MC68LK332GCAG16 - 32-Bit ColdFire MCU, ROMless, 144-LQFP | NXP
Référence : MC68LK332GCAG16 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.8 | $5 900,00 |
| 1 000 | $10.4 | $10 400,00 |
MC68LK332GCAG16 Présentation
The M68300 family belongs to the ColdFire / CPU32 lineage of 32-bit microcontrollers, which sit in the hierarchy MCU (microcontroller) -> embedded controller -> 32-bit microprocessor -> semiconductor IC. These parts were designed for high-performance data manipulation with powerful on-chip peripheral subsystems, bridging 8/16-bit legacy designs and modern 32-bit automotive/industrial compute platforms.
Key features include a 32-bit CPU32 core with 16.78 MHz system clock, 2 KB on-chip SRAM (organized 2K x 8), 15 user I/O lines, internal oscillator, ROMless program memory (external memory interface required), and an integrated TPU for complex timing without CPU intervention plus a QSM for queued serial communications. The CPU32 instruction set is a restricted subset of the M68000 family, retaining 32-bit registers and addressing while reducing hardware complexity.
Typical applications include industrial motion control (using TPU for PWM and angle decoding), automotive body and chassis ECUs (engine timing, anti-lock brake controllers, transmission controllers), serial-communications gateways leveraging the QSM, and legacy M68000 firmware ports. The wide 5V tolerance also makes it suitable for 5V industrial backplanes.
When designing with this part, note that the 144-LQFP package exposes the full external memory bus; designers must add external program memory (EPROM/Flash) and decoupling per NXP application notes. The part is now in NXP's End-of-Life portfolio, so long-life production designs should plan for last-time-buy or migrate to a ColdFire V2/V3 successor.
Alternatives de remplacement direct pour MC68LK332GCAG16 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68LK332GCAG16 (même facteur de forme et même empreinte) — différant par Core Processor, RAM Size, Core Size, Package, Program Memory Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68LK332ACAG16
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →MC68332GVAG16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332ACAG20
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332ACAG16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332GCAG20
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XEQ384CAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC68LK332GCAG16 Valeurs maximales et caractéristiques électriques
| Core | CPU32 (M68300 / ColdFire lineage) |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 16.78 MHz |
| Program Memory Type | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O Lines | 15 |
| Tension d'alimentation | 5 V |
| Oscillator Type | Internal |
| Boîtier / Format | 144-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect Bus | IMB (Intermodule Bus) |
Configuration des broches de MC68LK332GCAG16
| Broche 1 | VDD — 5V supply (per NXP MC68332 family datasheet) |
| Broche 2 | VSS — Ground |
| Broche 3 | ADDR0 — External address bus bit 0 (per datasheet) |
| Broche 4 | ADDR1 — External address bus bit 1 |
| Broche 5 | ADDR2 — External address bus bit 2 |
| Broche 6 | ADDR3 — External address bus bit 3 |
