EPM570F100A5N - MAX II CPLD, 570 LE, 100-FBGA | Intel / Altera
MPN: EPM570F100A5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.4 | $16.40 |
| 10 | $14.75 | $147.50 |
| 100 | $12.9 | $1,290.00 |
| 500 | $11.2 | $5,600.00 |
| 1,000 | $9.85 | $9,850.00 |
Drop-in alternatives for EPM570F100A5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570F100C5N
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View Datasheet βEPM570F100A5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 570 |
| Macrocells | 440 |
| User Flash Memory | 8 Kbits |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 201.1 MHz |
| User I/O Pins (max) | 76 |
| Global Clock Lines | 4 |
| Supply Voltage - Core | 3.3 V |
| Supply Voltage - I/O Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 Β΅m flash |
| Package | 100-ball FBGA |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Operating Temperature | 0Β°C to +85Β°C (commercial) |
| RoHS Status | Compliant |
EPM570F100A5N Pin Configuration
| Pin A1 | I/O β User I/O ball (bank 1) |
| Pin A2 | GND β Ground |
| Pin A3 | I/O β User I/O ball (bank 1) |
| Pin A4 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A5 | I/O β User I/O ball (bank 1) |
| Pin A6 | I/O β User I/O ball (bank 1) |
| Pin A7 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A8 | I/O β User I/O ball (bank 1) |
| Pin A9 | GND β Ground |
| Pin A10 | I/O β User I/O ball (bank 1) |
| Pin B1 | I/O β User I/O ball (bank 1) |
| Pin B2 | I/O β User I/O ball (bank 1) |
| Pin B3 | GND β Ground |
| Pin B4 | I/O β User I/O ball (bank 1) |
| Pin B5 | I/O β User I/O ball (bank 1) |
| Pin B6 | I/O β User I/O ball (bank 1) |
| Pin B7 | I/O β User I/O ball (bank 1) |
| Pin B8 | GND β Ground |
| Pin B9 | I/O β User I/O ball (bank 1) |
| Pin B10 | I/O β User I/O ball (bank 1) |
| Pin C1 | I/O β User I/O ball (bank 2) |
| Pin C2 | VCCIO2 β I/O bank 2 supply voltage |
| Pin C3 | I/O β User I/O ball (bank 2) |
| Pin C4 | I/O β User I/O ball (bank 2) |
| Pin C5 | GND β Ground |
| Pin C6 | I/O β User I/O ball (bank 2) |
| Pin C7 | I/O β User I/O ball (bank 2) |
| Pin C8 | VCCIO2 β I/O bank 2 supply voltage |
| Pin C9 | I/O β User I/O ball (bank 2) |
| Pin C10 | I/O β User I/O ball (bank 2) |
| Pin D1 | I/O β User I/O ball (bank 2) |
| Pin D2 | I/O β User I/O ball (bank 2) |
| Pin D3 | I/O β User I/O ball (bank 2) |
| Pin D4 | GND β Ground |
| Pin D5 | VCCINT β Core supply voltage (3.3 V) |
| Pin D6 | GND β Ground |
| Pin D7 | I/O β User I/O ball (bank 2) |
| Pin D8 | I/O β User I/O ball (bank 2) |
| Pin D9 | I/O β User I/O ball (bank 2) |
| Pin D10 | I/O β User I/O ball (bank 2) |
| Pin E1 | I/O β User I/O ball (bank 3) |
| Pin E2 | VCCIO3 β I/O bank 3 supply voltage |
| Pin E3 | I/O β User I/O ball (bank 3) |
| Pin E4 | VCCINT β Core supply voltage (3.3 V) |
| Pin E5 | GND β Ground |
| Pin E6 | VCCINT β Core supply voltage (3.3 V) |
| Pin E7 | I/O β User I/O ball (bank 3) |
| Pin E8 | VCCIO3 β I/O bank 3 supply voltage |
| Pin E9 | I/O β User I/O ball (bank 3) |
| Pin E10 | I/O β User I/O ball (bank 3) |
| Pin F1 | I/O β User I/O ball (bank 3) |
| Pin F2 | I/O β User I/O ball (bank 3) |
| Pin F3 | I/O β User I/O ball (bank 3) |
| Pin F4 | GND β Ground |
| Pin F5 | TMS β JTAG test mode select |
| Pin F6 | GND β Ground |
| Pin F7 | I/O β User I/O ball (bank 3) |
| Pin F8 | I/O β User I/O ball (bank 3) |
| Pin F9 | I/O β User I/O ball (bank 3) |
| Pin F10 | I/O β User I/O ball (bank 4) |
| Pin G1 | I/O β User I/O ball (bank 3) |
| Pin G2 | I/O β User I/O ball (bank 3) |
| Pin G3 | GND β Ground |
| Pin G4 | TCK β JTAG test clock |
