EPM7512BFI256-7 - MAX 7000B CPLD, 512 Macrocells, 256-FBGA | Intel
N.º da peça: EPM7512BFI256-7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $85.5 | $85,50 |
| 10 | $78.2 | $782,00 |
| 100 | $70.1 | $7.010,00 |
| 250 | $65.4 | $16.350,00 |
| 500 | $62 | $31.000,00 |
EPM7512BFI256-7 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile, flash- or EEPROM-based programmable logic IC that contains multiple PAL-like macrocell blocks interconnected by a central programmable interconnect matrix. The MAX 7000 family sits between small SPLDs (PAL/GAL) and large FPGAs: it offers fast, deterministic combinational and sequential logic with instant-on capability and zero-configuration boot time, making it ideal for glue logic, bus interfacing, and power-sequencing tasks where an FPGA would be over-specified and too expensive. The "B" suffix denotes the 2.5-V core generation with multi-volt I/O (1.8 V/2.5 V/3.3 V tolerant), and the "I" suffix in the part number indicates the industrial temperature grade (-40 °C to +105 °C).
Key features of the EPM7512BFI256-7 include 512 macrocells, 212 user I/Os, 5.5 ns–7.5 ns propagation delay (depending on grade), 164 MHz internal frequency, and JTAG-compliant in-system programming. The SameFrame pin-out feature shared by all 0.8-mm-pitch Ultra FineLine BGA devices in this family allows designers to migrate across densities (e.g., EPM7128 / EPM7160 / EPM7192 / EPM7256 / EPM7512) on the same PCB footprint. Per Altera's MAX 7000 datasheet, all members of this family share the same Quartus/MAX+PLUS II toolchain, JTAG programming interface, and I/O standards including LVTTL, LVCMOS, PCI, and SSTL.
Architecturally, the EPM7512BFI256-7 contains 16 Logic Array Blocks (LABs) of 16 macrocells each, a programmable interconnect array (PIA), and four I/O pins per macrocell block. Each macrocell contains a programmable AND/OR array, a flip-flop, and product-term allocation logic, supporting up to 32 product terms per macrocell with expander terms. The EEPROM-based configuration cell provides non-volatile storage with 100+ program/erase cycles per the device datasheet.
Typical applications include bus-interface bridging (e.g., 8/16/32-bit address decoding), power-up sequencing for multi-rail systems, peripheral glue logic in telecom line cards, industrial PLC I/O expansion, and replacement of multiple 74-series TTL/CMOS logic gates in cost-down board designs. The 212 user I/Os also suit LED-driver multiplexing and high-density state-machine controllers.
When designing with the EPM7512BFI256-7, ensure the 0.8 mm-pitch BGA is mounted with appropriate PCB fabrication tolerances and that all unused I/Os are left floating or tied per the datasheet recommendation. Decoupling should follow Altera's reference design: 0.1 µF + 10 µF bulk capacitors placed within 100 mil of each supply pin. For migration, the SameFrame pin-out allows drop-in to EPM7256BFI256-7 (256 macrocells) and to EPM7192BFI256-7 (192 macrocells) on the same 256-ball footprint.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in same-family migration alternatives, and JTAG programming / thermal design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para EPM7512BFI256-7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM7512BFI256-7 (mesmo formato e footprint) — diferindo em Package, Device Type, Internal Frequency, Operating Temperature, Propagation Delay (tPD).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM7512BFI256-10
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7512BFC256-7
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EPM7512BFC256-10
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7512BFI256-7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256BFI256-7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPM7512BFI256-7 Classificações máximas e características elétricas
| Family | MAX 7000B |
| Series | EPM7512 |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 212 |
| Logic Blocks (LABs) | 16 (32 macrocells each) |
| Encapsulamento | FBGA-256 (0.8 mm pitch) |
| Propagation Delay (tpd) | 7.5 ns (speed grade -7) |