| Broche 7 | ADDR4 — External address bus bit 4 |
| Broche 8 | ADDR5 — External address bus bit 5 |
| Broche 9 | ADDR6 — External address bus bit 6 |
| Broche 10 | ADDR7 — External address bus bit 7 |
| Broche 11 | ADDR8 — External address bus bit 8 |
| Broche 12 | ADDR9 — External address bus bit 9 |
| Broche 13 | ADDR10 — External address bus bit 10 |
| Broche 14 | ADDR11 — External address bus bit 11 |
| Broche 15 | ADDR12 — External address bus bit 12 |
| Broche 16 | ADDR13 — External address bus bit 13 |
| Broche 17 | ADDR14 — External address bus bit 14 |
| Broche 18 | ADDR15 — External address bus bit 15 |
| Broche 19 | ADDR16 — External address bus bit 16 |
| Broche 20 | ADDR17 — External address bus bit 17 |
| Broche 21 | ADDR18 — External address bus bit 18 |
| Broche 22 | ADDR19 — External address bus bit 19 |
| Broche 23 | ADDR20 — External address bus bit 20 |
| Broche 24 | ADDR21 — External address bus bit 21 |
| Broche 25 | ADDR22 — External address bus bit 22 |
| Broche 26 | ADDR23 — External address bus bit 23 |
| Broche 27 | DATA0 — External data bus bit 0 |
| Broche 28 | DATA1 — External data bus bit 1 |
| Broche 29 | DATA2 — External data bus bit 2 |
| Broche 30 | DATA3 — External data bus bit 3 |
| Broche 31 | DATA4 — External data bus bit 4 |
| Broche 32 | DATA5 — External data bus bit 5 |
| Broche 33 | DATA6 — External data bus bit 6 |
| Broche 34 | DATA7 — External data bus bit 7 |
| Broche 35 | DATA8 — External data bus bit 8 |
| Broche 36 | DATA9 — External data bus bit 9 |
| Broche 37 | DATA10 — External data bus bit 10 |
| Broche 38 | DATA11 — External data bus bit 11 |
| Broche 39 | DATA12 — External data bus bit 12 |
| Broche 40 | DATA13 — External data bus bit 13 |
| Broche 41 | DATA14 — External data bus bit 14 |
| Broche 42 | DATA15 — External data bus bit 15 |
| Broche 43 | CS0 — Chip-select 0 (per datasheet) |
| Broche 44 | CS1 — Chip-select 1 |
| Broche 45 | CS2 — Chip-select 2 |
| Broche 46 | CS3 — Chip-select 3 |
| Broche 47 | CS4 — Chip-select 4 |
| Broche 48 | CS5 — Chip-select 5 |
| Broche 49 | CS6 — Chip-select 6 |
| Broche 50 | CS7 — Chip-select 7 |
| Broche 51 | CS8 — Chip-select 8 |
| Broche 52 | CS9 — Chip-select 9 |
| Broche 53 | CS10 — Chip-select 10 |
| Broche 54 | IRQ1 — Interrupt request 1 (per datasheet) |
| Broche 55 | IRQ2 — Interrupt request 2 |
| Broche 56 | IRQ3 — Interrupt request 3 |
| Broche 57 | IRQ4 — Interrupt request 4 |
| Broche 58 | IRQ5 — Interrupt request 5 |
| Broche 59 | IRQ6 — Interrupt request 6 |
| Broche 60 | IRQ7 — Interrupt request 7 |
| Broche 61 | TPUCH0 — TPU channel 0 (per datasheet) |
| Broche 62 | TPUCH1 — TPU channel 1 |
| Broche 63 | TPUCH2 — TPU channel 2 |
| Broche 64 | TPUCH3 — TPU channel 3 |
| Broche 65 | TPUCH4 — TPU channel 4 |
| Broche 66 | TPUCH5 — TPU channel 5 |
| Broche 67 | TPUCH6 — TPU channel 6 |
| Broche 68 | TPUCH7 — TPU channel 7 |
| Broche 69 | TPUCH8 — TPU channel 8 |
| Broche 70 | TPUCH9 — TPU channel 9 |
| Broche 71 | TPUCH10 — TPU channel 10 |
| Broche 72 | TPUCH11 — TPU channel 11 |
| Broche 73 | TPUCH12 — TPU channel 12 |
| Broche 74 | TPUCH13 — TPU channel 13 |
| Broche 75 | TPUCH14 — TPU channel 14 |
| Broche 76 | TPUCH15 — TPU channel 15 |
| Broche 77 | QSMTXD — QSM transmit data (per datasheet) |
| Broche 78 | QSMRXD — QSM receive data |
