975,00 |
| 1 000 | $5.2 | $5 200,00 |
EPM570F100C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PLDs and high-density FPGAs in the programmable logic hierarchy. MAX II CPLDs use a unified Logic Array Block (LAB) architecture combined with a multi-level interconnect, providing deterministic timing ideal for glue logic, bus decoding, interface bridging, and control-plane state machines. Unlike SRAM-based FPGAs, the non-volatile Flash configuration makes MAX II parts boot in microseconds and retain their bitstream through power cycles without an external configuration device.
Key features of the EPM570F100C5N include 76 user I/Os, an 8 Kbit user Flash memory block (UFM), in-system programmability via JTAG, multi-volt core/IO support (1.8 V, 2.5 V, 3.3 V I/O standards), and a MultiVolt core that allows the core to run at 3.3 V while I/O banks operate at mixed voltages. The 100-FBGA package delivers the highest I/O count in the EPM570 family, making it suitable for I/O-rich glue-logic designs where board space is constrained.
Typical applications for the EPM570F100C5N include bus interface bridging (e.g., PCI to local bus), address decoding and chip-select generation in microprocessor systems, LED display driving and scan-matrix control, peripheral I/O expansion, and as a low-power alternative to small FPGAs in cost-sensitive industrial designs. Designers value MAX II CPLDs for deterministic timing, low static power (typically under 50 mA Icc), and instant-on behavior that eliminates FPGA configuration delay.
Designers should pay attention to MultiVolt bank configuration when mixing 1.8 V, 2.5 V, and 3.3 V interfaces; ensure the JTAG chain is properly terminated with 4.7 kohm pull-ups on TCK/TMS/TDI; and verify signal integrity on high-speed clock inputs to avoid metastability. The 100-FBGA requires careful PCB layout with microvia or via-in-pad technology for reliable solder joints.
This page synthesizes distributor pricing, drop-in replacement alternatives, and practical design notes not found on a single datasheet, providing engineers with a complete procurement and substitution reference.
Alternatives de remplacement direct pour EPM570F100C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570F100C5N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570F100C4N
✅ Remplacement direct✓ En stock
$14.32 / unité
Voir la fiche technique →EPM570F100I5N
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EPM570F100A5N
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPM570GF100I5N
✅ Remplacement direct✓ En stock
$10.35 / unité
Voir la fiche technique →EPM570M100C5N
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →EPM1270F100C5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570F100C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| User I/Os | 76 |
| Number of Logic Array Blocks | 57 |
| Propagation Delay (tPD) | 5.4 ns |
| Process Technology | 0.18 micron CMOS |
| Supply Voltage - Internal | 2.5 V, 3.3 V |
| I/O Standards Supported | 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL |
| Température de fonctionnement | 0C to 85C (TJ) |
| Type de montage | Surface Mount |
| Boîtier / Format | 100-LBGA (FBGA-100), 11 x 11 mm, 1.0 mm pitch |
| Supplier Device Package | 100-FBGA |
| Configuration Memory | On-chip Flash (instant-on, non-volatile) |