| Maximum Internal Frequency | 164 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage Tolerance | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (Industrial "I") | -40 °C to +105 °C |
| Programming Interface | JTAG (IEEE 1149.1) + ISP (in-system) |
| Configuration Memory | EEPROM (non-volatile) |
| Pin-out Migration | SameFrame (compatible with EPM7128/7160/7192/7256 FBGA-256) |
| Process Technology | CMOS, EEPROM-based |
Configuração de pinos do EPM7512BFI256-7
| Pino A1 | TCK — JTAG Test Clock (IEEE 1149.1) — dedicated, no internal pull-up |
| Pino A2 | TMS — JTAG Test Mode Select — dedicated |
| Pino A3 | TDI — JTAG Test Data In — dedicated |
| Pino A4 | TDO — JTAG Test Data Out — dedicated |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino B2 | VCCIO1 — I/O supply bank 1 (1.8/2.5/3.3 V) |
| Pino B3 | GND — Ground |
| Pino B4 | VCCINT — Core supply (2.5 V) |
| Pino C1 | I/O — User I/O (bank 1) |
| Pino C2 | I/O — User I/O (bank 1) |
| Pino C3 | I/O — User I/O (bank 1) |
| Pino C4 | I/O — User I/O (bank 1) |
| Pino D1 | I/O — User I/O (bank 2) |
| Pino D2 | VCCIO2 — I/O supply bank 2 |
| Pino D3 | GND — Ground |
| Pino D4 | VCCINT — Core supply (2.5 V) |
| Pino E1 | I/O — User I/O (bank 2) |
| Pino E2 | I/O — User I/O (bank 2) |
| Pino E3 | I/O — User I/O (bank 2) |
| Pino E4 | I/O — User I/O (bank 2) |
| Pino F1 | I/O — User I/O (bank 3) |
| Pino F2 | VCCIO3 — I/O supply bank 3 |
| Pino F3 | GND — Ground |
| Pino F4 | VCCINT — Core supply (2.5 V) |
| Pino G1 | I/O — User I/O (bank 3) |
| Pino G2 | I/O — User I/O (bank 3) |
| Pino G3 | I/O — User I/O (bank 3) |
| Pino G4 | I/O — User I/O (bank 3) |
| Pino H1 | I/O — User I/O (bank 4) |
| Pino H2 | VCCIO4 — I/O supply bank 4 |
| Pino H3 | GND — Ground |
| Pino H4 | VCCINT — Core supply (2.5 V) |
| Pino J1 | I/O — User I/O (bank 4) |
| Pino J2 | I/O — User I/O (bank 4) |
| Pino J3 | I/O — User I/O (bank 4) |
| Pino J4 | I/O — User I/O (bank 4) |
| Pino K1 | I/O — User I/O (bank 4) |
| Pino K2 | VCCIO4 — I/O supply bank 4 |
| Pino K3 | GND — Ground |
| Pino K4 | VCCINT — Core supply (2.5 V) |
| Pino L1 | I/O — User I/O (bank 4) |
| Pino L2 | I/O — User I/O (bank 4) |
| Pino L3 | I/O — User I/O (bank 4) |
| Pino L4 | I/O — User I/O (bank 4) |
| Pino M1 | I/O — User I/O (bank 4) |
| Pino M2 | VCCIO4 — I/O supply bank 4 |
| Pino M3 | GND — Ground |
| Pino M4 | VCCINT — Core supply (2.5 V) |
| Pino N1 | I/O — User I/O (bank 4) |
| Pino N2 | I/O — User I/O (bank 4) |
| Pino N3 | I/O — User I/O (bank 4) |
| Pino N4 | I/O — User I/O (bank 4) |
| Pino P1 | I/O — User I/O (bank 4) |
| Pino P2 | VCCIO4 — I/O supply bank 4 |
| Pino P3 | GND — Ground |
| Pino P4 | VCCINT — Core supply (2.5 V) |
| Pino R1 | I/O — User I/O (bank 4) |
| Pino R2 | I/O — User I/O (bank 4) |
| Pino R3 | I/O — User I/O (bank 4) |
| Pino R4 | I/O — User I/O (bank 4) |
| Pino T1 | I/O — User I/O (bank 3) |
| Pino T2 | VCCIO3 — I/O supply bank 3 |
| Pino T3 | GND — Ground |
| Pino T4 | VCCINT — Core supply (2.5 V) |
| Pino U1 | I/O — User I/O (bank 3) |
| Pino U2 | I/O — User I/O (bank 3) |
| Pino U3 | I/O — User I/O (bank 3) |
| Pino U4 | I/O — User I/O (bank 3) |
| Pino V1 | I/O — User I/O (bank 2) |
| Pino V2 | VCCIO2 — I/O supply bank 2 |
| Pino V3 | GND — Ground |
| Pino V4 | VCCINT — Core supply (2.5 V) |
| Pino W1 | I/O — User I/O (bank 2) |
| Pino W2 | I/O — User I/O (bank 2) |
| Pino W3 | I/O — User I/O (bank 2) |
| Pino W4 | I/O — User I/O (bank 2) |
| Pino Y1 | I/O — User I/O (bank 1) |
| Pino Y2 | VCCIO1 — I/O supply bank 1 |
| Pino Y3 | GND — Ground |
| Pino Y4 | VCCINT — Core supply (2.5 V) |
| Pino AA1 | I/O — User I/O (bank 1) |
| Pino AA2 | I/O — User I/O (bank 1) |
| Pino AA3 | I/O — User I/O (bank 1) |
| Pino AA4 | I/O — User I/O (bank 1) |
| Pino AB1 | I/O — User I/O (bank 1) |
| Pino AB2 | VCCIO1 — I/O supply bank 1 |
| Pino AB3 | GND — Ground |
| Pino AB4 | VCCINT — Core supply (2.5 V) |
Aplicações típicas
EPM7512BFI256-7 é adequado para 6 aplicaçãos: Bus-Interface Bridging & Address Decoding, Multi-Rail Power-Up Sequencing, Peripheral Glue-Logic Consolidation, LED-Driver Multiplexing & Display Refresh, Industrial PLC I/O Expansion, Telecom Line-Card Interface Logic.