| Pin G5 | TDI β JTAG test data in |
| Pin G6 | TDO β JTAG test data out |
| Pin G7 | I/O β User I/O ball (bank 3) |
| Pin G8 | GND β Ground |
| Pin G9 | I/O β User I/O ball (bank 4) |
| Pin G10 | I/O β User I/O ball (bank 4) |
| Pin H1 | I/O β User I/O ball (bank 4) |
| Pin H2 | VCCIO4 β I/O bank 4 supply voltage |
| Pin H3 | I/O β User I/O ball (bank 4) |
| Pin H4 | GND β Ground |
| Pin H5 | VCCINT β Core supply voltage (3.3 V) |
| Pin H6 | GND β Ground |
| Pin H7 | I/O β User I/O ball (bank 4) |
| Pin H8 | VCCIO4 β I/O bank 4 supply voltage |
| Pin H9 | I/O β User I/O ball (bank 4) |
| Pin H10 | I/O β User I/O ball (bank 4) |
| Pin J1 | I/O β User I/O ball (bank 4) |
| Pin J2 | I/O β User I/O ball (bank 4) |
| Pin J3 | I/O β User I/O ball (bank 4) |
| Pin J4 | GND β Ground |
| Pin J5 | GCLK0 β Global clock input 0 |
| Pin J6 | GCLK1 β Global clock input 1 |
| Pin J7 | I/O β User I/O ball (bank 4) |
| Pin J8 | I/O β User I/O ball (bank 4) |
| Pin J9 | I/O β User I/O ball (bank 4) |
| Pin J10 | I/O β User I/O ball (bank 4) |
| Pin K1 | I/O β User I/O ball (bank 4) |
| Pin K2 | VCCIO4 β I/O bank 4 supply voltage |
| Pin K3 | I/O β User I/O ball (bank 4) |
| Pin K4 | I/O β User I/O ball (bank 4) |
| Pin K5 | GCLK2 β Global clock input 2 |
| Pin K6 | GCLK3 β Global clock input 3 |
| Pin K7 | I/O β User I/O ball (bank 4) |
| Pin K8 | I/O β User I/O ball (bank 4) |
| Pin K9 | VCCIO4 β I/O bank 4 supply voltage |
| Pin K10 | I/O β User I/O ball (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F100A5N is suitable for 7 applications: I/O Expansion and Bus Bridging, Power-Sequencing and Reset-Distribution, Address Decoding for Memory-Mapped SoCs, Industrial Control Glue Logic, Automotive Body Electronics, Display Interface Bridging, Communications Backplane Glue Logic.
I/O Expansion and Bus Bridging
The EPM570F100A5N's 570 Logic Elements and 440 macrocells give designers generous headroom to implement I2C/SPI-to-GPIO expanders, UART bridges, and custom parallel-bus mux/demux logic on a single non-volatile device. Its 5.4 ns tPD makes it well suited as a 25 MHz+ glue-logic bridge between a host SoC and slower peripheral buses, and the 76 user I/O pins easily satisfy 16-bit address plus 16-bit data plus control-signal fan-out. Instant-on flash configuration eliminates the boot PROM required by SRAM FPGAs, simplifying board bring-up.
Recommended
Power-Sequencing and Reset-Distribution
Power-rail sequencing for multi-rail SoCs requires deterministic, glitch-free control signals that fire only after the upstream rail settles. The EPM570F100A5N provides deterministic 5.4 ns propagation delay across its 440 macrocells, ideal for cascading power-good inputs into ordered enable outputs for downstream regulators. With 1.5 V/1.8 V/2.5 V/3.3 V multi-voltage I/O banks, it can directly interface both low-voltage SoC rails and legacy 3.3 V/5 V system logic without level shifters. JTAG ISP allows in-field sequencing-logic updates.
Recommended
Address Decoding for Memory-Mapped SoCs
Address-decoding logic for memory-mapped peripherals benefits from the EPM570F100A5N's fast 5.4 ns tPD, which keeps chip-select propagation well under one memory cycle at typical SoC clock rates. The device supports PCI-compliant 66 MHz 32-bit I/O when configured as a bus interface, and its 570 LE accommodate wide OR-decode trees for several banks of memory or peripherals. The non-volatile configuration makes the decoder logic survive power cycles without reloading, improving boot reliability in industrial control and embedded computing.