| In-System Programmability | Yes (JTAG, IEEE 1532) |
| User Flash Memory (UFM) | 8 Kbit |
| Lead Free / RoHS | Yes (per verified data) |
| Programming Interface | JTAG (IEEE 1149.1) |
Configuration des broches de EPM570F100C5N
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche A3 | I/O — User I/O pin (bank 1) |
| Broche A4 | I/O — User I/O pin (bank 1) |
| Broche A5 | I/O — User I/O pin (bank 1) |
| Broche A6 | I/O — User I/O pin (bank 1) |
| Broche A7 | I/O — User I/O pin (bank 1) |
| Broche A8 | I/O — User I/O pin (bank 1) |
| Broche A9 | I/O — User I/O pin (bank 1) |
| Broche A10 | I/O — User I/O pin (bank 1) |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | I/O — User I/O pin (bank 1) |
| Broche B3 | I/O — User I/O pin (bank 1) |
| Broche B4 | I/O — User I/O pin (bank 1) |
| Broche B5 | I/O — User I/O pin (bank 1) |
| Broche B6 | I/O — User I/O pin (bank 1) |
| Broche B7 | I/O — User I/O pin (bank 1) |
| Broche B8 | I/O — User I/O pin (bank 1) |
| Broche B9 | I/O — User I/O pin (bank 1) |
| Broche B10 | I/O — User I/O pin (bank 1) |
| Broche C1 | I/O — User I/O pin (bank 2) |
| Broche C2 | I/O — User I/O pin (bank 2) |
| Broche C3 | I/O — User I/O pin (bank 2) |
| Broche C4 | I/O — User I/O pin (bank 2) |
| Broche C5 | I/O — User I/O pin (bank 2) |
| Broche C6 | I/O — User I/O pin (bank 2) |
| Broche C7 | I/O — User I/O pin (bank 2) |
| Broche C8 | I/O — User I/O pin (bank 2) |
| Broche C9 | I/O — User I/O pin (bank 2) |
| Broche C10 | I/O — User I/O pin (bank 2) |
| Broche D1 | I/O — User I/O pin (bank 2) |
| Broche D2 | I/O — User I/O pin (bank 2) |
| Broche D3 | I/O — User I/O pin (bank 2) |
| Broche D4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche D5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche D6 | VCCIO2 — I/O bank 2 supply voltage |
| Broche D7 | VCCIO2 — I/O bank 2 supply voltage |
| Broche D8 | I/O — User I/O pin (bank 2) |
| Broche D9 | I/O — User I/O pin (bank 2) |
| Broche D10 | I/O — User I/O pin (bank 2) |
| Broche E1 | I/O — User I/O pin (bank 2) |
| Broche E2 | I/O — User I/O pin (bank 2) |
| Broche E3 | I/O — User I/O pin (bank 2) |
| Broche E4 | GND — Ground |
| Broche E5 | GND — Ground |
| Broche E6 | GND — Ground |
| Broche E7 | GND — Ground |
| Broche E8 | I/O — User I/O pin (bank 2) |
| Broche E9 | I/O — User I/O pin (bank 2) |
| Broche E10 | I/O — User I/O pin (bank 2) |
| Broche F1 | I/O — User I/O pin (bank 3) |
| Broche F2 | I/O — User I/O pin (bank 3) |
| Broche F3 | I/O — User I/O pin (bank 3) |
| Broche F4 | GND — Ground |
| Broche F5 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Broche F6 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Broche F7 | GND — Ground |
| Broche F8 | I/O — User I/O pin (bank 3) |
| Broche F9 | I/O — User I/O pin (bank 3) |
| Broche F10 | I/O — User I/O pin (bank 3) |
| Broche G1 | I/O — User I/O pin (bank 3) |
| Broche G2 | I/O — User I/O pin (bank 3) |
| Broche G3 | TDI — JTAG Test Data In |
| Broche G4 | TMS — JTAG Test Mode Select |
| Broche G5 | |
| Broche G6 | TCK — JTAG Test Clock |
| Broche G7 | TDO — JTAG Test Data Out |
| Broche G8 | I/O — User I/O pin (bank 3) |
| Broche G9 | I/O — User I/O pin (bank 3) |
| Broche G10 | I/O — User I/O pin (bank 3) |
| Broche H1 | I/O — User I/O pin (bank 3) |
