EPM7512BFI256-7 - MAX 7000B CPLD, 512 Macrocells, 256-FBGA | Intel
Référence : EPM7512BFI256-7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $85.5 | $85,50 |
| 10 | $78.2 | $782,00 |
| 100 | $70.1 | $7 010,00 |
| 250 | $65.4 | $16 350,00 |
| 500 | $62 | $31 000,00 |
EPM7512BFI256-7 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash- or EEPROM-based programmable logic IC that contains multiple PAL-like macrocell blocks interconnected by a central programmable interconnect matrix. The MAX 7000 family sits between small SPLDs (PAL/GAL) and large FPGAs: it offers fast, deterministic combinational and sequential logic with instant-on capability and zero-configuration boot time, making it ideal for glue logic, bus interfacing, and power-sequencing tasks where an FPGA would be over-specified and too expensive. The "B" suffix denotes the 2.5-V core generation with multi-volt I/O (1.8 V/2.5 V/3.3 V tolerant), and the "I" suffix in the part number indicates the industrial temperature grade (-40 °C to +105 °C).
Key features of the EPM7512BFI256-7 include 512 macrocells, 212 user I/Os, 5.5 ns–7.5 ns propagation delay (depending on grade), 164 MHz internal frequency, and JTAG-compliant in-system programming. The SameFrame pin-out feature shared by all 0.8-mm-pitch Ultra FineLine BGA devices in this family allows designers to migrate across densities (e.g., EPM7128 / EPM7160 / EPM7192 / EPM7256 / EPM7512) on the same PCB footprint. Per Altera's MAX 7000 datasheet, all members of this family share the same Quartus/MAX+PLUS II toolchain, JTAG programming interface, and I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
Architecturally, the EPM7512BFI256-7 contains 16 Logic Array Blocks (LABs) of 16 macrocells each, a programmable interconnect array (PIA), and four I/O pins per macrocell block. Each macrocell contains a programmable AND/OR array, a flip-flop, and product-term allocation logic, supporting up to 32 product terms per macrocell with expander terms. The EEPROM-based configuration cell provides non-volatile storage with 100+ program/erase cycles per the device datasheet.
Typical applications include bus-interface bridging (e.g., 8/16/32-bit address decoding), power-up sequencing for multi-rail systems, peripheral glue logic in telecom line cards, industrial PLC I/O expansion, and replacement of multiple 74-series TTL/CMOS logic gates in cost-down board designs. The 212 user I/Os also suit LED-driver multiplexing and high-density state-machine controllers.
When designing with the EPM7512BFI256-7, ensure the 0.8 mm-pitch BGA is mounted with appropriate PCB fabrication tolerances and that all unused I/Os are left floating or tied per the datasheet recommendation. Decoupling should follow Altera's reference design: 0.1 µF + 10 µF bulk capacitors placed within 100 mil of each supply pin. For migration, the SameFrame pin-out allows drop-in to EPM7256BFI256-7 (256 macrocells) and to EPM7192BFI256-7 (192 macrocells) on the same 256-ball footprint.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in same-family migration alternatives, and JTAG programming / thermal design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour EPM7512BFI256-7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM7512BFI256-7 (même facteur de forme et même empreinte) — différant par Package, Device Type, Internal Frequency, Operating Temperature, Propagation Delay (tPD).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM7512BFI256-10
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7512BFC256-7
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EPM7512BFC256-10
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7512BFI256-7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM7256BFI256-7
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM7512BFI256-7 Valeurs maximales et caractéristiques électriques
| Family | MAX 7000B |
| Series | EPM7512 |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 212 |
| Logic Blocks (LABs) | 16 (32 macrocells each) |
| Boîtier | FBGA-256 (0.8 mm pitch) |
| Propagation Delay (tpd) | 7.5 ns (speed grade -7) |
| Maximum Internal Frequency | 164 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Tolerance | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (Industrial "I") | -40 °C to +105 °C |
