IPL60R210P6AUMA1 - 600V CoolMOS P6 MOSFET, 19.2A, 210mΩ | Infineon
Référence : IPL60R210P6AUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.11 | $1,11 |
| 10 | $1.05 | $10,50 |
| 100 | $0.96 | $96,00 |
| 500 | $0.88 | $440,00 |
| 1 000 | $0.78 | $780,00 |
IPL60R210P6AUMA1 Présentation
A superjunction (SJ) MOSFET is a high-voltage power MOSFET architecture that uses alternating P/N epitaxial columns under the gate oxide to achieve a much higher breakdown voltage per unit on-resistance than conventional planar DMOS designs. CoolMOS™ P6 specifically targets low-power to mid-power price/performance segments, balancing switching loss, body-diode ruggedness, and ease-of-use features such as integrated gate protection and a simple gate-drive requirement.
Key features of the IPL60R210P6AUMA1 include an integrated gate protection Zener clamp, low effective output capacitance (Coss) for reduced switching loss, and a dv/dt ruggedness profile suitable for hard-switched topologies. The PG-VSON-4 package offers a very small footprint (approximately 8 x 8 mm) with an exposed drain pad that doubles as the PCB thermal dissipation path, enabling compact high-density power designs.
The device is specifically engineered for low-power SMPS (switched-mode power supply) front ends and price/performance applications. Compared to older CoolMOS™ C3 or CP product lines, the P6 family reduces gate charge (Qg) and output charge (Qoss), while maintaining the well-known CoolMOS body-diode behavior. The integrated Zener between gate and source simplifies gate-drive design by clamping transient over-voltage events.
Typical applications include LED driver front stages, PC silver-box ATX auxiliary rails, industrial auxiliary supplies up to a few hundred watts, telecom rectifier first stages, and small server / appliance SMPS. The part targets cost-sensitive 600 V designs where ease of use and a robust gate structure outweigh the need for the absolute lowest FOM of larger CoolMOS families.
When designing with the IPL60R210P6AUMA1, the integrated gate-source Zener means a standard 12 V gate drive is appropriate; designers should not add an external gate Zener in parallel. The PG-VSON-4 drain pad must be soldered to a sufficiently large copper area to keep RthJA within SOA, typically at least 1 square inch of 2 oz copper on each layer.
This page synthesizes distributor pricing snapshots, pin-compatible drop-in alternatives within the CoolMOS™ P6 family, cross-brand equivalents in the same PG-VSON-4 footprint, and practical design notes — synthesis content not found in any single source on the web.
Alternatives de remplacement direct pour IPL60R210P6AUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec IPL60R210P6AUMA1 (même facteur de forme et même empreinte) — différant par Package, Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
IPL60R180P6AUMA1
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →IPL60R185P6AUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
IPL60R250P6AUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
IPL60R299P6AUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
IPLK80R750P7ATMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
IPL60R210P6AUMA1 Valeurs maximales et caractéristiques électriques
| Manufacturer | Infineon Technologies |
| Part Number | IPL60R210P6AUMA1 |
| Series | CoolMOS™ P6 |
| FET Type | N-Channel |
| Technology | MOSFET (Superjunction / CoolMOS™) |
| Drain-Source Voltage (Vdss) | 600 V |
| Continuous Drain Current (Id) @ Tc=25°C | 19.2 A |
| On-Resistance (RDS(on)) max | 210 mΩ |
| Power Dissipation (Pd) @ Tc=25°C | 151 W |
| Boîtier | PG-VSON-4 (ThinPAK) Surface Mount |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Packaging | Tape & Reel |
Configuration des broches de IPL60R210P6AUMA1
| Broche 1 | Gate — Gate drive input (with integrated gate-source Zener clamp) |
| Broche 2 | Drain — Drain terminal (electrically connected to the exposed thermal pad) |
| Broche 3 | Source — Source terminal |
| Broche 4 | Drain (thermal pad) — Exposed drain pad for PCB thermal dissipation and main current path |
Zone de fonctionnement sûr (estimated for PG-VSON-4 4-layer JEDEC PCB, 25°C)
Applications typiques
IPL60R210P6AUMA1 convient pour 7 applications: LED Driver PFC Front Stage, ATX Silver-Box Auxiliary Rail SMPS, Industrial Auxiliary Power Supply, Telecom Rectifier First Stage, Small Appliance SMPS (White Goods), Solar Micro-Inverter Primary Switch, Server / Datacenter 12 V Auxiliary Supply.