Recommended
Industrial Control Glue Logic
Programmable glue logic for PLCs, motor drives, and factory-automation backplanes requires deterministic timing, multi-voltage I/O, and industrial-temperature operation. The EPM570F100A5N's MAX II architecture offers Schmitt-trigger inputs that tolerate noisy industrial environments, plus 76 user I/O pins for connecting to sensor inputs, relay drivers, and HMI displays. With the I5N industrial -40 to 100 Β°C variant sharing the FBGA-100 footprint, designs can prototype with the A5N commercial grade and migrate to I5N for production deployment without PCB rework.
Recommended
Automotive Body Electronics
Body-control modules for lighting, mirror, and seat-positioning subsystems use the EPM570F100A5N as the central programmable logic hub to consolidate discrete 74-series logic into one AEC-Q100-qualified device. The 570 LE easily absorb typical body-module glue functions, and the four global clock lines support PWM generation for LED drivers. According to the Arrow distributor listing, the device is qualified under the Altera/Intel automotive part program for body-electronics duty cycles at 0 to 85 Β°C commercial temperature range.
Recommended
Display Interface Bridging
Bridging legacy parallel LCD/LED interfaces to modern SoC MIPI-DSI or LVDS outputs requires wide parallel-bus mux logic with strict timing margins. The EPM570F100A5N provides 76 user I/O pins and 5.4 ns tPD, sufficient for byte-to-pixel remapping and clock-domain crossing at typical TFT clock rates under 50 MHz. Multi-voltage I/O banks allow direct connection to 1.8 V SoC RGB interfaces and 3.3 V legacy LCD panels without external level shifters, simplifying display daughter-card designs.
Recommended
Communications Backplane Glue Logic
Communications backplanes route dozens of low-speed control signals alongside high-speed SERDES links and benefit from a programmable monitor/arbitration device. The EPM570F100A5N can implement custom bus-arbitration, hot-swap control, and JTAG scan-chain management across multiple line cards. The device's hot-socketing capability supports live insertion into powered backplanes, and the FBGA-100 package provides the mechanical density required for compact AdvancedTCA or microTCA-style boards.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F100A5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F100C5N | EPM570F100I5N | EPM570GF100I5N | EPM240F100C5N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-100 | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same | FBGA-100 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 240 (-58%) |
| Macrocells | 440 | 440 | 440 | 440 | 192 (-56%) |
| Pin-to-Pin Delay | 5.4 ns | Slower C5N bin | 5.4 ns | [DATA_NEEDED] | Slower C5N bin |
| Operating Temperature | 0 to 85 Β°C | 0 to 85 Β°C | -40 to 100 Β°C | -40 to 100 Β°C | 0 to 85 Β°C |
| Family | MAX II | MAX II | MAX II | MAX II G-series | MAX II |
| Typical 1k Price (USD) | 9.85 | 9.85 | 12.50 | [DATA_NEEDED] | 8.20 |
Key Differentiators
- Instant-on non-volatile flash configuration simplifies board design (vs SRAM-based FPGAs)
- Higher logic density in the same FBGA-100 footprint (vs EPM240F100C5N)
- True pin-to-pin compatible temperature-grade migration (vs EPM570F100I5N)
Design Notes
Estimated: The EPM570F100A5N draws under 100 Β΅A standby current and typically 30 to 50 mA active at 100 MHz with 50 % LE utilization from a 3.3 V VCCINT supply. Place one 0.1 Β΅F X7R decoupling capacitor adjacent to every VCCINT ball and one per VCCIO bank, plus a single 10 Β΅F bulk tantalum or ceramic capacitor near the package to suppress switching transients during simultaneous-output switching (SSO).
The FBGA-100 package uses a 1.0 mm ball pitch and requires 4-layer PCB stack-up with continuous ground plane beneath the device for signal-integrity and thermal dissipation. Fan-out escape routing must avoid vias-in-pad unless the assembly house supports microvia processes; standard through-hole vias on a 0.5 mm pad drill are recommended for cost-sensitive prototypes.
Do not leave JTAG pins (TCK/TMS/TDI/TDO) floating - tie TMS and TDI high through 10 kΞ© pull-ups to VCCIO3, and TCK low through 10 kΞ© to ensure the TAP controller stays in a known state at power-up. Failure to do so can cause unintended JTAG state transitions and unpredictable I/O behavior during board reset.
Route the four global clock lines (GCLK0-GCLK3) with controlled 50 Ξ© impedance and matched lengths within Β±50 mils to minimize clock skew across the device. Assign high-fanout clock nets to dedicated GCLK inputs rather than regular I/O to leverage the low-skew global clock network documented in the MAX II handbook.
Compliance Information
RoHS compliant and AEC-Q100 qualified under the Altera/Intel automotive part program per the Arrow distributor listing. Halogen-free per the MAX II handbook ordering information section.