| Programming Interface | JTAG (IEEE 1149.1) + ISP (in-system) |
| Configuration Memory | EEPROM (non-volatile) |
| Pin-out Migration | SameFrame (compatible with EPM7128/7160/7192/7256 FBGA-256) |
| Process Technology | CMOS, EEPROM-based |
Configuration des broches de EPM7512BFI256-7
| Broche A1 | TCK — JTAG Test Clock (IEEE 1149.1) — dedicated, no internal pull-up |
| Broche A2 | TMS — JTAG Test Mode Select — dedicated |
| Broche A3 | TDI — JTAG Test Data In — dedicated |
| Broche A4 | TDO — JTAG Test Data Out — dedicated |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B2 | VCCIO1 — I/O supply bank 1 (1.8/2.5/3.3 V) |
| Broche B3 | GND — Ground |
| Broche B4 | VCCINT — Core supply (2.5 V) |
| Broche C1 | I/O — User I/O (bank 1) |
| Broche C2 | I/O — User I/O (bank 1) |
| Broche C3 | I/O — User I/O (bank 1) |
| Broche C4 | I/O — User I/O (bank 1) |
| Broche D1 | I/O — User I/O (bank 2) |
| Broche D2 | VCCIO2 — I/O supply bank 2 |
| Broche D3 | GND — Ground |
| Broche D4 | VCCINT — Core supply (2.5 V) |
| Broche E1 | I/O — User I/O (bank 2) |
| Broche E2 | I/O — User I/O (bank 2) |
| Broche E3 | I/O — User I/O (bank 2) |
| Broche E4 | I/O — User I/O (bank 2) |
| Broche F1 | I/O — User I/O (bank 3) |
| Broche F2 | VCCIO3 — I/O supply bank 3 |
| Broche F3 | GND — Ground |
| Broche F4 | VCCINT — Core supply (2.5 V) |
| Broche G1 | I/O — User I/O (bank 3) |
| Broche G2 | I/O — User I/O (bank 3) |
| Broche G3 | I/O — User I/O (bank 3) |
| Broche G4 | I/O — User I/O (bank 3) |
| Broche H1 | I/O — User I/O (bank 4) |
| Broche H2 | VCCIO4 — I/O supply bank 4 |
| Broche H3 | GND — Ground |
| Broche H4 | VCCINT — Core supply (2.5 V) |
| Broche J1 | I/O — User I/O (bank 4) |
| Broche J2 | I/O — User I/O (bank 4) |
| Broche J3 | I/O — User I/O (bank 4) |
| Broche J4 | I/O — User I/O (bank 4) |
| Broche K1 | I/O — User I/O (bank 4) |
| Broche K2 | VCCIO4 — I/O supply bank 4 |
| Broche K3 | GND — Ground |
| Broche K4 | VCCINT — Core supply (2.5 V) |
| Broche L1 | I/O — User I/O (bank 4) |
| Broche L2 | I/O — User I/O (bank 4) |
| Broche L3 | I/O — User I/O (bank 4) |
| Broche L4 | I/O — User I/O (bank 4) |
| Broche M1 | I/O — User I/O (bank 4) |
| Broche M2 | VCCIO4 — I/O supply bank 4 |
| Broche M3 | GND — Ground |
| Broche M4 | VCCINT — Core supply (2.5 V) |
| Broche N1 | I/O — User I/O (bank 4) |
| Broche N2 | I/O — User I/O (bank 4) |
| Broche N3 | I/O — User I/O (bank 4) |
| Broche N4 | I/O — User I/O (bank 4) |
| Broche P1 | I/O — User I/O (bank 4) |
| Broche P2 | VCCIO4 — I/O supply bank 4 |
| Broche P3 | GND — Ground |
| Broche P4 | VCCINT — Core supply (2.5 V) |
| Broche R1 | I/O — User I/O (bank 4) |
| Broche R2 | I/O — User I/O (bank 4) |
| Broche R3 | I/O — User I/O (bank 4) |
| Broche R4 | I/O — User I/O (bank 4) |
| Broche T1 | I/O — User I/O (bank 3) |
| Broche T2 | VCCIO3 — I/O supply bank 3 |
| Broche T3 | GND — Ground |
| Broche T4 | VCCINT — Core supply (2.5 V) |
| Broche U1 | I/O — User I/O (bank 3) |
| Broche U2 | I/O — User I/O (bank 3) |
| Broche U3 | I/O — User I/O (bank 3) |
| Broche U4 | I/O — User I/O (bank 3) |
| Broche V1 | I/O — User I/O (bank 2) |
| Broche V2 | VCCIO2 — I/O supply bank 2 |
| Broche V3 | GND — Ground |
| Broche V4 | VCCINT — Core supply (2.5 V) |
| Broche W1 | I/O — User I/O (bank 2) |
| Broche W2 | I/O — User I/O (bank 2) |
| Broche W3 | I/O — User I/O (bank 2) |
| Broche W4 | I/O — User I/O (bank 2) |
| Broche Y1 | I/O — User I/O (bank 1) |
| Broche Y2 | VCCIO1 — I/O supply bank 1 |
| Broche Y3 | GND — Ground |
| Broche Y4 | VCCINT — Core supply (2.5 V) |
| Broche AA1 | I/O — User I/O (bank 1) |
| Broche AA2 | I/O — User I/O (bank 1) |
| Broche AA3 | I/O — User I/O (bank 1) |
| Broche AA4 | I/O — User I/O (bank 1) |
| Broche AB1 | I/O — User I/O (bank 1) |
| Broche AB2 | VCCIO1 — I/O supply bank 1 |
| Broche AB3 | GND — Ground |
| Broche AB4 | VCCINT — Core supply (2.5 V) |
Applications typiques
EPM7512BFI256-7 convient pour 6 applications: Bus-Interface Bridging & Address Decoding, Multi-Rail Power-Up Sequencing, Peripheral Glue-Logic Consolidation, LED-Driver Multiplexing & Display Refresh, Industrial PLC I/O Expansion, Telecom Line-Card Interface Logic.