| Broche H2 | I/O — User I/O pin (bank 3) |
| Broche H3 | I/O — User I/O pin (bank 3) |
| Broche H4 | I/O — User I/O pin (bank 3) |
| Broche H5 | GND — Ground |
| Broche H6 | GND — Ground |
| Broche H7 | I/O — User I/O pin (bank 4) |
| Broche H8 | I/O — User I/O pin (bank 4) |
| Broche H9 | I/O — User I/O pin (bank 4) |
| Broche H10 | I/O — User I/O pin (bank 4) |
| Broche J1 | I/O — User I/O pin (bank 3) |
| Broche J2 | I/O — User I/O pin (bank 3) |
| Broche J3 | I/O — User I/O pin (bank 3) |
| Broche J4 | I/O — User I/O pin (bank 3) |
| Broche J5 | VCCIO3 — I/O bank 3 supply voltage |
| Broche J6 | VCCIO4 — I/O bank 4 supply voltage |
| Broche J7 | I/O — User I/O pin (bank 4) |
| Broche J8 | I/O — User I/O pin (bank 4) |
| Broche J9 | I/O — User I/O pin (bank 4) |
| Broche J10 | I/O — User I/O pin (bank 4) |
| Broche K1 | I/O — User I/O pin (bank 3) |
| Broche K2 | I/O — User I/O pin (bank 3) |
| Broche K3 | I/O — User I/O pin (bank 3) |
| Broche K4 | I/O — User I/O pin (bank 3) |
| Broche K5 | GND — Ground |
| Broche K6 | GND — Ground |
| Broche K7 | I/O — User I/O pin (bank 4) |
| Broche K8 | I/O — User I/O pin (bank 4) |
| Broche K9 | I/O — User I/O pin (bank 4) |
| Broche K10 | I/O — User I/O pin (bank 4) |
| Broche L1 | I/O — User I/O pin (bank 4) |
| Broche L2 | I/O — User I/O pin (bank 4) |
| Broche L3 | I/O — User I/O pin (bank 4) |
| Broche L4 | I/O — User I/O pin (bank 4) |
| Broche L5 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Broche L6 | VCCINT — Core supply voltage (2.5 V or 3.3 V) |
| Broche L7 | GND — Ground |
| Broche L8 | I/O — User I/O pin (bank 4) |
| Broche L9 | I/O — User I/O pin (bank 4) |
| Broche L10 | I/O — User I/O pin (bank 4) |
| Broche M1 | I/O — User I/O pin (bank 4) |
| Broche M2 | I/O — User I/O pin (bank 4) |
| Broche M3 | I/O — User I/O pin (bank 4) |
| Broche M4 | I/O — User I/O pin (bank 4) |
| Broche M5 | GND — Ground |
| Broche M6 | GND — Ground |
| Broche M7 | I/O — User I/O pin (bank 4) |
| Broche M8 | I/O — User I/O pin (bank 4) |
| Broche M9 | I/O — User I/O pin (bank 4) |
| Broche M10 | I/O — User I/O pin (bank 4) |
| Broche N1 | I/O — User I/O pin (bank 4) |
| Broche N2 | I/O — User I/O pin (bank 4) |
| Broche N3 | I/O — User I/O pin (bank 4) |
| Broche N4 | I/O — User I/O pin (bank 4) |
| Broche N5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche N6 | VCCIO4 — I/O bank 4 supply voltage |
| Broche N7 | I/O — User I/O pin (bank 4) |
| Broche N8 | I/O — User I/O pin (bank 4) |
| Broche N9 | I/O — User I/O pin (bank 4) |
| Broche N10 | I/O — User I/O pin (bank 4) |
| Broche P1 | I/O — User I/O pin (bank 4) |
| Broche P2 | I/O — User I/O pin (bank 4) |
| Broche P3 | I/O — User I/O pin (bank 4) |
| Broche P4 | I/O — User I/O pin (bank 4) |
| Broche P5 | I/O — User I/O pin (bank 4) |
| Broche P6 | I/O — User I/O pin (bank 4) |
| Broche P7 | I/O — User I/O pin (bank 4) |
| Broche P8 | I/O — User I/O pin (bank 4) |
| Broche P9 | I/O — User I/O pin (bank 4) |
| Broche P10 | I/O — User I/O pin (bank 4) |
Applications typiques
EPM570F100C5N convient pour 6 applications: Microprocessor Bus Interface Bridging, Address Decoding and Chip-Select Generation, LED Display Scanning and Matrix Control, Peripheral I/O Expansion, Glue Logic Replacement (74-series consolidation), Industrial Control and Automation I/O.