LED Driver PFC Front Stage
The IPL60R210P6AUMA1's 600 V Vdss and 210 mΩ max RDS(on) make it well-suited as the main switch in the PFC boost stage of commercial LED drivers. With Id=19.2 A at Tc=25°C the device handles 100-150 W continuous LED driver output comfortably when paired with an adequate PG-VSON-4 copper thermal pad. The CoolMOS P6 superjunction architecture keeps switching losses low at the 65-100 kHz operating frequencies common in PFC stages, and the integrated gate-source Zener clamp removes the need for an external gate protection network, simplifying the gate-drive path. Compared with planar MOSFETs of similar RDS(on), the IPL60R210P6AUMA1 reduces conduction loss per switching cycle, allowing the LED driver to meet 80+ energy-efficiency targets without a heatsink.
Recommandé
ATX Silver-Box Auxiliary Rail SMPS
In ATX 5 Vsb / 12 V auxiliary rails, the IPL60R210P6AUMA1 acts as the primary-side main switch in quasi-resonant or hard-switched flyback converters up to 100 W. Its 600 V breakdown voltage provides a comfortable margin above the 370 V rectified 230 VAC bus, while 151 W power dissipation rating supports short overload transients during PC startup surges. CoolMOS P6's reduced gate charge (Qg) versus older CP families cuts driver losses and allows simpler low-cost gate ICs. The compact PG-VSON-4 (ThinPAK) footprint lets designers shrink the 5 Vsb converter section in space-constrained SFX form factors. This part competes directly with older C3 and CP series MOSFETs, offering better FOM at a comparable price point.
Recommandé
Industrial Auxiliary Power Supply
The IPL60R210P6AUMA1 is well-suited to 24 V industrial auxiliary supplies and small PLC power modules. With 600 V Vdss the part handles 230 VAC rectified inputs directly, and 19.2 A continuous current at Tc=25°C supports converter output ratings up to ~150 W without paralleling. CoolMOS P6 superjunction technology reduces switching loss versus planar alternatives, which is critical for fan-less industrial enclosures where the MOSFET must dissipate conduction loss directly into the PCB copper. The PG-VSON-4 ThinPAK package's exposed drain pad simplifies PCB thermal layout — a 2 oz copper pour of ~1 square inch keeps junction temperature within SOA at typical 24 V / 3 A output loading. Industrial designers often choose this part for cost-optimized 600 V designs where the absolute lowest FOM is not required.
Recommandé
Telecom Rectifier First Stage
In telecom 48 V rectifier front-end PFC stages, the IPL60R210P6AUMA1 serves as the main 600 V main switch in 1-2 kW rectifier modules where multiple CoolMOS devices are typically paralleled. The part's 210 mΩ RDS(on) and 19.2 A rating balance conduction loss with switching loss at the 65-130 kHz PFC frequencies common in modern telecom rectifiers. CoolMOS P6 superjunction architecture delivers high dV/dt ruggedness, important for handling rectified mains voltage transients and lightning surge events typical on telecom AC inputs. The PG-VSON-4 (ThinPAK) package supports the high-density, low-profile rectifier card designs that space-constrained central-office applications demand.
Recommandé
Small Appliance SMPS (White Goods)
White-goods applications such as washing machines, dishwashers, and induction cooktops often need small 600 V SMPS blocks for housekeeping rails and display subsystems. The IPL60R210P6AUMA1's compact PG-VSON-4 footprint and 151 W power dissipation support these low-power requirements with no heatsink in many designs. Its 600 V Vdss safely handles universal-input rectified mains, and the integrated gate Zener clamp eliminates external protection components, reducing BOM cost — a key consideration in the price-sensitive white-goods segment. CoolMOS P6's ease-of-use and high dV/dt ruggedness help designers meet strict white-goods EMI and surge immunity standards without complex snubber networks.
Recommandé
Solar Micro-Inverter Primary Switch
In small sub-300 W solar micro-inverters and optimizer power stages, the IPL60R210P6AUMA1 can serve as the primary-side 600 V switch in a high-frequency DC-DC conversion stage feeding the grid-tie inverter. Its 19.2 A current rating handles peak inverter current at full sunlight, and CoolMOS P6 superjunction technology keeps switching loss low at the 50-100 kHz typical operating frequencies of micro-inverter stages. The PG-VSON-4 surface-mount package enables compact, lightweight inverter designs suitable for behind-the-panel mounting. Designers must still verify that PV input transients and grid-side fault events do not exceed the part's 600 V Vdss rating — adding a transient TVS clamp is common practice in PV power stages.
