LCMXO3LF-4300E-5MG121I - 4320 LUT MachXO3LF FPGA | Lattice Semiconductor
Référence : LCMXO3LF-4300E-5MG121I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.75 | $1 375,00 |
| 500 | $11.9 | $5 950,00 |
| 1 000 | $10.4 | $10 400,00 |
LCMXO3LF-4300E-5MG121I Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after manufacture. Within the broader taxonomy, this part sits at: MachXO3LF FPGA -> low-density FPGA -> programmable logic device -> logic IC -> semiconductor. The MachXO3LF family specifically targets glue-logic, bridging, control-plane, and instant-on applications where traditional CPLDs or low-end FPGAs are deployed, with ultra-low static and dynamic power suitable for battery-backed and always-on designs.
Key features of the LCMXO3LF-4300E-5MG121I include 4,320 LUTs with up to 100 user I/O, embedded block-RAM of approximately 94,208 bits, a hardened I2C/SPI/UART/JTAG configuration interface, built-in user-internal and external oscillators, and on-chip PLLs. The device is built on a 65nm CMOS process technology, operates from a 1.2V core supply, and supports multiple I/O standards across several I/O banks. The "E" speed grade indicates an enhanced performance level and the "I" suffix denotes the industrial temperature range of -40C to +100C.
Technically, the MachXO3LF architecture combines LUT-based logic fabric with hardened IP blocks for common functions, allowing very high I/O count for the LUT density. The embedded sleep mode reduces standby current to microamp levels, and instant-on capability allows sub-millisecond wake from configuration memory. The 121-ball CSFBGA (also denoted 121-VFBGA) package offers a compact 8x8 mm ball footprint suitable for space-constrained control-plane PCB designs.
Typical applications for this part include I/O expansion and bridging in industrial controllers, glue-logic replacement, platform management for servers and storage, LED control and human-machine interface (HMI) systems, video signal multiplexing in consumer displays, secure boot and control PLD functions in communications infrastructure, and sensor aggregation in IoT edge nodes.
When designing with this device, ensure the JTAG programming header (TCK/TMS/TDI/TDO) is accessible for in-system programming and that all VCCIO bank rails are properly decoupled with 100 nF ceramic capacitors adjacent to each power pin. Verify that the chosen configuration mode (typically SPI master from a serial flash) leaves the SPI flash footprint compatible with the Lattice Diamond toolchain.
This page synthesizes distributor pricing, same-family drop-in alternatives within the MachXO3LF 121-ball CSFBGA package, and practical design notes that supplement the Lattice datasheet and family reference manual.
Alternatives de remplacement direct pour LCMXO3LF-4300E-5MG121I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LCMXO3LF-4300E-5MG121I (même facteur de forme et même empreinte) — différant par Family, Mounting Type, Process Technology, Speed Grade, User I/O Count.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO3LF-4300E-5MG121C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300C-5MG121I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5MG121I-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5BG121I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-6MG121I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5MG121I Valeurs maximales et caractéristiques électriques
| Series | MachXO3LF |
| Family | MachXO3 (Lattice) |
| Logic Cells / LUTs | 4,320 LUTs |
| Number of Logic Elements | 4,320 |
| Embedded Memory (Total) | 94,208 bits |
| User I/O Count | 100 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| Package Type | 121-VFBGA / CSFBGA |
| Pin/Ball Count | 121 |
| Type de montage | Surface Mount |
| Speed Grade | -5 E (enhanced) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Temperature Suffix | I (Industrial) |
| Configuration Interface | JTAG, SPI, I2C |
| On-chip Oscillator | Yes (internal) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Programming Toolchain | Lattice Diamond |
Guide de configuration des broches du LCMXO3LF-4300E-5MG121I 121-vfbga / csfbga
Configuration des broches du LCMXO3LF-4300E-5MG121I (boîtier 121-vfbga / csfbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LCMXO3LF-4300E-5MG121I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LCMXO3LF-4300E-5MG121I convient pour 7 applications: Industrial I/O Expansion and Bridging, Server and Storage Platform Management, LED Control and Human-Machine Interface, Communications Infrastructure Glue Logic, Sensor Aggregation in IoT Edge Nodes, Automotive and Industrial Control PLD, Display Signal Routing and Multiplexing.
