EPM7512BFC256-7 - MAX 7000B CPLD 512 Macro 212 IO | Altera
MPN: EPM7512BFC256-7 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for EPM7512BFC256-7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM7512BFC256-7N
β Drop-Inπ Reference alternative (not in catalog)
EPM7512BFC256-5
β Drop-Inπ Reference alternative (not in catalog)
EPM7512BFC256-10
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM7512BFC256-7Q
β Drop-Inπ Reference alternative (not in catalog)
EPM7512AEFC256-7
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM7512BFC256-7 Maximum Ratings & Electrical Characteristics
| Device Type | Complex Programmable Logic Device (CPLD) |
| Logic Family | MAX 7000B |
| Macrocells | 512 |
| User I/O Pins | 212 |
| Propagation Delay (tPD) | 5.5 ns |
| Internal Frequency | 164 MHz |
| Supply Voltage (Core) | 2.5 V |
| Configuration Memory | EEPROM (non-volatile) |
| Logic Family Technology | CMOS |
| Package | 256-ball BGA (FBGA) |
| Number of Terminals | 256 |
| Package Shape | Square |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to +70 C (commercial) |
| Temperature Grade | Commercial |
| Speed Grade | -7 (fastest commercial) |
EPM7512BFC256-7 square Pin Configuration Guide
Complete pinout information for EPM7512BFC256-7 (square package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM7512BFC256-7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7512BFC256-7 is suitable for 6 applications: Bus Bridging and Protocol Conversion, Address Decoding and Chip-Select Generation, Power-Up Sequencing and System Control, Legacy System Glue Logic Consolidation, Industrial Automation and Control Interfaces, Test and Measurement Instrumentation.
Bus Bridging and Protocol Conversion
The EPM7512BFC256-7 fits bus-bridging designs because its 212 user I/O pins and 512 macrocells can absorb wide address/data buses while its 5.5 ns propagation delay keeps translation logic fast. It is typically placed between two dissimilar bus interfaces, such as a legacy parallel bus and a modern serial peripheral, implementing the handshake and width-conversion logic in a single non-volatile device. Because the MAX 7000B architecture is EEPROM-based, the bridge logic is active immediately at power-up with no configuration load, which avoids the boot-time latency of SRAM FPGAs. The trade-off is that 512 macrocells limit the amount of buffering and FIFO logic that can be integrated, so deep buffering must be handled by external memory.
Recommended
Address Decoding and Chip-Select Generation
The EPM7512BFC256-7 is well suited to address decoding and chip-select generation because its 5.5 ns propagation delay keeps decode paths short and its 212 I/O pins can drive many chip-select lines directly. In a typical implementation the CPLD monitors the processor address and control buses and asserts the correct chip-select for memory and peripherals, replacing several discrete 74-series decoders. The deterministic MAX 7000B interconnect guarantees consistent decode timing across all pins, which simplifies worst-case timing analysis. The main consideration is that the 2.5 V core requires clean decoupling and, if the host bus is 3.3 V or 5 V, level translation must be verified against the device I/O specifications.
Recommended
Power-Up Sequencing and System Control
The EPM7512BFC256-7 is used as a power-up sequencing and system-control controller because its EEPROM configuration makes it active instantly at power-up, before processors and FPGAs have booted. With 512 macrocells it can implement multi-rail enable sequencing, reset stretching, watchdog timing, and fault latching in a single device, driving enable pins on regulators and reset inputs on processors. The 212 I/O pins allow many board-level control signals to be consolidated, reducing component count. Because the device is non-volatile, the sequencing logic is deterministic from the first millivolt of supply, which is critical for boards with strict rail-order requirements. The design must ensure the CPLD's own 2.5 V rail comes up early enough to control the other rails.
Recommended
Legacy System Glue Logic Consolidation
The EPM7512BFC256-7 is frequently chosen to consolidate legacy glue logic because it can replace dozens of discrete 74-series and PAL devices with one 256-ball BGA part. Its 512 macrocells and 212 I/O pins absorb counters, shift registers, state machines, and random logic, shrinking board area and improving reliability by eliminating many solder joints. The MAX 7000B EEPROM process preserves the logic without a configuration device, matching the instant-on behavior of the discrete logic it replaces. The trade-off is that the 256-ball BGA requires a multilayer PCB and careful escape routing, so consolidation makes most sense on boards that already use fine-pitch BGA packages.