| Broche 79 | QSMCLK — QSM clock |
| Broche 80 | QSPCS — QSM chip select |
| Broche 81 | XTAL — Crystal oscillator input |
| Broche 82 | EXTAL — External clock input |
| Broche 83 | VSS — Ground |
| Broche 84 | VDD — 5V supply |
| Broche 85 | RSTOUT — Reset output (per datasheet) |
| Broche 86 | RESET — Reset input |
| Broche 87 | HALT — Halt control |
| Broche 88 | BKPT — Breakpoint / background debug mode |
| Broche 89 | DSO — Development serial output (per datasheet) |
| Broche 90 | DSI — Development serial input |
| Broche 91 | PWM0 — Pulse-width modulation output 0 (per datasheet) |
| Broche 92 | PWM1 — Pulse-width modulation output 1 |
| Broche 93 | PWM2 — Pulse-width modulation output 2 |
| Broche 94 | PWM3 — Pulse-width modulation output 3 |
| Broche 95 | PWM4 — Pulse-width modulation output 4 |
| Broche 96 | PWM5 — Pulse-width modulation output 5 |
| Broche 97 | PWM6 — Pulse-width modulation output 6 |
| Broche 98 | PWM7 — Pulse-width modulation output 7 |
| Broche 99 | PWMA0 — Pulse-width modulation A0 (per datasheet) |
| Broche 100 | PWMA1 — Pulse-width modulation A1 |
| Broche 101 | PWMA2 — Pulse-width modulation A2 |
| Broche 102 | PWMA3 — Pulse-width modulation A3 |
| Broche 103 | PWMA4 — Pulse-width modulation A4 |
| Broche 104 | PWMA5 — Pulse-width modulation A5 |
| Broche 105 | PWMA6 — Pulse-width modulation A6 |
| Broche 106 | PWMA7 — Pulse-width modulation A7 |
| Broche 107 | TPUSA — TPU sub-address (per datasheet) |
| Broche 108 | TPUSB — TPU sub-bus |
| Broche 109 | TPUCLK — TPU clock |
| Broche 110 | TPUEN — TPU enable |
| Broche 111 | AVDD — Analog 5V supply (per datasheet) |
| Broche 112 | AVSS — Analog ground |
| Broche 113 | VRL — ADC voltage reference low (per datasheet) |
| Broche 114 | VRH — ADC voltage reference high |
| Broche 115 | AN0 — Analog input 0 (per datasheet) |
| Broche 116 | AN1 — Analog input 1 |
| Broche 117 | AN2 — Analog input 2 |
| Broche 118 | AN3 — Analog input 3 |
| Broche 119 | AN4 — Analog input 4 |
| Broche 120 | AN5 — Analog input 5 |
| Broche 121 | AN6 — Analog input 6 |
| Broche 122 | AN7 — Analog input 7 |
| Broche 123 | TXD — SCI transmit (per datasheet) |
| Broche 124 | RXD — SCI receive |
| Broche 125 | SCK — SCI clock |
| Broche 126 | PCS0 — Peripheral chip select 0 (per datasheet) |
| Broche 127 | PCS1 — Peripheral chip select 1 |
| Broche 128 | PCS2 — Peripheral chip select 2 |
| Broche 129 | PCS3 — Peripheral chip select 3 |
| Broche 130 | MISO — SPI MISO (per datasheet) |
| Broche 131 | MOSI — SPI MOSI |
| Broche 132 | SPICLK — SPI clock |
| Broche 133 | SPICS — SPI chip select |
| Broche 134 | WR — Write strobe (per datasheet) |
| Broche 135 | RD — Read strobe |
| Broche 136 | AS — Address strobe |
| Broche 137 | DS — Data strobe |
| Broche 138 | BG — Bus grant (per datasheet) |
| Broche 139 | BR — Bus request |
| Broche 140 | BB — Bus busy |
| Broche 141 | FC0 — Function code 0 (per datasheet) |
| Broche 142 | FC1 — Function code 1 |
| Broche 143 | FC2 — Function code 2 |
| Broche 144 | VSS — Ground |
Applications typiques
MC68LK332GCAG16 convient pour 6 applications: Industrial Motion Control, Automotive Engine Control Modules, Serial Communications Gateway, Anti-Lock Braking System (ABS) Controller, Transmission Control Unit (TCU), Industrial Robotic Controller.
