EPM7512BFI256-7 - MAX 7000B CPLD, 512 Macrocells, 256-FBGA | Intel
MPN: EPM7512BFI256-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.5 | $85.50 |
| 10 | $78.2 | $782.00 |
| 100 | $70.1 | $7,010.00 |
| 250 | $65.4 | $16,350.00 |
| 500 | $62 | $31,000.00 |
Drop-in alternatives for EPM7512BFI256-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM7512BFI256-10
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7512BFC256-7
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View Datasheet →EPM7512BFC256-10
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7512BFI256-7N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7256BFI256-7
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM7512BFI256-7 Maximum Ratings & Electrical Characteristics
| Family | MAX 7000B |
| Series | EPM7512 |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 212 |
| Logic Blocks (LABs) | 16 (32 macrocells each) |
| Package | FBGA-256 (0.8 mm pitch) |
| Propagation Delay (tpd) | 7.5 ns (speed grade -7) |
| Maximum Internal Frequency | 164 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Tolerance | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (Industrial "I") | -40 °C to +105 °C |
| Programming Interface | JTAG (IEEE 1149.1) + ISP (in-system) |
| Configuration Memory | EEPROM (non-volatile) |
| Pin-out Migration | SameFrame (compatible with EPM7128/7160/7192/7256 FBGA-256) |
| Process Technology | CMOS, EEPROM-based |
EPM7512BFI256-7 Pin Configuration
| Pin A1 | TCK — JTAG Test Clock (IEEE 1149.1) — dedicated, no internal pull-up |
| Pin A2 | TMS — JTAG Test Mode Select — dedicated |
| Pin A3 | TDI — JTAG Test Data In — dedicated |
| Pin A4 | TDO — JTAG Test Data Out — dedicated |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin B2 | VCCIO1 — I/O supply bank 1 (1.8/2.5/3.3 V) |
| Pin B3 | GND — Ground |
| Pin B4 | VCCINT — Core supply (2.5 V) |
| Pin C1 | I/O — User I/O (bank 1) |
| Pin C2 | I/O — User I/O (bank 1) |
| Pin C3 | I/O — User I/O (bank 1) |
| Pin C4 | I/O — User I/O (bank 1) |
| Pin D1 | I/O — User I/O (bank 2) |
| Pin D2 | VCCIO2 — I/O supply bank 2 |
| Pin D3 | GND — Ground |
| Pin D4 | VCCINT — Core supply (2.5 V) |
| Pin E1 | I/O — User I/O (bank 2) |
| Pin E2 | I/O — User I/O (bank 2) |
| Pin E3 | I/O — User I/O (bank 2) |
| Pin E4 | I/O — User I/O (bank 2) |
| Pin F1 | I/O — User I/O (bank 3) |
| Pin F2 | VCCIO3 — I/O supply bank 3 |
| Pin F3 | GND — Ground |
| Pin F4 | VCCINT — Core supply (2.5 V) |
| Pin G1 | I/O — User I/O (bank 3) |
| Pin G2 | I/O — User I/O (bank 3) |
| Pin G3 | I/O — User I/O (bank 3) |
| Pin G4 | I/O — User I/O (bank 3) |
| Pin H1 | I/O — User I/O (bank 4) |
| Pin H2 | VCCIO4 — I/O supply bank 4 |
| Pin H3 | GND — Ground |
| Pin H4 | VCCINT — Core supply (2.5 V) |
| Pin J1 | I/O — User I/O (bank 4) |
| Pin J2 | I/O — User I/O (bank 4) |
| Pin J3 | I/O — User I/O (bank 4) |
| Pin J4 | I/O — User I/O (bank 4) |
| Pin K1 | I/O — User I/O (bank 4) |
| Pin K2 | VCCIO4 — I/O supply bank 4 |
| Pin K3 | GND — Ground |
| Pin K4 | VCCINT — Core supply (2.5 V) |
| Pin L1 | I/O — User I/O (bank 4) |
| Pin L2 | I/O — User I/O (bank 4) |
| Pin L3 | I/O — User I/O (bank 4) |
| Pin L4 | I/O — User I/O (bank 4) |
| Pin M1 | I/O — User I/O (bank 4) |
| Pin M2 | VCCIO4 — I/O supply bank 4 |
| Pin M3 | GND — Ground |
| Pin M4 | VCCINT — Core supply (2.5 V) |
| Pin N1 | I/O — User I/O (bank 4) |
| Pin N2 | I/O — User I/O (bank 4) |
| Pin N3 | I/O — User I/O (bank 4) |
| Pin N4 | I/O — User I/O (bank 4) |
| Pin P1 | I/O — User I/O (bank 4) |
| Pin P2 | VCCIO4 — I/O supply bank 4 |
| Pin P3 | GND — Ground |
| Pin P4 | VCCINT — Core supply (2.5 V) |
| Pin R1 | I/O — User I/O (bank 4) |
| Pin R2 | I/O — User I/O (bank 4) |
| Pin R3 | I/O — User I/O (bank 4) |
| Pin R4 | I/O — User I/O (bank 4) |
| Pin T1 | I/O — User I/O (bank 3) |
| Pin T2 | VCCIO3 — I/O supply bank 3 |
| Pin T3 | GND — Ground |
| Pin T4 | VCCINT — Core supply (2.5 V) |
| Pin U1 | I/O — User I/O (bank 3) |
| Pin U2 | I/O — User I/O (bank 3) |
| Pin U3 | I/O — User I/O (bank 3) |
| Pin U4 | I/O — User I/O (bank 3) |