Recommended
Industrial Automation and Control Interfaces
The EPM7512BFC256-7 suits industrial automation and control interfaces because its 212 I/O pins can interface directly to parallel sensors, encoders, and actuator drivers while its 5.5 ns delay supports fast handshake logic. In a typical controller it implements custom parallel interfaces, PWM generation, and interlock state machines that would otherwise require multiple microcontrollers. The deterministic MAX 7000B timing makes behavior repeatable across units, which is important for safety-related interlocks. The commercial 0 C to +70 C temperature grade limits use to controlled-cabinet environments; for wider ambient ranges an industrial-grade CPLD should be selected instead. The 2.5 V core also requires a dedicated low-noise supply rail.
Recommended
Test and Measurement Instrumentation
The EPM7512BFC256-7 is used in test and measurement instrumentation because its 164 MHz internal frequency and 5.5 ns propagation delay support fast trigger and capture logic, while 512 macrocells can implement pattern generators and event counters. In an instrument front end it typically handles trigger qualification, time-to-digital conversion support, and high-speed digital I/O, feeding a host processor or FPGA. The non-volatile EEPROM configuration means the instrument is ready to measure immediately after power-on, with no configuration delay. The main design consideration is that the 256-ball BGA and 2.5 V core demand careful signal-integrity and power-integrity design to preserve the fast timing at the board level.
Recommended
Recommended Products Summary
Engineering reference data for EPM7512BFC256-7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7512BFC256-7N | EPM7512BFC256-5 | EPM7512BFC256-10 | EPM7512BFC256-7Q | EPM7512AEFC256-7 |
|---|---|---|---|---|---|---|
| Package | 256-ball BGA (FBGA) | 256-ball BGA (FBGA) - same | 256-ball BGA (FBGA) - same | 256-ball BGA (FBGA) - same | 256-ball BGA (FBGA) - same | 256-ball BGA (FBGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 |
| Propagation Delay (tPD) | 5.5 ns | 5.5 ns | [DATA_NEEDED: tPD for -5 grade] | [DATA_NEEDED: tPD for -10 grade] | 5.5 ns | 5.5 ns |
| Internal Frequency | 164 MHz | 164 MHz | [DATA_NEEDED: fMAX for -5 grade] | [DATA_NEEDED: fMAX for -10 grade] | 164 MHz | 164 MHz |
| Supply Voltage (Core) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V (MAX 7000AE) |
| Configuration Memory | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | [DATA_NEEDED: temperature grade for -7Q] | 0 C to +70 C (commercial) |
| Lead-Free / RoHS | [DATA_NEEDED: RoHS status] | Lead-free (N suffix) | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
Key Differentiators
- Non-volatile EEPROM configuration (vs EPM7512AEFC256-7)
- Fastest commercial speed grade (vs EPM7512BFC256-10)
- Lead-free option available (vs EPM7512BFC256-7N)
Design Notes
The EPM7512BFC256-7 runs from a 2.5 V core supply and must be decoupled with low-ESR ceramic capacitors placed as close as possible to each VCC ball. Use at least one 0.1 uF capacitor per power ball group plus a bulk 10 uF capacitor per rail. Because the device is EEPROM-based and active at power-up, the 2.5 V rail must ramp monotonically; a slow or non-monotonic ramp can cause undefined logic states during the power-up window. Estimated: at a typical core current of a few hundred milliamps, a 10 uF bulk capacitor provides adequate transient support for the switching transients of the 512 macrocells.
The 256-ball BGA package requires a multilayer PCB with via-in-pad or dog-bone escape routing. Route all 212 user I/O signals with controlled impedance where they carry fast edges, and keep the JTAG programming signals (TCK, TMS, TDI, TDO) short and referenced to a solid ground plane. Provide a ground plane directly under the device to minimize return-path inductance. Because the -7 speed grade supports 164 MHz internal operation, signal-integrity analysis should be performed on any net that toggles near that rate.
The most common pitfall with the EPM7512BFC256-7 is treating it as a pin-for-pin substitute for other MAX 7000B density grades without checking the ball map. Although the EPM7512BFC256-7N and EPM7512BFC256-5 share the same 256-ball BGA footprint, the EPM7512AEFC256-7 uses a 3.3 V core and different I/O levels, so it is not a direct electrical drop-in despite the same package. Always verify the core voltage and I/O standard before substituting. Also confirm the programming file is regenerated for the target speed grade, since timing closure differs between -5, -7, and -10 grades.
Compliance Information
No compliance data was present in the verified web data for the EPM7512BFC256-7. The EPM7512BFC256-7N variant is the lead-free (N-suffix) version. Confirm RoHS/REACH status with the distributor or manufacturer before design.