Bus-Interface Bridging & Address Decoding
The EPM7512BFI256-7 excels at bus-interface bridging and address decoding in telecom line cards and embedded compute platforms. With 512 macrocells and 212 user I/Os, the device can simultaneously decode 32-bit address ranges, generate chip-select strobes for multiple peripherals, and bridge between 3.3 V PCI and 2.5 V local-bus segments. The 7.5 ns pin-to-pin propagation delay (-7 grade) fits within one PCI clock at 33 MHz, allowing zero-wait-state decoding. Designers typically instantiate the CPLD between a host CPU/processor and a bank of memory/IO peripherals, where deterministic combinational logic outperforms FPGA soft-IP latency. The 2.5 V core with 3.3 V-tolerant I/Os removes level-shifters in mixed-voltage systems.
Recommandé
Multi-Rail Power-Up Sequencing
The EPM7512BFI256-7 is widely used as a multi-rail power-sequencer in ATCA/telecom and industrial platforms. Its 512 macrocells can monitor PG (power-good) signals from 8–12 DC-DC converters and generate sequenced enable (EN) pulses with programmable delays (typically 10 ms–200 ms per rail). Because the device is EEPROM-based, sequencing state is preserved across power cycles with no boot firmware required — a key advantage over MCU-based sequencers. The 212 user I/Os support direct connection to dozens of EN and PG lines, while the industrial -40 °C to +105 °C temperature range covers outdoor and hardened enclosures. Quartus II design entry enables state-machine sequencing with deterministic microsecond timing.
Recommandé
Peripheral Glue-Logic Consolidation
The EPM7512BFI256-7 can replace dozens of 74-series TTL/CMOS SSI/MSI packages — multiplexers, latches, transceivers, decoders — with a single CPLD, reducing board area and BOM cost in mature designs. With 512 macrocells, the device absorbs roughly 30–50 equivalent 74HC chips, and its 212 user I/Os handle the fan-out that would otherwise require multiple TTL packages. The deterministic 7.5 ns tPD matches legacy 74AS timing, allowing drop-in replacement without software re-validation. Industrial-grade operation and 2.5 V/3.3 V I/O tolerance further ease legacy-to-modern voltage migration (e.g., 5 V → 3.3 V), with the CPLD bridging between legacy peripherals and new low-voltage ASICs/SoCs.
Recommandé
LED-Driver Multiplexing & Display Refresh
The EPM7512BFI256-7 drives large LED-matrix displays and seven-segment multiplexed panels through its 212 user I/Os, scanning rows and columns with deterministic refresh timing up to several kHz per row. The 7.5 ns tPD enables row/column switching within a single refresh cycle, eliminating ghosting and flicker artifacts. Designers typically implement a state-machine refresh controller in VHDL/Verilog and synthesize it into the CPLD; the EEPROM-based configuration means the display controller starts within microseconds of power-up, with no firmware bootloader. The -40 °C to +105 °C industrial temperature grade supports outdoor signage, traffic-control displays, and factory-floor status panels.
Recommandé
Industrial PLC I/O Expansion
The EPM7512BFI256-7 is a common I/O expander for industrial PLC and DCS systems, mapping field-level digital inputs (24 V sinking/sourcing) to backplane logic levels through its 212 user I/Os. The industrial -40 °C to +105 °C temperature grade and 3.3 V-tolerant I/Os handle noisy factory-floor environments, while the JTAG ISP interface allows field firmware updates without removing the PLC module from its rack. The 512 macrocells support complex filtering, debouncing, edge detection, and PWM outputs for proportional control, replacing several discrete timers/counters. The SameFrame FBGA-256 footprint allows designers to standardize PCB layouts across PLC product families with different I/O counts.