Industrial Motion Control
The MC68LK332GCAG16's integrated Time Processing Unit (TPU) executes complex PWM generation, quadrature decoding, and stepper-motor control sequences independently of the CPU32 core. At 16.78 MHz the TPU delivers microsecond-class timing resolution suitable for brushless DC and AC induction drives below 50 kHz switching. Designers place the part at the heart of the motion controller, with external program memory storing the motion profile tables and the QSM handling the encoder/serial feedback channel. Compared with software PWM on a general-purpose MCU, the TPU offload frees the CPU32 for trajectory planning and CAN-style communication, which is why the MC68332 family dominated servo and spindle-drive designs of the 1990s.
Recommandé
Automotive Engine Control Modules
The MC68LK332GCAG16 was designed into automotive engine and transmission ECUs where the TPU handles fuel-injection timing and the QSM provides queued serial diagnostics. Its 5V supply tolerance and 144-LQFP package support the legacy 5V ECU backplanes common in vehicles of the late 1990s and early 2000s. The 16.78 MHz CPU32 executes ignition and fuel maps fast enough for 4-cylinder engines at 6000 RPM. Although new automotive designs use 3.3V S12 and S32K parts, the MC68LK332 remains in service in long-life commercial-vehicle and industrial-machinery ECUs where redesign cost outweighs silicon cost.
Recommandé
Serial Communications Gateway
The MC68LK332GCAG16's Queued Serial Module (QSM) provides hardware-managed SPI and SCI channels with FIFOs, making the part a natural choice for serial-protocol gateway and protocol-converter designs. The CPU32 core at 16.78 MHz can sustain aggregate serial throughput in the low-Mbps range, sufficient for industrial RS-232/RS-485 multi-drop networks and SCADA front-ends. Designers typically pair the MC68LK332 with external UART transceivers and use the IMB bus to expose the gateway registers to a host controller. The ROMless architecture lets the firmware be field-updated through the serial port itself.
Recommandé
Anti-Lock Braking System (ABS) Controller
Classic ABS designs of the 1990s used the MC68332 family because the TPU could sample wheel-speed sensors and generate brake-pressure PWM independently of the main CPU. The MC68LK332GCAG16's 5V tolerance, 16.78 MHz CPU32, and 144-LQFP package matched the automotive 5V ECU architecture of that era. The QSM handled the diagnostic link to the rest of the vehicle network. Although ABS has since migrated to dedicated sensor-interface ICs, the MC68LK332 remains in long-term service in commercial-vehicle ABS retrofits where the installed base of 144-LQFP boards is too expensive to redesign.
Recommandé
Transmission Control Unit (TCU)
Transmission control units of the late 1990s used the MC68332 family for gear-shift scheduling and clutch-pedal PWM generation. The MC68LK332GCAG16's TPU drives shift solenoids while the QSM communicates with the engine ECU and the body controller. Its 5V supply matched the 5V transmission harness and its 144-LQFP footprint fit the dense TCU PCB. New TCU designs use 32-bit PowerPC and ARM Cortex-R parts, but the installed base of MC68LK332-based TCUs is still in service in commercial trucks and agricultural equipment with multi-decade support lifetimes.