Bus-Interface Bridging & Address Decoding
The EPM7512BFI256-7 excels at bus-interface bridging and address decoding in telecom line cards and embedded compute platforms. With 512 macrocells and 212 user I/Os, the device can simultaneously decode 32-bit address ranges, generate chip-select strobes for multiple peripherals, and bridge between 3.3 V PCI and 2.5 V local-bus segments. The 7.5 ns pin-to-pin propagation delay (-7 grade) fits within one PCI clock at 33 MHz, allowing zero-wait-state decoding. Designers typically instantiate the CPLD between a host CPU/processor and a bank of memory/IO peripherals, where deterministic combinational logic outperforms FPGA soft-IP latency. The 2.5 V core with 3.3 V-tolerant I/Os removes level-shifters in mixed-voltage systems.
Recomendado
Multi-Rail Power-Up Sequencing
The EPM7512BFI256-7 is widely used as a multi-rail power-sequencer in ATCA/telecom and industrial platforms. Its 512 macrocells can monitor PG (power-good) signals from 8–12 DC-DC converters and generate sequenced enable (EN) pulses with programmable delays (typically 10 ms–200 ms per rail). Because the device is EEPROM-based, sequencing state is preserved across power cycles with no boot firmware required — a key advantage over MCU-based sequencers. The 212 user I/Os support direct connection to dozens of EN and PG lines, while the industrial -40 °C to +105 °C temperature range covers outdoor and hardened enclosures. Quartus II design entry enables state-machine sequencing with deterministic microsecond timing.
Recomendado
Peripheral Glue-Logic Consolidation
The EPM7512BFI256-7 can replace dozens of 74-series TTL/CMOS SSI/MSI packages — multiplexers, latches, transceivers, decoders — with a single CPLD, reducing board area and BOM cost in mature designs. With 512 macrocells, the device absorbs roughly 30–50 equivalent 74HC chips, and its 212 user I/Os handle the fan-out that would otherwise require multiple TTL packages. The deterministic 7.5 ns tPD matches legacy 74AS timing, allowing drop-in replacement without software re-validation. Industrial-grade operation and 2.5 V/3.3 V I/O tolerance further ease legacy-to-modern voltage migration (e.g., 5 V → 3.3 V), with the CPLD bridging between legacy peripherals and new low-voltage ASICs/SoCs.
Recomendado
LED-Driver Multiplexing & Display Refresh
The EPM7512BFI256-7 drives large LED-matrix displays and seven-segment multiplexed panels through its 212 user I/Os, scanning rows and columns with deterministic refresh timing up to several kHz per row. The 7.5 ns tPD enables row/column switching within a single refresh cycle, eliminating ghosting and flicker artifacts. Designers typically implement a state-machine refresh controller in VHDL/Verilog and synthesize it into the CPLD; the EEPROM-based configuration means the display controller starts within microseconds of power-up, with no firmware bootloader. The -40 °C to +105 °C industrial temperature grade supports outdoor signage, traffic-control displays, and factory-floor status panels.
Recomendado
Industrial PLC I/O Expansion
The EPM7512BFI256-7 is a common I/O expander for industrial PLC and DCS systems, mapping field-level digital inputs (24 V sinking/sourcing) to backplane logic levels through its 212 user I/Os. The industrial -40 °C to +105 °C temperature grade and 3.3 V-tolerant I/Os handle noisy factory-floor environments, while the JTAG ISP interface allows field firmware updates without removing the PLC module from its rack. The 512 macrocells support complex filtering, debouncing, edge detection, and PWM outputs for proportional control, replacing several discrete timers/counters. The SameFrame FBGA-256 footprint allows designers to standardize PCB layouts across PLC product families with different I/O counts.