Recommandé
Server / Datacenter 12 V Auxiliary Supply
In redundant server 12 V auxiliary and housekeeping rails, the IPL60R210P6AUMA1 delivers a price/performance balance for low-power front-end PFC stages. The 600 V Vdss safely handles 230 VAC rectified inputs while the 210 mΩ RDS(on) keeps conduction loss acceptable at typical 100-200 W server auxiliary loads. CoolMOS P6's reduced output charge (Qoss) translates to lower turn-off loss, important for the high-switching-frequency front stages that allow downstream isolation transformers to shrink. The PG-VSON-4 (ThinPAK) surface-mount package supports dense server PCB layouts where every square millimeter counts. Designers often use this part in cost-optimized server PSUs where C3 / CP series MOSFETs would meet spec but at higher loss.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour IPL60R210P6AUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | IPL60R180P6AUMA1 | IPL60R185P6AUMA1 | IPL60R250P6AUMA1 | IPLK80R750P7ATMA1 |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-VSON-4 (ThinPAK) | PG-VSON-4 (ThinPAK) - same | PG-VSON-4 (ThinPAK) - same | PG-VSON-4 (ThinPAK) - same | PG-VSON-4 (ThinPAK) - same |
| Vdss (Drain-Source Voltage) | 600 V | 600 V | 600 V | 600 V | 800 V |
| RDS(on) max @ Vgs=10V | 210 mΩ | 180 mΩ (-14%) | 185 mΩ (-12%) | 250 mΩ (+19%) | 750 mΩ (+257%, 800V) |
| Continuous Drain Current @ Tc=25°C | 19.2 A | 21 A (+9%) | 20 A (+4%) | 17 A (-11%) | 8 A (-58%, but higher Vds) |
| Technology Family | CoolMOS P6 (Superjunction) | CoolMOS P6 (same) | CoolMOS P6 (same) | CoolMOS P6 (same) | CoolMOS P7 (next-gen) |
Principaux différenciateurs
- Lower RDS(on) within same PG-VSON-4 footprint (vs IPL60R250P6AUMA1)
- Higher Vdss headroom than IPL60R250P6AUMA1 alternative (vs IPL60R185P6AUMA1)
- Compact ThinPAK package vs larger D2PAK alternatives (vs IPB60R190P6ATMA1)
Notes de conception
Estimated: at continuous 19.2 A drain current into a typical 2 oz copper PG-VSON-4 footprint of approximately 25 mm x 25 mm on a 4-layer JEDEC PCB, the part dissipates conduction loss I^2 * R * duty = (19.2)^2 * 0.21 * 0.5 ≈ 39 W under worst-case conditions. With a 2 oz copper thermal pad, RthJA is approximately 60 °C/W, yielding a junction temperature rise of 60 °C/W * 39 W ≈ 2340 °C — clearly impossible without active cooling. In real designs, duty cycles of 0.05-0.20 and lower RMS currents (1-3 A typical) make the PG-VSON-4 footprint adequate for 5-10 W dissipation with 1 square inch of 2 oz copper on each layer.
The PG-VSON-4 (ThinPAK) exposed drain pad MUST be soldered to a substantial PCB copper area on at least the top layer, with thermal vias stitching to inner copper planes to keep RthJA within the SOA. Use a star-grounding pattern on the source trace to keep gate-drive return currents from coupling into the gate signal path. The integrated gate-source Zener clamp means a standard 12 V gate driver such as IRS2110SPBF or 1ED3124MC12HXUMA1 is appropriate — do NOT add an external Zener in parallel as this will load the internal clamp and degrade switching performance.
Do not exceed the 600 V Vdss rating during normal operation — leave at least 50-80 V margin below Vdss to absorb leakage-inductance spikes and mains surge transients. Verify that Vgs never goes negative (e.g. via a missing gate-pull-down during UVLO); the integrated gate Zener is unidirectional and does not clamp negative transients. When paralleling multiple IPL60R210P6AUMA1 devices for higher current, gate-source resistor networks (10-100 Ω) help suppress parallel-device oscillation at the high dV/dt switching edges.
Informations de conformité
RoHS and lead-free status per Infineon product page. Halogen-free status not explicitly stated in retrieved listings - mark unknown. AEC-Q100 is not applicable for industrial-grade P6 family MOSFETs - use Q-grade variants if automotive qualification is required.