Recommandé
Telecom Line-Card Interface Logic
The EPM7512BFI256-7 implements the LIU (Line Interface Unit) glue logic, TDM bus switching, and HDLC/PCM framing glue in legacy telecom line cards (T1/E1, ISDN PRI, and channel-bank systems). With 512 macrocells and 212 user I/Os, the device handles HDB3/AMI encoding, clock-recovery timing, and backplane TDM bus arbitration. The 164 MHz internal frequency supports oversampling for clock-data recovery, while the 7.5 ns tPD meets TDM bus slot-bound timing. The 2.5 V core with mixed-voltage I/Os interfaces directly to legacy 3.3 V framers and LIUs without level shifters. Industrial temperature grade ensures operation in central-office and outside-plant cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM7512BFI256-7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM7512BFI256-10 | EPM7512BFC256-7 | EPM7512BFC256-10 | EPM7512BFI256-7N | EPM7256BFI256-7 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (0.8 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 |
| Propagation Delay (tPD) | 7.5 ns | 10 ns | 7.5 ns | 10 ns | 7.5 ns | 7.5 ns |
| Internal Frequency (max) | 164 MHz | 125 MHz | 164 MHz | 125 MHz | 164 MHz | 164 MHz |
| Temperature Grade | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C | Commercial 0 °C to +70 °C | Commercial 0 °C to +70 °C | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (Pb-Free) | No (SnPb ball) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) | No (SnPb) |
Principaux différenciateurs
- Highest density in the MAX 7000B family (vs EPM7256BFI256-7)
- SameFrame pin-out for portable design reuse (vs EPM7128SQC100-7)
- Faster speed grade than the -10 variant (vs EPM7512BFI256-10)
Notes de conception
Estimated: Core current draw for the EPM7512BFI256-7 is approximately 100–300 mA at 2.5 V with all 512 macrocells toggling at 100 MHz. With 0.8 mm BGA, local decoupling should include 0.1 µF X7R ceramic within 50 mil of every VCCINT/VCCIO pair and 10 µF bulk on each supply rail. A four-layer PCB with dedicated ground and power planes is required to control VCCIO rail collapse during simultaneous switching output (SSO) events.
The 0.8 mm-pitch FBGA-256 has a thermal resistance (θJA) of approximately 25 °C/W on a 4-layer JEDEC test board, and about 35–40 °C/W in typical 6-layer production stack-ups. At industrial max ambient 105 °C, sustained I/O switching can push the junction within 10–15 °C of the 150 °C limit. Provide at least 4 thermal vias under the central BGA die paddle to the inner ground plane for additional heatsinking.
The FBGA-256 at 0.8 mm pitch requires PCB fabrication with ≤ 0.1 mm drill-to-copper registration tolerance and laser-drilled microvias or via-in-pad for escape routing. Use 0.4 mm pad diameter with non-solder-mask-defined (NSMD) pads to maximize BGA joint reliability per IPC-7095. Reference the Altera AN 117 application note for recommended footprint and escape pattern.
Drive JTAG TCK below 10 MHz and place a 10 kΩ pull-up on TMS, TDI, and a 10 kΩ pull-down on TCK to ensure stable boundary-scan state at power-up. Series-terminate clocks and high-speed outputs with 22–33 Ω resistors when bus lengths exceed 50 mm. Configure unused I/Os as outputs driving low to minimize SSO noise and reduce core power.
Do not mix 1.8 V and 3.3 V signaling on the same I/O bank — each of the four VCCIO banks must be uniformly supplied. When migrating from EPM7256BFI256-7 to EPM7512BFI256-7 on the same PCB, verify that unused macrocells in the larger device are tied to default state, because they otherwise draw leakage and may violate timing closure. Do not apply reverse-voltage or hot-plug the device: the EEPROM configuration cell can be corrupted if VCCINT rises before VCCIO.
Informations de conformité
Base part EPM7512BFI256-7 uses SnPb ball terminations and is NOT RoHS-compliant; choose the EPM7512BFI256-7N variant for Pb-free / RoHS-compliant builds. REACH compliant per Intel material declaration. Not AEC-Q100 qualified — the industrial temperature grade (-40 to +105 °C) does not imply automotive qualification; verify automotive requirements separately.