Microprocessor Bus Interface Bridging
The EPM570F100C5N is well suited for bus interface bridging between legacy microprocessors and modern peripherals, where the 76 user I/Os provide ample connections for data, address, and control signals. Its 5.4 ns pin-to-pin delay allows protocol translation at clock rates up to 150 MHz without introducing latency that violates bus hold times. The instant-on Flash configuration eliminates FPGA boot time at power-up, ensuring the bridge is active before the CPU begins its bus cycles. Placed between a CPU local bus and a downstream peripheral, the CPLD decodes chip selects and arbitrates interrupts with deterministic timing. Compared to a small FPGA, the MAX II architecture consumes less static current (typically under 50 mA) while delivering the same glue-logic functionality, making it ideal for cost-sensitive embedded designs.
Recommandé
Address Decoding and Chip-Select Generation
The EPM570F100C5N excels at address decoding and chip-select generation in microprocessor systems, where its 440 macrocells can decode wide address buses with multiple chip-select outputs while maintaining 5.4 ns propagation delay. Designers use it to replace discrete 74LS138/139 decoder trees with a single programmable device, reducing PCB area and improving design flexibility. The 76 user I/Os support up to 76 decoded select outputs, well above what any discrete decoder can offer. Multi-volt I/O support (1.8 V, 2.5 V, 3.3 V) lets the CPLD interface directly with both modern low-voltage processors and legacy 3.3 V peripherals without level shifters. The instant-on behavior ensures chip-selects are valid by the time the CPU comes out of reset, eliminating the boot-race conditions common with SRAM-based FPGAs.
Recommandé
LED Display Scanning and Matrix Control
The EPM570F100C5N drives multiplexed LED matrix displays by generating row-scan patterns and column data latching signals at rates up to tens of MHz. Its 76 user I/Os can drive a 16-row x 32-column display directly when paired with external LED drivers, and the deterministic 5.4 ns delay allows precise PWM dimming control without flicker. The on-chip 8 Kbit user Flash memory stores calibration coefficients and brightness tables, eliminating an external EEPROM. Designers value the CPLD's ability to combine display refresh logic, button input scanning, and communication interfaces (SPI, I2C) in a single device, reducing BOM cost. The 100-FBGA package's high I/O density is ideal when the display controller must coexist with multiple peripheral interfaces on the same PCB.
Recommandé
Peripheral I/O Expansion
The EPM570F100C5N serves as a peripheral I/O expander for microcontrollers or processors that lack sufficient native GPIOs. Its 76 user I/Os can be configured individually as input, output, or bidirectional with internal pull-ups, replacing multiple GPIO expander chips with a single programmable device. The JTAG programming interface allows in-system firmware updates during development without external programming hardware. With MultiVolt I/O support, the CPLD bridges 1.8 V microcontroller pins to 3.3 V peripheral devices without external level shifters. Industrial designers appreciate the deterministic timing for interrupt prioritization and PWM generation at the I/O expansion layer. Compared to I2C/SPI GPIO expanders, the MAX II CPLD delivers faster response (sub-100 ns) and parallel I/O updates across many pins simultaneously.
Recommandé
Glue Logic Replacement (74-series consolidation)
The EPM570F100C5N consolidates dozens of 74-series logic gates (AND, OR, XOR, flip-flops, multiplexers) into a single programmable device, dramatically reducing PCB area and BOM count. With 440 macrocells, each equivalent to roughly 4-6 standard 74-series gates, the EPM570 can replace up to 2000 discrete gates while consuming a fraction of the board space. The non-volatile Flash configuration means the logic is active at power-on without external boot devices, eliminating the configuration delay of SRAM FPGAs. Designers can iterate logic changes in seconds via JTAG without re-spinning the PCB, accelerating development cycles. The deterministic 5.4 ns pin-to-pin delay ensures consistent timing across all operating conditions, critical for control-plane logic where race conditions cannot be tolerated.