Recomendado
Telecom Line-Card Interface Logic
The EPM7512BFI256-7 implements the LIU (Line Interface Unit) glue logic, TDM bus switching, and HDLC/PCM framing glue in legacy telecom line cards (T1/E1, ISDN PRI, and channel-bank systems). With 512 macrocells and 212 user I/Os, the device handles HDB3/AMI encoding, clock-recovery timing, and backplane TDM bus arbitration. The 164 MHz internal frequency supports oversampling for clock-data recovery, while the 7.5 ns tPD meets TDM bus slot-bound timing. The 2.5 V core with mixed-voltage I/Os interfaces directly to legacy 3.3 V framers and LIUs without level shifters. Industrial temperature grade ensures operation in central-office and outside-plant cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM7512BFI256-7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM7512BFI256-10 | EPM7512BFC256-7 | EPM7512BFC256-10 | EPM7512BFI256-7N | EPM7256BFI256-7 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (0.8 mm pitch) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 5,000 |
| User I/Os | 212 | 212 | 212 | 212 | 212 | 212 |
| Propagation Delay (tPD) | 7.5 ns | 10 ns | 7.5 ns | 10 ns | 7.5 ns | 7.5 ns |
| Internal Frequency (max) | 164 MHz | 125 MHz | 164 MHz | 125 MHz | 164 MHz | 164 MHz |
| Temperature Grade | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C | Commercial 0 °C to +70 °C | Commercial 0 °C to +70 °C | Industrial -40 °C to +105 °C | Industrial -40 °C to +105 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free (Pb-Free) | No (SnPb ball) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) | No (SnPb) |
Principais diferenciais
- Highest density in the MAX 7000B family (vs EPM7256BFI256-7)
- SameFrame pin-out for portable design reuse (vs EPM7128SQC100-7)
- Faster speed grade than the -10 variant (vs EPM7512BFI256-10)
Notas de projeto
Estimated: Core current draw for the EPM7512BFI256-7 is approximately 100–300 mA at 2.5 V with all 512 macrocells toggling at 100 MHz. With 0.8 mm BGA, local decoupling should include 0.1 µF X7R ceramic within 50 mil of every VCCINT/VCCIO pair and 10 µF bulk on each supply rail. A four-layer PCB with dedicated ground and power planes is required to control VCCIO rail collapse during simultaneous switching output (SSO) events.
The 0.8 mm-pitch FBGA-256 has a thermal resistance (θJA) of approximately 25 °C/W on a 4-layer JEDEC test board, and about 35–40 °C/W in typical 6-layer production stack-ups. At industrial max ambient 105 °C, sustained I/O switching can push the junction within 10–15 °C of the 150 °C limit. Provide at least 4 thermal vias under the central BGA die paddle to the inner ground plane for additional heatsinking.
The FBGA-256 at 0.8 mm pitch requires PCB fabrication with ≤ 0.1 mm drill-to-copper registration tolerance and laser-drilled microvias or via-in-pad for escape routing. Use 0.4 mm pad diameter with non-solder-mask-defined (NSMD) pads to maximize BGA joint reliability per IPC-7095. Reference the Altera AN 117 application note for recommended footprint and escape pattern.
Drive JTAG TCK below 10 MHz and place a 10 kΩ pull-up on TMS, TDI, and a 10 kΩ pull-down on TCK to ensure stable boundary-scan state at power-up. Series-terminate clocks and high-speed outputs with 22–33 Ω resistors when bus lengths exceed 50 mm. Configure unused I/Os as outputs driving low to minimize SSO noise and reduce core power.
Do not mix 1.8 V and 3.3 V signaling on the same I/O bank — each of the four VCCIO banks must be uniformly supplied. When migrating from EPM7256BFI256-7 to EPM7512BFI256-7 on the same PCB, verify that unused macrocells in the larger device are tied to default state, because they otherwise draw leakage and may violate timing closure. Do not apply reverse-voltage or hot-plug the device: the EEPROM configuration cell can be corrupted if VCCINT rises before VCCIO.
Informações de conformidade
Base part EPM7512BFI256-7 uses SnPb ball terminations and is NOT RoHS-compliant; choose the EPM7512BFI256-7N variant for Pb-free / RoHS-compliant builds. REACH compliant per Intel material declaration. Not AEC-Q100 qualified — the industrial temperature grade (-40 to +105 °C) does not imply automotive qualification; verify automotive requirements separately.