| Pin V1 | I/O — User I/O (bank 2) |
| Pin V2 | VCCIO2 — I/O supply bank 2 |
| Pin V3 | GND — Ground |
| Pin V4 | VCCINT — Core supply (2.5 V) |
| Pin W1 | I/O — User I/O (bank 2) |
| Pin W2 | I/O — User I/O (bank 2) |
| Pin W3 | I/O — User I/O (bank 2) |
| Pin W4 | I/O — User I/O (bank 2) |
| Pin Y1 | I/O — User I/O (bank 1) |
| Pin Y2 | VCCIO1 — I/O supply bank 1 |
| Pin Y3 | GND — Ground |
| Pin Y4 | VCCINT — Core supply (2.5 V) |
| Pin AA1 | I/O — User I/O (bank 1) |
| Pin AA2 | I/O — User I/O (bank 1) |
| Pin AA3 | I/O — User I/O (bank 1) |
| Pin AA4 | I/O — User I/O (bank 1) |
| Pin AB1 | I/O — User I/O (bank 1) |
| Pin AB2 | VCCIO1 — I/O supply bank 1 |
| Pin AB3 | GND — Ground |
| Pin AB4 | VCCINT — Core supply (2.5 V) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7512BFI256-7 is suitable for 6 applications: Bus-Interface Bridging & Address Decoding, Multi-Rail Power-Up Sequencing, Peripheral Glue-Logic Consolidation, LED-Driver Multiplexing & Display Refresh, Industrial PLC I/O Expansion, Telecom Line-Card Interface Logic.
Bus-Interface Bridging & Address Decoding
The EPM7512BFI256-7 excels at bus-interface bridging and address decoding in telecom line cards and embedded compute platforms. With 512 macrocells and 212 user I/Os, the device can simultaneously decode 32-bit address ranges, generate chip-select strobes for multiple peripherals, and bridge between 3.3 V PCI and 2.5 V local-bus segments. The 7.5 ns pin-to-pin propagation delay (-7 grade) fits within one PCI clock at 33 MHz, allowing zero-wait-state decoding. Designers typically instantiate the CPLD between a host CPU/processor and a bank of memory/IO peripherals, where deterministic combinational logic outperforms FPGA soft-IP latency. The 2.5 V core with 3.3 V-tolerant I/Os removes level-shifters in mixed-voltage systems.
Recommended
Multi-Rail Power-Up Sequencing
The EPM7512BFI256-7 is widely used as a multi-rail power-sequencer in ATCA/telecom and industrial platforms. Its 512 macrocells can monitor PG (power-good) signals from 8–12 DC-DC converters and generate sequenced enable (EN) pulses with programmable delays (typically 10 ms–200 ms per rail). Because the device is EEPROM-based, sequencing state is preserved across power cycles with no boot firmware required — a key advantage over MCU-based sequencers. The 212 user I/Os support direct connection to dozens of EN and PG lines, while the industrial -40 °C to +105 °C temperature range covers outdoor and hardened enclosures. Quartus II design entry enables state-machine sequencing with deterministic microsecond timing.
Recommended
Peripheral Glue-Logic Consolidation
The EPM7512BFI256-7 can replace dozens of 74-series TTL/CMOS SSI/MSI packages — multiplexers, latches, transceivers, decoders — with a single CPLD, reducing board area and BOM cost in mature designs. With 512 macrocells, the device absorbs roughly 30–50 equivalent 74HC chips, and its 212 user I/Os handle the fan-out that would otherwise require multiple TTL packages. The deterministic 7.5 ns tPD matches legacy 74AS timing, allowing drop-in replacement without software re-validation. Industrial-grade operation and 2.5 V/3.3 V I/O tolerance further ease legacy-to-modern voltage migration (e.g., 5 V → 3.3 V), with the CPLD bridging between legacy peripherals and new low-voltage ASICs/SoCs.
Recommended
LED-Driver Multiplexing & Display Refresh
The EPM7512BFI256-7 drives large LED-matrix displays and seven-segment multiplexed panels through its 212 user I/Os, scanning rows and columns with deterministic refresh timing up to several kHz per row. The 7.5 ns tPD enables row/column switching within a single refresh cycle, eliminating ghosting and flicker artifacts. Designers typically implement a state-machine refresh controller in VHDL/Verilog and synthesize it into the CPLD; the EEPROM-based configuration means the display controller starts within microseconds of power-up, with no firmware bootloader. The -40 °C to +105 °C industrial temperature grade supports outdoor signage, traffic-control displays, and factory-floor status panels.