Recommandé
Industrial Control and Automation I/O
The EPM570F100C5N is deployed in industrial control and automation systems where it interfaces sensors, actuators, and communication buses with deterministic timing. Its 76 user I/Os support parallel sensor arrays and multi-channel communication buses (RS-485, RS-232, SPI, I2C), while the 5.4 ns propagation delay enables real-time response to sensor events. For harsh industrial environments, the industrial-grade EPM570F100I5N variant extends operation to -40C to 100C. The CPLD's instant-on behavior ensures deterministic startup of safety-critical control loops, unlike FPGAs that require configuration time at boot. The on-chip 8 Kbit user Flash stores calibration data and serial numbers for asset tracking. Compared to discrete microcontroller solutions, the MAX II CPLD offers faster response and parallel processing of multiple I/O events without software overhead.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570F100C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570F100C4N | EPM570F100I5N | EPM570F100A5N | EPM570GF100I5N | EPM570M100C5N | EPM1270F100C5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-FBGA (11x11 mm) | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-FBGA (11x11 mm) - same | 100-TFBGA - same footprint | 100-FBGA (11x11 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 980 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| Propagation Delay (tPD) | 5.4 ns | 4.0 ns (-4 faster) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 100C (industrial) | -40C to 125C (automotive) | -40C to 100C (industrial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| AEC-Q100 Qualified | No | No | No | Yes | No | No | No |
Principaux différenciateurs
- 76 user I/Os in 100-FBGA, the highest I/O-count package in the EPM570 family (vs EPM570T100C5N (TQFP-100, 64 user I/Os))
- On-chip Flash configuration enables instant-on at power-up with no boot PROM (vs SRAM-based FPGAs (e.g., Cyclone IV EP4CE6))
- MultiVolt core allows 2.5 V or 3.3 V core from a single device (vs EPM240T100C5N (MAX II Z, 240 LE, fixed 3.3 V core))
Notes de conception
Estimated: The 100-FBGA at 1.0 mm pitch requires PCB fabrication with 0.4 mm laser-drilled microvias or via-in-pad technology for reliable solder joints. Standard 0.3 mm mechanical drills will not fit between 1.0 mm pitch balls; verify your PCB fabricator's capabilities before committing to the BGA variant. Designers can choose the TQFP-100 or EQFP-100 alternatives in the MAX II family for simpler 2-layer PCB designs.
Estimated: The MAX II MultiVolt I/O architecture allows mixing 1.8 V, 2.5 V, and 3.3 V I/O standards across the four I/O banks, but each bank must be powered from a single VCCIO rail. Ensure VCCIO1 through VCCIO4 are properly decoupled with 0.1 uF ceramic capacitors placed within 5 mm of each supply ball, plus a 10 uF bulk capacitor per bank. Unused I/O pins should be configured as outputs driving ground to minimize power consumption and switching noise.
The JTAG chain requires external 4.7 kohm pull-up resistors on TCK and TMS per IEEE 1149.1 specification; missing pull-ups cause intermittent JTAG programming failures. VCCINT must ramp monotonically from 0 V to the target voltage (2.5 V or 3.3 V) within 100 ms to avoid configuration errors at startup. The UFM (User Flash Memory) shares configuration logic resources and must be accounted for in your logic utilization budget before compilation.
Estimated: At maximum toggle rates (76 outputs at 100 MHz with 20 pF loads), the EPM570F100C5N dissipates approximately 0.5 W to 1.0 W typical. The 100-FBGA package has a theta_JA of approximately 30-35 C/W with standard JEDEC test board airflow, resulting in a 15-35 C junction temperature rise above ambient. For enclosed chassis designs without airflow, derate clock frequencies by 25-30% to maintain junction temperature below 125 C.
Informations de conformité
RoHS and lead-free compliance confirmed by distributor data. Not AEC-Q100 qualified - migrate to EPM570F100A5N for automotive. Halogen-free and conflict-mineral declarations not specified in available data.