Industrial I/O Expansion and Bridging
The LCMXO3LF-4300E-5MG121I is purpose-fit for industrial I/O expansion and protocol bridging because its 4,320 LUTs comfortably accommodate glue-logic between microcontrollers, sensors, and actuators. The 100 available user I/O pins across multiple banks let the device sit between a low-pin-count MCU and a high-pin-count field wiring harness, translating SPI to UART or GPIO to I2C without taxing the host MCU. Industrial temp grade (-40C to +100C) and 1.2V core operation suit 24V industrial bus systems when paired with a small LDO. According to the Lattice MachXO3 product page, this density class also handles small state machines for safe-shutdown sequencing in PLC backplanes.
Recommandé
Server and Storage Platform Management
The LCMXO3LF-4300E-5MG121I fits server and storage platform-management roles because its ultra-low static current and instant-on over SPI flash suit always-on housekeeping tasks such as fan tachometer aggregation, temperature monitoring, and GPIO expansion behind a BMC. The 94,208 bits of embedded block RAM accommodate small FIFOs for telemetry buffering before forwarding to the BMC over I2C or SPI. According to Lattice reference designs, the MachXO3LF is widely deployed as a control PLD in hyperscale server motherboards and NVMe backplanes. The 8x8 mm CSFBGA footprint supports dense board layouts typical of OCP NIC 3.0 cards and NVMe SSD controller boards.
Recommandé
LED Control and Human-Machine Interface
The LCMXO3LF-4300E-5MG121I is well-suited to LED control and HMI front panels because its LUT density and dedicated user-internal oscillators can drive PWM dimming, color-mixing, and dynamic LED matrix scanning without host intervention. The 100 user I/O pins can drive dozens of LED channels through external MOSFET drivers while the FPGA handles the matrix refresh, gamma correction, and fault detection. According to the Lattice MachXO3 family reference manual, the embedded block RAM can store lookup tables for color point correction across thousands of LEDs. Industrial temperature operation supports outdoor displays and industrial signage enclosures.
Recommandé
Communications Infrastructure Glue Logic
The LCMXO3LF-4300E-5MG121I supports communications infrastructure glue logic because its combination of 4,320 LUTs, multiple I/O banks, and on-chip PLLs allows it to bridge between SerDes, switch ASICs, and PHY devices. It can implement MDIO Bus Backplane Management, I2C/SPI fan-out, and reset sequencing for base-station line cards and routers. According to the Lattice MachXO3 datasheet, the device supports LVCMOS 3.3, 2.5, 1.8, and 1.5 standards across banks, enabling mixed-voltage bridging without external level shifters. The 1.2V core operation minimizes heat dissipation in sealed outdoor enclosures.
Recommandé
Sensor Aggregation in IoT Edge Nodes
The LCMXO3LF-4300E-5MG121I is purpose-fit for IoT edge sensor aggregation because its deep-sleep current in the low microamp region and sub-millisecond wake from SPI configuration memory make it ideal for battery-backed edge nodes that wake briefly to gather sensor data and forward it. The 94,208 bits of block RAM can buffer tens of sensor samples before forwarding to a low-power host MCU over I2C or SPI. According to Lattice application notes, the MachXO3LF supports always-on watchdog and housekeeping in wireless sensor motes and asset trackers. The small CSFBGA footprint supports coin-cell powered wearable form factors.
Recommandé
Automotive and Industrial Control PLD
The LCMXO3LF-4300E-5MG121I is suitable as a control PLD for automotive and industrial subsystems because the MachXO3LF family is offered in AEC-Q100 qualified variants for body-electronics, instrument clusters, and ADAS sensor preprocessing. The 100 user I/O pins support driving stepper and BLDC motor pre-drivers, while the 4,320 LUTs handle small deterministic state machines for safe torque off and field-oriented control handshakes. According to Lattice family documentation, the industrial temperature range and small CSFBGA footprint make it appropriate for sensor-fusion ECUs front-ends. Pair with Lattice Diamond for hardware-software co-design with ISO 26262 workflows.