Recommandé
Industrial Robotic Controller
Pre-CANopen factory robots used the MC68LK332GCAG16 as a joint-controller, with the TPU generating multi-axis servo PWM and the QSM handling the proprietary servo-loop bus. The 16.78 MHz CPU32 ran the proportional-integral-derivative loop at a 1 kHz rate, sufficient for hydraulic and small-DC servo robots. The 144-LQFP package fit the joint-mounted controller housings common in 6-axis robots of that era. Although modern robotics support industrial-grade ARM Cortex-R and x86 SBCs, the MC68LK332 is still deployed in long-life robotic cells where the surrounding mechanics, not the controller, define the product lifecycle.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68LK332GCAG16 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68LK332ACAG16 | MC68332GVAG16 | MC68332ACAG20 | MC68332ACAG16 | MC68332GCAG20 | MC9S12XEQ384CAG |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP - same |
| Core Architecture | CPU32 (32-bit M68300) | CPU32 (32-bit M68300) | CPU32 (32-bit M68300) | CPU32 (32-bit M68300) | CPU32 (32-bit M68300) | CPU32 (32-bit M68300) | S12X (16-bit) |
| Maximum Clock Frequency | 16.78 MHz | 16.78 MHz | 16 MHz (-4.6%) | 20 MHz (+19%) | 16 MHz (-4.6%) | 20 MHz (+19%) | 50 MHz (S12X) |
| Program Memory Type | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless | Flash (384 KB) |
| On-chip RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 32 KB |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 3.3 V / 5 V tolerant I/O |
| On-chip TPU | Yes | Yes | Yes | Yes | Yes | Yes | Enhanced Timer (ETPU) |
| On-chip QSM | Yes | Yes | Yes | Yes | Yes | Yes | SCI/SPI (no Q) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | Active |
Principaux différenciateurs
- CPU32 32-bit core at 16.78 MHz with integrated TPU and QSM (vs MC68LK332ACAG16)
- Pin-compatible 20 MHz speed grade option (vs MC68332ACAG20)
- Drop-in on the 144-LQFP M68332 family footprint (vs MC9S12XEQ384CAG)
Notes de conception
The MC68LK332GCAG16 is a 5V part. Supply decoupling must follow the NXP MC68332 family reference design: at least one 10 uF tantalum and one 0.1 uF ceramic cap on each VDD/VSS pair, placed within 5 mm of the supply pins. Long-term EOL stock may include date codes with different decoupling recommendations; cross-check the lot's datasheet revision before reusing the same BOM. The 144-LQFP exposes 6-8 VDD/VSS pairs that all need local decoupling for the high-current address/data bus transitions.
At 16.78 MHz the MC68LK332GCAG16 dissipates under 0.5 W typically and the 144-LQFP (20x20) thermal pad is the main heat path. Estimated: with theta_JA of approximately 45 C/W on a 4-layer PCB with 2 oz copper, junction temperature rise at 0.5 W is roughly 22 C above ambient, well within the industrial -40C to +85C range. Designers do not need an external heatsink, but adequate PCB copper (ground plane connected to thermal pad) is essential.
Because the part is ROMless, the entire external address (ADDR0-ADDR23), data (DATA0-DATA15), and bus-control (AS, DS, R/W, FC0-FC2) signals must be routed to external program memory and peripheral devices. Trace length matching is not critical at 16.78 MHz, so a standard two-layer or four-layer PCB is sufficient. Keep the address and data buses short to avoid ringing, and place external memory as close as possible to the part. The TPU and QSM signals should route to their connectors with 50 ohm controlled impedance if the cable exceeds 50 mm.
Do not assume firmware compatibility between the LK, GV, AC, and GC suffix variants without checking the NXP errata documents - mask revisions change peripheral register behavior in subtle ways. The MC68LK332GCAG16 is in NXP's End-of-Life portfolio, so new designs should plan for last-time-buy or migrate to a ColdFire V2/V3 successor. Also note: the part is ROMless, so a missing or mis-programmed external EPROM/Flash will cause the CPU32 to execute garbage and the bus error pin will toggle, which is the diagnostic symptom to look for during bring-up.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free statuses are not explicitly listed in the verified web data; designers should request the lot-specific environmental data from Rochester Electronics (the authorized aftermarket supplier) before placing the part into a RoHS-bound production line. AEC-Q100 is not_applicable for this industrial-grade MCU.