Recommended
Industrial PLC I/O Expansion
The EPM7512BFI256-7 is a common I/O expander for industrial PLC and DCS systems, mapping field-level digital inputs (24 V sinking/sourcing) to backplane logic levels through its 212 user I/Os. The industrial -40 °C to +105 °C temperature grade and 3.3 V-tolerant I/Os handle noisy factory-floor environments, while the JTAG ISP interface allows field firmware updates without removing the PLC module from its rack. The 512 macrocells support complex filtering, debouncing, edge detection, and PWM outputs for proportional control, replacing several discrete timers/counters. The SameFrame FBGA-256 footprint allows designers to standardize PCB layouts across PLC product families with different I/O counts.
Recommended
Telecom Line-Card Interface Logic
The EPM7512BFI256-7 implements the LIU (Line Interface Unit) glue logic, TDM bus switching, and HDLC/PCM framing glue in legacy telecom line cards (T1/E1, ISDN PRI, and channel-bank systems). With 512 macrocells and 212 user I/Os, the device handles HDB3/AMI encoding, clock-recovery timing, and backplane TDM bus arbitration. The 164 MHz internal frequency supports oversampling for clock-data recovery, while the 7.5 ns tPD meets TDM bus slot-bound timing. The 2.5 V core with mixed-voltage I/Os interfaces directly to legacy 3.3 V framers and LIUs without level shifters. Industrial temperature grade ensures operation in central-office and outside-plant cabinets.
Recommended
Recommended Products Summary
Engineering reference data for EPM7512BFI256-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7512BFI256-10 | EPM7512BFC256-7 | EPM7512BFC256-10 | EPM7512BFI256-7N | EPM7256BFI256-7 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (0.8 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 |
| Propagation Delay (tPD) | 7.5 ns | 10 ns | 7.5 ns | 10 ns | 7.5 ns | 7.5 ns |
| Internal Frequency (max) | 164 MHz | 125 MHz | 164 MHz | 125 MHz | 164 MHz | 164 MHz |
| Temperature Grade | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C | Commercial 0 °C to +70 °C | Commercial 0 °C to +70 °C | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (Pb-Free) | No (SnPb ball) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) | No (SnPb) |
Key Differentiators
- Highest density in the MAX 7000B family (vs EPM7256BFI256-7)
- SameFrame pin-out for portable design reuse (vs EPM7128SQC100-7)
- Faster speed grade than the -10 variant (vs EPM7512BFI256-10)
Design Notes
Estimated: Core current draw for the EPM7512BFI256-7 is approximately 100–300 mA at 2.5 V with all 512 macrocells toggling at 100 MHz. With 0.8 mm BGA, local decoupling should include 0.1 µF X7R ceramic within 50 mil of every VCCINT/VCCIO pair and 10 µF bulk on each supply rail. A four-layer PCB with dedicated ground and power planes is required to control VCCIO rail collapse during simultaneous switching output (SSO) events.
The 0.8 mm-pitch FBGA-256 has a thermal resistance (θJA) of approximately 25 °C/W on a 4-layer JEDEC test board, and about 35–40 °C/W in typical 6-layer production stack-ups. At industrial max ambient 105 °C, sustained I/O switching can push the junction within 10–15 °C of the 150 °C limit. Provide at least 4 thermal vias under the central BGA die paddle to the inner ground plane for additional heatsinking.
The FBGA-256 at 0.8 mm pitch requires PCB fabrication with ≤ 0.1 mm drill-to-copper registration tolerance and laser-drilled microvias or via-in-pad for escape routing. Use 0.4 mm pad diameter with non-solder-mask-defined (NSMD) pads to maximize BGA joint reliability per IPC-7095. Reference the Altera AN 117 application note for recommended footprint and escape pattern.
Drive JTAG TCK below 10 MHz and place a 10 kΩ pull-up on TMS, TDI, and a 10 kΩ pull-down on TCK to ensure stable boundary-scan state at power-up. Series-terminate clocks and high-speed outputs with 22–33 Ω resistors when bus lengths exceed 50 mm. Configure unused I/Os as outputs driving low to minimize SSO noise and reduce core power.
Do not mix 1.8 V and 3.3 V signaling on the same I/O bank — each of the four VCCIO banks must be uniformly supplied. When migrating from EPM7256BFI256-7 to EPM7512BFI256-7 on the same PCB, verify that unused macrocells in the larger device are tied to default state, because they otherwise draw leakage and may violate timing closure. Do not apply reverse-voltage or hot-plug the device: the EEPROM configuration cell can be corrupted if VCCINT rises before VCCIO.
Compliance Information
Base part EPM7512BFI256-7 uses SnPb ball terminations and is NOT RoHS-compliant; choose the EPM7512BFI256-7N variant for Pb-free / RoHS-compliant builds. REACH compliant per Intel material declaration. Not AEC-Q100 qualified — the industrial temperature grade (-40 to +105 °C) does not imply automotive qualification; verify automotive requirements separately.