Recommandé
Display Signal Routing and Multiplexing
The LCMXO3LF-4300E-5MG121I is well-suited to display signal routing and multiplexing because its multiple I/O banks and on-chip PLLs allow it to switch between MIPI, LVDS, CMOS display sources and sinks in TVs, monitors, and projection systems. The 100 user I/O pins can fan out to multiple panel connectors and EDID EEPROMs while the FPGA arbitrates input selection. According to Lattice reference designs, the MachXO3LF handles HDMI handshake retiming, HDCP repeater control, and fast input-switch transitions. The 1.2V core supports modern low-EMI panel power architectures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO3LF-4300E-5MG121I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO3LF-4300E-5MG121C | LCMXO3LF-4300C-5MG121I | LCMXO3LF-4300E-5MG121I-TR | LCMXO3LF-4300E-5BG121I | LCMXO3LF-4300E-6MG121I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 121-VFBGA / CSFBGA | 121-VFBGA / CSFBGA - same | 121-VFBGA / CSFBGA - same | 121-VFBGA / CSFBGA - same | 121-VFBGA / CSFBGA - same | 121-VFBGA / CSFBGA - same |
| LUTs | 4,320 | 4,320 | 4,320 | 4,320 | 4,320 | 4,320 |
| Embedded Memory (bits) | 94,208 | 94,208 | 94,208 | 94,208 | 94,208 | 94,208 |
| User I/O | 100 | 100 | 100 | 100 | 100 | 100 |
| Speed Grade | -5 (E) | -5 (E) | -3 (C) | -5 (E) | -5 (E) | -6 (E, faster) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tray | Tray |
| Approx. Unit Price (USD) | $18.50 | $16.80 | $17.20 | $18.50 | $18.50 | $19.40 |
Principaux différenciateurs
- Drop-in compatible with same-package MachXO3LF -4300 family (vs LCMXO3LF-4300E-5MG121C)
- Speed-grade flexibility without PCB change (vs LCMXO3LF-4300C-5MG121I)
- Low-density LUT count vs Spartan-7 / Cyclone 10 LP (vs Xilinx Spartan-7 / Intel Cyclone 10 LP)
Notes de conception
The LCMXO3LF-4300E-5MG121I operates from a single 1.2V core rail plus independent VCCIO rails per bank (typically 3.3V, 2.5V, 1.8V, or 1.5V). Place a 100 nF X7R 0402 ceramic decoupling capacitor at each VCC pin and a single 4.7 uF bulk capacitor near the package. For battery-backed applications, route the auxiliary VCC (VCCAUX) rail last so the device enters a defined sleep state on power-down. According to the Lattice MachXO3 family reference manual, VCCIO bank voltages must be applied before or simultaneously with the VCC core supply to avoid I/O latch-up.
Route all 121 balls of the 0.5 mm pitch CSFBGA package on the top side with microvia-in-pad if possible, or with 8 mil trace and space on a 4-layer stack-up. Match differential pair lengths to within 5 mil for high-speed LVDS signals routed between FPGA and PHY. Place the SPI configuration flash within 25 mm of the FPGA's SPI pins to keep the SPI clock rise/fall within budget. Reference the Lattice MachXO3 hardware reference manual for the recommended footprint, solder mask, and paste stencil apertures.
Keep all configuration-related signals (TCK, TMS, TDI, TDO, PROGRAMN, INITN, DONE) on the same PCB layer as the FPGA and avoid routing them across noisy planes. Place a JTAG header (2x5 1.27 mm pitch) within 50 mm of the FPGA for in-system programming. According to the Lattice Diamond toolchain notes, route CFG pins away from high-frequency switching converters to prevent false configuration triggers. Use a ground guard via fence along the CSFBGA perimeter to reduce SSN.
Do not exceed the maximum I/O current per pin or per bank specified in the Lattice datasheet - over-current can permanently damage the I/O cell. Ensure SPI flash density is sized at least 2x the bitstream size to leave room for golden-image backup. When migrating between LCMXO3LF speed grades (-3, -5, -6), verify that your design's timing closure still meets the new speed grade's fMAX requirement. Do not mix -C (0C to +85C) and -I (-40C to +100C) parts on the same PCB without verifying that your application's thermal profile stays within the -C part's derated range.
For LVDS or LVPECL signaling, place 100 ohm differential termination resistors within 5 mm of the receiver pins. According to the Lattice MachXO3 datasheet, the device supports LVDS 25 and LVPECL inputs with on-chip termination in some I/O standards. Always simulate your top-3 highest-speed nets with the IBIS model from the Lattice website to validate rise time and overshoot. Use a series damping resistor (10-33 ohm) on clock outputs driving long traces to reduce ringing.
Informations de conformité
RoHS and lead-free per Lattice product page; conflict-minerals declaration per Lattice corporate policy. AEC-Q100 qualified variants exist within the MachXO3LF family but require a different manufacturer part number; this -5MG121I part is industrial-temperature grade but not specifically AEC-Q100 qualified.
